EP1527121A1 - Compositions polymeres cristallines liquides - Google Patents

Compositions polymeres cristallines liquides

Info

Publication number
EP1527121A1
EP1527121A1 EP03771815A EP03771815A EP1527121A1 EP 1527121 A1 EP1527121 A1 EP 1527121A1 EP 03771815 A EP03771815 A EP 03771815A EP 03771815 A EP03771815 A EP 03771815A EP 1527121 A1 EP1527121 A1 EP 1527121A1
Authority
EP
European Patent Office
Prior art keywords
composition
percent
weight
aramid
particulate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP03771815A
Other languages
German (de)
English (en)
Other versions
EP1527121B1 (fr
Inventor
Michael Robert Samuels
Michael Joseph Molitor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of EP1527121A1 publication Critical patent/EP1527121A1/fr
Application granted granted Critical
Publication of EP1527121B1 publication Critical patent/EP1527121B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/52—Liquid crystal materials characterised by components which are not liquid crystals, e.g. additives with special physical aspect: solvents, solid particles
    • C09K19/54—Additives having no specific mesophase characterised by their chemical composition
    • C09K19/542—Macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
    • H01B3/445—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds from vinylfluorides or other fluoroethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles

Definitions

  • Liquid crystalline polymer compositions containing a perfluorinated polymer, a particulate aramid, and optionally hollow glass or quartz spheres usually have low dielectric constants, making them useful as substrates for electronic appplication such as electrical connectors, particularly when those applications involve high fre- quncy signals.
  • dielectric constant is important when dealing with high frequency signals. If the dielectric constant of the substrate is too high, these signals may be attenuated to such a degree that the elec- tronic apparatus does not function as designed. Therefore these substrates, particularly for this type of application, should have as low a dielectric constant as possible.
  • other properties are also necessary and/or de- sirable in such substrates, such as good strength, resistance to high temperatures, good fire resistance, and good formability, etc. Making such compositions is a challenge, since improving one particular property often leads to deterioration of another (desired) property. Thus such compositions are constantly being sought.
  • U.S. Patent 5,398,990 describes LCP compositions containing hollow glass spheres and polytetrafluoroethyl- ene. The presence of aramids is not mentioned.
  • European Patent Application 512,401 describes certain laminates having low dielectric constants .
  • the resin compositions contain molecularly porous aerogels, not hollow glass or quartz spheres.
  • Japanese Patent Application 0455437 describes a prepreg material which is made from a fluoroplastic, hollow glass spheres, and a cloth or paper-like material which can be an aramid. This material may be saturated with a thermosetting resin such as an epoxy resin, but LCPs aren't mentioned.
  • This invention concerns a composition, comprising, about 5 to about 25 percent by weight of a particulate aramid, about 5 to about 40 percent by weight of a particulate perfluorinated polymer, 0 to about 15 percent by weight of hollow glass or quartz spheres, and the remainder a liquid crytsalline polymer (LCP) , wherein percent by weight are based on the total amount of said particu- late aramid, perfluorinated thermoplasctic, hollow glass or quartz spheres, and liquid crystalline polymer present .
  • LCP liquid crytsalline polymer
  • aramid is meant aramid particles whose average largest dimension does not exceed 500 ⁇ , preferably 200 ⁇ m, and more preferably is less than 100 ⁇ m.
  • the particles may be of any shape, for example short fibers, fibrils, fibrids, irregular, spherical, disc shaped, etc. The longest dimension for example of a fi- ber, fibril or fibrid will normally be its length.
  • Particulate aramid also excludes aramids in the form of woven or nonwoven fabrics or aramid papers, even though the "particles" of aramid in any of these types of materials meet the size limitations described above. However there may be some adventitious entanglement between particulate aramid particles in the composition, formed when the composition is melt molded.
  • perfluorinated polymer a polymer which does not contain any hydrogen in a repeat unit, but may contain traces of hydrogen, for example in end groups .
  • thermoplastic a polymer which has a melting point or glass transition temperature above 30°C, preferably above 60°C.
  • the heat of melting should be at least 2 J/g for a polymer which is not liquid crystalline .
  • liquid crystalline polymer a polymer that is anisotropic when tested using the TOT test or any reasonable variation thereof, as described in U.S. Patent 4,118,372, which is hereby included by reference .
  • the perfluorinated polymer is present in the amount of about 10 to about 30 percent by weight. It is typically added as a particulate material to the other ingredients of the composition, to help assure uniform distribution of the various ingredients.
  • Preferred perfluorinated polymers include the homo- and copolymers of tetrafluoroethylene (TFE) .
  • perfluorinated polymers include polytetrafluoroethylene (PTFE) , a copolymer of TFE and hexafluoropropylene, and a copolymer of TFE and perfluoro (methyl vinyl ether).
  • PTFE is an especially preferred perfluorinated polymer.
  • PTFE is available as a fine powder from manufacture of PTFE aqueous dispersions, and such fine powders are useful for making the present compositions.
  • PTFE is diffi- cult to melt process for the purposes herein it is considered a thermoplastic . It is preferred that the perfluorinated polymer is a thermoplastic.
  • Hollow glass and quartz (micro) spheres suitable for use herein, are available commercially from companies such as 3M Co., St. Paul, MN, USA, and PQ Corp., Valley Forge, PA, USA. They typically have diameters of about 20 ⁇ m to about 75 ⁇ m. It is preferred that their concentration in the composition is 0 to about 10 percent by weight. Quartz is a preferred material for the hollow microspheres.
  • the spheres may be coated with an adhesion promoter such as a functional silane adhesion promoter to (nominally) improve adhesion between the spheres and the LCP.
  • the particulate aramid is about 8 to about 22 weight percent of the composition. All preferred percentages by weight herein are based on the total weight of named ingredients (as in claim 1) , and any preferred percentage by weight may be combined with any other (preferred) percentage by weight .
  • the particulate aramid is a "powder" grade. Such grades contain particles which for the most part are not fiber-like or fibrillar-like.
  • the aramid powder usually has a surface area of 2 m 2 /g or less, often 0.2 m 2 /g or less. It may be prepared by grinding the aramid, see for instance U.S. Patents 5,474,8-2 and 5,811,042, and Research Disclosure, May 1996, p. 293.
  • the particle size is such that at least 90 percent by weight, more preferably 95 percent by weight of the powder passes through a No. 100 (150 ⁇ m) screen when tested according to ASTM Method D-1921-01, Test Method B.
  • a composition containing a thermotropic LCP and powdered aramid has exceptionally good (improved) physical properties, such as tensile and flexural proper- ties.
  • a preferred aramid for the powder or any other particulate aramid form is poly (p-phenylene tereph- thalamide) .
  • compositions described herein can be made using typical thermoplastic mixing and processing techniques .
  • all of the ingredients can be fed to a single or twin screw extruder (the ingredients do not have to be fed simultaneously or at the same place in the extruder) , and using the mechanical action and/or heaters of the extruder the LCP, and optionally the perfluorinated po-ly- mer, are melted and mixed with the other ingredients.
  • the composition formed should be relatively uniform, with the aramid particles, glass or quartz spheres and perfluorinated polymer being reasonably uniformly dispersed in the LCP.
  • the LCP is typically present as a continuous phase in the composition.
  • the perfluorinated polymer and/or aramid are preferably present as discontinuous phases within the LCP continuous phase.
  • Other ingredients such as those typically used in thermoplastic compositions, may also be present, particularly in small quantities.
  • Such ingredients include fillers and reinforcing agents, pigments, dyes, antioxi- dants, lubricants, and nucleating agents.
  • these other ingredients should not deleteriously significantly affect the important properties of the composition.
  • the compositions of the present invention may be melt molded, while having lower dielectric constants (particularly at higher frequencies such as 5 GHz) than other typical LCP compositions, while maintaining other reasonable physical properties, for example tensile strength and elongation, and flexural strength and elon- gation. They often also have good flammability resistance, for example having a UL-94 rating of V-0 at 1.59 mm (1/16") thickness. This make them particularly useful in electrical or electronic parts such as electrical connectors where the reduced dielectric constant permits rapid passage with low .parasitic losses in high frequency applications, and their strength properties are sufficient for this application. Melt molding can be carried out conventional techniques such as injection molding, extrusion, etc. Herein certain properties are measured as follows:
  • Melting point and glass transition temperature are measured by method ASTM Method D3418. Melting points are taken as the temperature at the peak of the melting endotherm, and glass transition temperatures are taken as the midpoint of the transition. Melting points and glass transition temperatures are measured on the second heat, using a heating rate of 25°C/min. If more than one melting point is present the melting point of the polymer is taken as the highest of the melting points. Heats of fu- sion are taken as the area under the melting endotherm. Dielectric constant (e' ) , dielectric loss (e"), and loss tangent (e"/e') are determined by ASTM Method D- 150.
  • tensile strength and tensile elongation to break were determined using ASTM Method D- 638 (using strain gauges)
  • flexural modulus and flexural strength were determined by ASTM Method D-790
  • Heat Deflection Temperature (HDT) was determined by ASTM Method D648 at a 1.82 MPa load. Electrical properties were measured by ASTM Method D-257.
  • Examples 1-8 Liquid crystalline polymers, designated A, B or C were compounded with 10 weight percent (20 weight percent in Example 4) Kevlar ® Aramid Resin, Type # R120, or 10 weight percent 1.5 mm long Kevlar® cut floe (Example 7 and 8) (both available from E.I. DuPont de Nemours & Co .
  • Kevlar ® powder or floe and hollow glass spheres were fed through the feed zone of a 30 mm bilobal twin screw extruder manufactured by Werner & Pfleiderer (Stuttgart, Germany) . Screw RPM was set at 250. The resulting compounded products were molded into 15.2 cm xl5.2 cm x 0.16 cm plaques (electrically heated mold) using a 6 oz . HPM molding ma- chine and the following molding conditions: barrel temperatures 350°C, 110°C mold temperature, boost time 2 sec, injection time 10 sec, hold time 15 sec, boost pressure 4.8 MPa, injection pressure 3.5 MPa, screw speed 120 RPM.
  • Liquid crystalline polymer A was compounded with (percentages are weight percents) : •
  • Example 6 the average of 2 plaques

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)

Abstract

L'invention concerne des compositions polymères cristallines liquides pouvant être moulées en fusion et contenant un polymère perfluoré, un aramide particulaire, et éventuellement des billes de verre ou de quartz creuses, et possédant habituellement des constantes diélectriques faibles. Lesdites compositions sont particulièrement utiles en tant que connecteurs électriques et substrats pour d'autres applications électroniques dans lesquelles des signaux haute fréquence sont utilisés.
EP03771815A 2002-07-25 2003-07-23 Compositions polymeres cristallines liquides Expired - Fee Related EP1527121B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US39871002P 2002-07-25 2002-07-25
US398710P 2002-07-25
PCT/US2003/023225 WO2004011526A1 (fr) 2002-07-25 2003-07-23 Compositions polymeres cristallines liquides

Publications (2)

Publication Number Publication Date
EP1527121A1 true EP1527121A1 (fr) 2005-05-04
EP1527121B1 EP1527121B1 (fr) 2006-06-07

Family

ID=31188460

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03771815A Expired - Fee Related EP1527121B1 (fr) 2002-07-25 2003-07-23 Compositions polymeres cristallines liquides

Country Status (9)

Country Link
US (1) US7128847B2 (fr)
EP (1) EP1527121B1 (fr)
JP (1) JP4425790B2 (fr)
KR (1) KR20050025991A (fr)
CN (1) CN1294207C (fr)
AU (1) AU2003256774A1 (fr)
CA (1) CA2493754A1 (fr)
DE (1) DE60305926T2 (fr)
WO (1) WO2004011526A1 (fr)

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US7744802B2 (en) * 2004-06-25 2010-06-29 Intel Corporation Dielectric film with low coefficient of thermal expansion (CTE) using liquid crystalline resin
JP2006045517A (ja) * 2004-06-30 2006-02-16 Sumitomo Chemical Co Ltd フィルム
KR101148384B1 (ko) * 2009-11-26 2012-05-21 삼성전기주식회사 기판 형성용 조성물, 및 이를 이용한 프리프레그 및 기판
JP2015522086A (ja) * 2012-06-27 2015-08-03 ティコナ・エルエルシー 超低粘度の液晶性ポリマー組成物
CN108882515A (zh) * 2018-09-21 2018-11-23 维沃移动通信有限公司 一种信号传输器件、信号传输器件的加工方法及移动终端
JP2021109891A (ja) * 2020-01-07 2021-08-02 パナソニックＩｐマネジメント株式会社 液晶性樹脂組成物及び成形品
JP2021147476A (ja) * 2020-03-18 2021-09-27 Ｅｎｅｏｓ株式会社 樹脂組成物および該樹脂組成物からなる樹脂成形品
CN113930084B (zh) * 2021-09-18 2024-05-07 珠海万通特种工程塑料有限公司 一种液晶聚合物组合物及其应用
WO2023127734A1 (fr) * 2021-12-28 2023-07-06 住友化学株式会社 Composition de résine, et corps moule

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Also Published As

Publication number Publication date
JP4425790B2 (ja) 2010-03-03
DE60305926T2 (de) 2007-01-25
KR20050025991A (ko) 2005-03-14
DE60305926D1 (de) 2006-07-20
CA2493754A1 (fr) 2004-02-05
CN1294207C (zh) 2007-01-10
US20040056233A1 (en) 2004-03-25
JP2005533908A (ja) 2005-11-10
AU2003256774A1 (en) 2004-02-16
US7128847B2 (en) 2006-10-31
WO2004011526A1 (fr) 2004-02-05
EP1527121B1 (fr) 2006-06-07
CN1671770A (zh) 2005-09-21

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