EP1625627A2 - Production d'un composant optoelectronique encapsule, dans une matiere plastique, et procedes correspondants - Google Patents

Production d'un composant optoelectronique encapsule, dans une matiere plastique, et procedes correspondants

Info

Publication number
EP1625627A2
EP1625627A2 EP04738518A EP04738518A EP1625627A2 EP 1625627 A2 EP1625627 A2 EP 1625627A2 EP 04738518 A EP04738518 A EP 04738518A EP 04738518 A EP04738518 A EP 04738518A EP 1625627 A2 EP1625627 A2 EP 1625627A2
Authority
EP
European Patent Office
Prior art keywords
plastic
producing
optically transparent
optoelectronic component
pane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP04738518A
Other languages
German (de)
English (en)
Inventor
Siegfried Buettner
Roy Knechtel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
X Fab Semiconductor Foundries GmbH
Original Assignee
X Fab Semiconductor Foundries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2003122751 external-priority patent/DE10322751B3/de
Application filed by X Fab Semiconductor Foundries GmbH filed Critical X Fab Semiconductor Foundries GmbH
Publication of EP1625627A2 publication Critical patent/EP1625627A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the invention relates to a method for producing an optoelectronic component, consisting of a semiconductor chip and an optical window which is transparent for a specific wavelength range and which are sealed as a compact component unit in plastic.
  • the method specifically includes the application of the optical window in the pane and the associated exposure of the separation areas of the singulation and the contact areas of the semiconductor element for electrical contacting for the purpose of contour measurement before encapsulation.
  • Electro-optical semiconductor components have been used for some time for converting electrical into optical signals and vice versa.
  • the signals can also be further processed by integrated circuits.
  • the actual optical semiconductor element For electrical contacting and mechanical fixing in the beam path and for protection against environmental influences, the actual optical semiconductor element must be enclosed in a protective housing which has an optical window which is transparent to the radiation in question. Special materials and methods are known for encapsulating the optical semiconductor elements in transparent housings.
  • the application of an optical window to the chips, according to DE 43 19 786 A1, or its introduction into the housing, cf. US 6,117,705, DE 41 35 189 A1 is associated with considerable effort and high costs.
  • the invention has for its object to provide a more rational manufacturing process that the optically active structures of the semiconductor chip in the earliest possible stage from damage such. B. protects dirt, saves work steps and is more universal.
  • the object is achieved in that instead of further processing the separated component chip for hermetic sealing with the optically transparent window, collective processing in the semiconductor wafer assembly is carried out by connecting an optically transparent wafer (window wafer) corresponding to the size of the semiconductor wafer to the semiconductor wafer and then the separation takes place.
  • the invention has the advantage, inter alia, that the optically active region of the chip is already protected during further processing and no failures due to contamination and mechanical damage can occur.
  • the pane is provided with a connection layer in predetermined areas, for example with a glass solder printed. This is followed by a (groove-like) sinking of the pane in predetermined areas, which are adapted to the size of the individual element arranged in the grid, from the underside. After the underside of the window pane has been connected to the semiconductor pane, the pane is cut from the top, which is done precisely to the cutouts on the underside provided for the splitting.
  • optically active surface of each chip remains hermetically sealed, while the contact areas of the chip and separation areas of the separator are exposed.
  • depressions can also be made in the larger pane, which later have cavities over micromechanical structures, e.g. as part of integrated circuits.
  • the separation follows.
  • the separated compact component unit can then be used in the appropriate thickness in standard lead frame based semiconductor housings as well as in other mounting variants (COB etc.).
  • This method can be used for all chips with optically active structures.
  • Polishing one or both surfaces of the large disk improves the transmission behavior. Plane parallelism is achieved.
  • a rough edge (on the side) of the (already cut) window improves the stop of the plastic material during potting.
  • the surface of the smaller window is sure to stay clean.
  • Figure 1 is a schematic of two panes to be connected in cross-section, the upper one being the window that is optically transparent in the corresponding wavelength range, e.g. made of glass. It has depressions and is locally provided with a connection layer;
  • FIG. 2 shows the two disks from FIG. 1 in the connected state during the severing of the disk
  • FIG. 3 is a component unit after singulation
  • Figure 4 is the finished plastic-sealed component.
  • the method for encapsulating optoelectronic semiconductor components comprises two subcomplexes.
  • a complex is the application of the prepared (window) pane to the semiconductor wafer with the optically active regions 2 and possible other circuit structures and the connection of the two to one another.
  • the other complex is the cutting up of the optically transparent pane to expose electrical contacts and the separation paths of the separator, the control measurement, the contacting and sheathing of the individual elements with plastic, e.g. by injection molding.
  • the starting point is, according to FIG. 1, processed semiconductor wafers 1 with optically sensitive elements 2, the surface of which is protected by a conventional passivation 3, which has openings only in the area of the electrical connections 4, 4 '.
  • connection layer 6 is applied to the optical pane 5, which is transparent in the required wavelength range (eg glass).
  • the structuring of the connection layer 6 can take place during application or afterwards.
  • the structure of the connection layer 6 is to be adapted to the semiconductor component in such a way that a closed frame is created around a respective optically sensitive element and a sufficient distance to the optically sensitive elements and the contacting regions 4, 4 'is ensured.
  • the depressions 7 of the washer 5 are introduced from the connection side in the area of the contact areas, e.g. sawed. This takes place before the bonding via the structured layer 6.
  • the sawing-in 7 of the pane as a prerequisite for the later exposure of the contacting areas 4, must be carried out taking into account the pane thickness, so that both the mechanical stability of the pane remains guaranteed and the semiconductor structures are not damaged during sawing after the connection of the pane.
  • "Sawing” stands for any kind of cutting (cutting).
  • connection intermediate layer 6 The process control depends on the type of connection intermediate layer 6 used, taking into account minimal mechanical stresses in the connection plane.
  • the connection has a high level of planarity between wafer 5 and semiconductor wafer 1, which is positive for further processing.
  • the total thickness of the pane stack can be adjusted by grinding.
  • the contact areas are exposed by sawing 8 in the area of the sawnings 7 from the exposed, non-bonded side of the window pane 5 in such a way that the depth of the two cuts overlap (complement one another), as a result of which the parts between the bond areas forming a frame which are not connected to the semiconductor wafer 1 (no bond interlayer or open interlayer structure) fall out.
  • an electrical final inspection of the panes can be carried out, in which failures that are caused by the processes during the application of the windows can be detected.
  • the semiconductor wafers can be separated by standard processes into individual elements 11, see FIG. 3, at separation areas. These lie outside the contact areas 4, 4 '.
  • the subsequent encapsulation of the individual elements can then be carried out analogously to standard components.
  • the chips are individually attached to the metallic carrier strip 13 by means of adhesive 12. After the adhesive has hardened, wire bonding 13a takes place for contacting between the chip and the carrier strip (external connections).
  • the actual housing is created e.g. by plastic injection molding by injecting softened plastic material 14 around the array of chip carrier strips using a mold.
  • the lateral end faces of the glass attachment 10 represent a barrier for the plastic material, which ensures that no potting material gets onto the optical window and contaminates it.
  • the optical window is embedded in the surface of the housing.
  • the individual component unit contains a semiconductor chip (11) and an optical window (10). Hermetically enclosing at least the optically active areas of the semiconductor chip through the window takes place in the pane process, ie before the singulation.
  • a (window) pane provided with depressions (7) and partially covered with a connecting layer is connected to the prepared semiconductor pane (1) via the connecting layer sealing the optically active areas. Before the separation, the contact areas and the separation areas of the separation are exposed by cutting the window pane (8) precisely with respect to the depressions.
  • a control measurement of the component units can take place in the disc assembly. LIST OF REFERENCE NUMBERS
  • optically active structure 3 passivation layer
  • 9 exposed contact area, also 9a, 9b; 9a ', 9b'; 9a ", 9b".
  • plastic material plastic housing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé simplifié de montage de composants optoélectroniques, revêtus de matière plastique et leur structure. L'unité de composants individuelle contient une puce à semi-conducteurs (11) et une fenêtre optique (10). Une inclusion hermétique d'au moins des zones à activité optique de la puce à semi-conducteurs par la fenêtre s'effectue dès le processus préliminaire, c.-à-d. avant l'opération de séparation. Une tranche (à fenêtre) munie de dépressions (7) et recouverte, par endroits, d'une couche de jonction, est reliée à la tranche à semi-conducteurs (1) préparée au préalable, par l'intermédiaire de la couche de jonction qui étanchéifier des zones à activités optique. Avant l'opération de séparation, les zones de contact et les zones de séparation de la séparation sont dégagées, par répartition de la tranche (à fenêtre), de manière précise en termes de dépressions ciblées. Une mesure de contrôle des unités de composants peut être effectuée dans la structure de tranches assemblées.
EP04738518A 2003-05-19 2004-05-19 Production d'un composant optoelectronique encapsule, dans une matiere plastique, et procedes correspondants Withdrawn EP1625627A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2003122751 DE10322751B3 (de) 2003-05-19 2003-05-19 Verfahren zur Herstellung eines in Kunststoff verschlossenen optoelektronischen Bauelementes
PCT/DE2004/001045 WO2004105117A2 (fr) 2003-05-19 2004-05-19 Production d'un composant optoelectronique ferme, en matiere plastique, et procedes correspondants

Publications (1)

Publication Number Publication Date
EP1625627A2 true EP1625627A2 (fr) 2006-02-15

Family

ID=33477508

Family Applications (1)

Application Number Title Priority Date Filing Date
EP04738518A Withdrawn EP1625627A2 (fr) 2003-05-19 2004-05-19 Production d'un composant optoelectronique encapsule, dans une matiere plastique, et procedes correspondants

Country Status (3)

Country Link
US (1) US20060124915A1 (fr)
EP (1) EP1625627A2 (fr)
WO (1) WO2004105117A2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7760039B2 (en) * 2002-10-15 2010-07-20 Marvell World Trade Ltd. Crystal oscillator emulator
US7301408B2 (en) * 2002-10-15 2007-11-27 Marvell World Trade Ltd. Integrated circuit with low dielectric loss packaging material
US7791424B2 (en) * 2002-10-15 2010-09-07 Marvell World Trade Ltd. Crystal oscillator emulator
US20060113639A1 (en) * 2002-10-15 2006-06-01 Sehat Sutardja Integrated circuit including silicon wafer with annealed glass paste
US7768360B2 (en) * 2002-10-15 2010-08-03 Marvell World Trade Ltd. Crystal oscillator emulator

Family Cites Families (15)

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US5323051A (en) * 1991-12-16 1994-06-21 Motorola, Inc. Semiconductor wafer level package
US5534725A (en) * 1992-06-16 1996-07-09 Goldstar Electron Co., Ltd. Resin molded charge coupled device package and method for preparation thereof
KR940001333A (ko) * 1992-06-16 1994-01-11 문정환 수지봉합형 고체촬상소자 패키지 및 그 제조방법
US5448014A (en) * 1993-01-27 1995-09-05 Trw Inc. Mass simultaneous sealing and electrical connection of electronic devices
NL9400766A (nl) * 1994-05-09 1995-12-01 Euratec Bv Werkwijze voor het inkapselen van een geintegreerde halfgeleiderschakeling.
KR0148733B1 (ko) * 1995-04-27 1998-08-01 문정환 고체 촬상 소자용 패키지 및 그 제조방법
US5965933A (en) * 1996-05-28 1999-10-12 Young; William R. Semiconductor packaging apparatus
US5798557A (en) * 1996-08-29 1998-08-25 Harris Corporation Lid wafer bond packaging and micromachining
US6583444B2 (en) * 1997-02-18 2003-06-24 Tessera, Inc. Semiconductor packages having light-sensitive chips
US6117705A (en) * 1997-04-18 2000-09-12 Amkor Technology, Inc. Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
IL133453A0 (en) * 1999-12-10 2001-04-30 Shellcase Ltd Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby
JP4320892B2 (ja) * 2000-01-20 2009-08-26 株式会社デンソー 接合基板の切断方法
US6503780B1 (en) * 2000-07-05 2003-01-07 Amkor Technology, Inc. Wafer scale image sensor package fabrication method
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Non-Patent Citations (1)

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Title
See references of WO2004105117A2 *

Also Published As

Publication number Publication date
WO2004105117A8 (fr) 2005-12-22
WO2004105117A2 (fr) 2004-12-02
WO2004105117A3 (fr) 2005-02-03
US20060124915A1 (en) 2006-06-15

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