EP1631396A4 - Nettoyage megasonique utilisant une solution de nettoyage sursaturee - Google Patents
Nettoyage megasonique utilisant une solution de nettoyage sursatureeInfo
- Publication number
- EP1631396A4 EP1631396A4 EP04776442.8A EP04776442A EP1631396A4 EP 1631396 A4 EP1631396 A4 EP 1631396A4 EP 04776442 A EP04776442 A EP 04776442A EP 1631396 A4 EP1631396 A4 EP 1631396A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- cleaning
- supersaturated
- megasonic
- solution
- cleaning solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004140 cleaning Methods 0.000 title 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US47760203P | 2003-06-11 | 2003-06-11 | |
PCT/US2004/018464 WO2005006396A2 (fr) | 2003-06-11 | 2004-06-10 | Nettoyage megasonique utilisant une solution de nettoyage sursaturee |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1631396A2 EP1631396A2 (fr) | 2006-03-08 |
EP1631396A4 true EP1631396A4 (fr) | 2013-08-14 |
Family
ID=34061915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04776442.8A Withdrawn EP1631396A4 (fr) | 2003-06-11 | 2004-06-10 | Nettoyage megasonique utilisant une solution de nettoyage sursaturee |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1631396A4 (fr) |
JP (1) | JP4643582B2 (fr) |
KR (1) | KR101110905B1 (fr) |
CN (1) | CN1849182A (fr) |
TW (1) | TWI330552B (fr) |
WO (1) | WO2005006396A2 (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010108641A (ko) * | 2000-05-30 | 2001-12-08 | 강병근 | 무우를 주재로한 건강음료 및 그 제조방법 |
KR20020037177A (ko) * | 2000-11-13 | 2002-05-18 | 김용현 | 무를 첨가한 꿀음료 |
KR100827618B1 (ko) * | 2006-05-11 | 2008-05-07 | 한국기계연구원 | 세정용 초음파 장치 및 이를 이용한 초음파 세정시스템 |
US7969548B2 (en) * | 2006-05-22 | 2011-06-28 | Asml Netherlands B.V. | Lithographic apparatus and lithographic apparatus cleaning method |
JPWO2008050832A1 (ja) * | 2006-10-27 | 2010-02-25 | 東京エレクトロン株式会社 | 基板洗浄装置、基板洗浄方法、プログラム、および記録媒体 |
KR100748480B1 (ko) * | 2007-06-27 | 2007-08-10 | 한국기계연구원 | 세정용 초음파 장치를 이용한 초음파 세정시스템 |
JP4532580B2 (ja) * | 2008-08-20 | 2010-08-25 | 株式会社カイジョー | 超音波洗浄装置 |
JP4915455B2 (ja) * | 2010-02-25 | 2012-04-11 | トヨタ自動車株式会社 | 車両等大型製品のマイクロバブルによる脱脂システム |
JP2014130881A (ja) * | 2012-12-28 | 2014-07-10 | Ebara Corp | 研磨装置 |
JP6678448B2 (ja) * | 2015-12-22 | 2020-04-08 | 株式会社Screenホールディングス | 基板洗浄方法および基板洗浄装置 |
WO2020095091A1 (fr) * | 2018-11-06 | 2020-05-14 | Arcelormittal | Équipement améliorant le nettoyage par ultrasons |
JP7233691B2 (ja) * | 2019-03-28 | 2023-03-07 | 株式会社エアレックス | 低温物品の除染方法及びこれに使用するパスボックス |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5562778A (en) * | 1993-12-17 | 1996-10-08 | International Business Machines Corporation | Ultrasonic jet semiconductor wafer cleaning method |
US20010009155A1 (en) * | 1999-12-24 | 2001-07-26 | m . FSI LTD. | Substrate treatment process and apparatus |
US6290777B1 (en) * | 1996-08-20 | 2001-09-18 | Organo Corp. | Method and device for washing electronic parts member, or the like |
WO2003033178A1 (fr) * | 2001-10-18 | 2003-04-24 | The Procter & Gamble Company | Produits de nettoyage par ultrasons comprenant une composition de nettoyage renfermant un gaz dissous |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1022246A (ja) | 1996-07-04 | 1998-01-23 | Tadahiro Omi | 洗浄方法 |
US5800626A (en) | 1997-02-18 | 1998-09-01 | International Business Machines Corporation | Control of gas content in process liquids for improved megasonic cleaning of semiconductor wafers and microelectronics substrates |
US5849091A (en) * | 1997-06-02 | 1998-12-15 | Micron Technology, Inc. | Megasonic cleaning methods and apparatus |
US6167891B1 (en) * | 1999-05-25 | 2001-01-02 | Infineon Technologies North America Corp. | Temperature controlled degassification of deionized water for megasonic cleaning of semiconductor wafers |
JP3322853B2 (ja) * | 1999-08-10 | 2002-09-09 | 株式会社プレテック | 基板の乾燥装置および洗浄装置並びに乾燥方法および洗浄方法 |
US6684890B2 (en) * | 2001-07-16 | 2004-02-03 | Verteq, Inc. | Megasonic cleaner probe system with gasified fluid |
-
2004
- 2004-06-10 EP EP04776442.8A patent/EP1631396A4/fr not_active Withdrawn
- 2004-06-10 CN CNA2004800205237A patent/CN1849182A/zh active Pending
- 2004-06-10 JP JP2006533684A patent/JP4643582B2/ja not_active Expired - Fee Related
- 2004-06-10 WO PCT/US2004/018464 patent/WO2005006396A2/fr not_active Application Discontinuation
- 2004-06-10 KR KR1020057023902A patent/KR101110905B1/ko active IP Right Grant
- 2004-06-11 TW TW093116958A patent/TWI330552B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5562778A (en) * | 1993-12-17 | 1996-10-08 | International Business Machines Corporation | Ultrasonic jet semiconductor wafer cleaning method |
US6290777B1 (en) * | 1996-08-20 | 2001-09-18 | Organo Corp. | Method and device for washing electronic parts member, or the like |
US20010009155A1 (en) * | 1999-12-24 | 2001-07-26 | m . FSI LTD. | Substrate treatment process and apparatus |
WO2003033178A1 (fr) * | 2001-10-18 | 2003-04-24 | The Procter & Gamble Company | Produits de nettoyage par ultrasons comprenant une composition de nettoyage renfermant un gaz dissous |
Non-Patent Citations (1)
Title |
---|
See also references of WO2005006396A2 * |
Also Published As
Publication number | Publication date |
---|---|
WO2005006396A3 (fr) | 2005-09-15 |
EP1631396A2 (fr) | 2006-03-08 |
JP2007502032A (ja) | 2007-02-01 |
WO2005006396A2 (fr) | 2005-01-20 |
TW200507954A (en) | 2005-03-01 |
KR20060037270A (ko) | 2006-05-03 |
CN1849182A (zh) | 2006-10-18 |
JP4643582B2 (ja) | 2011-03-02 |
TWI330552B (en) | 2010-09-21 |
KR101110905B1 (ko) | 2012-02-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20051216 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: AKRION TECHNOLOGIES, INC. |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: FRASER, BRIAN Inventor name: WU, YI Inventor name: FRANKLIN, COLE, S. |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20130715 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/67 20060101ALI20130709BHEP Ipc: B08B 3/12 20060101AFI20130709BHEP |
|
17Q | First examination report despatched |
Effective date: 20131024 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20151014 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160225 |