AU2001285976A1 - Collective method for flush filling of through holes in a substrate - Google Patents

Collective method for flush filling of through holes in a substrate

Info

Publication number
AU2001285976A1
AU2001285976A1 AU2001285976A AU8597601A AU2001285976A1 AU 2001285976 A1 AU2001285976 A1 AU 2001285976A1 AU 2001285976 A AU2001285976 A AU 2001285976A AU 8597601 A AU8597601 A AU 8597601A AU 2001285976 A1 AU2001285976 A1 AU 2001285976A1
Authority
AU
Australia
Prior art keywords
holes
substrate
collective method
flush filling
flush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001285976A
Inventor
Francis Bourrieres
Clement Kaiser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novatec SA
Original Assignee
Novatec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Novatec SA filed Critical Novatec SA
Publication of AU2001285976A1 publication Critical patent/AU2001285976A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
AU2001285976A 2000-08-28 2001-07-25 Collective method for flush filling of through holes in a substrate Abandoned AU2001285976A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0010984 2000-08-28
FR0010984A FR2813216B1 (en) 2000-08-28 2000-08-28 DEVICE FOR FILLING OPENING HOLES IN A SUBSTRATE
PCT/FR2001/002422 WO2002019782A1 (en) 2000-08-28 2001-07-25 Collective method for flush filling of through holes in a substrate

Publications (1)

Publication Number Publication Date
AU2001285976A1 true AU2001285976A1 (en) 2002-03-13

Family

ID=8853762

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001285976A Abandoned AU2001285976A1 (en) 2000-08-28 2001-07-25 Collective method for flush filling of through holes in a substrate

Country Status (5)

Country Link
US (1) US20030170387A1 (en)
EP (1) EP1314341A1 (en)
AU (1) AU2001285976A1 (en)
FR (1) FR2813216B1 (en)
WO (1) WO2002019782A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2895125B1 (en) * 2005-12-21 2008-12-12 Novatec Sa METHOD OF AUTHENTICATING DOCUMENTS AND DEVICE FOR READING SAID DOCUMENTS FOR RECORDING FOR EVIDENCE
US7410090B2 (en) * 2006-04-21 2008-08-12 International Business Machines Corporation Conductive bonding material fill techniques
US9314864B2 (en) 2007-07-09 2016-04-19 International Business Machines Corporation C4NP compliant solder fill head seals
EP2421343B1 (en) * 2010-08-06 2013-03-20 Mass GmbH Assembly and method for machining circuit boards
AT13434U1 (en) * 2012-02-21 2013-12-15 Austria Tech & System Tech Method for producing a printed circuit board and use of such a method
EP2844044A1 (en) 2013-09-03 2015-03-04 Mass GmbH System and method for filling cavities in a printed circuit board
DE102017213841A1 (en) * 2017-08-08 2019-02-14 Continental Automotive Gmbh A printing stencil for use in a method of through-contacting a printed circuit board and using such a stencil sheet in such a method
EP4328028A1 (en) * 2022-08-23 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Filling holes of a component carrier structure with controllable and alignable movable medium applicator

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3514093A1 (en) * 1985-04-16 1986-10-23 Kaspar 5241 Gebhardshain Eidenberg METHOD FOR CLOSING HOLES PROVIDED IN A CIRCUIT BOARD
JPS6293999A (en) * 1985-10-19 1987-04-30 大日本スクリ−ン製造株式会社 Filling method of through holes in printed circuit board
JPH03240292A (en) * 1990-02-19 1991-10-25 Matsushita Electric Ind Co Ltd Manufacture of printed circuit board
JPH0494592A (en) * 1990-08-10 1992-03-26 Cmk Corp Filling method for filler in through hole of printed circuit board
US5587119A (en) * 1994-09-14 1996-12-24 E-Systems, Inc. Method for manufacturing a coaxial interconnect
FR2754474B1 (en) * 1996-10-15 1999-04-30 Novatec DEVICE FOR DEPOSITING A VISCOUS OR PASTA ON A SUBSTRATE THROUGH THE OPENINGS OF A STENCIL
FR2754473B1 (en) * 1996-10-15 1999-02-26 Novatec PROCESS FOR PRODUCING DEPOSITS OF VISCOUS AND / OR PASTY PRODUCT ON A SUBSTRATE THROUGH THE OPENINGS OF A STENCIL AND PRODUCT DISPENSING DEVICE

Also Published As

Publication number Publication date
FR2813216B1 (en) 2003-03-21
EP1314341A1 (en) 2003-05-28
FR2813216A1 (en) 2002-03-01
US20030170387A1 (en) 2003-09-11
WO2002019782A1 (en) 2002-03-07

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