Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
  • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
  • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09809—Coaxial layout
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/01—Tools for processing; Objects used during processing
  • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
  • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
  • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
  • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil

Definitions

• the present invention aims to provide a collective bubble-free filling process of through holes in a substrate with a product flush on both sides of the substrate.
• the present description refers more particularly to the filling of through holes on printed circuits.
• Patent FR96.12671 by the same inventor describes a direct transfer device which allows, by adjusting the transfer pressure and the contact time, to better control the quantity of product injected into the through holes. On the other hand, the control is not sufficient to control the filling to the point of filling the holes so that the product is flush with the open face of the substrate.
• the present invention aims to provide another method of collective filling of through holes and flush and without bubbles without the disadvantages of the devices of the prior art.
• the process for the collective filling of through and flush holes in a substrate according to the invention is essentially characterized in that it consists in displacing, in a translational movement relative to the first face of the substrate, a product transfer member so as to force said product in the through holes and so as to make it protrude on the second face of the substrate and to scrape off the excess product spread on the first face.
• a scraper member in relative translational movement and coordinated on the second face of the substrate, shears the excess product protruding so as to level off said product present in the holes with the second face of the substrate without causing for raising the product on the opposite face thanks to an angle greater than or equal to 90 ° between the scraper lips and the substrate.
• US Patent 4,728,568 A does not consist of a filling process but a masking process for the purpose of filling.
• water-soluble adhesive materials are used.
• FIGS. 2, 3 and 4 of this patent are used for filling and do not make it possible to obtain the result precisely sought in the invention, namely: the perfect flushing of the surfaces by the product for filling the holes and the absence of bubbles inside the holes.
• the circuit passes between rollers 4 and 4 'and then the surplus product is removed by two opposite doctor blades 6 and 6'.
• FIG. 3 shows a conventional filling technology by transfer with a doctor blade. This process does not aim and does not peraiet to obtain a leveling of the filling product, this operation is done after hardening by abrasion.
• FIG. 4 shows a filling technology using a first upper transfer doctor 14 and a lower doctor 14 'to remove the protruding product.
• the major drawback of '' such a process is the doctor blade angle which is less than 90 ° in its active part necessarily causing a transfer force tending to repel the product and to make it protrude on the opposite side which excludes a product flush on at least one of the two faces.
• Another disadvantage of this form of scraping by a doctor whose angle is less than 90 ° is to cause a spreading of the product on all the surface whereas the angle ⁇ higher than 90 ° causes a removal of the product by shearing, detaching thus the latter to be collected in the container.
• the non-spreading of the product is also very important because it contributes to the outcrop.
• the patent therefore does not answer the problem that we are trying to solve.
• the patent Matsushita Electric Ind JP 032 40292 aims to fill holes and to spread with precision over an entire surface an engraving reserve ink by successive passage between two rollers and two opposite doctor blades.
• the function of the doctor blades is to spread a thin film of product over the entire surface and not to remove it by detaching it from the surface by shearing.
• the aims are completely opposite in relation to the problem that the inventor seeks to solve (spreading of the product in relation to removal) and the means used are also different because, as has already been explained, the doctor blades used here form an angle less than 90 °.
• a cleanliness mask having openings facing the through holes can be interposed between the first face of the substrate and the transfer device.
• the transfer member will be moved to the surface of the mask and the product will not contaminate the first face of the substrate.
• the cleansing mask may also have a determined thickness in order to control the extra thickness of product relative to the first face.
• the mask can have a very small thickness if it is not desired to increase the thickness of the product.
• the method and the device which results therefrom can be adapted on a screen printing machine commercially available.
• this process could be adapted on DEK or MPM type machines which are used in the field of electronic manufacturing.
• the transfer member can be constituted either by an inclined screen printing doctor blade, or preferably by a closed direct transfer device such as PROFLOW marketed by DEK or RHEOPUMP marketed by MPM.
• the scraper consists of at least one flexible lip which has an angle ⁇ greater than 90 ° with the substrate in the scraping zone and by a container which allows the recovery of the sheared product.
• the scraper preferably consists of a closed device having two flexible lips as described above and arranged in opposition, so that the scraper can operate in both directions.
• Figure 1 shows in section a filling operation as it can be practiced according to the prior art.
• Figure 2 shows in section a collective filling device according to the present invention.
• Figure 3 shows in section a collective filling device according to the present invention mounted on a screen printing machine.
• Figure 1 a direct transfer system (4) equipped with lips (6) and a piston (5) which applies a transfer pressure on the product (3) together with the translational movement of the direct transfer system according to the sense).
• the product (3) is forced into the openings (2) of the substrate (1).
• a doctor blade (9) forming an angle ⁇ less than 90 ° causes a flush on the face (B) but generates a transfer force F tending to t bring the product up on the opposite face (A), which has the effect of eliminating the outcrop on said face.
• FIG 2 is shown in section a device according to the present invention.
• the product (3) is forced into the openings (2) of the substrate (1) by means of the transfer member which in the present case consists of an inclined doctor blade (7) which moves according to the direction (F).
• the transfer thrust exerted by the member (7) on the product (3) is such that it is extradited through the holes so that the product (3) protrudes from the underside of the substrate (1).
• the scraper member (8) located opposite the transfer device (7) relative to the substrate is moved in the direction (F).
• the scraper member (8) is in contact with the underside of the substrate via the flexible lips (9).
• the product which protrudes from the underside of the substrate is sheared and is recovered in the container formed by (8).
• the relative position between the transfer member and the scraper member (8) is such that the transfer takes place in an area located between the two lips (9) of the scraper device. So that the protruding product is sheared without spreading and without rising on the opposite face, the flexible and thin lips (9) have an angle ⁇ in the scraping zone greater than or equal to 90 °.
• the protruding product is sheared and detached to be collected in the container (8) from which it can possibly be recovered to be reused.
• lips of thickness 100 to 500 microns with an angle ⁇ of 150 ° have given very good results.
• Figure 3 shows another embodiment of the present invention.
• the device which is the subject of the present invention has been adapted on an existing screen printing machine.
• the transfer member (4) containing the product (3) is in contact with the mask (10) via the lips (6).
• the mask (10) is aligned with the substrate so that the openings (16) face the holes (2) of the substrate (1).
• the product contained in the transfer member is pressurized by means of the piston (5).
• the substrate (1) rests on a conveyor (12) and is in contact via the lips (9) with the scraper member (8).
• the scraper member (8) can be moved by means of a translation system (15) of any known type which is fixed to the table of the screen printing machine (14).
• the transfer member (4) When the transfer member (4) is put moving in the direction (G) through the gantry (13), the product is transferred into the openings of the mask and of the substrate so that the product exceeds the underside of the substrate.
• the scraper member (8) is moved in the direction (G) at the same speed as the transfer member (4) and the relative position of one relative to the other is such that the delimited transfer area by the lips (6) is always located between the flexible lips (9) of the scraper member.
• the transfer member (4) remains in contact with the mask (10) while the scraper member (8) is moved away from the substrate (1) by the descent of the table (14).
• the substrate itself is separated from the mask to be removed and replaced by a substrate to be filled. Given the symmetry of the device, it can operate in the direction (G) but also in the opposite direction, which increases the productivity achieved with such a device.
• the present invention it is possible to add, if necessary, a very fine mask of cleanliness which is pressed against the underside so as to avoid soiling or pollution of the substrate during shearing of the transferred product. .
• This mask has openings opposite the crossings to be filled.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Screen Printers (AREA)

Applications Claiming Priority (3)

Publications (1)

Family

ID=8853762

Family Applications (1)

Country Status (5)

Families Citing this family (8)

Family Cites Families (7)

• 2000
  • 2000-08-28 FR FR0010984A patent/FR2813216B1/fr not_active Expired - Fee Related
• 2001
  • 2001-07-25 AU AU2001285976A patent/AU2001285976A1/en not_active Abandoned
  • 2001-07-25 US US10/343,941 patent/US20030170387A1/en not_active Abandoned
  • 2001-07-25 EP EP01965309A patent/EP1314341A1/de not_active Withdrawn
  • 2001-07-25 WO PCT/FR2001/002422 patent/WO2002019782A1/fr not_active Application Discontinuation

Non-Patent Citations (1)

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