EP1328943A1 - Organic memory, identification marker (rfid-tag) with organic memory and uses of an organic memory - Google Patents
Organic memory, identification marker (rfid-tag) with organic memory and uses of an organic memoryInfo
- Publication number
- EP1328943A1 EP1328943A1 EP01974010A EP01974010A EP1328943A1 EP 1328943 A1 EP1328943 A1 EP 1328943A1 EP 01974010 A EP01974010 A EP 01974010A EP 01974010 A EP01974010 A EP 01974010A EP 1328943 A1 EP1328943 A1 EP 1328943A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- organic
- conductive
- data storage
- organic material
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000015654 memory Effects 0.000 title claims abstract description 32
- 239000003550 marker Substances 0.000 title 1
- 239000011368 organic material Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims description 33
- 238000013500 data storage Methods 0.000 claims description 13
- 230000005611 electricity Effects 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 230000005669 field effect Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 2
- 238000013021 overheating Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
Definitions
- the invention relates to a data storage device which is based on organic material and which is used in combination with an organic integrated circuit (integrated plastic circuit).
- a data memory for an RFID tag RFID tags: radio frequency identification - tags
- RFID tags radio frequency identification - tags
- OFETs organic field-effect transistors
- the object of the invention is therefore to create an organic data memory for microelectronic mass applications and disposable products based on organic material.
- the invention relates to a data storage device based on organic materials.
- the invention furthermore relates to an identification tag (RFID tag) which is based on organic materials and which comprises organic field-effect transistors and an organic data memory.
- RFID tag identification tag
- the use of an organic data storage is also the subject of the invention.
- the subject of the invention is a method for describing an organic data memory, in which a transistor circuit is missing in an integrated circuit based on organic material, has been made non-conductive by manipulation of one or more conductor tracks and / or simple conductor tracks are conductive or non-conductive.
- organic material here encompasses all types of organic, organometallic and / or inorganic plastics, which in English are referred to as “plastics”, for example. These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A restriction in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but rather is also due to the widespread use of e.g. Silicones thought. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but the use of “small molecules” is also entirely possible.
- the organic data memory can preferably be written to only once.
- the organic data memory comprises a transistor circuit, which is comparable in terms of the switching principle to the non-volatile memories from semiconductor technology.
- a data memory can be described using mask programming, in which the transistors or their gates are missing at the corresponding points and / or the gate oxide of the transistors has different thicknesses (transistor conductive / non-conductive).
- “fusable links” can be thin conductor tracks made of conductive organic material, e.g. Pani or Pedot or Polypyrol.
- conductive and non-conductive conductor tracks can be provided within a transistor circuit, e.g. there may be a conductor track for each bit, a closed conductive conductor track corresponding to a logical “0” and an open or non-conductive one corresponding to a logical “1”.
- a particularly tamper-proof variant provides two conductor tracks for at least one data bit and preferably for each data bit. When writing, one of these conductor tracks is made non-conductive. Depending on which trace is not conductive, the bit is fixed to 1 or 0. Subsequent changes are no longer possible due to the use of two conductor tracks.
- Another way of describing the data storage on an organic basis is to change the electricity constant of the gate oxide.
- the insulating layer between the gate and the semiconductor is changed (e.g. by light irradiation) so that there is a change in the electricity constant, which causes the gate to either switch (high electricity constant) or insulate (low electricity constant).
- the data memories can preferably be written to once, preferably, but not exclusively, by manipulation of one or more interconnects.
- the following processes can be used to describe the memory:
- a conductor track can be destroyed by laser radiation or targeted heat and thus rendered non-conductive.
- the conductor track can be separated or closed simply by omitting a structure on a mask / cliché.
- the electricity constant can be changed by laser radiation
- the memory can only be written once using the process steps mentioned above. The description can be made when the tag or product is manufactured
- this technology can also be used for electronics such as make an electronic barcode or an electronic ticket unusable after use by deliberately embossing a certain bit arrangement after use (when validating the ticket, when paying at the cash register) or by making the memory illegible.
- the memory can be used in combination with the following systems:
- identification tags In an identification system (identification tags, RFID (radio frequency identification tags) e.g. for - electronic barcode
- Figure 1 shows a memory matrix in different versions.
- FIG. 1 shows the basic circuit diagram of four embodiments of a memory matrix.
- Circuit a) shows the programming by omitting the corresponding transistors e.g. an integrated circuit; b) shows a so-called fusable link, whereby some conductor tracks are interrupted by a current surge and / or laser radiation or in some other way (see middle field there); c) shows the mask programming in which conductor tracks are either connected or not, i.e. the transistor is connected or not, and d) shows the embodiment with different gate thicknesses that are conductive or non-conductive.
- the horizontal lines 1 and vertical lines 2 show the electrical lines of the circuit. Points 3 indicate that two crossing conductor tracks are in electrical contact.
- the switch symbol 7 stands for one
- Field effect transistor and shows the three connections source, drain and gate.
- the "T-pieces" 4 show the ground connection of the individual transistors in the circuit.
- section b) of the figure two zigzag conductor tracks 6 can be seen, which show thin conductor tracks and / or conductor tracks with a fuse that is easy to interrupt.
- the interrupted conductor track 5 in the middle section at part b) of the figure shows that the electrical line to a point 3 at this point e.g. was interrupted by a short circuit or by laser radiation.
- the middle transistor has a thicker gate oxide 8, as a result of which the current channel of the transistor becomes non-conductive.
- Figure 2 shows a cross-sectional view of a transistor with thick and thin gate oxide.
- the first semiconducting layer with source and drain electrodes 10, 11, which are connected via a semiconducting layer 12, is located on the carrier (not shown).
- the insulating layer 13a, 13b is located above the semiconducting layer 12.
- the gate electrode 14 is located above this layer 13.
- the insulator is so thick that the gate voltage is not sufficient to make the current channel conductive and in case b) it is narrow enough to make the current channel conductive. This results in a) a blocking transistor in the first case and a conductive transistor in case b).
- the memory is reached with a double conductor track.
- the second conductor track contains the complementary information to the first, if the first is conductive (bit "1") then the second is non-conductive (bit "0"). It is no longer possible to subsequently change the storage information.
- the invention makes it possible to store information in integrated circuits based on organic materials. This can be particularly useful for RFID tags e.g. for plagiarism protection, as an electronic ticket, as a luggage tag etc. can be used economically. So far, no data memories for so-called "plastic circuits" are known.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
Abstract
The invention relates to a memory, based on organic material and applied in combination with an organic integrated circuit (integrated plastic circuit). The invention particularly relates to a memory for a RFID-Tag (RFID-tags: radio frequency identification tags) and several methods for describing a memory.
Description
Beschreibungdescription
Organischer Datenspeicher, Identifizierungsmarke (RFID-Tag) mit organischem Datenspeicher, Verwendungen eines organischen DatenspeichersOrganic data storage, identification tag (RFID tag) with organic data storage, uses of an organic data storage
Die Erfindung betrifft einen Datenspeicher, der auf organischem Material basiert und der in Kombination mit einer organischen integrierten Schaltung (integrated plastic circuit) eingesetzt wird. Insbesondere betrifft sie einen Datenspeicher für einen RFID-Tag (RFID-tags : radio frequency identification - tags) sowie mehrere Verfahren zum Beschreiben eines Datenspeichers .The invention relates to a data storage device which is based on organic material and which is used in combination with an organic integrated circuit (integrated plastic circuit). In particular, it relates to a data memory for an RFID tag (RFID tags: radio frequency identification - tags) and several methods for writing to a data memory.
Organische, integrierte Schaltkreise auf der Basis von Organischen Feld-Effekt-Transistoren (OFETs) werden für mikroelektronische Massenanwendungen und Wegwerf-Produkte wie kontakt-Organic, integrated circuits based on organic field-effect transistors (OFETs) are used for microelectronic mass applications and disposable products such as contact
. I ' los auslesbare Identif kations- und Produkt- ,tags" gebraucht. Dabei kann auf das excellente Betriebsverhalten der Silizium- Technologie verzichtet werden, aber dafür sollten sehr niedrige Herstellungkosten und mechanische Flexibilität gewährleistet sein. Die Bauteile wie z.B. elektronische Strich- Kodierungen (Barcodes), sind typischerweise Einwegeprodukte., I 'los readable identification and product, tags "used. The excellent operating behavior of silicon technology can be dispensed with, but for this very low manufacturing costs and mechanical flexibility should be guaranteed. The components such as electronic bar codes (barcodes ), are typically single-use products.
Für diese organischen integrierten Schaltungen, wie sie z.B. aus der WO 99/30432 bekannt sind, gibt es bislang keine Lösung für das Problem, wie Informationen in einem Ident Tag und/oder einem low-cost IPC speicherbar sind.For these organic integrated circuits, e.g. are known from WO 99/30432, so far there is no solution to the problem of how information can be stored in an ident tag and / or a low-cost IPC.
Die Lösungen aus der Halbleitertechnologie sind für die Anforderungen dieser Massenprodukte überqualifiziert und vor allem zu teuer.The solutions from semiconductor technology are overqualified for the requirements of these mass products and, above all, are too expensive.
Aufgabe der Erfindung ist es daher, einen organischen Daten- Speicher für mikroelektronische Massenanwendungen und Wegwerf-Produkte auf der Basis von organischem Material zu schaffen.
Gegenstand der Erfindung ist ein Datenspeicher, der auf organischen Materialien basiert. Weiterhin ist Gegenstand der Erfindung eine Identifizierungsmarke (RFID-Tag) , die auf orga- nischen Materialien basiert und die organische Feld-Effekt- Transistoren und einen organischen Datenspeicher umfasst . Die Verwendung eines organischen Datenspeichers ist auch Gegenstand der Erfindung. Schließlich ist Gegenstand der Erfindung ein Verfahren zum Beschreiben eines organischen Datenspei- chers, bei dem bei einer auf organischem Material basierenden integrierten Schaltung eine Transistorschaltung fehlt, durch Manipulation einer oder mehrerer Leiterbahnen nichtleitend gemacht wurde und/oder einfache Leiterbahnen leitend oder nicht-leitend sind.The object of the invention is therefore to create an organic data memory for microelectronic mass applications and disposable products based on organic material. The invention relates to a data storage device based on organic materials. The invention furthermore relates to an identification tag (RFID tag) which is based on organic materials and which comprises organic field-effect transistors and an organic data memory. The use of an organic data storage is also the subject of the invention. Finally, the subject of the invention is a method for describing an organic data memory, in which a transistor circuit is missing in an integrated circuit based on organic material, has been made non-conductive by manipulation of one or more conductor tracks and / or simple conductor tracks are conductive or non-conductive.
Der Begriff „organisches Material" umfasst hier alle Arten von organischen, metallorganischen und/oder anorganischen Kunststoffen, die im Englischen z.B. mit „plastics" bezeichnet werden. Es handelt sich um alle Arten von Stoffen mit Ausnahme der Halbleiter, die die klassischen Dioden bilden (Germanium, Silizium) und der typischen metallischen Leiter. Eine Beschränkung im dogmatischen Sinn auf organisches Material als Kohlenstoff-enthaltendes Material ist demnach nicht vorgesehen, vielmehr ist auch an den breiten Einsatz von z.B. Siliconen gedacht. Weiterhin soll der Term keiner Beschränkung im Hinblick auf die Molekülgröße, insbesondere auf poly- mere und/oder oligomere Materialien unterliegen, sondern es ist durchaus auch der Einsatz von „small molecules" möglich.The term “organic material” here encompasses all types of organic, organometallic and / or inorganic plastics, which in English are referred to as “plastics”, for example. These are all types of substances with the exception of the semiconductors that form the classic diodes (germanium, silicon) and the typical metallic conductors. A restriction in the dogmatic sense to organic material as carbon-containing material is therefore not provided, but rather is also due to the widespread use of e.g. Silicones thought. Furthermore, the term should not be subject to any restriction with regard to the molecular size, in particular to polymeric and / or oligomeric materials, but the use of “small molecules” is also entirely possible.
Bevorzugt ist der organische Datenspeicher nur einmal beschreibbar.The organic data memory can preferably be written to only once.
Nach einer Ausführungsform umfasst der organische Datenspeicher eine Transistorschaltung, die vom Schaltprinzip her ver- gleichbar zu den Fest-Speichern aus der Halbleitertechnik ist.
Die Beschreibung eines solchen Datenspeichers kann über eine Maskenprogrammierung., bei der die Transistoren, bzw. deren Gates an den entsprechenden Stellen fehlen und/oder das Gateoxid der Transistoren verschiedene Dicken hat (Transistor leitend/nichtleitend) .According to one embodiment, the organic data memory comprises a transistor circuit, which is comparable in terms of the switching principle to the non-volatile memories from semiconductor technology. Such a data memory can be described using mask programming, in which the transistors or their gates are missing at the corresponding points and / or the gate oxide of the transistors has different thicknesses (transistor conductive / non-conductive).
Die Beschreibung kann auch über sogenannte „fusable links" erfolgen, also über Leiterbahnen, die über einen Strom unterbrochen werden können. „Fusable links" können dünne Leiter- bahnen sein, aus leitendem organischen Material z.B. Pani oder Pedot oder Polypyrol.The description can also be made using so-called "fusable links", that is to say via conductor tracks which can be interrupted by a current. "Fusable links" can be thin conductor tracks made of conductive organic material, e.g. Pani or Pedot or Polypyrol.
Weiterhin können leitende und nicht leitende Leiterbahnen innerhalb einer Transistorschaltung vorgesehen sein, z.B. kann für jedes Bit eine Leiterbahn vorhanden sein, wobei eine geschlossene leitende Leiterbahn einer logischen „0" entspricht und eine offene bzw. nicht leitende einer logischen „1".Furthermore, conductive and non-conductive conductor tracks can be provided within a transistor circuit, e.g. there may be a conductor track for each bit, a closed conductive conductor track corresponding to a logical “0” and an open or non-conductive one corresponding to a logical “1”.
Eine besonders fälschungssichere Variante sieht zwei Leiter- bahnen für zumindest ein Datenbit und vorzugsweise für jedes Datenbit vor. Beim Beschreiben wird eine dieser Leiterbahnen nichtleitend gemacht. Je nachdem, welche Leiterbahn nichtleitend ist, wird das Bit auf l oder 0 festgeschrieben. Durch die Verwendung von zwei Leiterbahnen ist eine nachträgliche Änderung nicht mehr möglich.A particularly tamper-proof variant provides two conductor tracks for at least one data bit and preferably for each data bit. When writing, one of these conductor tracks is made non-conductive. Depending on which trace is not conductive, the bit is fixed to 1 or 0. Subsequent changes are no longer possible due to the use of two conductor tracks.
Eine weitere Möglichkeit der Beschreibung des Datenspeichers auf organischer Basis liegt in der Änderung der Elektrisi- tätskonstante des Gateoxids. Dabei wird die isolierende Schicht zwischen Gate und Halbleiter so verändert (z.B. durch Lichteinstrahlung) , dass eine Änderung der Elektrizitätskonstante resultiert, die bewirkt, dass das Gate entweder schaltet (hohe Elektrizitätskonstante) oder isoliert (niedrige E- lektrizitätskonstante) .Another way of describing the data storage on an organic basis is to change the electricity constant of the gate oxide. The insulating layer between the gate and the semiconductor is changed (e.g. by light irradiation) so that there is a change in the electricity constant, which causes the gate to either switch (high electricity constant) or insulate (low electricity constant).
Neben der Möglichkeit, einen Datenspeicher auf der Basis organischen Materials mit Transistorschaltung aufzubauen, gibt
es die Variante, durch einfache Leiterbahnen, die leitend oder nicht leitend sind, Datenspeicher aufzubauen, wobei zur Gewinnung der gespeicherten Information deren Widerstand ausgelesen wird. Dabei entspricht z.B. der Zustand „leitend" ei- ner logischen „0" und nicht leitend einer logischen „1". Das Auslesen kann z.B. mit Hilfe von Transistoren geschehen.In addition to the possibility of building a data memory based on organic materials with transistor switching, there are it is the variant of constructing data memories by means of simple conductor tracks which are conductive or non-conductive, the resistance of which is read out in order to obtain the stored information. In this case, for example, the “conductive” state corresponds to a logical “0” and not a logical “1”. The readout can be done, for example, using transistors.
Bevorzugt sind die Datenspeicher einmal beschreibbar, vorzugsweise, aber nicht ausschließlich durch Manipulation einer oder mehrerer Leiterbahnen. Dabei können folgende Prozesse zur Beschreibung des Speichers zum Einsatz kommen:The data memories can preferably be written to once, preferably, but not exclusively, by manipulation of one or more interconnects. The following processes can be used to describe the memory:
- Durch Lasereinstrahlung oder gezielt eingebrachte Hitze kann eine Leiterbahn zerstört und damit nicht-leitend ge- macht werden.- A conductor track can be destroyed by laser radiation or targeted heat and thus rendered non-conductive.
- Durch chemische Behandlung wie z.B. Base/Säurestempel- By chemical treatment such as Base / acid Temple
(lei fähige Bereiche nichtleitend machen oder umgekehrt)(make conductive areas non-conductive or vice versa)
- Durch mechanische Behandlung, z.B. Durchtrennen einer Leiterbahn mit einer Nadel - Durch elektrische Spannung wird eine Leiterbahn lokal kurzgeschlossen und damit durch Überhitzung zerstört.- By mechanical treatment, e.g. Cutting a conductor path with a needle - A conductor path is short-circuited locally by electrical voltage and thus destroyed by overheating.
- Während der Produktion kann einfach durch Weglassen einer Struktur auf einer Maske / auf einem Klischee die Leiterbahn getrennt oder geschlossen sein. - Durch Lasereinstrahlung kann die Elektrizitätskonstante geändert werden- During production, the conductor track can be separated or closed simply by omitting a structure on a mask / cliché. - The electricity constant can be changed by laser radiation
Durch die oben genannten Prozessschritte lässt sich der Speicher nur ein einziges Mal beschreiben. Die Beschreibung kann bei der Herstellung des Tags oder des Produktes erfolgenThe memory can only be written once using the process steps mentioned above. The description can be made when the tag or product is manufactured
(z.B. Plagiatschutz oder elektr. Barcode, wobei viele Tags denselben Speicherinhalt haben) oder beim Montieren der Elektronik (z.B. Kofferanhänger, elektron. Briefmarke, elektr. Ticket, wobei jedes Ticket einen eigenen Speicher- Inhalt hat) .
Da sich die organischen Materialien nur selten durch Analysemethoden voneinander unterscheiden lassen sind entsprechende Codierungen auch weitgehend fälschungssicher.(eg plagiarism protection or electronic barcode, where many tags have the same memory content) or when assembling the electronics (eg luggage tag, electronic stamp, electronic ticket, where each ticket has its own memory content). Since the organic materials can rarely be distinguished from one another by analysis methods, the corresponding codes are also largely forgery-proof.
Gleichzeitig kann diese Technik auch dafür benutzt werden, eine Elektronik, wie z.B. einen elektronischen Barcode oder ein elektronisches Ticket nach Gebrauch gezielt unbrauchbar zu machen, indem eine bestimmte Bitanordnung nach Gebrauch (beim Entwerten des Tickets, beim Bezahlen an der Kasse) ge- zielt eingeprägt wird oder der Speicher unleserlich gemacht wird.At the same time, this technology can also be used for electronics such as make an electronic barcode or an electronic ticket unusable after use by deliberately embossing a certain bit arrangement after use (when validating the ticket, when paying at the cash register) or by making the memory illegible.
Der Speicher kann in Kombination mit folgenden Systemen eingesetzt werden:The memory can be used in combination with the following systems:
• In einer integrierten Kunststoff-Schaltung, d.h. einer Schaltung, die auf organischem Material basiert,• In an integrated plastic circuit, i.e. a circuit based on organic material,
• In einem Ident-System (Ident-Tags, RFID (Radio Frequenz Ident Tags) z.B. für - elektronischer Barcode• In an identification system (identification tags, RFID (radio frequency identification tags) e.g. for - electronic barcode
- elektronische Tickets- electronic tickets
- Plagiatschutz- Protection against plagiarism
- Produktinformation- Product information
• In einem Sensor • In einem organischen Display mit integrierter Elektronik• In a sensor • In an organic display with integrated electronics
Im folgenden wird die Erfindung noch anhand zweier Figuren, die bevorzugte Ausführungsformen der Erfindung zeigen, näher erläutert .The invention is explained in more detail below with reference to two figures which show preferred embodiments of the invention.
Figur 1 zeigt eine Speichermatrix in verschiedenen Ausführungen.Figure 1 shows a memory matrix in different versions.
Figur 2 zeigt eine Ausführungsform mit unterschiedlicher Di- cke des Gateoxids.
In Figur 1 ist das Prinzipschaltbild von vier Ausführungsformen einer Speichermatrix gezeig .Figure 2 shows an embodiment with different thickness of the gate oxide. FIG. 1 shows the basic circuit diagram of four embodiments of a memory matrix.
Die Schaltung a) zeigt die Programmierung durch Weglassen der entsprechenden Transistoren z.B. einer integrierten Schaltung; b) zeigt einen sogenannten fusable link, wobei einige Leiterbahnen durch einen Stromstoss und/oder Lasereinstrahlung oder auf eine andere Art unterbrochen sind (siehe dort mittleres Feld) ; c) zeigt die Maskenprogrammierung, bei der Leiterbahnen entweder verbunden werden oder nicht, d.h. der Transistor ist angeschlossen oder nicht, und d) zeigt die Ausführungsform mit verschiedenen Gatedicken, die leitend oder nicht leitend sind.Circuit a) shows the programming by omitting the corresponding transistors e.g. an integrated circuit; b) shows a so-called fusable link, whereby some conductor tracks are interrupted by a current surge and / or laser radiation or in some other way (see middle field there); c) shows the mask programming in which conductor tracks are either connected or not, i.e. the transistor is connected or not, and d) shows the embodiment with different gate thicknesses that are conductive or non-conductive.
Die waagrechten Linien 1 und senkrechten Linien 2 zeigen die elektrischen Leitungen der Schaltung. Mit den Punkten 3 wird markiert, dass zwei sich kreuzenden Leiterbahnen in elektri- sche Kontakt stehen. Das Schaltsymbol 7 steht für einenThe horizontal lines 1 and vertical lines 2 show the electrical lines of the circuit. Points 3 indicate that two crossing conductor tracks are in electrical contact. The switch symbol 7 stands for one
Feldeffekt-Transistor und zeigt die drei Anschlüsse Source, Drain und Gate. Die „T-Stücke" 4 zeigen den Erdungsanschluss der einzelne Transistoren der Schaltung.Field effect transistor and shows the three connections source, drain and gate. The "T-pieces" 4 show the ground connection of the individual transistors in the circuit.
Im Abschnitt b) der Figur sind zwei Zick-Zack-Leiterbahnen 6 zu erkennen, die dünne Leiterbahnen und/oder Leiterbahnen mit einer Sicherung, die leicht zu unterbrechen ist, zeigen.In section b) of the figure, two zigzag conductor tracks 6 can be seen, which show thin conductor tracks and / or conductor tracks with a fuse that is easy to interrupt.
Die unterbrochene Leiterbahn 5 im mittleren Abschnitt bei Teil b) der Figur zeigt, dass die elektrische Leitung zu einem Punkt 3 an dieser Stelle z.B. durch Kurzschluss oder durch Lasereinstrahlung unterbrochen wurde .The interrupted conductor track 5 in the middle section at part b) of the figure shows that the electrical line to a point 3 at this point e.g. was interrupted by a short circuit or by laser radiation.
Im Teil d) des Schaltbildes hat der mittlere Transistor ein dickeres Gate-Oxyd 8, wodurch der Stromkanal des Transistors nichtleitend wird.
Figur 2 zeigt eine Querschnittsdarstellung eines Transistors mit dickem und dünnem Gateoxid. Auf dem Träger (nicht gezeigt) befindet sich die erste halbleitende Schicht mit Sour- ce und Drain Elektroden 10,11 die über eine halbleitende Schicht 12 verbunden sind. Über der halbleitenden Schicht 12 befindet sich die isolierende Schicht 13a, 13b. Über dieser Schicht 13 befindet sich die Gate Elektrode 14. Im Fall a) mit der isolierenden Schicht 13a ist der Isolator so dick, dass die Gate-Spannung nicht ausreicht um den Strom-Kanal leitend zu machen und im Fall b) ist sie schmal genug, um den Strom-Kanal leitend zu machen. Es resultiert demnach im ersten Fall a) ein sperrender Transistor und im Fall b) ein leitender Transistor.In part d) of the circuit diagram, the middle transistor has a thicker gate oxide 8, as a result of which the current channel of the transistor becomes non-conductive. Figure 2 shows a cross-sectional view of a transistor with thick and thin gate oxide. The first semiconducting layer with source and drain electrodes 10, 11, which are connected via a semiconducting layer 12, is located on the carrier (not shown). The insulating layer 13a, 13b is located above the semiconducting layer 12. The gate electrode 14 is located above this layer 13. In the case a) with the insulating layer 13a, the insulator is so thick that the gate voltage is not sufficient to make the current channel conductive and in case b) it is narrow enough to make the current channel conductive. This results in a) a blocking transistor in the first case and a conductive transistor in case b).
Eine besonders fälschungssichere Variante des organischenA particularly counterfeit-proof variant of the organic
Speichers wird mit doppelter Leiterbahnführung ereicht. Dabei enthält die zweite Leiterbahn die komplementäre Information zur ersten, ist die erste leitend (Bit „1") so ist die zweite nichtleitend (Bit „0") . Eine nachträgliche Änderung der Spei- cherinformation ist nicht mehr möglich.The memory is reached with a double conductor track. The second conductor track contains the complementary information to the first, if the first is conductive (bit "1") then the second is non-conductive (bit "0"). It is no longer possible to subsequently change the storage information.
Mit der Erfindung wird es möglich, Informationen in integrierten, auf organischen Materialien basierenden Schaltungen zu speichern. Dies kann insbesondere für den Einsatz in RFID- Tags z.B. beim Plagiatschutz, als elektronisches Ticket, als Kofferanhänger etc. wirtschaftlich verwertet werden. Bisher sind keine Datenspeicher für sog. „plastic circuits" bekannt.
The invention makes it possible to store information in integrated circuits based on organic materials. This can be particularly useful for RFID tags e.g. for plagiarism protection, as an electronic ticket, as a luggage tag etc. can be used economically. So far, no data memories for so-called "plastic circuits" are known.
Claims
1. Datenspeicher, der auf organischem Material basiert.1. Data storage based on organic material.
2. Datenspeicher nach Anspruch 1, der nur einmal beschreibbar ist .2. Data memory according to claim 1, which can only be written once.
3. Datenspeicher nach einem der Ansprüche 1 oder 2 , der eine Transistorschaltung umfasst.3. Data memory according to one of claims 1 or 2, which comprises a transistor circuit.
4. Datenspeicher nach einem der vorstehenden Ansprüche, der zwei Leiterbahnen für zumindest ein zu speicherndes Datenbit umfasst .4. Data memory according to one of the preceding claims, which comprises two conductor tracks for at least one data bit to be stored.
5. Verfahren zum Beschreiben eines organischen Datenspeichers, bei dem bei einer auf organischem Material basierenden integrierten Schaltung eine Transistorschaltung entweder fehlt, durch Manipulation einer oder mehrerer Leiterbahnen nichtleitend gemacht wurde und/oder einfache Leiterbahnen leitend oder nicht-leitend sind.5. A method for describing an organic data memory in which a transistor circuit is either missing in an integrated circuit based on organic material, has been made non-conductive by manipulation of one or more conductor tracks and / or simple conductor tracks are conductive or non-conductive.
6. Verfahren nach Anspruch 5, das durch Maskenprogrammierung, bei der die Transistoren, bzw. deren Gates an den entsprechenden Stellen fehlen und/oder das Gateoxid der Transistoren verschiedene Elektrizitätskonstanten hat, durchgeführt wird.6. The method according to claim 5, which is carried out by mask programming, in which the transistors or their gates are missing at the corresponding points and / or the gate oxide of the transistors has different electricity constants.
7.Verfahren nach einem der Ansprüche 5 oder- 6, bei dem die Beschreibung über „fusable links" erfolgt.7.The method according to any one of claims 5 or 6, in which the description is made via "fusable links".
8. Verfahren nach einem der Ansprüche 5 bis 7, bei dem durch Lasereinstrahlung und/oder gezielt eingebrachte Hitze eine Leiterbahn zerstört und damit nicht-leitend gemacht wird.8. The method according to any one of claims 5 to 7, in which a conductor track is destroyed by laser radiation and / or deliberately introduced heat and is thus rendered non-conductive.
9. Verfahren nach einem der Ansprüche 5 bis 8, bei dem durch chemische Behandlung wie z.B. Base/Säurestempel leitfähige Bereiche nichtleitend gemacht werden oder umgekehrt. 9. The method according to any one of claims 5 to 8, in which by chemical treatment such as base / acid stamp conductive areas are made non-conductive or vice versa.
10. Verfahren nach einem der Ansprüche 5 bis 9, bei dem durch mechanische Behandlung eine einfache Leiterbahn und/oder die eines Transistors manipuliert wird.10. The method according to any one of claims 5 to 9, in which a simple conductor track and / or a transistor is manipulated by mechanical treatment.
11. Verfahren nach einem der Ansprüche 5 bis 10, bei dem durch elektrische Spannung eine einfache Leiterbahn und/oder eine Leiterbahn eines Transistors lokal kurzgeschlossen und/ oder durch Überhitzung zerstört wird.11. The method according to any one of claims 5 to 10, in which a simple conductor track and / or a conductor track of a transistor is short-circuited locally and / or destroyed by overheating by electrical voltage.
12. Verfahren nach einem der Ansprüche 5 bis 11, bei dem durch Weglassen einer Struktur bei der Herstellung auf einer Maske und/oder auf einem Klischee eine Leiterbahn getrennt oder geschlossen wird.12. The method according to any one of claims 5 to 11, in which a conductor track is separated or closed by omitting a structure during manufacture on a mask and / or on a cliché.
13. Verfahren nach einem der Ansprüche 5 bis 12, bei dem das Verfahren benutzt wird, um eine bestimmte Bitanordnung gezielt einzuprägen oder gezielt unleserlich zu machen.13. The method according to any one of claims 5 to 12, in which the method is used to specifically impress a specific bit arrangement or to make it illegible in a targeted manner.
14. Verfahren nach Anspruch 6, bei dem die Änderung der Elektrizitätskonstante des Gateoxids durch Lasereinstrahlung herbeigeführt wird.14. The method according to claim 6, wherein the change in the electricity constant of the gate oxide is brought about by laser radiation.
15. Identifizierungsmarke, die auf organischen Materialien basiert und die einen organischen Feld-Effekt-Transistor und einen organischen Datenspeicher umfasst.15. Identification tag, which is based on organic materials and which comprises an organic field-effect transistor and an organic data storage medium.
16. Verwendung eines auf organischem Material basierenden Datenspeichers in einer integrierten Kunststoff-Schaltung (plastic integrated circuit) .16. Use of a data storage device based on organic material in an integrated plastic circuit.
17. Verwendung eines auf organischem Material basierenden Datenspeichers in einem Ident-System (Ident-Tags) , RFID (Radio Frequenz Ident Tags) .17. Use of a data storage device based on organic material in an identification system (identification tags), RFID (radio frequency identification tags).
18. Verwendung eines auf organischem Material basierenden Datenspeichers in einem Sensor. 18. Use of a data storage device based on organic material in a sensor.
19. Verwendung eines auf organischem Material basierenden Datenspeichers in einem organischen Display mit integrierter Elektronik. 19. Use of a data storage device based on organic material in an organic display with integrated electronics.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10045192 | 2000-09-13 | ||
DE10045192A DE10045192A1 (en) | 2000-09-13 | 2000-09-13 | Organic data storage, RFID tag with organic data storage, use of an organic data storage |
PCT/DE2001/003400 WO2002023553A1 (en) | 2000-09-13 | 2001-09-05 | Organic memory, identification marker (rfid-tag) with organic memory and uses of an organic memory |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1328943A1 true EP1328943A1 (en) | 2003-07-23 |
Family
ID=7655993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01974010A Withdrawn EP1328943A1 (en) | 2000-09-13 | 2001-09-05 | Organic memory, identification marker (rfid-tag) with organic memory and uses of an organic memory |
Country Status (5)
Country | Link |
---|---|
US (1) | US6903958B2 (en) |
EP (1) | EP1328943A1 (en) |
JP (1) | JP4960569B2 (en) |
DE (1) | DE10045192A1 (en) |
WO (1) | WO2002023553A1 (en) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002015264A2 (en) | 2000-08-18 | 2002-02-21 | Siemens Aktiengesellschaft | Encapsulated organic-electronic component, method for producing the same and use thereof |
DE10043204A1 (en) * | 2000-09-01 | 2002-04-04 | Siemens Ag | Organic field-effect transistor, method for structuring an OFET and integrated circuit |
US20040026121A1 (en) * | 2000-09-22 | 2004-02-12 | Adolf Bernds | Electrode and/or conductor track for organic components and production method thereof |
DE10151036A1 (en) | 2001-10-16 | 2003-05-08 | Siemens Ag | Isolator for an organic electronic component |
DE10200475A1 (en) * | 2002-01-09 | 2003-07-24 | Samsung Sdi Co | Non-volatile memory element and display matrices made from it |
DE10212639A1 (en) * | 2002-03-21 | 2003-10-16 | Siemens Ag | Device and method for laser structuring functional polymers and uses |
DE10212640B4 (en) * | 2002-03-21 | 2004-02-05 | Siemens Ag | Logical components made of organic field effect transistors |
DE10226370B4 (en) | 2002-06-13 | 2008-12-11 | Polyic Gmbh & Co. Kg | Substrate for an electronic component, use of the substrate, methods for increasing the charge carrier mobility and organic field effect transistor (OFET) |
US8044517B2 (en) | 2002-07-29 | 2011-10-25 | Polyic Gmbh & Co. Kg | Electronic component comprising predominantly organic functional materials and a method for the production thereof |
US20060079327A1 (en) * | 2002-08-08 | 2006-04-13 | Wolfgang Clemens | Electronic device |
ATE355566T1 (en) | 2002-08-23 | 2006-03-15 | Polyic Gmbh & Co Kg | ORGANIC COMPONENT FOR SURGE PROTECTION AND ASSOCIATED CIRCUIT |
WO2004042837A2 (en) * | 2002-11-05 | 2004-05-21 | Siemens Aktiengesellschaft | Organic electronic component with high-resolution structuring and method for the production thereof |
DE10253154A1 (en) | 2002-11-14 | 2004-05-27 | Siemens Ag | Biosensor, used to identify analyte in liquid sample, has test field with detector, where detector registers field changes as electrical signals for evaluation |
EP1563554B1 (en) * | 2002-11-19 | 2012-01-04 | PolyIC GmbH & Co. KG | Organic electronic component comprising the same organic material for at least two functional layers |
WO2004047144A2 (en) | 2002-11-19 | 2004-06-03 | Polyic Gmbh & Co.Kg | Organic electronic component comprising a structured, semi-conductive functional layer and a method for producing said component |
DE10300521A1 (en) * | 2003-01-09 | 2004-07-22 | Siemens Ag | Organoresistive memory |
US20060125061A1 (en) * | 2003-01-09 | 2006-06-15 | Wolfgang Clemens | Board or substrate for an organic electronic device and use thereof |
EP1586127B1 (en) * | 2003-01-21 | 2007-05-02 | PolyIC GmbH & Co. KG | Organic electronic component and method for producing organic electronic devices |
DE112004000012B4 (en) * | 2003-01-21 | 2012-06-14 | Polyic Gmbh & Co. Kg | Plastic product with integrated organic electronic component, method of manufacturing |
DE10302149A1 (en) * | 2003-01-21 | 2005-08-25 | Siemens Ag | Use of conductive carbon black / graphite blends for the production of low-cost electronics |
KR100749126B1 (en) * | 2003-01-29 | 2007-08-13 | 폴리아이씨 게엠베하 운트 코. 카게 | Organic storage component and corresponding triggering circuit |
DE10311664A1 (en) * | 2003-03-14 | 2004-09-23 | Martin Scattergood | Operating games machine involves reader connected to games machine contactlessly reading game information from transponder card, determining parameter for game program corresponding to information |
DE10330064B3 (en) * | 2003-07-03 | 2004-12-09 | Siemens Ag | Organic logic gate has load field effect transistor with potential-free gate electrode in series with switching field effect transistor |
DE10330062A1 (en) * | 2003-07-03 | 2005-01-27 | Siemens Ag | Method and device for structuring organic layers |
DE10338277A1 (en) * | 2003-08-20 | 2005-03-17 | Siemens Ag | Organic capacitor with voltage controlled capacity |
DE10339036A1 (en) | 2003-08-25 | 2005-03-31 | Siemens Ag | Organic electronic component with high-resolution structuring and manufacturing method |
DE10340643B4 (en) | 2003-09-03 | 2009-04-16 | Polyic Gmbh & Co. Kg | Printing method for producing a double layer for polymer electronics circuits, and thereby produced electronic component with double layer |
DE10340644B4 (en) * | 2003-09-03 | 2010-10-07 | Polyic Gmbh & Co. Kg | Mechanical controls for organic polymer electronics |
JP4624093B2 (en) * | 2003-12-19 | 2011-02-02 | 株式会社半導体エネルギー研究所 | Semiconductor device and ID tag |
DE102004002024A1 (en) * | 2004-01-14 | 2005-08-11 | Siemens Ag | Self-aligning gate organic transistor and method of making the same |
JP4946438B2 (en) * | 2004-07-06 | 2012-06-06 | コニカミノルタホールディングス株式会社 | Semiconductor device, method for manufacturing the same, and electronic device |
DE102004040831A1 (en) | 2004-08-23 | 2006-03-09 | Polyic Gmbh & Co. Kg | Radio-tag compatible outer packaging |
EP1812893A4 (en) * | 2004-10-18 | 2008-12-10 | Semiconductor Energy Lab | Semiconductor device and driving method of the same |
US7935958B2 (en) | 2004-10-22 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2006148088A (en) * | 2004-10-22 | 2006-06-08 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
US9734901B2 (en) * | 2004-10-29 | 2017-08-15 | Semiconductor Energy Laboratory Co., Ltd. | Display device with semiconductor memory cell |
JP4809658B2 (en) * | 2004-10-29 | 2011-11-09 | 株式会社半導体エネルギー研究所 | Display device and electronic apparatus using the same |
DE102004059465A1 (en) | 2004-12-10 | 2006-06-14 | Polyic Gmbh & Co. Kg | recognition system |
DE102004059467A1 (en) * | 2004-12-10 | 2006-07-20 | Polyic Gmbh & Co. Kg | Gate made of organic field effect transistors |
DE102004059464A1 (en) | 2004-12-10 | 2006-06-29 | Polyic Gmbh & Co. Kg | Electronic component with modulator |
DE102004063435A1 (en) | 2004-12-23 | 2006-07-27 | Polyic Gmbh & Co. Kg | Organic rectifier |
US7506813B2 (en) * | 2005-01-06 | 2009-03-24 | Quad/Graphics, Inc. | Resonator use in the print field |
JP2006237593A (en) * | 2005-01-31 | 2006-09-07 | Semiconductor Energy Lab Co Ltd | Storage device and semiconductor device |
DE102005009820A1 (en) * | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | Electronic assembly with organic logic switching elements |
DE102005009819A1 (en) | 2005-03-01 | 2006-09-07 | Polyic Gmbh & Co. Kg | electronics assembly |
US8030643B2 (en) * | 2005-03-28 | 2011-10-04 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and manufacturing method the same |
US7358590B2 (en) * | 2005-03-31 | 2008-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
DE102005017655B4 (en) | 2005-04-15 | 2008-12-11 | Polyic Gmbh & Co. Kg | Multilayer composite body with electronic function |
EP1886344B1 (en) * | 2005-04-28 | 2014-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and semiconductor device |
US7700984B2 (en) | 2005-05-20 | 2010-04-20 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device including memory cell |
US7868320B2 (en) | 2005-05-31 | 2011-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US7905397B2 (en) * | 2005-06-01 | 2011-03-15 | Semiconductor Energy Laboratory Co., Ltd. | Data management method and data management system |
DE102005031448A1 (en) | 2005-07-04 | 2007-01-11 | Polyic Gmbh & Co. Kg | Activatable optical layer |
DE102005035589A1 (en) | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Manufacturing electronic component on surface of substrate where component has two overlapping function layers |
DE102005035590A1 (en) * | 2005-07-29 | 2007-02-01 | Polyic Gmbh & Co. Kg | Electronic component has flexible substrate and stack of layers including function layer on substratesurface |
US7935957B2 (en) * | 2005-08-12 | 2011-05-03 | Semiconductor Energy Laboratory Co., Ltd. | Memory device and a semiconductor device |
DE102005042166A1 (en) * | 2005-09-06 | 2007-03-15 | Polyic Gmbh & Co.Kg | Organic device and such a comprehensive electrical circuit |
DE102005044306A1 (en) | 2005-09-16 | 2007-03-22 | Polyic Gmbh & Co. Kg | Electronic circuit and method for producing such |
US20070068404A1 (en) * | 2005-09-29 | 2007-03-29 | Edwin Hirahara | Systems and methods for additive deposition of materials onto a substrate |
WO2007055299A1 (en) * | 2005-11-09 | 2007-05-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
TWI267850B (en) * | 2005-12-30 | 2006-12-01 | Ind Tech Res Inst | Bit cell of organic memory |
US7605410B2 (en) * | 2006-02-23 | 2009-10-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
DE102006013605A1 (en) * | 2006-03-22 | 2007-10-11 | Polyic Gmbh & Co. Kg | Method for programming an electronic circuit and electronic circuit |
WO2008041716A1 (en) * | 2006-10-04 | 2008-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
US7782651B2 (en) * | 2006-10-24 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including storage device and method for driving the same |
WO2008059940A1 (en) * | 2006-11-17 | 2008-05-22 | Semiconductor Energy Laboratory Co., Ltd. | Memory element and method for manufacturing the same, and semiconductor device |
KR101416876B1 (en) * | 2006-11-17 | 2014-07-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device and method for manufacturing the same |
EP2336249B1 (en) * | 2006-12-19 | 2014-08-13 | Seiko Epson Corporation | Pigment dispersion, ink composition, inkset, and recording device |
US7994607B2 (en) * | 2007-02-02 | 2011-08-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
JP5525694B2 (en) | 2007-03-14 | 2014-06-18 | 株式会社半導体エネルギー研究所 | Semiconductor device and manufacturing method of semiconductor device |
JP2008243238A (en) * | 2007-03-23 | 2008-10-09 | Elpida Memory Inc | Molecule battery memory device |
US20100224819A1 (en) * | 2007-05-11 | 2010-09-09 | Mati Karelson | Method for manufacturing of a smart packaging material |
DE102007030308A1 (en) | 2007-06-29 | 2009-01-02 | Printed Systems Gmbh | Method for producing a memory structure |
EP2023418A1 (en) | 2007-08-09 | 2009-02-11 | Sony Corporation | Memory device |
US10259078B2 (en) * | 2015-06-30 | 2019-04-16 | Motorola Mobility Llc | Antenna structure and methods for changing an intrinsic property of a substrate material of the antenna structure |
Family Cites Families (82)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54121685A (en) * | 1978-03-14 | 1979-09-20 | Kyushu Nippon Electric | Ic and method of fabricating same |
US4340657A (en) * | 1980-02-19 | 1982-07-20 | Polychrome Corporation | Novel radiation-sensitive articles |
JPS59145576A (en) | 1982-11-09 | 1984-08-21 | ザイトレツクス・コ−ポレ−シヨン | Programmable mos transistor |
JPS60117769A (en) * | 1983-11-30 | 1985-06-25 | Fujitsu Ltd | Semiconductor memory device |
JPS63280460A (en) * | 1987-05-13 | 1988-11-17 | Hitachi Ltd | Storage element |
JP2728412B2 (en) | 1987-12-25 | 1998-03-18 | 株式会社日立製作所 | Semiconductor device |
US5364735A (en) * | 1988-07-01 | 1994-11-15 | Sony Corporation | Multiple layer optical record medium with protective layers and method for producing same |
US4937119A (en) * | 1988-12-15 | 1990-06-26 | Hoechst Celanese Corp. | Textured organic optical data storage media and methods of preparation |
JPH0766991B2 (en) * | 1990-04-27 | 1995-07-19 | 松下電器産業株式会社 | Electric control element |
EP0418504B1 (en) * | 1989-07-25 | 1995-04-05 | Matsushita Electric Industrial Co., Ltd. | Organic semiconductor memory device having a MISFET structure and its control method |
US5206525A (en) * | 1989-12-27 | 1993-04-27 | Nippon Petrochemicals Co., Ltd. | Electric element capable of controlling the electric conductivity of π-conjugated macromolecular materials |
FI91573C (en) | 1990-01-04 | 1994-07-11 | Neste Oy | Method for manufacturing electronic and electro-optical components and circuits |
JPH03289169A (en) * | 1990-04-05 | 1991-12-19 | Toagosei Chem Ind Co Ltd | Semiconductor memory |
JP2586174B2 (en) * | 1990-04-13 | 1997-02-26 | 日本電気株式会社 | Storage device |
FR2664430B1 (en) * | 1990-07-04 | 1992-09-18 | Centre Nat Rech Scient | THIN FILM FIELD EFFECT TRANSISTOR WITH MIS STRUCTURE, IN WHICH THE INSULATION AND THE SEMICONDUCTOR ARE MADE OF ORGANIC MATERIALS. |
US5376561A (en) | 1990-12-31 | 1994-12-27 | Kopin Corporation | High density electronic circuit modules |
JP3522771B2 (en) | 1991-03-22 | 2004-04-26 | 三菱電機株式会社 | Inverter |
US5332315A (en) | 1991-04-27 | 1994-07-26 | Gec Avery Limited | Apparatus and sensor unit for monitoring changes in a physical quantity with time |
JP3224829B2 (en) | 1991-08-15 | 2001-11-05 | 株式会社東芝 | Organic field effect device |
US5486851A (en) * | 1991-10-30 | 1996-01-23 | Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. | Illumination device using a pulsed laser source a Schlieren optical system and a matrix addressable surface light modulator for producing images with undifracted light |
JPH05190787A (en) * | 1992-01-13 | 1993-07-30 | Sharp Corp | Semiconductor memory device and manufacture thereof |
JP2709223B2 (en) * | 1992-01-30 | 1998-02-04 | 三菱電機株式会社 | Non-contact portable storage device |
JP3150750B2 (en) | 1992-03-13 | 2001-03-26 | 日本写真印刷株式会社 | Organic rectifier |
DE4243832A1 (en) | 1992-12-23 | 1994-06-30 | Daimler Benz Ag | Push button arrangement |
WO1994017556A1 (en) | 1993-01-26 | 1994-08-04 | Fci-Fiberchem, Inc. | Optical sensor with electroluminescent light source and polymer light detector |
US5567550A (en) * | 1993-03-25 | 1996-10-22 | Texas Instruments Incorporated | Method of making a mask for making integrated circuits |
JPH0722669A (en) * | 1993-07-01 | 1995-01-24 | Mitsubishi Electric Corp | Plastic functional element |
US5684884A (en) | 1994-05-31 | 1997-11-04 | Hitachi Metals, Ltd. | Piezoelectric loudspeaker and a method for manufacturing the same |
JP3246189B2 (en) * | 1994-06-28 | 2002-01-15 | 株式会社日立製作所 | Semiconductor display device |
US5574291A (en) * | 1994-12-09 | 1996-11-12 | Lucent Technologies Inc. | Article comprising a thin film transistor with low conductivity organic layer |
US5786827A (en) * | 1995-02-21 | 1998-07-28 | Lucent Technologies Inc. | Semiconductor optical storage device and uses thereof |
WO1997018944A1 (en) | 1995-11-22 | 1997-05-29 | The Government Of The United States Of America, Represented By The Secretary Of The Navy | Patterned conducting polymer surfaces and process for preparing the same and devices containing the same |
US5625199A (en) * | 1996-01-16 | 1997-04-29 | Lucent Technologies Inc. | Article comprising complementary circuit with inorganic n-channel and organic p-channel thin film transistors |
US6326640B1 (en) | 1996-01-29 | 2001-12-04 | Motorola, Inc. | Organic thin film transistor with enhanced carrier mobility |
WO1998040930A1 (en) | 1997-03-10 | 1998-09-17 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
KR100248392B1 (en) * | 1997-05-15 | 2000-09-01 | 정선종 | The operation and control of the organic electroluminescent devices with organic field effect transistors |
GB9715907D0 (en) | 1997-07-29 | 1997-10-01 | Cambridge Consultants | Electroluminescent device production process |
WO1999010929A2 (en) | 1997-08-22 | 1999-03-04 | Koninklijke Philips Electronics N.V. | A method of providing a vertical interconnect between thin film microelectronic devices |
JP4509228B2 (en) | 1997-08-22 | 2010-07-21 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Field effect transistor made of organic material and method of manufacturing the same |
ES2199705T1 (en) * | 1997-09-11 | 2004-03-01 | Prec Dynamics Corp | IDENTIFICATION TRANSPONDER WITH INTEGRATED CIRCUIT CONSISTING OF ORGANIC MATERIALS. |
JP2001521269A (en) | 1997-10-17 | 2001-11-06 | ザ リージェンツ オブ ザ ユニヴァーシティー オブ カリフォルニア | Method of manufacturing organic semiconductor device using inkjet printing technology, and apparatus and system using the same |
EP0958663A1 (en) * | 1997-12-05 | 1999-11-24 | Koninklijke Philips Electronics N.V. | Identification transponder |
US5998805A (en) * | 1997-12-11 | 1999-12-07 | Motorola, Inc. | Active matrix OED array with improved OED cathode |
JPH11191677A (en) * | 1997-12-26 | 1999-07-13 | Hokuriku Electric Ind Co Ltd | Multilayered circuit board equipped with rom memory |
NO306529B1 (en) | 1998-01-16 | 1999-11-15 | Opticom As | Transistor |
US6087196A (en) | 1998-01-30 | 2000-07-11 | The Trustees Of Princeton University | Fabrication of organic semiconductor devices using ink jet printing |
US6045977A (en) * | 1998-02-19 | 2000-04-04 | Lucent Technologies Inc. | Process for patterning conductive polyaniline films |
DE19816860A1 (en) | 1998-03-06 | 1999-11-18 | Deutsche Telekom Ag | Chip card, especially credit card |
GB9808061D0 (en) | 1998-04-16 | 1998-06-17 | Cambridge Display Tech Ltd | Polymer devices |
TW410478B (en) * | 1998-05-29 | 2000-11-01 | Lucent Technologies Inc | Thin-film transistor monolithically integrated with an organic light-emitting diode |
JP3725698B2 (en) * | 1998-07-03 | 2005-12-14 | 日本電信電話株式会社 | Self-destructive semiconductor device |
DE19836174C2 (en) | 1998-08-10 | 2000-10-12 | Illig Maschinenbau Adolf | Heater for heating thermoplastic sheets and method for adjusting the temperature of this heater |
US6215130B1 (en) | 1998-08-20 | 2001-04-10 | Lucent Technologies Inc. | Thin film transistors |
CN102226766B (en) * | 1998-08-26 | 2017-03-01 | 医药及科学传感器公司 | Based on optical sensing device further |
DE19851703A1 (en) | 1998-10-30 | 2000-05-04 | Inst Halbleiterphysik Gmbh | Electronic structure, e.g. FET, is produced by plotting, spraying, spin coating or spreading of insulating, semiconducting and-or conductive layers onto a substrate |
US6384804B1 (en) * | 1998-11-25 | 2002-05-07 | Lucent Techonologies Inc. | Display comprising organic smart pixels |
US6506438B2 (en) * | 1998-12-15 | 2003-01-14 | E Ink Corporation | Method for printing of transistor arrays on plastic substrates |
US6321571B1 (en) * | 1998-12-21 | 2001-11-27 | Corning Incorporated | Method of making glass structures for flat panel displays |
US6114088A (en) * | 1999-01-15 | 2000-09-05 | 3M Innovative Properties Company | Thermal transfer element for forming multilayer devices |
GB2347013A (en) * | 1999-02-16 | 2000-08-23 | Sharp Kk | Charge-transport structures |
US6207472B1 (en) * | 1999-03-09 | 2001-03-27 | International Business Machines Corporation | Low temperature thin film transistor fabrication |
US6498114B1 (en) * | 1999-04-09 | 2002-12-24 | E Ink Corporation | Method for forming a patterned semiconductor film |
US6072716A (en) * | 1999-04-14 | 2000-06-06 | Massachusetts Institute Of Technology | Memory structures and methods of making same |
FR2793089B3 (en) | 1999-04-28 | 2001-06-08 | Rene Liger | TRANSPONDER WITH INTEGRATED ANTENNA |
DE19919448A1 (en) | 1999-04-29 | 2000-11-02 | Miele & Cie | Cooling device and method for indicating germs |
US6723394B1 (en) | 1999-06-21 | 2004-04-20 | Cambridge University Technical Services Limited | Aligned polymers for an organic TFT |
DE19933757A1 (en) | 1999-07-19 | 2001-01-25 | Giesecke & Devrient Gmbh | Manufacturing chip card with integral battery involves applying first conducting track structure, electrolyte and second conducting track structure to form opposite polarity electrodes |
DE19935527A1 (en) | 1999-07-28 | 2001-02-08 | Giesecke & Devrient Gmbh | Active film for chip cards with display |
DE19937262A1 (en) | 1999-08-06 | 2001-03-01 | Siemens Ag | Arrangement with transistor function |
WO2001015233A1 (en) | 1999-08-24 | 2001-03-01 | Koninklijke Philips Electronics N.V. | Display device |
US6593690B1 (en) * | 1999-09-03 | 2003-07-15 | 3M Innovative Properties Company | Large area organic electronic devices having conducting polymer buffer layers and methods of making same |
EP1149420B1 (en) * | 1999-10-11 | 2015-03-04 | Creator Technology B.V. | Integrated circuit |
EP1103916A1 (en) | 1999-11-24 | 2001-05-30 | Infineon Technologies AG | IC-card |
US6621098B1 (en) * | 1999-11-29 | 2003-09-16 | The Penn State Research Foundation | Thin-film transistor and methods of manufacturing and incorporating a semiconducting organic material |
US6197663B1 (en) * | 1999-12-07 | 2001-03-06 | Lucent Technologies Inc. | Process for fabricating integrated circuit devices having thin film transistors |
AU781789B2 (en) | 1999-12-21 | 2005-06-16 | Flexenable Limited | Solution processing |
DE10012204A1 (en) | 2000-03-13 | 2001-09-20 | Siemens Ag | Electronic postage stamp for identifying postal articles |
US6329226B1 (en) * | 2000-06-01 | 2001-12-11 | Agere Systems Guardian Corp. | Method for fabricating a thin-film transistor |
DE10043204A1 (en) | 2000-09-01 | 2002-04-04 | Siemens Ag | Organic field-effect transistor, method for structuring an OFET and integrated circuit |
DE10061297C2 (en) | 2000-12-08 | 2003-05-28 | Siemens Ag | Procedure for structuring an OFET |
DE10105914C1 (en) | 2001-02-09 | 2002-10-10 | Siemens Ag | Organic field effect transistor with photo-structured gate dielectric and a method for its production |
US6870183B2 (en) * | 2002-11-04 | 2005-03-22 | Advanced Micro Devices, Inc. | Stacked organic memory devices and methods of operating and fabricating |
-
2000
- 2000-09-13 DE DE10045192A patent/DE10045192A1/en not_active Ceased
-
2001
- 2001-09-05 WO PCT/DE2001/003400 patent/WO2002023553A1/en active Application Filing
- 2001-09-05 US US10/380,206 patent/US6903958B2/en not_active Expired - Fee Related
- 2001-09-05 JP JP2002527512A patent/JP4960569B2/en not_active Expired - Fee Related
- 2001-09-05 EP EP01974010A patent/EP1328943A1/en not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO0223553A1 * |
Also Published As
Publication number | Publication date |
---|---|
JP2004509458A (en) | 2004-03-25 |
JP4960569B2 (en) | 2012-06-27 |
WO2002023553A1 (en) | 2002-03-21 |
US20040026690A1 (en) | 2004-02-12 |
DE10045192A1 (en) | 2002-04-04 |
US6903958B2 (en) | 2005-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2002023553A1 (en) | Organic memory, identification marker (rfid-tag) with organic memory and uses of an organic memory | |
DE69803781T2 (en) | FIXED MEMORY AND FIXED MEMORY ARRANGEMENT | |
DE3635938C2 (en) | ||
WO2002015293A2 (en) | Organic field-effect transistor (ofet), a production method therefor, an integrated circuit constructed from the same and their uses | |
EP1309994A2 (en) | Encapsulated organic-electronic component, method for producing the same and use thereof | |
EP1825516A2 (en) | Organic field effect transistor gate | |
EP1436839A2 (en) | Electronic unit, circuit design for the same, and production method | |
DE1954966A1 (en) | Circuit made by film application and method of making it | |
EP1825423B1 (en) | Electronic component comprising a modulator | |
EP1463637B1 (en) | Valuable document or security document comprising a switch | |
DE602004003498T2 (en) | FLEXIBLE SEMICONDUCTOR COMPONENT AND IDENTIFICATION LABEL | |
DE3044984A1 (en) | INTEGRATED TRANSISTOR CIRCUIT, ESPECIALLY FOR CODING | |
DE10156470B4 (en) | RF ID tag with a semiconductor device having organic semiconductor based transistors and non-volatile read / write memory cells | |
DE10212926A1 (en) | Semiconductor storage cell has a modulation region arranged between a first gate electrode of a gate electrode arrangement and an insulating region | |
EP1586004B1 (en) | Board or substrate for an organic electronic device and use thereof | |
EP1999757B1 (en) | Method for programming an electronic circuit and electronic circuit | |
DE2034659A1 (en) | Read-only memory | |
EP1532570B1 (en) | Organic component for overvoltage protection and associated circuit | |
EP2210221B1 (en) | Production of a portable data carrier | |
WO2004064074A1 (en) | Organo-resistive memory | |
DE102006013606A1 (en) | Electronic circuit programming method for forming e.g. identification or product labels, involves partially covering data storage unit with barcode, and electrically programming electronic circuit depending on form and array of barcode | |
DE102007048306B4 (en) | Integrated circuit with switching unit for memory cell coupling and method for producing an integrated circuit for memory cell coupling | |
DE102004003094A1 (en) | Electronic circuit for portable, contactless data carrier with circuit arrangement that provides indirectly rewriteable non-volatile memory | |
EP2099265A2 (en) | Printed circuit path arrangement for contacting electronic components | |
DE102009022254A1 (en) | Electrical switching circuit i.e. Radio frequency identification-transponder, has electrical supply lines connecting functional determined specimen of two or multiple components with another component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20030228 |
|
AK | Designated contracting states |
Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
RBV | Designated contracting states (corrected) |
Designated state(s): DE FR GB |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: POLYIC GMBH & CO. KG |
|
17Q | First examination report despatched |
Effective date: 20070126 |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: POLYIC GMBH & CO. KG |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150401 |