EP1619752A1 - Antenna module - Google Patents
Antenna module Download PDFInfo
- Publication number
- EP1619752A1 EP1619752A1 EP05015079A EP05015079A EP1619752A1 EP 1619752 A1 EP1619752 A1 EP 1619752A1 EP 05015079 A EP05015079 A EP 05015079A EP 05015079 A EP05015079 A EP 05015079A EP 1619752 A1 EP1619752 A1 EP 1619752A1
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- EP
- European Patent Office
- Prior art keywords
- antenna
- module according
- antenna module
- patch
- amplifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000001465 metallisation Methods 0.000 claims abstract description 25
- 239000003989 dielectric material Substances 0.000 claims abstract description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000009466 transformation Effects 0.000 claims description 2
- 230000000284 resting effect Effects 0.000 claims 1
- 230000003071 parasitic effect Effects 0.000 description 6
- 238000010276 construction Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005404 monopole Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
- H01Q1/3275—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
- H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration
Definitions
- the invention relates to an antenna module for frequencies in the GHz range, which can be attached to a motor vehicle.
- Such an antenna module integrates various functions of roof antennas for motor vehicles.
- microstrip patch antennas are known, which have a substrate which is metallized over its entire surface and has on its upper side a suitable metal structure or antenna structure.
- Such antennas generally have a narrow frequency bandwidth, e.g. 1% to 2% relative bandwidth if no additional measures are foreseen.
- parasitic elements By employing parasitic elements, greater bandwidth or the ability to cover multiple frequency bands can be achieved.
- These parasitic elements are line structures which are formed on the same or a higher level than the antenna structure. When forming the parasitic elements on a higher antenna structure, these are coupled to the lower antenna structure, wherein a common RF tap on the lower antenna structure to an amplifier device takes place. In the parasitic elements high-frequency currents are induced, which adapt to the shape and dimension of the parasitic elements and thus in turn generate fields. This gives the entire structure the opportunity to radiate and receive even at neighboring frequencies or even at somewhat distant frequencies.
- antenna modules with separate side-by-side antenna elements are typically used. However, this requires a lot of space. Furthermore, sufficient decoupling is necessary for proper functioning of the individual antenna elements.
- EP 0 521 384 A1 shows an antenna module with an upper and a lower substrate, wherein an upper ⁇ / 2 antenna structure is applied to the upper substrate and a lower ⁇ / 2 antenna structure is applied to the lower substrate. Both antenna structures serve a metal layer provided below the lower substrate as a reference surface, so that a parallel connection of the two antenna resonant circuits results.
- the invention has for its object to provide an antenna module that ensures a compact design and a versatile functionality with high security.
- the lower patch antenna is designed to be larger than the upper patch antenna for effective radiation properties.
- the patch antennas Independently of one another, the patch antennas have substrate materials on whose upper side corresponding ⁇ / 2 antenna structures are formed and whose undersides have a metallization or abut against a metallization. In principle, both substrates can be metallized on their underside. In such an embodiment, in principle, z. B. an additional Dielectric between the lower metallization of the upper patch antenna and the antenna structure of the lower patch antenna are.
- the stacked patch antennas are decoupled.
- the two metallizations of the patch antennas - i. the lower metallization of the lower patch antenna and the metallization of the upper patch antenna or acting as this antenna structure of the lower patch antenna separately formed.
- EP 0 521 384 A1 the two metallizations of the patch antennas - i. the lower metallization of the lower patch antenna and the metallization of the upper patch antenna or acting as this antenna structure of the lower patch antenna separately formed.
- EP 0 521 384 A1 less a broadband system, but an arrangement of two decoupled antennas is to be created.
- ⁇ / 2 antenna elements or antenna structures are provided according to the invention. They are designed here for satellite reception, ie signals with circular polarization at an elevation angle of substantially 30 ° to 90 ° relative to the horizontal.
- parasitic elements are optionally provided above the antenna base structure and coupled directly to the lower antenna structure, a separate tap for the separate upper ⁇ / 2 antenna structure is provided according to the invention.
- the signals are advantageously tapped coaxially.
- the preferably coaxial tap can in this case take place on the lower metallization of the lower patch antenna or a printed circuit board provided here.
- a via may be provided by the lower patch antenna, which serves the two metallizations or the antenna structure of the lower patch antenna serving as metallization of the upper patch antenna and the metallization the lower patch antenna connects galvanically.
- This through-connection advantageously takes place in the middle of the ⁇ / 2 antenna structure, since here there is a maximum of the current distribution and correspondingly a minimum of the magnitude of the voltage.
- the laterally central region of the antenna structure can be short-circuited without causing any adverse effects on the current and field distribution.
- the antenna module according to the invention may e.g. for receiving GPS signals in the L band, i. at 1575 MHz, and DAB worldStar (WorldSpace) satellite-based digital radio services in Africa and Asia at 1467 MHz to 1492 MHz and DMB (Digital Multimedia Broadcasting) in Far East Asia at 2630 MHz to 2655 MHz and SDARS (Satellite Digital Audio Reception System) be used at 2320 MHz to 2345 MHz in the US.
- the selection of the frequency bands for the upper and lower patch antenna is done on the one hand by the dimensioning of the antenna structures.
- the dielectric material of the substrates can be chosen such that the appropriate frequency bands are achieved.
- the upper, smaller patch antenna can cover a service of lower frequency by the upper substrate has a correspondingly higher dielectric constant than the lower substrate.
- the patch antennas may also receive terrestrial signals in addition to satellite reception; for example, the lower patch antenna for SDARS additionally received terrestrial.
- the upper patch antenna is advantageously provided for GPS reception.
- active patch receiving antennas are advantageously formed, with a low-noise amplifier (LNA) being integrated at the base of the antenna.
- the low-noise amplifiers are mounted on the underside of a printed circuit board, on the upper side of which the lower patch antenna is provided.
- one of the low-noise amplifiers may be provided on one printed circuit board and the other on a separate printed circuit board.
- only parts of a low-noise amplifier can be constructed on a separate circuit board, this separate part preferably includes the DC voltage supply or regulation, so that the connection of the two circuit boards by a simple wire connection, e.g. a wire pin can be realized.
- the antenna module according to the invention can additionally also have a terrestrial antenna, e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz).
- a terrestrial antenna e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz).
- the terrestrial antenna can be arranged in front of, behind or on the stack of patch antennas, advantageously in the direction of travel behind it.
- a suitable filter technique is advantageously provided in the amplifiers, which suppresses the relatively strong transmission signal of the telephone antenna already at the input of the amplifier. This can protect the amplifier or the separate amplifier against saturation effects.
- the antenna module can be designed as a group antenna with a plurality of elements each consisting of an upper patch antenna and a lower patch antenna.
- the elements in the group can serve as transmitting and / or receiving antenna.
- the antenna module can serve as a transmitting and receiving antenna, wherein one of the two patch antennas serves as a transmitting and the other as a receiving antenna; This is particularly useful in a group antenna, in each case one of the two antennas of each stack serves as a transmitting and the other as a receiving antenna.
- An antenna module 1 shown in Fig. 1 comprises, as shown in Fig. 1, a base plate 2, e.g. may be formed as a metal plate, a mounted on the base plate 2 lower circuit board 3 and a parallel and above extending from this upper circuit board 4. Between the upper printed circuit board 4 and the base plate 2 are two in the lateral direction by a metallic wall 6 separate and electromagnetically shielded Verellrkammem 7 and 8 are provided. In particular, they can be parts of a common amplifier chamber, which is subdivided by the metallic wall 6.
- a lower patch antenna 10 which comprises a lower substrate 11 made of a dielectric, e.g. Ceramics, a formed on the upper side of the lower substrate 11 lower ⁇ / 2 antenna structure 12 and formed on the underside of the lower substrate 11 lower full-surface metallization 13 has.
- the lower ⁇ / 2 antenna structure 12 is contacted via a through hole 14 extending through the lower substrate 11 to a first low noise amplifier (LNA) 16 received in the left amplifier chamber 7 and attached to the underside of the upper circuit board 4.
- LNA low noise amplifier
- the via 14 may in this case be contacted with the amplifier 16 directly or advantageously indirectly via a conductor track of the upper printed circuit board 4.
- the coupling-in point of the via 14 at the lower antenna structure 12 is preferably not covered by the upper antenna structure 22;
- this Einkoppeltician is not covered by the upper substrate 21, so that this Einkoppeltician can be soldered as Anlöt Vietnamese without it collides with the upper substrate 21 and z. B. is to form a corresponding recess in the upper substrate.
- an upper patch antenna 20 comprising an upper substrate 21, an upper ⁇ / 2 antenna structure 22 formed on the upper surface of the upper substrate 21, and a full-surface upper formed on the lower surface of the upper substrate 21 Metallization 23 has.
- the upper ⁇ / 2 antenna structure 22 is contacted via an upper through-hole 24 directly or via the upper printed circuit board 4 with a second low-noise amplifier (LNA) 26 mounted on the underside of the upper printed circuit board 4 and received in the right-hand amplifier chamber 8 Amplified RF signals and passes on a second (right) coaxial tap 28.
- LNA low-noise amplifier
- a through hole 19 extending through the lower substrate 11 galvanically connects the lower ⁇ / 2 antenna structure 12 to the lower metallization 13, thus laying them at an equal potential.
- the plated-through hole 19 advantageously takes place in the center of the lower ⁇ / 2 antenna structure 12, since in this region no significant voltages, but a current maximum of the induced RF currents occurs.
- Parts of the low-noise amplifiers 7, 8 can also be constructed on the separate printed circuit board 3.
- the division of the amplifiers 7, 8 may relate only to the DC power supply or even be designed for a whole or several RF amplifier stages. Alternatively, both amplifiers 7, 8 may be accommodated on a separate circuit board. If a DC voltage separation is provided, a simple wire connection 32 between the two circuit boards 3 and 4 may be provided as an electrical connection.
- the upper patch antenna 20 with the upper ⁇ / 2 antenna structure 22 is smaller than the lower patch antenna 10 with the lower ⁇ / 2 antenna structure 12, whereby good radiation properties of the ⁇ / 2 antennas 10, 20 achieved become.
- the lower patch antenna 10 can also be provided for terrestrial reception, for example in SDARS.
- the upper, smaller patch antenna 20 is designed for lower frequency bands and the lower patch antenna 10 for higher frequency bands; by appropriate choice of the dielectric constant ⁇ r , however, the frequency bands can basically be set freely; Accordingly, the upper patch antenna 20 may also be provided for a lower frequency band, in which the upper substrate 21 has a correspondingly higher dielectric constant ⁇ r .
- the metallization 23 of the upper patch antenna 20 can be omitted so that the upper substrate 21 sees the lower antenna structure 12 arranged below it as a metallization.
- the antenna module 41 of FIG. 2 is basically constructed in accordance with that of FIG. 1 and correspondingly provided with the same reference numerals.
- the first (left) amplifier 16 is constructed on the lower circuit board 3.
- preferably only the RF part of the first amplifier 16 may be constructed on the separate, lower circuit board 3.
- a e.g. provided by a coaxial line 43 HF connection between the circuit boards 3 and 4 is provided.
- FIG. 3 shows an antenna module 51 in which on the base plate 2, in addition to the antenna module 1 or 41 shown in FIGS. 1 and 2, there is laterally provided an antenna 53 which is designed as a monopole or is oriented mainly vertically.
- the antenna 9 can be implemented, for example, as a dual or multi-band radio antenna or AM / FM radio receiving antenna and as a terrestrial DAB antenna (L-band or band III) or as a combination of these antennas.
- a third amplifier 55 is e.g. provided below the antenna 53 in a separate chamber; the amplifiers 7, 8 and 55 can also share functions.
- band-stop filter 60 show exemplary embodiments of band-stop filter 60. These filters are designed so that the transmission band of the radio antenna 53 is sufficiently suppressed, so that no interference is caused in the simultaneous operation of radio and digital radio or GPS.
- a line piece 62 is provided as an inductance, which forms a series connection with a capacitor C according to FIG. 4a and a parallel connection according to FIG. 4c.
- a line section 64 is provided as a ⁇ / 4 line, which causes an open-circuit short-circuit transformation.
- the dummy element Z is each provided for the purpose of adaptation and may be a capacitor, a coil or a combination of such elements in a corresponding circuit.
- the band-lock filters 60 are each connected with their input 66 to the respective antenna base point and with its output 67 to the input of the respective amplifier.
Abstract
Description
Die Erfindung betrifft ein Antennenmodul für Frequenzen im GHz-Bereich, das an einem Kraftfahrzeug befestigt werden kann.The invention relates to an antenna module for frequencies in the GHz range, which can be attached to a motor vehicle.
Ein derartiges Antennenmodul integriert verschiedene Funktionen von Dachantennen für Kraftfahrzeuge. Hierbei sind Mikrostreifen-Patch-Antennen bekannt, die ein Substrat aufweisen, das auf seiner Unterseite vollflächig metallisiert ist und auf seiner Oberseite eine geeignete Metallstruktur bzw. Antennenstruktur aufweist. Derartige Antennen haben im Allgemeinen eine schmale Frequenzbandbreite, z.B. 1 % bis 2 % relative Bandbreite, falls keine zusätzlichen Maßnahmen vorgesehen sind. Durch das Einsetzen parasitärer Elemente kann eine größere Bandbreite oder die Fähigkeit, mehrere Frequenzbänder abzudecken, erreicht werden. Diese parasitären Elemente sind Leitungs- oder Flächenstrukturen, welche auf derselben oder einer höheren Ebene als die Antennenstruktur ausgebildet sind. Bei Ausbildung der parasitären Elemente auf einer höheren Antennenstruktur sind diese mit der unteren Antennenstruktur gekoppelt, wobei ein gemeinsamer HF-Abgriff an der unteren Antennenstruktur zu einer Verstärkereinrichtung erfolgt. In den parasitären Elementen werden Hochfrequenzströme induziert, welche sich an die Form und Dimension der parasitären Elemente anpassen und damit ihrerseits Felder erzeugen. Hierdurch gibt man dem gesamten Gebilde die Möglichkeit, auch bei Nachbarfrequenzen oder sogar bei etwas entfemteren Frequenzen zu strahlen und zu empfangen.Such an antenna module integrates various functions of roof antennas for motor vehicles. Here, microstrip patch antennas are known, which have a substrate which is metallized over its entire surface and has on its upper side a suitable metal structure or antenna structure. Such antennas generally have a narrow frequency bandwidth, e.g. 1% to 2% relative bandwidth if no additional measures are foreseen. By employing parasitic elements, greater bandwidth or the ability to cover multiple frequency bands can be achieved. These parasitic elements are line structures which are formed on the same or a higher level than the antenna structure. When forming the parasitic elements on a higher antenna structure, these are coupled to the lower antenna structure, wherein a common RF tap on the lower antenna structure to an amplifier device takes place. In the parasitic elements high-frequency currents are induced, which adapt to the shape and dimension of the parasitic elements and thus in turn generate fields. This gives the entire structure the opportunity to radiate and receive even at neighboring frequencies or even at somewhat distant frequencies.
Derartige Antennenaufbauten sind jedoch nur dann geeignet, wenn das ganze erweiterte Frequenzband für denselben Dienst zur Vertügung steht.However, such antenna structures are only suitable if the whole extended frequency band is available for the same service.
Falls mehrere unabhängige Dienste vorgesehen sind, werden in der Regel Antennenmodule mit separaten nebeneinander aufgebauten Antennenelementen verwendet. Hierfür ist jedoch ein hoher Platzbedarf erforderlich. Weiterhin ist für eine einwandfreie Funktion der einzelnen Antennenelemente eine ausreichende Entkopplung erforderlich.If several independent services are provided, antenna modules with separate side-by-side antenna elements are typically used. However, this requires a lot of space. Furthermore, sufficient decoupling is necessary for proper functioning of the individual antenna elements.
Die EP 0 521 384 A1 zeigt ein Antennenmodul mit einem oberen und einem unteren Substrat, wobei auf dem oberen Substrat eine obere λ/2-Antennenstruktur und auf dem unteren Substrat eine untere λ/2-Antennenstruktur aufgebracht ist. Beiden Antennenstrukturen dient eine unterhalb des unteren Substrates vorgesehene Metallschicht als Referenzfläche, so dass sich eine Parallelschaltung der beiden Antennenschwingkreise ergibt.EP 0 521 384 A1 shows an antenna module with an upper and a lower substrate, wherein an upper λ / 2 antenna structure is applied to the upper substrate and a lower λ / 2 antenna structure is applied to the lower substrate. Both antenna structures serve a metal layer provided below the lower substrate as a reference surface, so that a parallel connection of the two antenna resonant circuits results.
Der Erfindung liegt die Aufgabe zugrunde, ein Antennenmodul zu schaffen, das einen kompakten Aufbau und eine vielseitige Funktionalität bei hoher Sicherheit gewährleistet.The invention has for its object to provide an antenna module that ensures a compact design and a versatile functionality with high security.
Diese Aufgabe wird durch ein Antennenmodul nach Anspruch 1 gelöst. Die Unteransprüche beschreiben bevorzugte Weiterbildungen.This object is achieved by an antenna module according to claim 1. The dependent claims describe preferred developments.
Erfindungsgemäß werden somit zwei unterschiedlich große λ/2-Patch-Antennen übereinander gesetzt und separat abgegriffen. Die untere Patch-Antenne ist hierbei für eine effektive Strahlungseigenschaften größer als die obere Patch-Antenne ausgebildet. Die Patch-Antennen weisen unabhängig voneinander Substratmaterialien auf, an deren Oberseiten entsprechende λ/2-Antennenstrukturen ausgebildet sind und deren Unterseiten eine Metallisierung aufweisen oder an einer Metallisierung anliegen. Hierbei können grundsätzlich beide Substrate auf ihrer Unterseite metallisiert sein. Bei einer derartigen Ausführungsform kann grundsätzlich auch z. B. ein zusätzliches Dielektrikum zwischen der unteren Metallisierung der oberen Patch-Antenne und der Antennenstruktur der unteren Patch-Antenne liegen.Thus, according to the invention, two λ / 2 patch antennas of different sizes are superimposed and tapped separately. The lower patch antenna is designed to be larger than the upper patch antenna for effective radiation properties. Independently of one another, the patch antennas have substrate materials on whose upper side corresponding λ / 2 antenna structures are formed and whose undersides have a metallization or abut against a metallization. In principle, both substrates can be metallized on their underside. In such an embodiment, in principle, z. B. an additional Dielectric between the lower metallization of the upper patch antenna and the antenna structure of the lower patch antenna are.
Gemäß einer vorteilhaften Ausbildung wird jedoch auf der Unterseite des oberen Substrates keine Metallisierung ausgebildet, da dieses Element durch den gestapelten Aufbau direkt auf der metallischen Antennenstruktur der unteren Patch-Antenne sitzt bzw. angeordnet ist und diese direkt als eigene Metallisierung sieht; hierdurch ergeben sich keine funktionellen Nachteile, insbesondere liegt hier keine Kopplung dieser Antennen vor.According to an advantageous embodiment, however, no metallization is formed on the underside of the upper substrate, since this element is sitting or arranged by the stacked structure directly on the metallic antenna structure of the lower patch antenna and sees this directly as a separate metallization; This results in no functional disadvantages, in particular, there is no coupling of these antennas.
Erfindungsgemäß sind die übereinander angeordneten Patch-Antennen entkoppelt. Hierzu sind - anders als z. B. bei der eingangs genannten EP 0 521 384 A1 - die beiden Metallisierungen der Patch-Antennen - d.h. die untere Metallisierung der unteren Patch-Antenne und die Metallisierung der oberen Patch-Antenne bzw. die als diese wirkende Antennenstruktur der unteren Patch-Antenne separat ausgebildet. Anders als bei der EP 0 521 384 A1 soll erfindungsgemäß weniger ein breitbandiges System, sondem eine Anordnung von zwei entkoppelten Antennen geschaffen werden.According to the invention, the stacked patch antennas are decoupled. For this purpose - unlike z. As in the aforementioned EP 0 521 384 A1 - the two metallizations of the patch antennas - i. the lower metallization of the lower patch antenna and the metallization of the upper patch antenna or acting as this antenna structure of the lower patch antenna separately formed. Unlike EP 0 521 384 A1, according to the invention less a broadband system, but an arrangement of two decoupled antennas is to be created.
Weiterhin sind - anders als bei den meisten herkömmlichen, für terrestrischen Empfang vorgesehenen Antennenmodulen mit λ/4- Antennenelementen - erfindungsgemäß λ/2-Antennenelemente bzw. Antennenstrukturen vorgesehen. Sie sind hierbei für einen Satellitenempfang ausgebildet, d.h. Signale mit zirkularer Polarisation unter einem Elevationswinkel von im Wesentlichen 30° bis 90° gegenüber der Horizontalen. Anders als bei herkömmlichen Antennenstrukturen, bei denen oberhalb der Antennengrundstruktur gegebenenfalls parasitäre Elemente vorgesehen und direkt mit der unteren Antennenstruktur gekoppelt sind, ist erfindungsgemäß ein separater Abgriff für die separate obere λ/2-Antennenstruktur vorgesehen.Furthermore, in contrast to most conventional antenna modules provided with λ / 4 antenna elements for terrestrial reception, λ / 2 antenna elements or antenna structures are provided according to the invention. They are designed here for satellite reception, ie signals with circular polarization at an elevation angle of substantially 30 ° to 90 ° relative to the horizontal. Unlike conventional antenna structures, in which parasitic elements are optionally provided above the antenna base structure and coupled directly to the lower antenna structure, a separate tap for the separate upper λ / 2 antenna structure is provided according to the invention.
Die Signale werden vorteilhafterweise koaxial abgegriffen. Der vorzugsweise koaxiale Abgriff kann hierbei auf der unteren Metallisierung der unteren Patch-Antenne bzw. einer hier vorgesehenen Leiterplatte erfolgen. Um dasselbe Bezugspvtential für die Metallisierungen der beiden Patch-Antennen zu realisieren, kann eine Durchkontaktierung durch die untere Patch-Antenne vorgesehen sein, die die beiden Metallisierungen bzw. die als Metallisierung der oberen Patch-Antenne dienende Antennenstruktur der unteren Patch-Antenne und die Metallisierung der unteren Patch-Antenne galvanisch verbindet. Diese Durchkontaktierung erfolgt hierbei vorteilhafterweise in der Mitte der λ/2-Antennenstruktur, da hier ein Maximum der Stromverteilung und entsprechend ein Minimum des Betrags der Spannung vorliegt. Somit kann der lateral mittlere Bereich der Antennenstruktur kurzgeschlossen werden, ohne dass Beeinträchtigungen in der Strom- und Feldverteilung entstehen.The signals are advantageously tapped coaxially. The preferably coaxial tap can in this case take place on the lower metallization of the lower patch antenna or a printed circuit board provided here. In order to realize the same reference potential for the metallizations of the two patch antennas, a via may be provided by the lower patch antenna, which serves the two metallizations or the antenna structure of the lower patch antenna serving as metallization of the upper patch antenna and the metallization the lower patch antenna connects galvanically. This through-connection advantageously takes place in the middle of the λ / 2 antenna structure, since here there is a maximum of the current distribution and correspondingly a minimum of the magnitude of the voltage. Thus, the laterally central region of the antenna structure can be short-circuited without causing any adverse effects on the current and field distribution.
Das erfindungsgemäße Antennenmodul kann z.B. für den Empfang von GPS-Signalen im L-Band, d.h. bei 1575 MHz, und der satellitengestützten digitalen Radiodienste DAB worldStar (WorldSpace) in Afrika und Asien bei 1467 MHz bis 1492 MHz sowie DMB (Digital Mulimedia Broadcasting) in Fernost-Asien bei 2630 MHz bis 2655 MHz und SDARS (Satellite Digital Audio Reception System) bei 2320 MHz bis 2345 MHz in den USA eingesetzt werden. Die Auswahl der Frequenzbänder für die obere und untere Patch-Antenne erfolgt zum einen durch die Dimensionierung der Antennenstrukturen. Zusätzlich kann entsprechend das dielektrische Material der Substrate derartig gewählt werden, dass die geeigneten Frequenzbänder erreicht werden. Somit kann grundsätzlich auch die obere, kleinere Patch-Antenne einen Dienst niedrigerer Frequenz decken, indem das obere Substrat eine entsprechend höhere Dielektrizitätskontante als das untere Substrat aufweist.The antenna module according to the invention may e.g. for receiving GPS signals in the L band, i. at 1575 MHz, and DAB worldStar (WorldSpace) satellite-based digital radio services in Africa and Asia at 1467 MHz to 1492 MHz and DMB (Digital Multimedia Broadcasting) in Far East Asia at 2630 MHz to 2655 MHz and SDARS (Satellite Digital Audio Reception System) be used at 2320 MHz to 2345 MHz in the US. The selection of the frequency bands for the upper and lower patch antenna is done on the one hand by the dimensioning of the antenna structures. In addition, according to the dielectric material of the substrates can be chosen such that the appropriate frequency bands are achieved. Thus, in principle, the upper, smaller patch antenna can cover a service of lower frequency by the upper substrate has a correspondingly higher dielectric constant than the lower substrate.
Die Patch-Antennen können zusätzlich zu dem Satellitenempfang auch terrestrische Signale empfangen; so kann z.B. die untere Patch-Antenne für SDARS ergänzend terrestrisch empfangen. Die obere Patch-Antenne ist vorteilhafterweise für GPS-Empfang vorgesehen.The patch antennas may also receive terrestrial signals in addition to satellite reception; for example, the lower patch antenna for SDARS additionally received terrestrial. The upper patch antenna is advantageously provided for GPS reception.
Erfindungsgemäß sind vorteilhafterweise aktive Patch-Empfangsantennen ausgebildet, wobei ein rauscharmer Verstärker (low noise amplifier, LNA) am Antennenfußpunkt integriert ist. Vorteilhafterweise werden die rauscharmen Verstärker auf der Unterseite einer Leiterplatte angebracht, auf deren Oberseite die untere Patch-Antenne vorgesehen ist. Weiterhin kann einer der rauscharmen Verstärker auf einer Leiterplatte und der andere auf einer separaten Leiterplatte vorgesehen sein. Weiterhin können auch nur Teile eines Rauscharmen Verstärkers auf einer separaten Leiterplatte aufgebaut sein, wobei dieser separate Teil vorzugsweise die Gleichspannungsversorgung bzw. -regelung enthält, so dass die Verbindung der beiden Leiterplatten durch eine einfache Drahtverbindung, z.B. einen Drahtpin realisiert werden kann.According to the invention, active patch receiving antennas are advantageously formed, with a low-noise amplifier (LNA) being integrated at the base of the antenna. Advantageously, the low-noise amplifiers are mounted on the underside of a printed circuit board, on the upper side of which the lower patch antenna is provided. Furthermore, one of the low-noise amplifiers may be provided on one printed circuit board and the other on a separate printed circuit board. Furthermore, only parts of a low-noise amplifier can be constructed on a separate circuit board, this separate part preferably includes the DC voltage supply or regulation, so that the connection of the two circuit boards by a simple wire connection, e.g. a wire pin can be realized.
Das erfindungsgemäße Antennenmodul kann weiterhin ergänzend auch eine terrestrische Antenne aufweisen, z.B. einen (Mehrband-) Monopol oder eine (Mehrband-) Stabantenne wie z.B. für Telefondienste, AM/FM oder terrestrisches DAB im L-Band (1452 MHz bis 1492 MHz) sowie Band III (170 MHz bis 230 MHz). Die terrestrische Antenne kann vor, hinter oder auf dem Stapel aus Patch-Antennen, vorteilhafterweise in Fahrtrichtung hinter dieser, angeordnet sein.The antenna module according to the invention can additionally also have a terrestrial antenna, e.g. a (multi-band) monopole or a (multi-band) rod antenna such as e.g. for telephone services, AM / FM or terrestrial DAB in the L band (1452 MHz to 1492 MHz) and Band III (170 MHz to 230 MHz). The terrestrial antenna can be arranged in front of, behind or on the stack of patch antennas, advantageously in the direction of travel behind it.
Falls die beiden Patch-Antennen mit einer Telefonantenne kombiniert sind, ist vorteilhafterweise eine geeignete Filtertechnik in den Verstärkern vorgesehen, die das relativ starke Sendesignal der Telefonantenne bereits am Eingang der Verstärker unterdrückt. Hierdurch kann man den Verstärker bzw. die separaten Verstärker gegen Sättigungseffekte schützen.If the two patch antennas are combined with a telephone antenna, a suitable filter technique is advantageously provided in the amplifiers, which suppresses the relatively strong transmission signal of the telephone antenna already at the input of the amplifier. This can protect the amplifier or the separate amplifier against saturation effects.
Weiterhin kann das Antennenmodul als Gruppenantenne mit mehreren Elementen aus jeweils einem oberen Patch-Antenne und einer unteren Patch-Antenne ausgebildet sein. Die Elemente in der Gruppe können als Sende- und/oder Empfangsantenne dienen.Furthermore, the antenna module can be designed as a group antenna with a plurality of elements each consisting of an upper patch antenna and a lower patch antenna. The elements in the group can serve as transmitting and / or receiving antenna.
Das Antennenmodul kann als Sende- und Empfangsantenne dienen, wobei eine der beiden Patchantennen als Sende- und die andere als Empfangsantenne dient; dies ist insbesondere in einer Gruppenantenne sinnvoll, bei der von jedem Stapel jeweils eine der beiden Antennen als Sende- und die andere als Empfangsantenne dient.The antenna module can serve as a transmitting and receiving antenna, wherein one of the two patch antennas serves as a transmitting and the other as a receiving antenna; This is particularly useful in a group antenna, in each case one of the two antennas of each stack serves as a transmitting and the other as a receiving antenna.
Die Erfindung wird im Folgenden anhand der beiliegenden Zeichnungen an einigen Ausführungsformen näher erläutert. Es zeigen:
- Fig. 1
- den Aufbau eines Antennenmoduls gemäß einer ersten Ausführungsform mit zwei auf einer gemeinsamen Leiterplatte vorgesehenen Verstärkern;
- Fig. 2 .
- den Aufbau eines Antennenmoduls gemäß einer weiteren Ausführungsform mit auf unterschiedlichen Leiterplatten angeordneten Verstärkern der Antennenelemente;
- Fig. 3
- den Aufbau eines Antennenmoduls gemäß einer weiteren Ausführungsform mit einer zusätzlichen, im Wesentlichen vertikal ausgerichteten terrestrischen Antenne;
- Fig. 4 a bis c
- verschiedene Ausführungsformen für Band-Sperr-Filter für das Antennenmodul der Fig. 3 zur Unterdrückung des Sendebandes der terrestrischen Funkantenne.
- Fig. 1
- the construction of an antenna module according to a first embodiment with two provided on a common circuit board amplifiers;
- Fig. 2.
- the construction of an antenna module according to a further embodiment with arranged on different circuit boards amplifiers of the antenna elements;
- Fig. 3
- the construction of an antenna module according to another embodiment with an additional, substantially vertically aligned terrestrial antenna;
- Fig. 4 a to c
- Various embodiments for band-rejection filter for the antenna module of FIG. 3 for suppressing the transmission band of the terrestrial radio antenna.
Ein in Fig. 1 gezeigtes Antennenmodul 1 weist gemäß Fig. 1 eine Grundplatte 2, die z.B. als Metallplatte ausgebildet sein kann, eine auf der Grundplatte 2 befestigte untere Leiterplatte 3 und eine parallel und oberhalb von dieser verlaufende obere Leiterplatte 4 auf. Zwischen der oberen Leiterplatte 4 und der Grundplatte 2 sind zwei in lateraler Richtung durch eine metallische Wand 6 getrennte und elektromagnetisch abgeschirmte Verstärkerkammem 7 und 8 vorgesehen. Sie können insbesondere Teile einer gemeinsamen Verstärkerkammer sein, die durch die metallische Wand 6 unterteilt ist.An antenna module 1 shown in Fig. 1 comprises, as shown in Fig. 1, a
Auf der oberen Leiterblatte 4 ist eine untere Patch-Antenne 10 angebracht, die ein unteres Substrat 11 aus einem Dielektrikum, z.B. Keramik, eine auf der Oberseite des unteren Substrates 11 ausgebildete untere λ/2-Antennenstruktur 12 und eine auf der Unterseite des unteren Substrates 11 ausgebildete untere vollflächige Metallisierung 13 aufweist. Die untere λ/2-Antennenstruktur 12 ist über eine durch das untere Substrat 11 verlaufende Durchkontaktierung 14 mit einem in der linken Verstärkerkammer 7 aufgenommenen, an der Unterseite der oberen Leiterplatte 4 befestigten ersten rauscharmen Verstärker (LNA) 16 kontaktiert. der die aufgenommenen HF-Signale verstärkt und über einen ersten (linken) koaxialen Abgriff 18 weiterleitet. Die Durchkontaktierung 14 kann hierbei mit dem Verstärker 16 direkt oder vorteilhafterweise indirekt über eine Leiterbahn der oberen Leiterplatte 4 kontaktiert sein.Mounted on the
Gemäß Fig. 1 wird vorzugsweise der Einkoppelpunkt der Durchkontaktierung 14 an der unteren Antennenstruktur 12 von der oberen Antennenstruktur 22 nicht überdeckt; vorteilhafterweise wird dieser Einkoppelpunkt auch nicht von dem oberen Substrat 21 überdeckt, so dass dieser Einkoppelpunkt als Anlötpunkt gelötet werden kann, ohne dass er mit dem oberen Substrat 21 kollidiert und z. B. eine entsprechende Aussparung in dem oberen Substrat auszubilden ist.According to FIG. 1, the coupling-in point of the via 14 at the
Auf der unteren Patch-Antenne 10 ist eine obere Patch-Antenne 20 befestigt, die ein oberes Substrat 21, eine auf der Oberseite des oberen Substrates 21 ausgebildete obere λ/2-Antennenstruktur 22 und eine auf der Unterseite des oberen Substrates 21 ausgebildete vollflächige obere Metallisierung 23 aufweist. Die obere λ/2-Antennenstruktur 22 ist über eine obere Durchkontaktierung 24 direkt oder über die obere Leiterplatte 4 mit einem auf der Unterseite der oberen Leiterplatte 4 angebrachten, in der rechten Verstärkerkammer 8 aufgenommenen zweiten rauscharmen Verstärker (LNA) 26 kontaktiert, der die aufgenommenen HF-Signale verstärkt und über einen zweiten (rechten) koaxialen Abgriff 28 weitergibt.Mounted on the
Eine durch das untere Substrat 11 verlaufende Durchkontaktierung 19 verbindet die untere λ/2-Antennenstruktur 12 galvanisch mit der unteren Metallisierung 13 und diese somit auf ein gleiches Potential legt. Die Durchkontaktierung 19 erfolgt hierbei vorteilhafterweise mittig an der unteren λ/2-Antennenstruktur 12, da in diesem Bereich keine wesentlichen Spannungen, sondern ein Strommaximum der induzierten HF-Ströme auftritt.A through
Teile der rauscharmen Verstärker 7, 8 können auch auf der separaten Leiterplatte 3 aufgebaut sein. Die Teilung der Verstärker 7, 8 kann sich nur auf die Gleichspannungsversorgung beziehen oder sogar für eine ganze oder mehrere HF-Verstarker-Stufen ausgebildet sein. Alternativ hierzu können auch beide Verstärker 7, 8 auf einer separaten Leiterplatte aufgenommen sein. Falls eine Gleichspannungstrennung vorgesehen ist, kann eine einfache Drahtverbindung 32 zwischen den beiden Leiterplatten 3 und 4 als elektrische Verbindung vorgesehen sein.Parts of the low-
Die obere Patch-Antenne 20 mit der oberen λ/2-Antennenstruktur 22 ist kleiner als die untere Patch-Antenne 10 mit der unteren λ/2-Antennenstruktur 12, wodurch gute Strahlungseigenschaften der λ/2-Antennen 10, 20 erreicht werden. Hierbei ist die obere Patch-Antenne 20 zum Empfang eines GPS-Signals und die untere Patch-Antenne 10 z. B. für SDARS oder DAB vorgesehen; ergänzend kann die untere Patch-Antenne 10 auch für terrestrischen Empfang, z.B. bei SDARS, vorgesehen sein. Vorteilhafterweise ist die obere, kleinere Patch-Antenne 20 für niedrigere Frequenzbänder und die untere Patch-Antenne 10 für höhere Frequenzbänder ausgelegt; durch entsprechende Wahl der Dielektrizitätskonstanten εr können die Frequenzbänder jedoch grundsätzlich frei festgelegt werden; entsprechend kann die obere Patch-Antenne 20 auch für ein niedrigeres Frequenzband vorgesehen sein, in dem das obere Substrat 21 eine entsprechend höhere Dielektrizitätkonstante εr aufweist.The
Erfindungsgemäß kann die Metallisierung 23 der oberen Patch-Antenne 20 weggelassen werden, so dass das obere Substrat 21 die unter ihr angeordnete untere Antennenstruktur 12 als Metallisierung sieht.According to the invention, the
Das Antennenmodul 41 der Fig. 2 ist grundsätzlich entsprechend demjenigen der Fig. 1 aufgebaut und entsprechend mit gleichen Bezugszeichen versehen. Hierbei ist jedoch der erste (linke) Verstärker 16 auf der unteren Leiterplatte 3 aufgebaut. Alternativ hierzu kann vorzugsweise auch lediglich der HF-Teil des ersten Verstärkers 16 auf der separaten, unteren Leiterplatte 3 aufgebaut sein. Hierbei ist eine z.B. durch eine Koaxialleitung 43 gebildete HF-Verbindung zwischen den Leiterplatten 3 und 4 vorgesehen.The
Fig. 3 zeigt ein Antennenmodul 51, bei dem auf der Grundplatte 2 zusätzlich zu dem in Fig. 1 bzw. 2 gezeigten Antennenmodul 1 bzw. 41 lateral anschließend eine Antenne 53 vorgesehen ist, die als Monopol ausgebildet oder hauptsächlich vertikal ausgerichtet ist. Die Antenne 9 kann beispielsweise als Dual- oder Mehrbandfunkantenne oder AM/FM-Radio-Empfangsantenne sowie als terrestrische DAB-Antenne (L-Band oder Band III) oder als eine Kombination dieser Antennen ausgeführt sein.FIG. 3 shows an
Ein dritter Verstärker 55 ist z.B. unterhalb der Antenne 53 in einer separaten Kammer vorgesehen ; die Verstärker 7, 8 und 55 können auch Funktionen teilen.A
Fig. 4 a bis c zeigen Ausführungsbeispiele für Band-Sperren-Filter 60. Diese Filter sind so ausgelegt, dass das Sendeband der Funkantenne 53 hinreichend unterdrückt wird, so dass bei einem gleichzeitigen Betrieb von Funk und digitalem Radio oder GPS keine Beeinträchtigung hervorgerufen wird. In den Band-Sperren-Filtem 60 ist als Induktivität ein Leitungsstück 62 vorgesehen, das mit einem Kondensator C gemäß Fig. 4a einen Reihenschluss und gemäß Fig. 4c einen Parallelschluss bildet. In Fig. 4b ist ein Leitungsstück 64 als λ/4-Leitung vorgesehen, die eine Leerlauf-Kurzschluss-Transformation bewirkt. Das Blindelement Z ist jeweils zwecks Anpassung vorgesehen und kann ein Kondensator, eine Spule oder eine Kombination derartiger Elemente in einer entsprechenden Schaltung sein. Die Band-Sperren-Filter 60 sind jeweils mit ihrem Eingang 66 an den jeweiligen Antennenfusspunkt und mit ihrem Ausgang 67 an den Eingang des jeweiligen Verstärkers anzuschließen.4 a to c show exemplary embodiments of band-
Claims (23)
einem unteren Substrat (11) aus einem dielektrischen Material,
einer auf der Oberseite des unteren Substrates (11) ausgebildeten unteren λ/2-Antennenstruktur (12) für Frequenzen im GHz-Bereich im Satellitenempfang und
einer auf der Unterseite des unteren Substrates (11) vorgesehenen unteren Metallisierung (13),
einem oberen Substrat (21) aus einem dielektrischen Material,
einer auf der Oberseite des oberen Substrates (21) ausgebildeten oberen λ/2-Antennenstruktur (22) für Frequenzen im GHz-Bereich im Satellitenempfang, und
einer auf der Unterseite des oberen Substrates (21) ausgebildeten oder aufliegenden Metallisierung (23; 12),
wobei die obere Patch-Antenne (20) gegenüber der unteren Patch-Antenne (10) kleiner dimensioniert ist.Antenna module for frequencies in the GHz range, for attachment to a motor vehicle, comprising at least:
a lower substrate (11) made of a dielectric material,
a lower λ / 2 antenna structure (12) formed on the upper side of the lower substrate (11) for frequencies in the GHz range in the satellite reception and
a lower metallization (13) provided on the underside of the lower substrate (11),
an upper substrate (21) made of a dielectric material,
an upper λ / 2 antenna structure (22) formed on the upper side of the upper substrate (21) for frequencies in the GHz range in the satellite reception, and
a metallization (23, 12) formed or resting on the underside of the upper substrate (21),
wherein the upper patch antenna (20) is smaller in size than the lower patch antenna (10).
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DE102004035064A DE102004035064A1 (en) | 2004-07-20 | 2004-07-20 | antenna module |
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US7405700B2 (en) | 2005-06-06 | 2008-07-29 | Laird Technologies, Inc. | Single-feed multi-frequency multi-polarization antenna |
US8111196B2 (en) | 2006-09-15 | 2012-02-07 | Laird Technologies, Inc. | Stacked patch antennas |
US7528780B2 (en) | 2006-09-15 | 2009-05-05 | Laird Technologies, Inc. | Stacked patch antennas |
US7277056B1 (en) | 2006-09-15 | 2007-10-02 | Laird Technologies, Inc. | Stacked patch antennas |
US7587183B2 (en) | 2006-12-15 | 2009-09-08 | Laird Technologies, Inc. | Multi-frequency antenna assemblies with DC switching |
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US9553365B2 (en) | 2011-03-15 | 2017-01-24 | Delphi Deutschland Gmbh | Multiband reception antenna for the combined reception of satellite signals and terrestrially emitted radio signals |
US9093750B2 (en) | 2013-09-12 | 2015-07-28 | Laird Technologies, Inc. | Multiband MIMO vehicular antenna assemblies with DSRC capabilities |
US9270019B2 (en) | 2013-09-12 | 2016-02-23 | Laird Technologies, Inc. | Multiband MIMO vehicular antenna assemblies with DSRC capabilities |
Also Published As
Publication number | Publication date |
---|---|
US7489280B2 (en) | 2009-02-10 |
US20070210967A1 (en) | 2007-09-13 |
US7295167B2 (en) | 2007-11-13 |
EP1619752B1 (en) | 2014-04-02 |
US20060273969A1 (en) | 2006-12-07 |
DE102004035064A1 (en) | 2006-02-16 |
US20060220970A1 (en) | 2006-10-05 |
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