EP1619752B1 - Antenna module - Google Patents

Antenna module Download PDF

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Publication number
EP1619752B1
EP1619752B1 EP05015079.6A EP05015079A EP1619752B1 EP 1619752 B1 EP1619752 B1 EP 1619752B1 EP 05015079 A EP05015079 A EP 05015079A EP 1619752 B1 EP1619752 B1 EP 1619752B1
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EP
European Patent Office
Prior art keywords
antenna
module according
patch
antenna module
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
EP05015079.6A
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German (de)
French (fr)
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EP1619752A1 (en
Inventor
Mehran Aminzadeh
Florian Scherbel
Meinolf Schafmeister
Keno Mennenga
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Molex CVS Hildesheim GmbH
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Laird Technologies GmbH
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Publication of EP1619752A1 publication Critical patent/EP1619752A1/en
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Publication of EP1619752B1 publication Critical patent/EP1619752B1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/27Adaptation for use in or on movable bodies
    • H01Q1/32Adaptation for use in or on road or rail vehicles
    • H01Q1/325Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
    • H01Q1/3275Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00Antenna arrays or systems
    • H01Q21/28Combinations of substantially independent non-interacting antenna units or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/0407Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the invention relates to an antenna module for frequencies in the GHz range, which can be attached to a motor vehicle.
  • Such an antenna module integrates various functions of roof antennas for motor vehicles.
  • microstrip patch antennas are known, which have a substrate which is metallized over its entire surface and has on its upper side a suitable metal structure or antenna structure.
  • Such antennas generally have a narrow frequency bandwidth, e.g. 1% to 2% relative bandwidth if no additional measures are foreseen.
  • parasitic elements By employing parasitic elements, greater bandwidth or the ability to cover multiple frequency bands can be achieved.
  • These parasitic elements are line structures which are formed on the same or a higher level than the antenna structure. When forming the parasitic elements on a higher antenna structure, these are coupled to the lower antenna structure, wherein a common RF tap on the lower antenna structure to an amplifier device takes place. In the parasitic elements high-frequency currents are induced, which adapt to the shape and dimension of the parasitic elements and thus in turn generate fields. This gives the entire structure the opportunity to radiate and receive at neighboring frequencies or even at slightly more distant frequencies
  • antenna modules with separate side-by-side antenna elements are typically used. However, this requires a lot of space. Furthermore, sufficient decoupling is necessary for proper functioning of the individual antenna elements.
  • the EP 0 521 384 A1 shows an antenna module with an upper and a lower substrate, wherein on the upper substrate, an upper ⁇ / 2 antenna structure and on the lower substrate, a lower ⁇ / 2 antenna structure is applied. Both antenna structures serve a metal layer provided below the lower substrate as a reference surface, so that a parallel connection of the two antenna resonant circuits results.
  • the US 2004/0051661 A1 shows an antenna module for GPS signals and telematic Dedicated Short Range Communications for Road Transport Telematics (DSRC) signals.
  • a metallic ground plane is provided on a printed circuit board.
  • a first antenna is formed by the metallic ground plane, a dielectric placed thereon and an antenna structure formed thereon.
  • a second antenna is formed by the metallic ground plane, the dielectric of the first antenna and another dielectric provided above, and an upper second antenna structure for terrestrial reception.
  • the DE 101 33 295 A1 shows an antenna assembly for motor vehicles for mounting on a substantially horizontal metallic body surface having radiators for a plurality of gap-separated frequency bands of the GHz range.
  • the US-A-4,827,271 shows a patch antenna with vias between the antenna structure and the metallization for potential matching.
  • the invention has for its object to provide an antenna module, which ensures a compact design and a versatile functionality with high security and easy accessibility of Einkoppell the vias.
  • the lower patch antenna is designed to be larger than the upper patch antenna for an effective radiation property.
  • the patch antennas have substrate materials on whose upper side corresponding ⁇ / 2 antenna structures are formed.
  • a lower metallization is provided on the underside of the lower substrate.
  • the underside of the upper substrate has a metallization or it is at a MetaIltechnik on. Both substrates can basically be metallised on their underside.
  • z. B an additional dielectric between the lower metallization of the upper patch antenna and the antenna structure of the lower patch antenna are. The coupling point of the lower antenna tap to the lower antenna structure is not covered by the upper substrate.
  • the stacked patch antennas are decoupled.
  • the two metallizations of the patch antennas - ie the lower metallization of the lower patch antenna and the metallization of the upper patch antenna or acting as this antenna structure of the lower patch antenna separately formed.
  • the EP 0 521 384 A1 According to the invention less is a broadband system, but an arrangement of two decoupled antennas are created.
  • ⁇ / 2 antenna elements or antenna structures are provided according to the invention. They are designed here for satellite reception, ie signals with circular polarization at an elevation angle of substantially 30 ° to 90 ° relative to the horizontal.
  • parasitic elements are optionally provided above the antenna base structure and coupled directly to the lower antenna structure, a separate tap for the separate upper ⁇ / 2 antenna structure is provided according to the invention.
  • the signals are advantageously tapped coaxially.
  • the preferably coaxial tap can in this case take place on the lower metallization of the lower patch antenna or a printed circuit board provided here.
  • a via can be provided by the lower patch antenna, which serves the two metallizations or the antenna structure of the lower patch antenna serving as metallization of the upper patch antenna and the metallization the lower patch antenna connects galvanically.
  • This through-connection advantageously takes place in the middle of the ⁇ / 2 antenna structure, since here there is a maximum of the current distribution and correspondingly a minimum of the magnitude of the voltage.
  • the laterally central region of the antenna structure can be short-circuited without causing any adverse effects on the current and field distribution.
  • the antenna module according to the invention can eg for the reception of GPS signals in L-band, ie at 1575 MHz, and the satellite-based digital radio services DAB worldStar (WorldSpace) in Africa and Asia at 1467 MHz to 1492 MHz and DMB (Digital Multimedia Broadcasting) Far East Asia at 2630 MHz to 2655 MHz and SDARS (Satellite Digital Audio Reception System) at 2320 MHz to 2345 MHz in the US.
  • the selection of the frequency bands for the upper and lower patch antenna is done on the one hand by the dimensioning of the antenna structures.
  • the dielectric material of the substrates can be chosen such that the appropriate frequency bands are achieved.
  • the upper, smaller patch antenna can cover a service of lower frequency by the upper substrate has a correspondingly higher dielectric constant than the lower substrate.
  • the patch antennas may also receive terrestrial signals in addition to satellite reception; such as e.g. the lower patch antenna for SDARS received supplementary terrestrial.
  • the upper patch antenna is advantageously provided for GPS reception.
  • active patch receiving antennas are advantageously formed, with a low-noise amplifier (LNA) being integrated at the base of the antenna.
  • the low-noise amplifiers are mounted on the underside of a printed circuit board, on the upper side of which the lower patch antenna is provided.
  • one of the low-noise amplifiers may be provided on one printed circuit board and the other on a separate printed circuit board.
  • only parts of a low-noise amplifier can be constructed on a separate circuit board, this separate part preferably includes the DC voltage supply or regulation, so that the connection of the two circuit boards by a simple wire connection, e.g. a wire pin can be realized.
  • the antenna module according to the invention can additionally also have a terrestrial antenna, e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz).
  • a terrestrial antenna e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz).
  • the terrestrial antenna can be arranged in front of, behind or on the stack of patch antennas, advantageously in the direction of travel behind it.
  • the two patch antennas are combined with a telephone antenna, advantageously a suitable filter technique is provided in the amplifiers, which already has the relatively strong transmission signal of the telephone antenna at the input of the amplifier suppressed. This can protect the amplifier or the separate amplifier against saturation effects.
  • the antenna module can be designed as a group antenna with a plurality of elements each consisting of an upper patch antenna and a lower patch antenna.
  • the elements in the group can serve as transmitting and / or receiving antenna.
  • the antenna module can serve as a transmitting and receiving antenna, wherein one of the two patch antennas serves as a transmitting and the other as a receiving antenna; This is particularly useful in a group antenna, in each case one of the two antennas of each stack serves as a transmitting and the other as a receiving antenna.
  • An in Fig. 1 shown antenna module 1 has according to Fig. 1 a base plate 2, which may be formed, for example, as a metal plate, a base plate 2 attached to the lower circuit board 3 and a parallel and above this running upper circuit board 4.
  • a base plate 2 which may be formed, for example, as a metal plate
  • a base plate 2 attached to the lower circuit board 3 and a parallel and above this running upper circuit board 4.
  • two separate and electromagnetically shielded amplifier chambers 7 and 8 are provided in the lateral direction by a metallic wall 6.
  • they can be parts of a common amplifier chamber, which is subdivided by the metallic wall 6.
  • a lower patch antenna 10 which comprises a lower substrate 11 made of a dielectric, e.g. Ceramics, a formed on the upper side of the lower substrate 11 lower ⁇ / 2 antenna structure 12 and formed on the underside of the lower substrate 11 lower full-surface metallization 13 has.
  • the lower ⁇ / 2 antenna structure 12 is contacted via a via 14 passing through the lower substrate 11 to a first low noise amplifier (LNA) 16 received in the left amplifier chamber 7 and attached to the underside of the upper circuit board 4, which detects the received RF signals. Amplified signals and via a first (left) coaxial tap 18 forwards.
  • the via 14 may in this case be contacted with the amplifier 16 directly or advantageously indirectly via a conductor track of the upper printed circuit board 4.
  • Fig. 1 In this case, the coupling point of the via 14 at the lower antenna structure 12 from the upper antenna structure 22 not covered; In this case, this coupling-in point is not covered by the upper substrate 21, so that this coupling-in point can be soldered as a soldering point, without it colliding with the upper substrate 21 and z. B. is to form a corresponding recess in the upper substrate.
  • an upper patch antenna 20 comprising an upper substrate 21, an upper ⁇ / 2 antenna structure 22 formed on the upper surface of the upper substrate 21, and a full-surface upper formed on the lower surface of the upper substrate 21 Metallization 23 has.
  • the upper ⁇ / 2 antenna structure 22 is contacted via an upper through-hole 24 directly or via the upper printed circuit board 4 with a second low-noise amplifier (LNA) 26 mounted on the underside of the upper printed circuit board 4 and received in the right-hand amplifier chamber 8 Amplified RF signals and passes on a second (right) coaxial tap 28.
  • LNA low-noise amplifier
  • a through hole 19 extending through the lower substrate 11 galvanically connects the lower ⁇ / 2 antenna structure 12 to the lower metallization 13, thus laying them at an equal potential.
  • the plated-through hole 19 advantageously takes place in the center of the lower ⁇ / 2 antenna structure 12, since in this region no significant voltages, but a current maximum of the induced RF currents occurs.
  • Parts of the low-noise amplifiers 7, 8 can also be constructed on the separate printed circuit board 3.
  • the pitch of the amplifiers 7, 8 may only relate to the DC power supply or even be designed for a whole or several RF amplifier stages. Alternatively, both amplifiers 7, 8 may be accommodated on a separate circuit board. If a DC voltage separation is provided, a simple wire connection 32 between the two circuit boards 3 and 4 may be provided as an electrical connection.
  • the upper patch antenna 20 with the upper ⁇ / 2 antenna structure 22 is smaller than the lower patch antenna 10 with the lower ⁇ / 2 antenna structure 12, whereby good radiation properties of the ⁇ / 2 antennas 10, 20 are achieved.
  • the lower patch antenna 10 can also be provided for terrestrial reception, for example in SDARS.
  • the upper, smaller patch antenna 20 is designed for lower frequency bands and the lower patch antenna 10 for higher frequency bands; by appropriate choice of the dielectric constant ⁇ r , however, the frequency bands can basically be set freely; Accordingly, the upper patch antenna 20 may also be provided for a lower frequency band, in which the upper substrate 21 has a correspondingly higher dielectric constant ⁇ r .
  • the metallization 23 of the upper patch antenna 20 can be omitted so that the upper substrate 21 sees the lower antenna structure 12 arranged below it as a metallization.
  • the antenna module 41 of Fig. 2 is basically the same as the one of Fig. 1 constructed and correspondingly provided with the same reference numerals.
  • the first (left) amplifier 16 is constructed on the lower circuit board 3.
  • the RF portion of the first amplifier 16 may be on the separate one; be constructed lower board 3.
  • an HF connection formed, for example, by a coaxial line 43 is provided between the printed circuit boards 3 and 4.
  • Fig. 3 shows an antenna module 51, in which on the base plate 2 in addition to the in Fig. 1 2 or later, an antenna 53 is provided, which is designed as a monopole or is oriented mainly vertically.
  • the antenna 53 may be implemented, for example, as a dual or multi-band radio antenna or AM / FM radio receiving antenna, as a terrestrial DAB antenna (L-band or band III), or as a combination of these antennas.
  • a third amplifier 55 is e.g. provided below the antenna 53 in a separate chamber; the amplifiers 16, 26 and 55 can also share functions.
  • Fig. 4a to c show embodiments for band-lock filter 60. These filters are designed so that the transmission band of the radio antenna 53 is sufficiently suppressed, so that no interference is caused in a simultaneous operation of radio and digital radio or GPS.
  • a line piece 62 is provided as an inductance, which with a capacitor C according to Fig. 4a a row closure and according to Fig. 4c forms a parallel connection.
  • a line 64 is provided as a ⁇ / 4 line, which causes an open-circuit short-circuit transformation.
  • the dummy element Z is each provided for the purpose of adaptation and may be a capacitor, a coil or a combination of such elements in a corresponding circuit.
  • the band-lock filters 60 are each connected with their input 66 to the respective antenna base point and with its output 67 to the input of the respective amplifier.

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  • Remote Sensing (AREA)
  • Physics & Mathematics (AREA)
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Description

Die Erfindung betrifft ein Antennenmodul für Frequenzen im GHz-Bereich, das an einem Kraftfahrzeug befestigt werden kann.The invention relates to an antenna module for frequencies in the GHz range, which can be attached to a motor vehicle.

Ein derartiges Antennenmodul integriert verschiedene Funktionen von Dachantennen für Kraftfahrzeuge. Hierbei sind Mikrostreifen-Patch-Antennen bekannt, die ein Substrat aufweisen, das auf seiner Unterseite vollflächig metallisiert ist und auf seiner Oberseite eine geeignete Metallstruktur bzw. Antennenstruktur aufweist. Derartige Antennen haben im Allgemeinen eine schmale Frequenzbandbreite, z.B. 1 % bis 2 % relative Bandbreite, falls keine zusätzlichen Maßnahmen vorgesehen sind. Durch das Einsetzen parasitärer Elemente kann eine größere Bandbreite oder die Fähigkeit, mehrere Frequenzbänder abzudecken, erreicht werden. Diese parasitären Elemente sind Leitungs- oder Flächenstrukturen, welche auf derselben oder einer höheren Ebene als die Antennenstruktur ausgebildet sind. Bei Ausbildung der parasitären Elemente auf einer höheren Antennenstruktur sind diese mit der unteren Antennenstruktur gekoppelt, wobei ein gemeinsamer HF-Abgriff an der unteren Antennenstruktur zu einer Verstärkereinrichtung erfolgt. In den parasitären Elementen werden Hochfrequenzströme induziert, welche sich an die Form und Dimension der parasitären Elemente anpassen und damit ihrerseits Felder erzeugen. Hierdurch gibt man dem gesamten Gebilde die Möglichkeit, auch bei Nachbarfrequenzen oder sogar bei etwas entfernteren Frequenzen zu strahlen und zu empfangenSuch an antenna module integrates various functions of roof antennas for motor vehicles. Here, microstrip patch antennas are known, which have a substrate which is metallized over its entire surface and has on its upper side a suitable metal structure or antenna structure. Such antennas generally have a narrow frequency bandwidth, e.g. 1% to 2% relative bandwidth if no additional measures are foreseen. By employing parasitic elements, greater bandwidth or the ability to cover multiple frequency bands can be achieved. These parasitic elements are line structures which are formed on the same or a higher level than the antenna structure. When forming the parasitic elements on a higher antenna structure, these are coupled to the lower antenna structure, wherein a common RF tap on the lower antenna structure to an amplifier device takes place. In the parasitic elements high-frequency currents are induced, which adapt to the shape and dimension of the parasitic elements and thus in turn generate fields. This gives the entire structure the opportunity to radiate and receive at neighboring frequencies or even at slightly more distant frequencies

Derartige Antennenaufbauten sind jedoch nur dann geeignet, wenn das ganze erweiterte Frequenzband für denselben Dienst zur Verfügung steht.However, such antenna structures are only suitable if the whole extended frequency band is available for the same service.

Falls mehrere unabhängige Dienste vorgesehen sind, werden in der Regel Antennenmodule mit separaten nebeneinander aufgebauten Antennenelementen verwendet. Hierfür ist jedoch ein hoher Platzbedarf erforderlich. Weiterhin ist für eine einwandfreie Funktion der einzelnen Antennenelemente eine ausreichende Entkopplung erforderlich.If several independent services are provided, antenna modules with separate side-by-side antenna elements are typically used. However, this requires a lot of space. Furthermore, sufficient decoupling is necessary for proper functioning of the individual antenna elements.

Die EP 0 521 384 A1 zeigt ein Antennenmodul mit einem oberen und einem unteren Substrat, wobei auf dem oberen Substrat eine obere λ/2-Antennenstruktur und auf dem unteren Substrat eine untere λ/2-Antennenstruktur aufgebracht ist. Beiden Antennenstrukturen dient eine unterhalb des unteren Substrates vorgesehene Metallschicht als Referenzfläche, so dass sich eine Parallelschaltung der beiden Antennenschwingkreise ergibt.The EP 0 521 384 A1 shows an antenna module with an upper and a lower substrate, wherein on the upper substrate, an upper λ / 2 antenna structure and on the lower substrate, a lower λ / 2 antenna structure is applied. Both antenna structures serve a metal layer provided below the lower substrate as a reference surface, so that a parallel connection of the two antenna resonant circuits results.

Die US 2004/0051661 A1 zeigt ein Antennenmodul für GPS-Signale und telematische DSRC (Dedicated Short Range Communications for Road Transport Telematics)-Signale. Hierbei ist eine metallische Grundebene auf einer Leiterplatte vorgesehen. Eine erste Antenne wird durch die metallische Grundebene, ein darauf gesetztes Dielektrikum sowie eine darauf ausgebildete Antennenstruktur gebildet. Eine zweite Antenne wird durch die metallische Grundebene, das Dielektrikum der ersten Antenne sowie ein weiteres, darüber vorgesehenes Dielektrikum und eine obere zweite Antennenstruktur für terrestrischen Empfang ausgebildet.The US 2004/0051661 A1 shows an antenna module for GPS signals and telematic Dedicated Short Range Communications for Road Transport Telematics (DSRC) signals. Here, a metallic ground plane is provided on a printed circuit board. A first antenna is formed by the metallic ground plane, a dielectric placed thereon and an antenna structure formed thereon. A second antenna is formed by the metallic ground plane, the dielectric of the first antenna and another dielectric provided above, and an upper second antenna structure for terrestrial reception.

Die DE 101 33 295 A1 zeigt eine Antennenanordnung für Kraftfahrzeuge zur Anbringung auf einer in Wesentlichen waagerechten metallischen Karosserieoberfläche, die Strahler für mehrere, durch Lücken getrennte Frequenzbänder des GHz-Bereichs aufweist.The DE 101 33 295 A1 shows an antenna assembly for motor vehicles for mounting on a substantially horizontal metallic body surface having radiators for a plurality of gap-separated frequency bands of the GHz range.

Die US-A-4,827,271 zeigt eine Patch-Antenne mit Durchkontaktierungen zwischen der Antennenstruktur und der Metallisierung zum Potentialabgleich.The US-A-4,827,271 shows a patch antenna with vias between the antenna structure and the metallization for potential matching.

Der Erfindung liegt die Aufgabe zugrunde, ein Antennenmodul zu schaffen, das einen kompakten Aufbau und eine vielseitige Funktionalität bei hoher Sicherheit und eine leichte Zugänglichkeit der Einkoppelpunkte der Durchkontaktierungen gewährleistet.The invention has for its object to provide an antenna module, which ensures a compact design and a versatile functionality with high security and easy accessibility of Einkoppelpunkte the vias.

Diese Aufgabe wird durch ein Antennenmodul nach Anspruch 1 gelöst. Die Unteransprüche beschreiben bevorzugte Weiterbildungen.This object is achieved by an antenna module according to claim 1. The dependent claims describe preferred developments.

Erfindungsgemäß werden somit zwei unterschiedlich große λ/2-Patch-Antennen übereinander gesetzt und separat abgegriffen. Die untere Patch-Antenne ist hierbei für eine effektive Strahlungseigenschaft größer als die obere Patch-Antenne ausgebildet. Die Patch-Antennen weisen unabhängig voneinander Substratmaterialien auf, an deren Oberseiten entsprechende λ/2-Antennenstrukturen ausgebildet sind. Auf der Unterseite des unteren Substrates ist eine untere Metallisierung vorgesehen. Die Unterseite des oberen Substrates weist eine Metallisierung auf oder sie liegt an einer MetaIlisierung an. Beide Substrate können grundsätzlich auf ihrer Unterseite metallisiert sein. Bei einer derartigen Ausführungsform kann grundsätzlich auch z. B. ein zusätzliches Dielektrikum zwischen der unteren Metallisierung der oberen Patch-Antenne und der Antennenstruktur der unteren Patch-Antenne liegen. Der Einkoppelpunkt des unteren Antennenabgriffs an die untere Antennenstruktur ist von dem oberen Substrat nicht bedeckt.Thus, according to the invention, two λ / 2 patch antennas of different sizes are superimposed and tapped separately. The lower patch antenna is designed to be larger than the upper patch antenna for an effective radiation property. Independently of one another, the patch antennas have substrate materials on whose upper side corresponding λ / 2 antenna structures are formed. On the underside of the lower substrate, a lower metallization is provided. The underside of the upper substrate has a metallization or it is at a MetaIlisierung on. Both substrates can basically be metallised on their underside. In such an embodiment, in principle, z. B. an additional dielectric between the lower metallization of the upper patch antenna and the antenna structure of the lower patch antenna are. The coupling point of the lower antenna tap to the lower antenna structure is not covered by the upper substrate.

Gemäß einer vorteilhaften Ausbildung wird jedoch auf der Unterseite des oberen Substrates keine Metallisierung ausgebildet, da dieses Element durch den gestapelten Aufbau direkt auf der metallischen Antennenstruktur der unteren Patch-Antenne sitzt bzw. angeordnet ist und diese direkt als eigene Metallisierung sieht; hierdurch ergeben sich keine funktionellen Nachteile, insbesondere liegt hier keine Kopplung dieser Antennen vor.According to an advantageous embodiment, however, no metallization is formed on the underside of the upper substrate, since this element sits or is arranged by the stacked structure directly on the metallic antenna structure of the lower patch antenna and sees this directly as a separate metallization; This results in no functional disadvantages, in particular, there is no coupling of these antennas.

Erfindungsgemäß sind die übereinander angeordneten Patch-Antennen entkoppelt. Hierzu sind - anders als z. B. bei der eingangs genannten EP 0 521 384 A1 - die beiden Metallisierungen der Patch-Antennen - d.h. die untere Metallisierung der unteren Patch-Antenne und die Metallisierung der oberen Patch-Antenne bzw. die als diese wirkende Antennenstruktur der unteren Patch-Antenne separat ausgebildet. Anders als bei der EP 0 521 384 A1 soll erfindungsgemäß weniger ein breitbandiges System, sondern eine Anordnung von zwei entkoppelten Antennen geschaffen werden.According to the invention, the stacked patch antennas are decoupled. For this purpose - unlike z. B. in the aforementioned EP 0 521 384 A1 - The two metallizations of the patch antennas - ie the lower metallization of the lower patch antenna and the metallization of the upper patch antenna or acting as this antenna structure of the lower patch antenna separately formed. Unlike the EP 0 521 384 A1 According to the invention less is a broadband system, but an arrangement of two decoupled antennas are created.

Weiterhin sind - anders als bei den meisten herkömmlichen, für terrestrischen Empfang vorgesehenen Antennenmodulen mit λ/4- Antennenelementen - erfindungsgemäß λ/2-Antennenelemente bzw. Antennenstrukturen vorgesehen. Sie sind hierbei für einen Satellitenempfang ausgebildet, d.h. Signale mit zirkularer Polarisation unter einem Elevationswinkel von im Wesentlichen 30° bis 90° gegenüber der Horizontalen. Anders als bei herkömmlichen Antennenstrukturen, bei denen oberhalb der Antennengrundstruktur gegebenenfalls parasitäre Elemente vorgesehen und direkt mit der unteren Antennenstruktur gekoppelt sind, ist erfindungsgemäß ein separater Abgriff für die separate obere λ/2-Antennenstruktur vorgesehen.Furthermore, in contrast to most conventional antenna modules provided with λ / 4 antenna elements for terrestrial reception, λ / 2 antenna elements or antenna structures are provided according to the invention. They are designed here for satellite reception, ie signals with circular polarization at an elevation angle of substantially 30 ° to 90 ° relative to the horizontal. Unlike conventional antenna structures, in which parasitic elements are optionally provided above the antenna base structure and coupled directly to the lower antenna structure, a separate tap for the separate upper λ / 2 antenna structure is provided according to the invention.

Die Signale werden vorteilhafterweise koaxial abgegriffen. Der vorzugsweise koaxiale Abgriff kann hierbei auf der unteren Metallisierung der unteren Patch-Antenne bzw. einer hier vorgesehenen Leiterplatte erfolgen. Um dasselbe Bezugspotential für die Metallisierungen der beiden Patch-Antennen zu realisieren, kann eine Durchkontaktierung durch die untere Patch-Antenne vorgesehen sein, die die beiden Metallisierungen bzw. die als Metallisierung der oberen Patch-Antenne dienende Antennenstruktur der unteren Patch-Antenne und die Metallisierung der unteren Patch-Antenne galvanisch verbindet. Diese Durchkontaktierung erfolgt hierbei vorteilhafterweise in der Mitte der λ/2-Antennenstruktur, da hier ein Maximum der Stromverteilung und entsprechend ein Minimum des Betrags der Spannung vorliegt. Somit kann der lateral mittlere Bereich der Antennenstruktur kurzgeschlossen werden, ohne dass Beeinträchtigungen in der Strom- und Feldverteilung entstehen.The signals are advantageously tapped coaxially. The preferably coaxial tap can in this case take place on the lower metallization of the lower patch antenna or a printed circuit board provided here. In order to realize the same reference potential for the metallizations of the two patch antennas, a via can be provided by the lower patch antenna, which serves the two metallizations or the antenna structure of the lower patch antenna serving as metallization of the upper patch antenna and the metallization the lower patch antenna connects galvanically. This through-connection advantageously takes place in the middle of the λ / 2 antenna structure, since here there is a maximum of the current distribution and correspondingly a minimum of the magnitude of the voltage. Thus, the laterally central region of the antenna structure can be short-circuited without causing any adverse effects on the current and field distribution.

Das erfindungsgemäße Antennenmodul kann z.B. für den Empfang von GPS-Signalen im L-Band, d.h. bei 1575 MHz, und der satellitengestützten digitalen Radiodienste DAB worldStar (WorldSpace) in Afrika und Asien bei 1467 MHz bis 1492 MHz sowie DMB (Digital Mulimedia Broadcasting) in Fernost-Asien bei 2630 MHz bis 2655 MHz und SDARS (Satellite Digital Audio Reception System) bei 2320 MHz bis 2345 MHz in den USA eingesetzt werden. Die Auswahl der Frequenzbänder für die obere und untere Patch-Antenne erfolgt zum einen durch die Dimensionierung der Antennenstrukturen. Zusätzlich kann entsprechend das dielektrische Material der Substrate derartig gewählt werden, dass die geeigneten Frequenzbänder erreicht werden. Somit kann grundsätzlich auch die obere, kleinere Patch-Antenne einen Dienst niedrigerer Frequenz decken, indem das obere Substrat eine entsprechend höhere Dielektrizitätskontante als das untere Substrat aufweist.The antenna module according to the invention can eg for the reception of GPS signals in L-band, ie at 1575 MHz, and the satellite-based digital radio services DAB worldStar (WorldSpace) in Africa and Asia at 1467 MHz to 1492 MHz and DMB (Digital Multimedia Broadcasting) Far East Asia at 2630 MHz to 2655 MHz and SDARS (Satellite Digital Audio Reception System) at 2320 MHz to 2345 MHz in the US. The selection of the frequency bands for the upper and lower patch antenna is done on the one hand by the dimensioning of the antenna structures. In addition, according to the dielectric material of the substrates can be chosen such that the appropriate frequency bands are achieved. Thus, in principle, the upper, smaller patch antenna can cover a service of lower frequency by the upper substrate has a correspondingly higher dielectric constant than the lower substrate.

Die Patch-Antennen können zusätzlich zu dem Satellitenempfang auch terrestrische Signale empfangen; so kann z.B. die untere Patch-Antenne für SDARS ergänzend terrestrisch empfangen. Die obere Patch-Antenne ist vorteilhafterweise für GPS-Empfang vorgesehen.The patch antennas may also receive terrestrial signals in addition to satellite reception; such as e.g. the lower patch antenna for SDARS received supplementary terrestrial. The upper patch antenna is advantageously provided for GPS reception.

Erfindungsgemäß sind vorteilhafterweise aktive Patch-Empfangsantennen ausgebildet, wobei ein rauscharmer Verstärker (low noise amplifier, LNA) am Antennenfußpunkt integriert ist. Vorteilhafterweise werden die rauscharmen Verstärker auf der Unterseite einer Leiterplatte angebracht, auf deren Oberseite die untere Patch-Antenne vorgesehen ist. Weiterhin kann einer der rauscharmen Verstärker auf einer Leiterplatte und der andere auf einer separaten Leiterplatte vorgesehen sein. Weiterhin können auch nur Teile eines Rauscharmen Verstärkers auf einer separaten Leiterplatte aufgebaut sein, wobei dieser separate Teil vorzugsweise die Gleichspannungsversorgung bzw. -regelung enthält, so dass die Verbindung der beiden Leiterplatten durch eine einfache Drahtverbindung, z.B. einen Drahtpin realisiert werden kann.According to the invention, active patch receiving antennas are advantageously formed, with a low-noise amplifier (LNA) being integrated at the base of the antenna. Advantageously, the low-noise amplifiers are mounted on the underside of a printed circuit board, on the upper side of which the lower patch antenna is provided. Furthermore, one of the low-noise amplifiers may be provided on one printed circuit board and the other on a separate printed circuit board. Furthermore, only parts of a low-noise amplifier can be constructed on a separate circuit board, this separate part preferably includes the DC voltage supply or regulation, so that the connection of the two circuit boards by a simple wire connection, e.g. a wire pin can be realized.

Das erfindungsgemäße Antennenmodul kann weiterhin ergänzend auch eine terrestrische Antenne aufweisen, z.B. einen (Mehrband-) Monopol oder eine (Mehrband-) Stabantenne wie z.B. für Telefondienste, AM/FM oder terrestrisches DAB im L-Band (1452 MHz bis 1492 MHz) sowie Band III (170 MHz bis 230 MHz). Die terrestrische Antenne kann vor, hinter oder auf dem Stapel aus Patch-Antennen, vorteilhafterweise in Fahrtrichtung hinter dieser, angeordnet sein.The antenna module according to the invention can additionally also have a terrestrial antenna, e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz). The terrestrial antenna can be arranged in front of, behind or on the stack of patch antennas, advantageously in the direction of travel behind it.

Falls die beiden Patch Antennen mit einer Telefonantenne kombiniert sind, ist vorteilhafterweise eine geeignete Filtertechnik in den Verstärkern vorgesehen, die das relativ starke Sendesignal der Telefonantenne bereits am Eingang der Verstärker unterdrückt. Hierdurch kann man den Verstärker bzw. die separaten Verstärker gegen Sättigungseffekte schützen.If the two patch antennas are combined with a telephone antenna, advantageously a suitable filter technique is provided in the amplifiers, which already has the relatively strong transmission signal of the telephone antenna at the input of the amplifier suppressed. This can protect the amplifier or the separate amplifier against saturation effects.

Weiterhin kann das Antennenmodul als Gruppenantenne mit mehreren Elementen aus jeweils einem oberen Patch-Antenne und einer unteren Patch-Antenne ausgebildet sein. Die Elemente in der Gruppe können als Sende- und/oder Empfangsantenne dienen.Furthermore, the antenna module can be designed as a group antenna with a plurality of elements each consisting of an upper patch antenna and a lower patch antenna. The elements in the group can serve as transmitting and / or receiving antenna.

Das Antennenmodul kann als Sende- und Empfangsantenne dienen, wobei eine der beiden Patchantennen als Sende- und die andere als Empfangsantenne dient; dies ist insbesondere in einer Gruppenantenne sinnvoll, bei der von jedem Stapel jeweils eine der beiden Antennen als Sende- und die andere als Empfangsantenne dient.The antenna module can serve as a transmitting and receiving antenna, wherein one of the two patch antennas serves as a transmitting and the other as a receiving antenna; This is particularly useful in a group antenna, in each case one of the two antennas of each stack serves as a transmitting and the other as a receiving antenna.

Die Erfindung wird im Folgenden anhand der beiliegenden Zeichnungen an einigen Ausführungsformen näher erläutert. Es zeigen:

Fig. 1
den Aufbau eines Antennenmoduls gemäß einer ersten Ausführungsform mit zwei auf einer gemeinsamen Leiterplatte vorgesehenen Verstärkern;
Fig. 2
den Aufbau eines Antennenmoduls gemäß einer weiteren Ausführungsform mit auf unterschiedlichen Leiterplatten angeordneten Verstärkern der Antennenelemente;
Fig. 3
den Aufbau eines Antennenmoduls gemäß einer weite ren Ausführungsform mit einer zusätzlichen, im Wesentlichen vertikal ausgerichteten terrestrischen Antenne;
Fig. 4 a bis c
verschiedene Ausführungsformen für Band-Sperr-Filter für das Antennenmodul der Fig. 3 zur Unterdrückung des Sendebandes der terrestrischen Funkantenne.
The invention will be explained in more detail below with reference to the accompanying drawings of some embodiments. Show it:
Fig. 1
the construction of an antenna module according to a first embodiment with two provided on a common circuit board amplifiers;
Fig. 2
the construction of an antenna module according to a further embodiment with arranged on different circuit boards amplifiers of the antenna elements;
Fig. 3
the construction of an antenna module according to a wide ren embodiment with an additional, substantially vertically aligned terrestrial antenna;
Fig. 4 a to c
various embodiments for band-blocking filter for the antenna module of Fig. 3 to suppress the transmission band of the terrestrial radio antenna.

Ein in Fig. 1 gezeigtes Antennenmodul 1 weist gemäß Fig. 1 eine Grundplatte 2, die z.B. als Metallplatte ausgebildet sein kann, eine auf der Grundplatte 2 befestigte untere Leiterplatte 3 und eine parallel und oberhalb von dieser verlaufende obere Leiterplatte 4 auf. Zwischen der oberen Leiterplatte 4 und der Grundplatte 2 sind zwei in lateraler Richtung durch eine metallische Wand 6 getrennte und elektromagnetisch abgeschirmte Verstärkerkammern 7 und 8 vorgesehen. Sie können insbesondere Teile einer gemeinsamen Verstärkerkammer sein, die durch die metallische Wand 6 unterteilt ist.An in Fig. 1 shown antenna module 1 has according to Fig. 1 a base plate 2, which may be formed, for example, as a metal plate, a base plate 2 attached to the lower circuit board 3 and a parallel and above this running upper circuit board 4. Between the upper circuit board 4 and the base plate 2, two separate and electromagnetically shielded amplifier chambers 7 and 8 are provided in the lateral direction by a metallic wall 6. In particular, they can be parts of a common amplifier chamber, which is subdivided by the metallic wall 6.

Auf der oberen Leiterplatte 4 ist eine untere Patch-Antenne 10 angebracht, die ein unteres Substrat 11 aus einem Dielektrikum, z.B. Keramik, eine auf der Oberseite des unteren Substrates 11 ausgebildete untere λ/2-Antennenstruktur 12 und eine auf der Unterseite des unteren Substrates 11 ausgebildete untere vollflächige Metallisierung 13 aufweist. Die untere λ/2-Antennenstruktur 12 ist über eine durch das untere Substrat 11 verlaufende Durchkontaktierung 14 mit einem in der linken Verstärkerkammer 7 aufgenommenen, an der Unterseite der oberen Leiterplatte 4 befestigten ersten rauscharmen Verstärker (LNA) 16 kontaktiert, der die aufgenommenen HF-Signale verstärkt und über einen ersten (linken) koaxialen Abgriff 18 weiterleitet. Die Durchkontaktierung 14 kann hierbei mit dem Verstärker 16 direkt oder vorteilhafterweise indirekt über eine Leiterbahn der oberen Leiterplatte 4 kontaktiert sein.Mounted on the upper circuit board 4 is a lower patch antenna 10 which comprises a lower substrate 11 made of a dielectric, e.g. Ceramics, a formed on the upper side of the lower substrate 11 lower λ / 2 antenna structure 12 and formed on the underside of the lower substrate 11 lower full-surface metallization 13 has. The lower λ / 2 antenna structure 12 is contacted via a via 14 passing through the lower substrate 11 to a first low noise amplifier (LNA) 16 received in the left amplifier chamber 7 and attached to the underside of the upper circuit board 4, which detects the received RF signals. Amplified signals and via a first (left) coaxial tap 18 forwards. The via 14 may in this case be contacted with the amplifier 16 directly or advantageously indirectly via a conductor track of the upper printed circuit board 4.

Gemäß Fig. 1 wird hierbei der Einkoppelpunkt der Durchkontaktierung 14 an der unteren Antennenstruktur 12 von der oberen Antennenstruktur 22 nicht überdeckt; hierbei wird dieser Einkoppelpunkt auch nicht von dem oberen Substrat 21 überdeckt, so dass dieser Einkoppelpunkt als Anlötpunkt gelötet werden kann, ohne dass er mit dem oberen Substrat 21 kollidiert und z. B. eine entsprechende Aussparung in dem oberen Substrat auszubilden ist.According to Fig. 1 In this case, the coupling point of the via 14 at the lower antenna structure 12 from the upper antenna structure 22 not covered; In this case, this coupling-in point is not covered by the upper substrate 21, so that this coupling-in point can be soldered as a soldering point, without it colliding with the upper substrate 21 and z. B. is to form a corresponding recess in the upper substrate.

Auf der unteren Patch-Antenne 10 ist eine obere Patch-Antenne 20 befestigt, die ein oberes Substrat 21, eine auf der Oberseite des oberen Substrates 21 ausgebildete obere λ/2-Antennenstruktur 22 und eine auf der Unterseite des oberen Substrates 21 ausgebildete vollflächige obere Metallisierung 23 aufweist. Die obere λ/2-Antennenstruktur 22 ist über eine obere Durchkontaktierung 24 direkt oder über die obere Leiterplatte 4 mit einem auf der Unterseite der oberen Leiterplatte 4 angebrachten, in der rechten Verstärkerkammer 8 aufgenommenen zweiten rauscharmen Verstärker (LNA) 26 kontaktiert, der die aufgenommenen HF-Signale verstärkt und über einen zweiten (rechten) koaxialen Abgriff 28 weitergibt.Mounted on the lower patch antenna 10 is an upper patch antenna 20 comprising an upper substrate 21, an upper λ / 2 antenna structure 22 formed on the upper surface of the upper substrate 21, and a full-surface upper formed on the lower surface of the upper substrate 21 Metallization 23 has. The upper λ / 2 antenna structure 22 is contacted via an upper through-hole 24 directly or via the upper printed circuit board 4 with a second low-noise amplifier (LNA) 26 mounted on the underside of the upper printed circuit board 4 and received in the right-hand amplifier chamber 8 Amplified RF signals and passes on a second (right) coaxial tap 28.

Eine durch das untere Substrat 11 verlaufende Durchkontaktierung 19 verbindet die untere λ/2-Antennenstruktur 12 galvanisch mit der unteren Metallisierung 13 und diese somit auf ein gleiches Potential legt. Die Durchkontaktierung 19 erfolgt hierbei vorteilhafterweise mittig an der unteren λ/2-Antennenstruktur 12, da in diesem Bereich keine wesentlichen Spannungen, sondern ein Strommaximum der induzierten HF-Ströme auftritt.A through hole 19 extending through the lower substrate 11 galvanically connects the lower λ / 2 antenna structure 12 to the lower metallization 13, thus laying them at an equal potential. The plated-through hole 19 advantageously takes place in the center of the lower λ / 2 antenna structure 12, since in this region no significant voltages, but a current maximum of the induced RF currents occurs.

Teile der rauscharmen Verstärker 7, 8 können auch auf der separaten Leiterplatte 3 aufgebaut sein. Die Teilung der Verstärker 7, 8 kann sich nur auf die Gleichspannungsversorgung beziehen oder sogar für eine ganze oder mehrere HF-Verstärker-Stufen ausgebildet sein. Alternativ hierzu können auch beide Verstärker 7, 8 auf einer separaten Leiterplatte aufgenommen sein. Falls eine Gleichspannungstrennung vorgesehen ist, kann eine einfache Drahtverbindung 32 zwischen den beiden Leiterplatten 3 und 4 als elektrische Verbindung vorgesehen sein.Parts of the low-noise amplifiers 7, 8 can also be constructed on the separate printed circuit board 3. The pitch of the amplifiers 7, 8 may only relate to the DC power supply or even be designed for a whole or several RF amplifier stages. Alternatively, both amplifiers 7, 8 may be accommodated on a separate circuit board. If a DC voltage separation is provided, a simple wire connection 32 between the two circuit boards 3 and 4 may be provided as an electrical connection.

Die obere Patch-Antenne 20 mit der oberen λ/2-Antennenstruktur 22 ist kleiner als die untere Patch-Antenne 10 mit der unteren λ/2-Antennenstruktur 12, wodurch gute Strahlungseigenschaften der λ/2-Antennen 10, 20 erreicht werden. Hierbei ist die obere Patch-Antenne 20 zum Empfang eines GPS-Signals und die untere Patch-Antenne 10 z. B. für SDARS oder DAB vorgesehen; ergänzend kann die untere Patch-Antenne 10 auch für terrestrischen Empfang, z.B. bei SDARS, vorgesehen sein. Vorteilhafterweise ist die obere, kleinere Patch-Antenne 20 für niedrigere Frequenzbänder und die untere Patch-Antenne 10 für höhere Frequenzbänder ausgelegt; durch entsprechende Wahl der Dielektrizitätskonstanten εr können die Frequenzbänder jedoch grundsätzlich frei festgelegt werden; entsprechend kann die obere Patch-Antenne 20 auch für ein niedrigeres Frequenzband vorgesehen sein, in dem das obere Substrat 21 eine entsprechend höhere Dielektrizitätkonstante εr aufweist.The upper patch antenna 20 with the upper λ / 2 antenna structure 22 is smaller than the lower patch antenna 10 with the lower λ / 2 antenna structure 12, whereby good radiation properties of the λ / 2 antennas 10, 20 are achieved. Here, the upper patch antenna 20 for receiving a GPS signal and the lower patch antenna 10 z. B. intended for SDARS or DAB; In addition, the lower patch antenna 10 can also be provided for terrestrial reception, for example in SDARS. Advantageously, the upper, smaller patch antenna 20 is designed for lower frequency bands and the lower patch antenna 10 for higher frequency bands; by appropriate choice of the dielectric constant ε r , however, the frequency bands can basically be set freely; Accordingly, the upper patch antenna 20 may also be provided for a lower frequency band, in which the upper substrate 21 has a correspondingly higher dielectric constant ε r .

Erfindungsgemäß kann die Metallisierung 23 der oberen Patch-Antenne 20 weggelassen werden, so dass das obere Substrat 21 die unter ihr angeordnete untere Antennenstruktur 12 als Metallisierung sieht.According to the invention, the metallization 23 of the upper patch antenna 20 can be omitted so that the upper substrate 21 sees the lower antenna structure 12 arranged below it as a metallization.

Das Antennenmodul 41 der Fig. 2 ist grundsätzlich entsprechend demjenigen der Fig. 1 aufgebaut und entsprechend mit gleichen Bezugszeichen versehen. Hierbei ist jedoch der erste (linke) Verstärker 16 auf der unteren Leiterplatte 3 aufgebaut. Alternativ hierzu kann vorzugsweise auch lediglich der HF-Teil des ersten Verstärkers 16 auf der separaten; unteren Leiterplatte 3 aufgebaut sein. Hierbei ist eine z.B. durch eine Koaxialleitung 43 gebildete HF-Verbindung zwischen den Leiterplatten 3 und 4 vorgesehen.The antenna module 41 of Fig. 2 is basically the same as the one of Fig. 1 constructed and correspondingly provided with the same reference numerals. Here, however, the first (left) amplifier 16 is constructed on the lower circuit board 3. Alternatively, preferably only the RF portion of the first amplifier 16 may be on the separate one; be constructed lower board 3. In this case, an HF connection formed, for example, by a coaxial line 43 is provided between the printed circuit boards 3 and 4.

Fig. 3 zeigt ein Antennenmodul 51, bei dem auf der Grundplatte 2 zusätzlich zu dem in Fig. 1 bzw. 2 gezeigten Antennenmodul 1 bzw. 41 lateral anschließend eine Antenne 53 vorgesehen ist, die als Monopol ausgebildet oder hauptsächlich vertikal ausgerichtet ist. Die Antenne 53 kann beispielsweise als Dual- oder Mehrbandfunkantenne oder AM/FM-Radio-Empfangsantenne sowie als terrestrische DAB-Antenne (L-Band oder Band III) oder als eine Kombination dieser Antennen ausgeführt sein. Fig. 3 shows an antenna module 51, in which on the base plate 2 in addition to the in Fig. 1 2 or later, an antenna 53 is provided, which is designed as a monopole or is oriented mainly vertically. The antenna 53 may be implemented, for example, as a dual or multi-band radio antenna or AM / FM radio receiving antenna, as a terrestrial DAB antenna (L-band or band III), or as a combination of these antennas.

Ein dritter Verstärker 55 ist z.B. unterhalb der Antenne 53 in einer separaten Kammer vorgesehen; die Verstärker 16, 26 und 55 können auch Funktionen teilen.A third amplifier 55 is e.g. provided below the antenna 53 in a separate chamber; the amplifiers 16, 26 and 55 can also share functions.

Fig. 4a bis c zeigen Ausführungsbeispiele für Band-Sperren-Filter 60. Diese Filter sind so ausgelegt, dass das Sendeband der Funkantenne 53 hinreichend unterdrückt wird, so dass bei einem gleichzeitigen Betrieb von Funk und digitalem Radio oder GPS keine Beeinträchtigung hervorgerufen wird. In den Band-Sperren-Filtem 60 ist als Induktivität ein Leitungsstück 62 vorgesehen, das mit einem Kondensator C gemäß Fig. 4a einen Reihenschluss und gemäß Fig. 4c einen Parallelschluss bildet. In Fig. 4b ist ein Leitungsstück 64 als λ/4-Leitung vorgesehen, die eine Leerlauf-Kurzschluss-Transformation bewirkt. Das Blindelement Z ist jeweils zwecks Anpassung vorgesehen und kann ein Kondensator, eine Spule oder eine Kombination derartiger Elemente in einer entsprechenden Schaltung sein. Die Band-Sperren-Filter 60 sind jeweils mit ihrem Eingang 66 an den jeweiligen Antennenfusspunkt und mit ihrem Ausgang 67 an den Eingang des jeweiligen Verstärkers anzuschließen. Fig. 4a to c show embodiments for band-lock filter 60. These filters are designed so that the transmission band of the radio antenna 53 is sufficiently suppressed, so that no interference is caused in a simultaneous operation of radio and digital radio or GPS. In the band-barrier filter 60 is a line piece 62 is provided as an inductance, which with a capacitor C according to Fig. 4a a row closure and according to Fig. 4c forms a parallel connection. In Fig. 4b a line 64 is provided as a λ / 4 line, which causes an open-circuit short-circuit transformation. The dummy element Z is each provided for the purpose of adaptation and may be a capacitor, a coil or a combination of such elements in a corresponding circuit. The band-lock filters 60 are each connected with their input 66 to the respective antenna base point and with its output 67 to the input of the respective amplifier.

Claims (19)

  1. Antenna module for frequencies in the GHz range to be fixed to a motor vehicle, having at least: a lower patch antenna (10) with a lower substrate (11) made of a dielectric material, a lower lambda/2 antenna structure (12) formed on the upper face of the lower substrate (11) for GHz-range satellite reception and a lower metallisation (13) provided on the lower face of the lower substrate (11), an upper patch antenna (20) mounted on the lower patch antenna (10) having an upper substrate (21) made of a dielectrical material, the lower face of which has a metallisation (23) or lies on a metallisation (12), and an upper lambda/2 antenna structure (22) formed on the upper face of the upper substrate (21) for satellite GHz-range satellite reception, a lower antenna tap (14) from the lower lambda/2 antenna structure (12) for satellite reception through the lower substrate (11) and an upper antenna tap (24) separate from the lower antenna tap (14) from the upper lambda/2 antenna structure (22) for satellite reception through the upper substrate (21) and the lower patch, whereby the upper patch antenna (20) is smaller than the lower patch antenna (10), and whereby the coupling point of the lower antenna tap (14) is not covered by the upper substrate (21) on the lower lambda/2 antenna structure (12) for satellite reception.
  2. Antenna module according to Claim 1, characterised in that at least one boost chamber is arranged underneath the lower patch antenna (10) and the antenna taps (14, 24) are connected to a boosting device arranged in the at least one boost chamber (7, 8).
  3. Antenna module according to Claim 2, characterised in that at least two boost chambers (7, 8) electromagnetically shielded by a metal wall (6) are formed, whereby a first low-noise booster (16) is provided in the first boost chamber (7) to receive the high frequency signal of the lower antenna structure (12) for satellite reception by means of the lower antenna tap (14), and a second low-noise booster (16) is provided in the second boost chamber (7) to receive the high frequency signal of the upper lambda/2 antenna structure (22) for satellite reception by means of the upper antenna tap (24).
  4. Antenna module according to either Claim 2 or Claim 3, characterised in that it has at least a base plate (2) on which the at least one boost chamber (7, 8) is fixed, whereby the lower metallisation of the lower patch antenna (10) is galvanically connected to the base plate (2).
  5. Antenna module according to any one of claims 2 to 4, characterised in that the lower patch antenna (10) is fixed on a circuit board, on the lower face of which the boosters (16, 27) are fixed.
  6. Antenna module according to Claim 5, characterised in that parts of the boosting device (16, 26), for example the DC voltage supply, are constructed on at least one further circuit board (3), whereby the circuit boards (3, 4) are connected to a wire connection (32) by means of direct current or to a high frequency connection (43) in a high frequency manner, whereby the at least one further circuit board (3) is arranged underneath the circuit board (4) which receives the boosting device (16, 26).
  7. Antenna module according to any one of the preceding claims, characterised in that an upper metallisation (23) is formed on the lower face of the upper substrate (21).
  8. Antenna module according to any one of claims 1 to 6, characterised in that the lower face of the upper substrate (21) lies directly on the lower lambda/2 antenna structure (12) for satellite reception of the lower patch antenna (10) which is acting as the lower metallisation.
  9. Antenna module according to any one of the preceding claims, characterised in that the upper patch antenna (20) is designed for higher frequencies than the lower patch antenna (10).
  10. Antenna module according to any one of claims 1 to 8, characterised in that the upper substrate (21) has a higher dielectric constant than the lower substrate (11), and the upper patch antenna (20) is designed for lower frequencies than the lower patch antenna (10).
  11. Antenna module according to any one of the preceding claims, characterised in that the radiation pattern of the lambda/2 antenna structures (12, 22) for satellite reception cover an elevation angle of essentially 30° to 90°.
  12. Antenna module according to any one of the preceding claims, characterised in that the antenna module additionally has one or a plurality of antennae (53) for terrestrial reception, for example monopoles or predominantly vertically aligned antennae.
  13. Antenna module according to Claim 12, characterised in that the one or a plurality of terrestrial antennae (53) are provided for at least one of the following functions: mobile telephone, AM/FM radio reception, DAB Band III and DAB terrestrial L-Band.
  14. Antenna module according to either Claim 12 or Claim 13, characterised in that one or a plurality of terrestrial antennae (53) are provided laterally adjacent to or on the patch antennae (10, 20).
  15. Antenna module according to Claim 14, characterised in that the at least one low-noise boosting device (16, 26, 55) has a band-stop filter (60) for at least one of the transmission frequency bands of the one or a plurality of terrestrial antennae (53).
  16. Antenna module according to Claim 15, characterised in that the at least one band-stop filter (60) is mounted with its input (66) on the respective antenna base and with its output (67) on the input of the respective booster (16, 26, 55).
  17. Antenna module according to either Claim 15 or Claim 16, characterised in that the at least one band-stop filter (60) has a piece of wire (62, 64) for inductivity.
  18. Antenna module according to Claim 17, characterised in that the piece of wire (64) is designed as a lambda/4 wire for idle short-circuit transformation.
  19. Antenna module according to any one of the preceding claims, characterised in that one of the two patch antennae (10, 20) is designed as a transmitting antenna and the other patch antenna (20, 10) is designed as a receiving antenna.
EP05015079.6A 2004-07-20 2005-07-12 Antenna module Active EP1619752B1 (en)

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US20070210967A1 (en) 2007-09-13
US20060273969A1 (en) 2006-12-07
EP1619752A1 (en) 2006-01-25
US20060220970A1 (en) 2006-10-05
DE102004035064A1 (en) 2006-02-16
US7295167B2 (en) 2007-11-13
US7489280B2 (en) 2009-02-10

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