EP1523749A2 - Oberflächenmontierbares bauelement und verfahren zu dessen herstellung - Google Patents
Oberflächenmontierbares bauelement und verfahren zu dessen herstellungInfo
- Publication number
- EP1523749A2 EP1523749A2 EP03764907A EP03764907A EP1523749A2 EP 1523749 A2 EP1523749 A2 EP 1523749A2 EP 03764907 A EP03764907 A EP 03764907A EP 03764907 A EP03764907 A EP 03764907A EP 1523749 A2 EP1523749 A2 EP 1523749A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- individual
- connection
- component
- connections
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 title description 6
- 239000003990 capacitor Substances 0.000 claims abstract description 52
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 16
- 238000009736 wetting Methods 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 abstract description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 21
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 8
- 229910052758 niobium Inorganic materials 0.000 description 7
- 239000010955 niobium Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000003870 refractory metal Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001404 mediated effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WTKKCYNZRWIVKL-UHFFFAOYSA-N tantalum Chemical compound [Ta+5] WTKKCYNZRWIVKL-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/14—Structural combinations or circuits for modifying, or compensating for, electric characteristics of electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/26—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
Definitions
- the invention relates to a surface-mountable component with individual components and an external connection.
- the invention further relates to a method for producing the surface-mountable component.
- surface-mountable components which are tantalum electrolytic capacitors. These surface-mountable components have the disadvantage that they have a replacement series resistor, also known as Electrical Serial Resistence (ESR), which is too high for some requirements.
- ESR Electrical Serial Resistence
- a surface-mountable component is specified which has at least one external connection. Furthermore, the
- the external connection is connected to several individual connections via welding spots.
- the external connection forms a contact area on the assembly side of the component, an area being provided in the external connection for later wetting with solder that is free of welding spots.
- the surface-mountable component has the advantage that the individual components are connected with their individual connections with the aid of the external connection. Accordingly, the individual components are connected from the outside, that is to say after the individual individual component has been manufactured. There. -The external connection is connected to the individual connections via welding spots, resulting in a particularly stable, corrosion-resistant electrical connection between the external connection and the individual connections. At the external connection, a surface is provided for later wetting with solder, which is free of welding spots, so that a particularly simple soldering of the component according to the invention with e.g. one
- Printed circuit board is made possible. Welding spots generally have the property of not being readily wettable with solder.
- Individual connections mean in particular connections of the individual components which are arranged on the outside of the individual components.
- a contact surface is formed on the assembly side of the component, a surface-mountable component can be implemented in a simple manner.
- Stacking the individual components together also has the advantage that a space-saving structure of the individual components can be realized.
- the external connection is L-shaped.
- One leg of the L forms the contact surface. It is particularly advantageous if the leg of the L forming the contact surface is directed inwards. This creates a particularly space-saving structure.
- the external connection can be formed from one of the individual connections. This has the advantage that the processing of additional elements can be dispensed with.
- the surface-mountable component is preferably pressed into prepared solder points or conductive adhesive on a circuit board and then wetted with solder on its contact surfaces by means of heat.
- the solder must not only be wetted on the contact surface on the assembly side of the component. Rather, wettability with solder must also be present at a certain minimum height above the circuit board on the external contacts of the component. By having the external contact on its outside no overlap with others Has contact elements, particularly good wettability with solder is given here.
- each individual component has its own housing.
- the external connection is a separate part which is connected to individual connections.
- This embodiment has the advantage that the external connection can be used as a shaping element when assembling the component.
- a method for producing the component is specified, external connections being provided in a first method step, the position of the external connections limiting the external dimensions of the component to be produced.
- individual components each of which has individual connections, are stacked with one another, specifically within the positioned external connections.
- the individual connections of the individual components are connected to the external connections by means of welding, a surface of the external connection to be wetted with solder being kept free from welding spots.
- the external connection extends along a side surface of the component. This arrangement of the external connection ensures that the component takes up little space in the lateral direction and can therefore be used for a space-saving construction on a circuit board.
- connection by laser welding is advantageously considered.
- other welding processes that can be used for joining the external connection and individual connection. Joining by welding has the advantage that a reliable and stable connection can be created both electrically and mechanically.
- individual components are stacked one on top of the other.
- the mounting surface of the component is formed by the base of the lower individual component.
- the individual connections of the uppermost individual component are advantageously bent downwards.
- the individual connections of the other individual components can be bent upwards or downwards.
- This embodiment has the advantage that the component advantageously takes up as little space as possible in height, that is to say in the stacking direction.
- the individual components stacked one above the other can be glued to one another by adhesive. This has the advantage that the mechanical strength of the component is improved.
- one or more of the individual components are capacitors which have a housing.
- Each housing includes an anode body.
- An anode contact which is conductively connected to the external connection, is led out of each anode body.
- the anode contact can also be identical to a single connection or the anode contact is connected to the external connection via a separate single connection.
- Such a component has the advantage that it is a multiple capacitor, it being possible to easily connect the individual capacitors in parallel. As a result, the replacement series resistance can advantageously be reduced.
- several individual components are provided, each of which has a housing. An electrical functional unit is arranged in each of these housings. Connection elements of the electrical functional units are led out of the respective housing as individual connections.
- This embodiment of the component shows that the invention is not restricted to capacitors, but can be applied to a large number of different components.
- a number of individual components are stacked one above the other.
- the mounting surface is formed by a side surface of the stack formed in this way.
- This embodiment of the component has the advantage that the individual components can be used advantageously not only one above the other but also in an embodiment stacked next to one another. This is particularly advantageous in cases where the overall height of the component is critical and the individual components have a large height. Here it is particularly advantageous not to stack the individual components one above the other but next to one another.
- two external connections are provided.
- the external connections connect the individual connections of the individual components to a parallel connection of the individual components.
- This special embodiment of the component enables a capacitor to be implemented which consists of a parallel connection of several individual capacitors and thus has a very low equivalent series resistance.
- Figure 1 shows an example of a component in a schematic longitudinal section.
- FIG. 2 shows another embodiment of a component corresponding to FIG. 1, only the right half being shown.
- FIGS. 3, 4, 5 and 6 only the right half of an embodiment corresponding to FIG. 1 being shown in each case.
- FIG. 7 shows a side view of a component, welding spots being arranged in two rows one above the other.
- FIG. 8 shows a representation corresponding to FIG. 7, but only one row of welding spots is arranged.
- FIG. 9 shows the side view of a further embodiment of a component, the individual components lying on edge and thus being stacked next to one another.
- FIG. 10 shows an example of a capacitor in a schematic cross section.
- Figure 11 shows an example of a further capacitor in a schematic cross section.
- FIG. 1 shows a component which is made up of two individual components 21, 22 lying one above the other.
- the individual components 21, 22 each have approximately the shape of a cuboid. They are stacked on top of each other with their flat sides.
- the lower flat side of the lower individual component 21 forms the mounting side 4 of the component.
- a functional unit 101, 102 is provided in each of the individual components 21, 22 and is located in the interior of a housing 21, 22. It is expressly pointed out that the invention is not restricted to components in which the individual components have functional units surrounded by housings. Rather, it is also conceivable that housing-less functional units are stacked together.
- each functional unit 101, 102 individual connections 322, 312 are provided, which are connected to the respective functional unit 101, 102.
- the individual connection 322 of the upper individual component 22 also forms the external connection 12, which forms a contact surface 52 on the underside of the component.
- the outer terminal 12 electrically connects the single terminal 322 to the single terminal 312.
- each functional unit 101, 102 would be anode bodies of tantalum capacitors.
- Each functional unit 101, 102 then has an anode contact 91, 92, which can consist, for example, of a valve metal such as niobium or tantalum.
- Each anode contact 91, 92 is still connected to an individual connection 321, 311 within the respective housing 21, 22. This connection can be realized for example by gluing, soldering or welding.
- a solderable material can be considered as the individual connection 311, 321.
- the individual connections 311, 321 can be made flat.
- they can be in the form of sheets or strips.
- the flat design of the external connections 321, 311 ensures a particularly high and thus advantageous contact area between individual connections 311, 321 and the external connection 11.
- the external connection 11 on the right side of the component is formed by the individual connection 321 of the upper individual component 22.
- the external connection 11 is bent downward before its point of exit from the housing 71, contacts the individual connection 311 of the lower one Individual component 21 and is finally bent inwards on the underside of the stack.
- the external connection 11 forms the shape of an L, with one leg 61 of the L forming a contact surface 51 on the mounting side 4 of the component.
- the external connections 11, 12 can have the form of contact strips, which are preferably, but not necessarily, made of the same material as the individual connections 311, 312, 321, 322. In particular, nickel, steel or also copper and alloys are considered as materials.
- FIG. 1 shows an embodiment of the component in which the individual connections 311, 312 of the lower component 21 are bent upwards.
- FIG. 2 shows an embodiment of the component corresponding to FIG. 1, but with the difference that the individual connection 311 is bent downward at its point of exit from the housing of the individual component 21. However, as in FIG. 1, it runs on the inside of the external connection 11, so that an overlap of connections on the outside of the external connection 11 can be avoided.
- Figure 3 shows an embodiment corresponding to Figure 2, but with the difference that the outer connection 11 is a separate part.
- the external connection 11 contacts the individual connection 321, which in turn contacts the individual connection 311 of the lower individual component 21.
- the external connection 11 has approximately the shape of an L, with a leg 61 of the L forming a contact surface on the underside of the component.
- the individual connection 321 of the upper individual component 22 is bent downwards.
- the individual connection 311 of the lower individual component 21 is bent upwards.
- the length of the individual connections 311, 321 is selected such that the individual connections 311, 321 overlap. Mutual contacting of the individual connections 311, 321 is thereby possible without any problems.
- the individual connections 311, 321 are additionally overlapped by the external connection 11, so that all three contact elements 321, 311, 11 are in mutual electrical and mechanical contact with one another.
- FIG. 4 shows an embodiment corresponding to FIG. 3, however, in contrast to FIG. 3, the individual connection 311 mediates the contact between the individual connection 321 and the external connection 11.
- the external connection 11 does not overlap the overlap area of the individual connections 321, 311.
- the external connection 11 overlaps the individual connection 311.
- the individual connection 311 in turn overlaps with the individual connection 321.
- FIG. 5 shows an embodiment corresponding to FIG. 3, but with the difference that the individual connection 311 is not bent upwards but downwards. Accordingly the length of the individual connection 311 is somewhat shorter than in FIG. 3.
- the embodiment according to FIG. 5 has the advantage over the embodiment according to FIG. 3 that the width of the component is somewhat reduced, which can be a great advantage when space is critical.
- FIG. 6 shows an embodiment corresponding to FIG. 4, but with the difference that the external connection 321 is not only bent downwards but also at a further kink inwards into the space between the individual components 21, 22.
- This design is obtained when a single component is used as the second individual component 22, which in turn already has the property of being surface-mountable. In this case, it is namely necessary to provide a contact surface on the underside of the individual component 22, which in this case is formed by the individual connection 321.
- the electrical contact between the individual connections 311 and 321 is mediated in FIG. 6 by the external connection 11, which overlaps both individual connections 311, 321. However, the individual connections 311, 321 do not overlap one another, which is advantageous with regard to the width of the component.
- FIG. 7 shows a side view of a component, two individual components 21, 22 being stacked one on top of the other.
- the individual connection 11 is connected to the individual connections of the individual components 21, 22 by means of welding points 300.
- the welding points 300 are arranged in two rows one above the other.
- the arrangement of the individual connections in relation to the arrangement of the individual components 21, 22 is selected such that the surface 350 of the external connection 11 to be wetted, which extends from the underside of the component to a certain height, for example half the height of the lower individual component 21 extends, is free of welding spots 300.
- FIG. 8 shows a further embodiment corresponding to FIG. 7, with the difference that the individual connections of the individual components 21, 22 are designed in such a way that the welding spots 300 are only present in a single row.
- Figure 9 shows a further embodiment in a side view corresponding to Figure 7, with the difference that the individual components 21, 22 are stacked side by side.
- the individual connections 311, 312 are led out laterally from the individual components 21, 22 and connected to the common external connection 11.
- the connection is made by welding points 300.
- the stack 200 formed by the individual components 21, 22 thus extends in the lateral direction.
- the external connection 11 is drawn starting from approximately half the height of the individual components 21, 22 to the underside, where it forms an external contact with an L-shaped section which projects inwards (not shown in FIG. 9).
- the mounting surface 41 of the component is not formed by the base surface of one of the individual components 21, 22 but by a side surface of the stack 200.
- the present component can be used particularly advantageously as a stack of stacked capacitors, in particular solid electrolytic capacitors.
- capacitors come into consideration, the anode bodies of which are provided with a flat or also with a round, wire-shaped contact.
- individual capacitors as are known from the publication WO 01/16973 A1, the disclosure of which is expressly incorporated by reference in its entirety here.
- This publication describes solid electrolytic capacitors which have a flat anode contact.
- electrolytic capacitors whose anode contact is a wire-shaped contact.
- embodiments of solid electrolytic capacitors are described which can be used advantageously in the present component:
- a capacitor which has an anode body which is surrounded by a housing with a base area. An anode contact is led out of the interior of the anode body. The anode contact is welded to an anode connection. The surface of the anode connection has a soft solderable material.
- Base area of the housing-extending section of the anode connection forms a soldering area there.
- the capacitor has the advantage that the soldering surface on the base of the housing is not formed by the anode contact led out of the anode body, but by an anode connection having a solderable surface. This eliminates the need to make the anode contact solderable.
- Particularly suitable materials for the anode contact are those which contain a refractory metal.
- Refractory metals are, for example, titanium, zirconium, hafnium, tantalum, niobium, vanadium, tungsten and molybdenum. These refractory metals are in principle suitable for the production of solid electrolytic capacitors such as have already been produced, for example, as tantalum electrolytic capacitors or as niobium electrolytic capacitors.
- alloys of these refractory metals can also be considered as material for the anode contact.
- the anode contact can contain a non-solderable material such as zirconium, tantalum, niobium, molybdenum or tungsten. A solderability of the anode contact is then no longer necessary due to the welded connection between the anode contact and the anode connection.
- a non-solderable material such as zirconium, tantalum, niobium, molybdenum or tungsten.
- This embodiment of the capacitor has the advantage that the anode contact already ends within the housing and thus very little material is used for the anode contact. Since tantalum is used for the anode contact in many cases, this results in an economic advantage.
- the anode contact emerges from an end face of the housing.
- a section of the anode contact lying outside the housing is welded to an anode connection and for
- the anode connection continues the anode contact in the direction of the base area and is bent inwards on the base area in order to form a soldering area on the base area.
- the anode contact can emerge at about half the height on the end face of the housing and can be bent toward the base surface of the housing.
- Such an anode contact has the advantage that, in addition to the soldering surface arranged on the base of the base body, the capacitor can also be soldered in a section extending from the base surface along the end face of the housing to the exit point of the anode contact from the housing.
- solderability of the side tab of the anode contact is required by various standards.
- the IEC 60068-258 standard requires wettability with solder over at least 95% of the total connection area.
- IPC / EIA J-STD-002A only a wettability of the part of the anode contact lying on the front side of the housing is required over the thickness of the anode contact.
- anode connection and the anode contact have the shape of strips running in a longitudinal direction, wherein the width of the anode connection can be different from the width of the anode contact.
- Anode connection and anode contact are particularly easy to produce in the form of strips running in a longitudinal direction, for example in the form of metal sheets.
- a strip-shaped anode contact also has the advantage that the anode body can be applied to the anode contact by screen printing a paste.
- the shape of a strip for the anode connection is advantageous because it enables a stable welded connection to be established by superposing the anode contact and anode connection on top of one another.
- the width of the anode contact that is suitable for certain predetermined electrical properties of the capacitor can be adapted to housing standards for the soldering surface by choosing a suitable width for the anode connection.
- the width of the anode contact is smaller than the width of the anode connection.
- narrow anode contacts as is necessary for capacitors with certain electrical properties, can be adapted to the widths of the soldering surface on the underside of the housing that are required for standardization reasons
- the anode connection can be made softenable by having nickel, copper, cobalt, tin, lead, a noble metal or steel on its surface. It is also possible, to achieve the solderability of the anode connection by an alloy of the metals mentioned.
- the welding of the anode contact to the anode connection can advantageously be produced by the anode contact and the anode connection overlapping one another and by welding spots being placed on the overlap surface which delimit a surface. This ensures a flat and correspondingly stable attachment of the anode connection to the anode contact.
- FIG. 10 shows a capacitor with an anode body 81 which is surrounded by a housing 71.
- the anode body 81 can be, for example, a porous sintered body made of tantalum or niobium powder.
- the housing 71 can be formed, for example, from an injection-moldable plastic.
- An anode contact 91 is led out of the anode body 81 and emerges from the housing 71 on an end face 410 thereof. At the point of exit of the anode contact 91 from the housing 71, the latter is bent in the direction of the base 43 of the housing 71.
- An anode connection 46 is welded onto a section 411 of the anode contact 91. While the anode contact 91 preferably consists of a material corresponding to the anode body 81, such as tantalum or niobium, a material that can be joined by soft soldering is selected for the anode connection 46.
- the anode connection 46 corresponds to the individual connections 311, 321 of FIGS. 1 to 9.
- the capacitor according to the invention can be economically manufactured in large quantities by using system carriers for the anode contact 91 and for a cathode contact 416.
- the anode connection 46 made of soft solderable material has the advantage that a soldering surface 48 can be formed by bending the anode connection 46 and thus by forming a section 47 of the anode connection 46 on the base surface 43 of the housing 71.
- a cathode contact 416 is attached to the cathode applied to the anode body 81 and is bent around the housing 71 in a manner corresponding to the anode connection 46, so that a further soldering surface 417 is created on the base surface 43 of the housing 71, with the aid of which the cathode is formed of the capacitor can be soldered to a circuit board.
- soldering surface 48 or a further soldering surface 417 on the base 43 of the housing 71 creates a capacitor in the form of a chip, as is particularly advantageously suitable for use in the context of a surface mounting technique.
- the thickness d of the anode contact 91 is approximately 0.075 mm.
- the thickness D of the anode connection 46 is approximately 0.1 mm.
- the capacitor shown in FIG. 10 has the advantage over the example from FIG. 11 that the welding between the anode contact 91 and the anode connection 46 in the width of the capacitor only requires the sum of d and D, thereby maximizing the utilization of the housing in the lateral direction 71 and thus higher capacities can be realized with the same housing size.
- FIG. 11 shows a further embodiment of the capacitor, an end section 49 of the anode contact 91 lying within the housing 71 being welded flat to an anode connection 46.
- the welding can be carried out, for example, by laser welding.
- the anode connection 46 emerges from an end face 410 of the housing 71 and is bent there in the direction of the base surface 43 of the housing 71. At the edge between the end face 410 and the base surface 43 of the housing, the anode connection 46 is bent inwards again, so that a soldering surface 48 formed on the base surface 43 of the housing 71 is formed by an end section of the anode connection 46.
- the embodiment of the invention shown in FIG. 11 has a lower housing utilization than the embodiment shown in FIG. 1, but it has the advantage that the anode contact 91 can be made shorter, as a result of which the relatively expensive tantalum normally used for the anode contact 91 - or niobium material can be saved.
- FIG 12 shows a capacitor according to the embodiment of Figure 10 during manufacture.
- the anode body 81 is already encapsulated by the housing 71.
- the cathode contact 416 and the anode contact 91 emerge from the housing on the left side of the two end faces of the housing 71.
- the anode contact 91 and the anode connection 46 are in the form of strips 413 extending in a longitudinal direction.
- the anode contact 91 thus has a flat side 45.
- the anode contact 91 and the anode terminal 46 overlap one another in the area indicated by the broken line.
- the welding between anode contact 91 and anode connection 46 is carried out by means of welding spots 300, which delimit a surface 415.
- a stable connection between the anode contact 91 and the anode connection 46 can thereby be achieved.
- the width b of the anode contact 91 can be adjusted to a the required larger width B of a soldering surface can be adapted by appropriate selection of the width B of the anode connection 46.
- the anode connection 46 also has a flat side 412. The two flat sides 412, 45 of anode contact 91 and anode connection 46 overlap one another.
- the anode connection 46 has at its end a section 47 which, after bending the anode connection 46 around the housing 71, comes to rest on the underside of the housing 71 and forms a soldering surface 48 there.
- the cathode contact 416 is bent around the housing 71 and forms a further soldering surface 417 on the underside of the housing 71.
- the capacitor can be realized with any material that forms a suitable, porous sintered body and is not limited to tantalum or niobium.
- the capacitor can be manufactured, for example, as follows:
- the anode body 81 with an anode contact 91 led out is provided.
- the anode contact 91 is welded to an anode connection 46.
- the anode body 81 is electrically conductively connected to a cathode contact 416.
- Cathode contact 416 and anode connection 46 are provided for a large number of capacitors as components of a leadframe.
- the system carrier provides the cathode contact 416 and the anode connection 46 with the appropriate dimensions, so that the anode body 81 with the anode contact 91 only has to be inserted into the system carrier.
- the anode body 81 is extrusion-coated by a plastic housing. Then the cathode contact 416 and the anode connection 46 around the housing onto the base 43 of the
- Housing 71 bent. There they form a first and a further soldering surface 48, 417.
- a plurality of anode bodies 81 can also be inserted into the system carrier and separated from the housing 71 after the encapsulation. After the separation, the anode contact 46 or cathode contact 416 is bent.
- the present invention is not limited to a parallel connection of capacitors, but can be used with a large number of different components, for example resistors, coils or all possible other electrical components which are to be implemented as surface-mountable components.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10232787 | 2002-07-18 | ||
DE10232787 | 2002-07-18 | ||
DE10244713 | 2002-09-25 | ||
DE10244713A DE10244713A1 (de) | 2002-07-18 | 2002-09-25 | Oberflächenmontierbares Bauelement und Verfahren zu dessen Herstellung |
PCT/DE2003/002432 WO2004010756A2 (de) | 2002-07-18 | 2003-07-18 | Oberflächenmontierbares bauelement und verfahren zu dessen herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1523749A2 true EP1523749A2 (de) | 2005-04-20 |
Family
ID=30771719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03764907A Withdrawn EP1523749A2 (de) | 2002-07-18 | 2003-07-18 | Oberflächenmontierbares bauelement und verfahren zu dessen herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7161796B2 (de) |
EP (1) | EP1523749A2 (de) |
JP (1) | JP2005533383A (de) |
CN (1) | CN1669099A (de) |
TW (1) | TWI226648B (de) |
WO (1) | WO2004010756A2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10262263B4 (de) | 2002-05-21 | 2008-12-04 | Epcos Ag | Oberflächenmontierbarer Feststoff-Elektrolytkondensator, Verfahren zu dessen Herstellung sowie Systemträger |
JP4688875B2 (ja) * | 2005-05-13 | 2011-05-25 | 三洋電機株式会社 | 積層型固体電解コンデンサ及びその製造方法 |
US8289675B2 (en) | 2007-05-24 | 2012-10-16 | Daniel Devoe | Stacked multilayer capacitor |
US7633739B2 (en) * | 2007-05-24 | 2009-12-15 | Daniel Devoe | Stacked multilayer capacitor |
JP5132374B2 (ja) * | 2008-03-18 | 2013-01-30 | 三洋電機株式会社 | 固体電解コンデンサ及びその製造方法 |
US10084503B2 (en) * | 2014-10-15 | 2018-09-25 | Skyworks Solutions, Inc. | Surface-mount technology devices and related methods |
CN105491816B (zh) * | 2016-02-04 | 2018-07-20 | 东莞立德精密工业有限公司 | 磁性线圈焊接方法 |
JP6694303B2 (ja) * | 2016-03-24 | 2020-05-13 | Koa株式会社 | 面実装型抵抗器 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3686535A (en) * | 1971-07-02 | 1972-08-22 | Union Carbide Corp | Electrolytic capacitor with separate interconnected anode bodies |
JPH01109711A (ja) | 1987-10-23 | 1989-04-26 | Matsushita Electric Ind Co Ltd | 複合チップ状固体電解コンデンサ |
JPH0513666A (ja) * | 1991-06-29 | 1993-01-22 | Sony Corp | 複合半導体装置 |
JPH0817679A (ja) | 1994-06-30 | 1996-01-19 | Kyocera Corp | 複合セラミックコンデンサ |
US5519581A (en) * | 1994-10-21 | 1996-05-21 | Hewlett-Packard Company | Mounting of toroidal inductors |
JP3436082B2 (ja) * | 1997-07-08 | 2003-08-11 | 松下電器産業株式会社 | チップ形固体電解コンデンサ |
JP4342013B2 (ja) * | 1998-05-06 | 2009-10-14 | 株式会社ハイニックスセミコンダクター | 超高集積回路のblpスタック及びその製造方法 |
JP2001015000A (ja) * | 1999-04-26 | 2001-01-19 | Sanyo Electric Co Ltd | 電子部品の製造方法及び電子部品 |
EP1215691B1 (de) | 1999-05-28 | 2011-07-13 | Murata Manufacturing Co., Ltd. | Festelektrolytkondensator und seine herstellungsmethode |
DE19941094A1 (de) * | 1999-08-30 | 2003-07-10 | Epcos Ag | Kondensator und Verfahren zum Herstellen eines Anodenkörpers und eines Anodenableiters hierfür |
JP3737915B2 (ja) | 1999-09-29 | 2006-01-25 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着方法およびその装置 |
AU2002227347A1 (en) * | 2000-12-14 | 2002-06-24 | Kemet Electronics Corporation | Method of applying masking material |
JP4233233B2 (ja) | 2001-03-15 | 2009-03-04 | 三洋電機株式会社 | チップ型固体電解コンデンサー |
DE10131236B4 (de) | 2001-06-28 | 2006-03-30 | Epcos Ag | Kondensator |
-
2003
- 2003-07-16 TW TW092119397A patent/TWI226648B/zh not_active IP Right Cessation
- 2003-07-18 EP EP03764907A patent/EP1523749A2/de not_active Withdrawn
- 2003-07-18 JP JP2004522132A patent/JP2005533383A/ja not_active Withdrawn
- 2003-07-18 CN CNA038171112A patent/CN1669099A/zh active Pending
- 2003-07-18 WO PCT/DE2003/002432 patent/WO2004010756A2/de not_active Application Discontinuation
- 2003-07-18 US US10/522,214 patent/US7161796B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2004010756A2 * |
Also Published As
Publication number | Publication date |
---|---|
JP2005533383A (ja) | 2005-11-04 |
TWI226648B (en) | 2005-01-11 |
CN1669099A (zh) | 2005-09-14 |
WO2004010756A3 (de) | 2004-04-08 |
TW200415657A (en) | 2004-08-16 |
US20050254196A1 (en) | 2005-11-17 |
US7161796B2 (en) | 2007-01-09 |
WO2004010756A2 (de) | 2004-01-29 |
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