EP1608788A1 - Oxygen-free copper alloy and method for its manufacture and use of copper alloy - Google Patents
Oxygen-free copper alloy and method for its manufacture and use of copper alloyInfo
- Publication number
- EP1608788A1 EP1608788A1 EP04725401A EP04725401A EP1608788A1 EP 1608788 A1 EP1608788 A1 EP 1608788A1 EP 04725401 A EP04725401 A EP 04725401A EP 04725401 A EP04725401 A EP 04725401A EP 1608788 A1 EP1608788 A1 EP 1608788A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- alloy
- ppm
- oxygen
- magnesium
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Definitions
- the invention relates to an oxygen-free copper alloy, in which there is alloyed material that increases temperature resistance.
- the alloy is particularly suited to be used in targets where both a good temperature resistance and a good electroconductivity is required of the alloy.
- the invention also relates to manufacturing the copper alloy and to the use of the copper alloy.
- the oxygen content of the most generally used copper quality is typically 200 - 400 ppm.
- Oxygen is naturally bound in copper in a regular manufacturing process.
- the oxygen content can also be kept on a desired level intentionally, because oxygen bounds harmful substances to less harmful oxides.
- the electroconductivity of copper is always the higher, the purer the copper is, and also the oxygen bound in copper reduces conductivity.
- the thermal conductivity of copper is proportional to its electroconductivity.
- oxygen-free copper with an oxygen content not higher than 10 ppm.
- oxygen-free copper oxygen is prevented from getting into contact with molten copper by using a protective, reducing layer on top of the melt (for example graphite), by using protective gas (for example nitrogen) or by using a vacuum.
- the temperature resistance of oxygen-free copper has been improved by alloying silver in the copper, for example 0.02 - 0.3% of the alloy weight.
- magnesium has earlier been used as a microalloying ingredient, generally in very small contents.
- Other alloy ingredients are generally used at the same time.
- these types of alloys which are used for producing connector wire employed in semiconductor technology. By melting, the wire is formed into drops that have a perfect ball shape. Said material also has a good tensile strength.
- magnesium is suggested as an alloy ingredient also in the publication JP-A-63140052, for example. Here magnesium, with the content of 3 - 10 ppm, lowers the softening temperature of copper.
- the object of the present invention is to eliminate some drawbacks of the prior art and to achieve an improved oxygen-free copper alloy.
- the essential features of the invention are enlisted in the claims.
- magnesium is alloyed in oxygen-free copper, when calculated of the alloy weight.
- the magnesium content of an oxygen-free copper alloy according to the invention is over 30 ppm, preferably over 50 ppm.
- the magnesium content is not higher than 180 ppm, preferably not higher than 150 ppm.
- the oxygen content of the alloy is not higher than 10 ppm, preferably not higher than 5 ppm, such as 1 - 3 ppm.
- the alloy is suited to be used particularly in products where there is required a good temperature resistance, and at the same time good electroconductivity or thermal conductivity.
- the temperature resistance of copper is generally expressed by the so-called half-softening temperature (V ⁇ ).
- V ⁇ half-softening temperature
- the half-softening temperature is remarkably dependent on the degree of deformation.
- the half-softening temperature is generally defined with a degree of deformation of 40 % and 94 %.
- the electroconductivity of copper is generally expressed by the so-called IACS- value (International Anneal Copper Standard). It expresses the electroconductivity in percentages of the electroconductivity of standard non- alloyed copper.
- the electroconductivity of an oxygen-free copper quality is at least 100 % I ACS.
- the half-softening temperatures of copper alloys according to the invention are at least of the same order as those of alloys containing 0.3 - 0.25% silver. With a 40% degree of deformation, the half-softening temperature is at least 340° C, preferably at least 380° C. With a 94% degree of deformation, the half-softening temperature is at least 300° C, preferably at least 335° C. Irrespective of alloying, the electroconductivity still remains on a high level (over 100 % IACS). Conductivity is preferably at least about'101 % IACS.
- magnesium raises the recrystallization temperature of pure copper.
- Magnesium atoms are larger than copper atoms, wherefore the lattice structure is distorted, and tensions are created. Consequently the moving of dislocations becomes more difficult.
- Magnesium alloyed copper can be manufactured by similar manufacturing techniques as other qualities of oxygen-free copper, for example in slab or rod casting, either as horizontal or vertical casting. In a suitable step of the process, for instance into the casting furnace, there is added a required amount of magnesium. Because magnesium is sensitive to react with oxygen, especial attention must be paid to protection from air. Also in devices that get into contact with the melt, it is advantageous to use such oxide-free materials from which magnesium cannot bind oxygen. Casting is generally followed by thermal treatment and working. A typical route for manufacturing could be slab casting downwards and working by hot and cold casting. With these contents, magnesium can result in secondary grain structure, which must be taken into account when choosing the working temperature.
- the total content of said impurities is preferably not higher than 10 ppm.
- the copper according to the invention can be used in targets where a good temperature resistance is required. These are for instance commutators of electric motors, which contain several segments and the temperature of resins, which are used to fit segments together, will rise up higher than 200 °C. Further, the copper alloy of the invention can be used in substrate materials that are coated at high temperatures. For instance, solar panels are manufactured by high-temperature coating processes. One target is also the electrode tips used in welding, prerably in MIG welding, and flat bars and profiles used in generators, in which the copper alloy of the invention replaces the more expensive copper silver alloy.
- alloy ingredients can be used. These are particularly silver and phosphorus. It is well known that silver raises the half-softening temperature. The silver content is advantageously not higher than 500 ppm. Other possible alloy ingredients are for instance sulphur, tin, zinc, nickel, silicon and tellurium. Advantageously the content of these is not higher than 50 ppm. Also tin raises the half-softening temperature, but it is not as efficient as magnesium, and what is more, it lowers conductivity to a larger degree.
- silver raises the half-softening temperature.
- the silver content is advantageously not higher than 500 ppm.
- Other possible alloy ingredients are for instance sulphur, tin, zinc, nickel, silicon and tellurium.
- the content of these is not higher than 50 ppm.
- tin raises the half-softening temperature, but it is not as efficient as magnesium, and what is more, it lowers conductivity to a larger degree.
- magnesium alloyed oxygen-free copper alloys in which there were alloyed magnesium 50, 100 and 150 ppm of the alloy weight.
- the temperature resistance and electroconductivity of the alloys were compared with the temperature resistance and electroconductivity of known silver-copper alloys.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20030508A FI20030508A0 (en) | 2003-04-03 | 2003-04-03 | Oxygen-free copper alloy |
FI20030508 | 2003-04-03 | ||
PCT/FI2004/000203 WO2004087976A1 (en) | 2003-04-03 | 2004-04-02 | Oxygen-free copper alloy and method for its manufacture and use of copper alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1608788A1 true EP1608788A1 (en) | 2005-12-28 |
Family
ID=8565920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP04725401A Withdrawn EP1608788A1 (en) | 2003-04-03 | 2004-04-02 | Oxygen-free copper alloy and method for its manufacture and use of copper alloy |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060198757A1 (en) |
EP (1) | EP1608788A1 (en) |
CN (1) | CN1798854A (en) |
FI (1) | FI20030508A0 (en) |
TW (1) | TW200426231A (en) |
WO (1) | WO2004087976A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2018264670B2 (en) | 2017-05-10 | 2023-10-26 | Haldor Topsøe A/S | A process for reducing the content of oxygen in metallic copper |
CN111549254A (en) * | 2020-04-29 | 2020-08-18 | 铜陵有色金属集团股份有限公司金威铜业分公司 | Oxygen-free copper-based microalloy and preparation method and application thereof |
JP7205567B2 (en) * | 2021-05-31 | 2023-01-17 | 三菱マテリアル株式会社 | Copper alloy plastic working materials, copper alloy bars, parts for electronic and electrical equipment, terminals |
TW202212584A (en) * | 2020-06-30 | 2022-04-01 | 日商三菱綜合材料股份有限公司 | Copper alloy plastic working material, copper alloy rod material, component for electronic/electrical devices, and terminal |
JP7120389B1 (en) | 2021-05-31 | 2022-08-17 | 三菱マテリアル株式会社 | Copper alloy plastic working materials, copper alloy wire rods, parts for electronic and electrical equipment, terminals |
US20230243020A1 (en) * | 2020-06-30 | 2023-08-03 | Mitsubishi Materials Corporation | Plastic copper alloy working material, copper alloy wire material, component for electronic and electrical equipment, and terminal |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
JPH03291340A (en) * | 1990-04-10 | 1991-12-20 | Mitsubishi Materials Corp | Copper alloy extra fine wire for semiconductor device and semiconductor device |
JP2662209B2 (en) * | 1995-10-05 | 1997-10-08 | 古河電気工業株式会社 | Copper alloy for electronic equipment with excellent plating adhesion and solder bondability and its manufacturing method |
JP2898627B2 (en) * | 1997-03-27 | 1999-06-02 | 日鉱金属株式会社 | Copper alloy foil |
JP3957391B2 (en) * | 1998-03-06 | 2007-08-15 | 株式会社神戸製鋼所 | High strength, high conductivity copper alloy with excellent shear processability |
-
2003
- 2003-04-03 FI FI20030508A patent/FI20030508A0/en not_active Application Discontinuation
-
2004
- 2004-03-29 TW TW093108493A patent/TW200426231A/en unknown
- 2004-04-02 US US10/551,477 patent/US20060198757A1/en not_active Abandoned
- 2004-04-02 CN CNA2004800087052A patent/CN1798854A/en active Pending
- 2004-04-02 WO PCT/FI2004/000203 patent/WO2004087976A1/en active Search and Examination
- 2004-04-02 EP EP04725401A patent/EP1608788A1/en not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO2004087976A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2004087976A1 (en) | 2004-10-14 |
US20060198757A1 (en) | 2006-09-07 |
TW200426231A (en) | 2004-12-01 |
CN1798854A (en) | 2006-07-05 |
FI20030508A0 (en) | 2003-04-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20050928 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL HR LT LV MK |
|
DAX | Request for extension of the european patent (deleted) | ||
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: RENFORS, TUOMAS Inventor name: HIEKKANEN, ILPPO |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LUVATA OY |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20081101 |