EP1627421A2 - Structure amorphe de couplage optique pour detecteur d ondes electromagnetiques et detecteur associe - Google Patents
Structure amorphe de couplage optique pour detecteur d ondes electromagnetiques et detecteur associeInfo
- Publication number
- EP1627421A2 EP1627421A2 EP04766022A EP04766022A EP1627421A2 EP 1627421 A2 EP1627421 A2 EP 1627421A2 EP 04766022 A EP04766022 A EP 04766022A EP 04766022 A EP04766022 A EP 04766022A EP 1627421 A2 EP1627421 A2 EP 1627421A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- patterns
- optical coupling
- coupling structure
- detector
- electromagnetic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000008878 coupling Effects 0.000 title claims abstract description 52
- 238000010168 coupling process Methods 0.000 title claims abstract description 52
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 52
- 230000003287 optical effect Effects 0.000 title claims abstract description 37
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 10
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 230000000737 periodic effect Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
Definitions
- the field of the invention is that of electromagnetic wave detectors made of semiconductor material and in particular with a quantum multi-well structure, particularly suitable for the infrared field.
- This type of structure has the advantage of providing very good sensitivities due to the discretization of the energy levels within the conduction bands of the photoconductive materials used.
- the electric field of the incident electromagnetic wave has a component along the direction of growth of the layers, or in the direction D indicated in figure 1 , direction perpendicular to the plane of the layers.
- the major drawback of using networks is the wavelength and angle resonance associated with the increase in absorption, which limits the use of these devices to a very narrow absorption window. These resonances are directly linked to the periodic nature of the networks. Thus if one wants to have a detector capable of detecting a wavelength domain having a wider spectral band, it is necessary to seek other solutions than network structures. This is why the present invention provides a new amorphous optical coupling structure intended to couple electromagnetic radiation to the surface of a photodetector, to erase the periodic effects while ensuring efficient optical coupling.
- the subject of the present invention is an optical coupling structure intended to couple electromagnetic radiation to the surface of a photodetector, characterized in that it comprises a coupling surface paved in first and second directions perpendicular to each other, by a set of N series of first patterns, second patterns, ... of nth patterns, the patterns being identical within the same series, the patterns being distributed in the first and second directions, the centers between two adjacent patterns or the inter-reticular distance between two adjacent patterns being variable and the first, the second, ... the nth patterns being square and / or rectangular
- the density of patterns on the coupling surface is substantially constant over the whole of said surface.
- the optical coupling surface consists of a set of N series of first, second, ... nth identical elementary cells within the same series constituting the tiling, each first, second, ... nth elementary cell comprising a pattern homothetic to said elementary cell.
- the average of the distances between the centers of the adjacent patterns or that of the inter-reticular distances between two patterns adjacent, in the first direction and the average in the second direction are substantially equal to the wavelength of the electromagnetic radiation in the detector medium.
- the inter-reticular space between the patterns is constant.
- each pattern is centered within an elementary cell, the inter-reticular distance between patterns not being constant, the filling rate of the elementary cells with the patterns being constant
- the surface of coupling can include first, second, third and fourth patterns of dimensions aa, bb, ab and ba respectively
- the patterns can both be engraved at the coupling surface and produced on the surface of the coupling surface by conventional photolithography methods and typically include an engraving depth of the order of lambda / 4.
- the paving can be obtained by depositing a very conductive layer of the Gold or Silver type.
- the invention also relates to an electromagnetic wave detector comprising a quantum multi-well structure operating on interband or intersubband transitions by absorption of radiation around a lambda wavelength, and comprising means of optical coupling of said radiation , characterized in that the optical coupling means comprise an optical coupling structure according to the invention.
- the object of the invention is to reinforce the electromagnetic field in the form of optical modes at the level of the active layer and can therefore be applied to inter-band or inter-band transitions.
- the detector can advantageously comprise a stack of layers produced on the surface of a substrate, said stack comprising the quantum multi-well structure and external layers, the first and second patterns being etched within an external layer.
- the invention also relates to a matrix electromagnetic wave detector characterized in that it comprises a matrix of unitary detector elements according to the invention, each unitary element detector comprising a stack of layers, said stack comprising the quantum multi-well structure and external layers, the first and second patterns being etched within an external layer, said elements being produced on the surface of a common substrate.
- the stack of active layers is a stack of semiconductor layers of the GaAs type, doped GaAIAs, the substrate being of the GaAs type, doped or not.
- the detector may comprise a substrate transparent to the wavelength of the radiation and a reflective layer at said wavelength, said reflective layer being on the surface of the patterns, so as to operate the detector in reflection.
- the invention finally relates to a laser source comprising a quantum multi-well structure operating on interband or intersubband transitions at a lambda wavelength and comprising an optical coupling structure according to the invention.
- FIG. 1 shows schematically a quantum multi-well structure according to the known art.
- FIG. 2 illustrates a quantum multi-well detector having optical coupling means of the matrix diffraction grating type, according to the prior art
- Figure 3 illustrates a first variant of the optical coupling structure according to the invention.
- Figure 4 illustrates a second variant of the optical coupling structure according to the invention.
- Figure 5 illustrates a third variant of the optical coupling structure according to the invention.
- FIG. 6 illustrates an example of a quantum multi-well detector according to the invention, seen in section.
- Figure 7 illustrates an example of a matrix detector according to the invention.
- the coupling structure according to the invention comprises a set of patterns paved at a coupling surface, distributed in two orthogonal directions Dx and Dy, the density of patterns over the entire surface being substantially constant.
- the coupling surface is made up of 4 series of elementary patterns, two series of square patterns of dimensions c * c, d * d and two series of rectangular patterns of dimensions c * d and d * c, as illustrated in Figure 3.
- the distance between patterns is constant and equal to e.
- the dimension c + e is adapted to a first wavelength ⁇ - * and the dimension d + e is adapted to a second wavelength ⁇ 2 , so as to obtain an efficient coupling structure over a certain spectral band. That is, c + e ⁇ ⁇ -i / n and d + e ⁇ ⁇ 2 / n, n being the optical index of the detector medium.
- the optical coupling surface is defined in elementary surfaces also 0 called elementary cells of dimensions a * a, a * b, b * a and b * b, as illustrated in FIG. 4.
- the patterns have dimensions c * c, Cf dvi, d * C and d * d respectively.
- the dimensions CM and 5 CIM are determined to maintain the same filling rate as the cells a * a and b * b.
- the dimension a is adapted to a first wavelength ⁇ -i and the dimension b is adapted to a second wavelength ⁇ 2 , so as to obtain an efficient coupling structure over a certain spectral band.
- the pattern is placed in the center of the cell, the difference between each pattern is variable within the structure (e c + e, e + ed, Third variant:
- the optical coupling surface is defined in elementary surfaces also called elementary cells of dimensions a * a, a * b, b * a and b * b, as illustrated in FIG. 5.
- the patterns have dimensions c * c, c * d, d * c and d * d respectively.
- the dimension c is adapted to a first wavelength ⁇ i and the dimension d is adapted to a second wavelength ⁇ 2 , so as to obtain an efficient coupling structure over a certain spectral band.
- the filling rate is not the same between square cells and rectangular cells.
- the optical structure according to the invention can comprise engraved patterns (preferred mode because technologically easier to produce).
- the detector can be conventionally produced on the surface of a substrate made of semiconductor material which can be undoped S.
- An assembly of layers constituting an ohmic contact called lower Ci of highly doped semiconductor material is deposited on the surface of the substrate.
- This ohmic contact supports all of the semiconductor layers constituting the MPQ quantum multi-well structure, the latter is in contact with an assembly of layers constituting an ohmic contact called higher Cs, the detection being ensured between the two ohmic contact layers.
- the patterns can be etched in the ohmic contact layer Cs as illustrated in FIG. 6 which represents a sectional view.
- FIG. 7 illustrates an example of a matrix detector according to the invention in which all of the patterns are produced on the surface of a common substrate with an ohmic contact layer also common.
- a first ohmic contact layer Ci is also made transparent.
- the second ohmic contact layer Cs is deposited.
- the patterns are engraved within the Cs layer.
- We proceed to the definition of the unit detection elements by etching all the layers up to the surface of the lower contact layer Ci. - On the matrix detector thus obtained, it is advantageous to deposit a layer of encapsulation.
- the lower ohmic contact layer is made of Si doped GaAs with a doping rate of 5. 10 1 8 cm -3 and a thickness typically of 2 microns.
- the quantum multiwell structure is achieved by stacking
- 50 periods composed of a layer of GaAs doped Si with a charge carrier concentration of 5. 10 18 cm -3 of thickness 5 nm, inserted between two barrier layers made of Ga 0.75 Al 0.25 As thickness 50 nm.
- the upper contact layer is identical to the lower contact layer and also has a thickness of 2 microns;
- the patterns of the amorphous coupling pattern are produced within this upper contact layer.
- the etching depths are 1.2 micron and the steps of the patterns a and b of 2.4 microns and 2.7 microns (the average optical index of the structure being 3.3 to 9 microns).
- the filling rate of the surface of the upper contact layer is typically of the order of 50%.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biophysics (AREA)
- Light Receiving Elements (AREA)
- Optical Radar Systems And Details Thereof (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0306431A FR2855653B1 (fr) | 2003-05-27 | 2003-05-27 | Structure amorphe de couplage optique pour detecteur d'ondes electromagnetiques et detecteur associe |
PCT/EP2004/050929 WO2004107392A2 (fr) | 2003-05-27 | 2004-05-26 | Structure amorphe de couplage optique pour detecteur d'ondes electromagnetiques et detecteur associe |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1627421A2 true EP1627421A2 (fr) | 2006-02-22 |
Family
ID=33427481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04766022A Withdrawn EP1627421A2 (fr) | 2003-05-27 | 2004-05-26 | Structure amorphe de couplage optique pour detecteur d ondes electromagnetiques et detecteur associe |
Country Status (4)
Country | Link |
---|---|
US (1) | US7687760B2 (fr) |
EP (1) | EP1627421A2 (fr) |
FR (1) | FR2855653B1 (fr) |
WO (1) | WO2004107392A2 (fr) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2855654B1 (fr) * | 2003-05-27 | 2006-03-03 | Thales Sa | Detecteur d'ondes electromagnetiques avec surface de couplage optique comprenant des motifs lamellaires |
FR2863774B1 (fr) * | 2003-12-16 | 2006-03-03 | Thales Sa | Photodetecteur a concentration de champ proche |
FR2893184B1 (fr) | 2005-11-10 | 2007-12-28 | Thales Sa | Structure optique de localisation d'un champ electro-magnetique et dispositif detecteurs ou emetteurs comprenant une telle structure |
FR2933781A1 (fr) * | 2008-07-11 | 2010-01-15 | Thales Sa | Extracteur de photons a cristaux photoniques pour micro-sources optiques a fort rendement |
FR2933786B1 (fr) * | 2008-07-11 | 2010-08-20 | Thales Sa | Dispositif optique comportant un cristal photonique a base de gainp sans absorption a deux photons |
FR2937791B1 (fr) * | 2008-10-24 | 2010-11-26 | Thales Sa | Dispositif d'imagerie polarimetrique optimise par rapport au contraste de polarisation |
FR2937792B1 (fr) * | 2008-10-24 | 2011-03-18 | Thales Sa | Dispositif d'imagerie multispectral a base de multi-puits quantiques |
JP5621394B2 (ja) * | 2009-11-19 | 2014-11-12 | セイコーエプソン株式会社 | センサーチップ、センサーカートリッジ及び分析装置 |
Family Cites Families (31)
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FR2507821A1 (fr) * | 1981-06-16 | 1982-12-17 | Thomson Csf | Transistor a effet de champ vertical a jonction et procede de fabrication |
FR2548453B1 (fr) * | 1983-06-30 | 1986-11-14 | Thomson Csf | Procede de fabrication d'un transistor a effet de champ a jonction vertical haute frequence |
FR2640044B1 (fr) * | 1988-12-06 | 1993-02-12 | Thomson Csf | Dispositif de detection de rayonnements optiques |
FR2653229B1 (fr) * | 1989-10-12 | 1992-01-17 | Thomson Csf | Detecteur capacitif d'onde electromagnetique. |
FR2655434B1 (fr) * | 1989-12-05 | 1992-02-28 | Thomson Csf | Dispositif optique a puits quantiques et procede de realisation. |
FR2655774A1 (fr) * | 1989-12-08 | 1991-06-14 | Thomson Csf | Perfectionnement aux transistors de puissance en materiaux iii-v sur substrat silicium et procede de fabrication. |
FR2670006B1 (fr) * | 1990-11-29 | 1993-03-12 | Thomson Csf | Bolometre electronique a puits quantique et application a un detecteur de rayonnements. |
SE468188B (sv) * | 1991-04-08 | 1992-11-16 | Stiftelsen Inst Foer Mikroelek | Metod foer inkoppling av straalning i en infraroeddetektor, jaemte anordning |
FR2678774B1 (fr) * | 1991-07-05 | 1998-07-10 | Thomson Csf | Detecteur d'ondes electromagnetiques. |
FR2693594B1 (fr) * | 1992-07-07 | 1994-08-26 | Thomson Csf | Détecteur d'ondes électromagnétiques à puits quantiques. |
FR2729789B1 (fr) * | 1993-09-10 | 1998-03-20 | Thomson Csf | Detecteur a puits quantique et procede de realisation |
FR2718571B1 (fr) * | 1994-04-08 | 1996-05-15 | Thomson Csf | Composant hybride semiconducteur. |
US5485015A (en) * | 1994-08-25 | 1996-01-16 | The United States Of America As Represented By The Secretary Of The Army | Quantum grid infrared photodetector |
FR2726691B1 (fr) * | 1994-11-08 | 1997-01-24 | Thomson Csf | Photodetecteur de grande dimension et procede de realisation d'un tel photodetecteur |
FR2726903B1 (fr) * | 1994-11-10 | 1996-12-06 | Thomson Csf | Ecartometre integre |
US5539206A (en) * | 1995-04-20 | 1996-07-23 | Loral Vought Systems Corporation | Enhanced quantum well infrared photodetector |
FR2756667B1 (fr) * | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques bispectral |
FR2756666B1 (fr) * | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques |
US5773831A (en) * | 1997-03-19 | 1998-06-30 | Lockheed Martin Vought Systems Corporation | Patch coupled infrared photodetector |
JP3955367B2 (ja) * | 1997-09-30 | 2007-08-08 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | 光半導体素子およびその製造方法 |
FR2780203B1 (fr) * | 1998-06-23 | 2003-07-04 | Thomson Csf | Detecteur a puits quantique avec couche de stockage des electrons photoexcites |
US6441373B1 (en) * | 1998-09-14 | 2002-08-27 | Fujitsu Limited | Infrared photodetector and method of manufacturing the same |
US6180990B1 (en) * | 1999-03-26 | 2001-01-30 | Lockheed Martin Corporation | Hyperspectral radiation detector |
JP2000299488A (ja) * | 1999-04-13 | 2000-10-24 | Fujitsu Ltd | 赤外線センサの製造方法 |
US6875975B2 (en) * | 1999-12-24 | 2005-04-05 | Bae Systems Information And Electronic Systems Integration Inc | Multi-color, multi-focal plane optical detector |
FR2808926B1 (fr) * | 2000-05-12 | 2003-08-01 | Thomson Csf | Detecteur optique polarimetrique |
FR2808925B1 (fr) * | 2000-05-12 | 2003-08-08 | Thomson Csf | Detecteur optique bi-spectral |
FR2811808B1 (fr) * | 2000-07-11 | 2002-10-25 | Thomson Csf | Dispositif d'auto-compensation pour detecteurs soustractifs |
US6828642B2 (en) * | 2001-04-17 | 2004-12-07 | Lockhead Martin Corporation | Diffraction grating coupled infrared photodetector |
FR2834130B1 (fr) * | 2001-12-20 | 2005-02-18 | Thales Sa | Procede d'amelioration des caracteristiques optiques de composants optoelectroniques multicouches |
US7135698B2 (en) * | 2002-12-05 | 2006-11-14 | Lockheed Martin Corporation | Multi-spectral infrared super-pixel photodetector and imager |
-
2003
- 2003-05-27 FR FR0306431A patent/FR2855653B1/fr not_active Expired - Fee Related
-
2004
- 2004-05-26 WO PCT/EP2004/050929 patent/WO2004107392A2/fr active Application Filing
- 2004-05-26 US US10/558,247 patent/US7687760B2/en not_active Expired - Fee Related
- 2004-05-26 EP EP04766022A patent/EP1627421A2/fr not_active Withdrawn
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
US20060243892A1 (en) | 2006-11-02 |
WO2004107392A2 (fr) | 2004-12-09 |
FR2855653B1 (fr) | 2005-10-21 |
US7687760B2 (en) | 2010-03-30 |
FR2855653A1 (fr) | 2004-12-03 |
WO2004107392A3 (fr) | 2005-01-13 |
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