EP1384559B1 - Spanplatte mit einer verdichteten Seitenkante - Google Patents

Spanplatte mit einer verdichteten Seitenkante Download PDF

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Publication number
EP1384559B1
EP1384559B1 EP02016411A EP02016411A EP1384559B1 EP 1384559 B1 EP1384559 B1 EP 1384559B1 EP 02016411 A EP02016411 A EP 02016411A EP 02016411 A EP02016411 A EP 02016411A EP 1384559 B1 EP1384559 B1 EP 1384559B1
Authority
EP
European Patent Office
Prior art keywords
side edge
adhesive
adhesive mixture
particle board
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP02016411A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1384559A1 (de
Inventor
Bruno Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Egger GmbH and Co OG
Original Assignee
Fritz Egger GmbH and Co OG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DK02016411T priority Critical patent/DK1384559T3/da
Priority to PT02016411T priority patent/PT1384559E/pt
Priority to EP02016411A priority patent/EP1384559B1/de
Priority to SI200230108T priority patent/SI1384559T1/xx
Priority to AT02016411T priority patent/ATE290944T1/de
Application filed by Fritz Egger GmbH and Co OG filed Critical Fritz Egger GmbH and Co OG
Priority to ES02016411T priority patent/ES2238526T3/es
Priority to DE50202484T priority patent/DE50202484D1/de
Publication of EP1384559A1 publication Critical patent/EP1384559A1/de
Application granted granted Critical
Publication of EP1384559B1 publication Critical patent/EP1384559B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity

Definitions

  • the invention relates to a chipboard with a compacted upper layer, with a compacted lower layer and with a porous middle layer. Furthermore, the invention relates to a method for Improvement of the impact resistance of a chipboard with a compacted surface layer, a compacted lower layer and a porous middle layer as well a device for performing a corresponding Process.
  • chipboard A common application of chipboard is the production of plates for furniture production. These are the Chipboard cut to size and the resulting Side edges, such as in GB 1489814 A be described with a foil or with a Laminate coated. Along the side edges is then the coating on the one hand to the denser upper and lower layers and on the other hand at the less dense and thus softer middle layer. Then done during further production or later Use a punch or push against the side edge, so may cause damage to the coating or a Form change come. Because the soft middle class can not adequately exert the pressure exerted withstand.
  • the present invention is therefore the technical Problem based, known chipboard with a improved impact resistance in the area of the side edges to provide.
  • the middle Layer a share of small cavities, openings and Has columns, so has a porosity.
  • the particles be in the openings with the help of the liquid Adhesive mixture introduced and after curing of the Adhesive fixed. A higher density and therefore one increased impact resistance of the middle layer achieved thereby.
  • the inventive method for producing a Chipboard includes the following steps.
  • a Adhesive mixture of a basic adhesive and particles gets formed. Thereafter, the adhesive mixture at least partially on the side edge of the chipboard applied. After setting the adhesive mixture the side edge is smoothed.
  • a base adhesive is used thermoplastic dispersion adhesive, in particular a PVAc adhesive (polyvinyl acetate adhesive), also known as White glue is known, used.
  • PVAc adhesive polyvinyl acetate adhesive
  • White glue is known, used.
  • the adhesive mixture is generally applied to the side edge applied, with every possible and known Procedure can be used. However, it is preferably, the adhesive mixture with a roller langezen. This will be a targeted and even Distribution of the adhesive mixture achieved.
  • Procedure is before applying the adhesive mixture the side edge profiled. This serves to the Side edge already adapt to later use, so that the adhesive mixture to be applied exactly the Area of the side edge reached, which after the Completion should have the increased impact resistance. Because the profiling would only after the application and Curing the adhesive mixture performed so would the area of the middle class is partially removed again, which should just have the improved properties.
  • the adhesive mixture heats the side edge. Thereby is the penetration of the adhesive mixture in the Middle layer by reducing the viscosity facilitated.
  • the side edge cooled. This will be the smoothing step on the one hand noticeably supported. On the other hand, the setting of the Glue accelerates.
  • a smoothing shoe is preferably used.
  • the side edge of a laminate or a film can be applied as a coating.
  • a coating by applying a color or Lacquer layer possible. It is important to ensure that the Color or the paint adheres to the surface sufficiently.
  • a chipboard is produced, whose Side edge an exterior adapted to the surface which additionally has a high impact resistance having.
  • the impact resistance can be in the range of Shock resistance of the top of the chipboard or even above it.
  • Figs. 1a and 1b show an inventive Chipboard 1 before and after application of the Adhesive mixture.
  • the chipboard 1 has a compacted upper layer 2, a compacted lower layer 3 and a porous one Middle layer 4 on. At the side edge 5 are the superimposed layers 2, 3 and 4 free.
  • the porous middle layer 4 with the Lower density and strength can be in this condition be damaged by a lateral impact.
  • the porous middle layer 4 is according to the invention in the range the side edge 5 at least partially by a Adhesive mixture of a basic adhesive and Filled with wood particles.
  • the of the adhesive mixture occupied space area 6 is shown in Fig. 1b. ever according to the degree of penetration of the adhesive mixture in the area of the side edge 5, the area 6 is larger or smaller.
  • the Area 6 continuously along the side edge 5 with a sufficient thickness is available.
  • the thickness can be between a few tenths of a millimeter and over one Centimeters lie.
  • the Base adhesive is a dispersion adhesive, in particular a PVA glue.
  • This adhesive also known as white glue is cheap and reliable and therefore especially for the Processing of the side edge 5 suitable.
  • the arranged in the region 6 of the middle layer 4 Particles are preferably made of wood flour and / or Wood shavings. Likewise, it is possible as a particle rock, Sand, metal or a plastic to use.
  • the side edge 5 before the application of the adhesive mixture are profiled, see in particular in Fig. 2 a rounded profile the side edge 5.
  • the freely exposed area of the Side edge 5 with middle layer 4 is opposite to the Design considerably enlarged according to FIG. thats why Also, the area 6 shown in Fig. 2b Middle layer 5, which provided with the adhesive mixture is opposite to that shown in Fig. 1 Embodiment enlarged.
  • the Side edges 5 provided with a coating 7, consisting of a laminate or a film can exist. Because the Middle layer 4 in the area of the coating 7 covered side edge 5 with the area 6 with Increased density is provided, the coating is 7 in the area of the side edge 5 well protected from shocks. Because the density and impact resistance below the Coating does not deviate much from the Shock resistance in the upper layer 2 from.
  • Fig. 3 is an embodiment of the inventive method as a block diagram shown.
  • FIG. 4 shows a further embodiment of the method.
  • Procedural steps before applying the Adhesive mixture profiling the side edge of the Chipboard and heating of the side edge provided.
  • the Side edge smoothed and cooled at the same time.
  • the side edge is coated.
  • the cooling while smoothing can also be done by a replaced by a separate step before or after smoothing become.
  • the chipboard is back removed.
  • Fig. 5 shows an embodiment of a Device according to the invention for carrying out the above explained method.
  • a feeder 10 for a prefabricated Chipboard 1 is presently designed as a conveyor belt.
  • the chipboard 1 is in the direction of the illustrated Arrows in Fig. 5 from left to right along the moved below stations moves.
  • a mixing device 11 for producing a Adhesive mixture of a basic adhesive and particles has a container 12 with the base adhesive and a Container 13 with particles on.
  • the so made Adhesive mixture is an applicator 14 for Apply the adhesive mixture to the side edge of the Chipboard 1 fed.
  • the applicator 14 has in the present case, a roller not shown in detail for Rolling on the adhesive mixture.
  • the chipboard 1 of a smoothing device 15th supplied by means of a not shown Smoothing shoe smooths the side edge and so for a further processing prepared.
  • Fig. 6 shows a further embodiment of the above explained and shown in Fig. 5 apparatus.
  • a Profiling device 16 for profiling the Side edge before applying the adhesive mixture is intended.
  • the profiling device 16 appropriately equipped cutting or milling tools not shown in detail in Fig. 6.
  • a heating device 17 for heating the side edge of the chipboard before applying the Adhesive mixture provided.
  • the smoothing device 15 which is present having a cooling device not shown separately.
  • a Coating device 18 for coating the Side edge of the chipboard 1 provided.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Housing For Livestock And Birds (AREA)
  • Laminated Bodies (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Road Signs Or Road Markings (AREA)
EP02016411A 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten Seitenkante Expired - Lifetime EP1384559B1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
PT02016411T PT1384559E (pt) 2002-07-22 2002-07-22 Painel de aglomerado com um bordo comprimido
EP02016411A EP1384559B1 (de) 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten Seitenkante
SI200230108T SI1384559T1 (https=) 2002-07-22 2002-07-22
AT02016411T ATE290944T1 (de) 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten seitenkante
DK02016411T DK1384559T3 (da) 2002-07-22 2002-07-22 Spånplade med en fortættet sidekant
ES02016411T ES2238526T3 (es) 2002-07-22 2002-07-22 Tablero de madera aglomerada con un borde lateral compactado.
DE50202484T DE50202484D1 (de) 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten Seitenkante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02016411A EP1384559B1 (de) 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten Seitenkante

Publications (2)

Publication Number Publication Date
EP1384559A1 EP1384559A1 (de) 2004-01-28
EP1384559B1 true EP1384559B1 (de) 2005-03-16

Family

ID=29797160

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02016411A Expired - Lifetime EP1384559B1 (de) 2002-07-22 2002-07-22 Spanplatte mit einer verdichteten Seitenkante

Country Status (7)

Country Link
EP (1) EP1384559B1 (https=)
AT (1) ATE290944T1 (https=)
DE (1) DE50202484D1 (https=)
DK (1) DK1384559T3 (https=)
ES (1) ES2238526T3 (https=)
PT (1) PT1384559E (https=)
SI (1) SI1384559T1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006052293C5 (de) * 2006-11-03 2011-02-03 Kronotec Ag Holzwerkstoffplatte mit Echtholzfurnier und Verfahren zu ihrer Herstellung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT1621304E (pt) * 2004-06-25 2011-07-06 Kronotec Ag Processo para moldar superfícies de materiais à base de madeira
DE102011085996A1 (de) 2011-11-09 2013-05-16 Henkel Ag & Co. Kgaa Mehrschicht-Kantenverklebung
ITBO20120061A1 (it) * 2012-02-09 2013-08-10 Sorbini Srl Apparato per conferire ai lati grezzi di pannelli in truciolare di legno o simili, un aspetto regolare, liscio ed in grado di ricevere un qualsiasi trattamento di finitura.

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE381071B (sv) * 1974-01-11 1975-11-24 Casco Ab Beleggning och tetning av spanskivekanter
DE19907939C1 (de) * 1999-02-24 2000-05-31 Homag Maschinenbau Ag Durchlaufverfahren und Vorrichtung zum Anbringen eines Beschichtungsmaterials an porösen Schmalseiten von Werkstücken
DE20003326U1 (de) * 2000-02-24 2000-07-13 Nolte-Möbel GmbH & Co. KG, 76726 Germersheim Veredelte Spanplatte für Möbel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006052293C5 (de) * 2006-11-03 2011-02-03 Kronotec Ag Holzwerkstoffplatte mit Echtholzfurnier und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
ES2238526T3 (es) 2005-09-01
DK1384559T3 (da) 2005-05-30
PT1384559E (pt) 2005-06-30
DE50202484D1 (de) 2005-04-21
EP1384559A1 (de) 2004-01-28
SI1384559T1 (https=) 2005-08-31
ATE290944T1 (de) 2005-04-15

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