EP1288321A1 - Werkstoff für ein Metallband - Google Patents
Werkstoff für ein Metallband Download PDFInfo
- Publication number
- EP1288321A1 EP1288321A1 EP02017970A EP02017970A EP1288321A1 EP 1288321 A1 EP1288321 A1 EP 1288321A1 EP 02017970 A EP02017970 A EP 02017970A EP 02017970 A EP02017970 A EP 02017970A EP 1288321 A1 EP1288321 A1 EP 1288321A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- material according
- tin
- silver
- ratio
- metal strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9265—Special properties
- Y10S428/929—Electrical contact feature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12708—Sn-base component
- Y10T428/12715—Next to Group IB metal-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
Definitions
- the invention relates to a material for a metal strip for the production of electrical contact components.
- Plug-in contact connections are widely used in electrotechnical applications. This basically means a mechanical arrangement of plug and Plug sleeve for opening and closing an electrically conductive connection. Plug contact connections come in a wide variety of applications used, for example in the automotive electrical, telecommunications or the industrial plant electronics.
- a common manufacturing method of such plug contact elements is blankslosestanzen a copper or a copper alloy strip and this for Plug contact element to process further.
- Copper has a high electrical Conductivity.
- the copper or copper alloy strips are tinned in advance. Tin is particularly suitable for its good corrosion resistance Coating material for copper.
- the technical standard includes the order of the Coating in the hot dip process.
- tin alloys for Surface coating of the base material known, in particular tin-silver alloys, because these are among the very good contact materials.
- DE 36 28 783 C2 discloses an electrical connector of a Copper alloy containing 0.3 to 2% by weight of magnesium and 0.001 to 0.1% by weight Having phosphorus.
- the electrical connectors are characterized by their Strength, their electrical conductivity and stress relaxation properties elevated temperatures. They show satisfactory performance characteristics, even if they are made in a compact size and complicated shape.
- the prior art also includes a copper alloy by DE 43 38 769 A1 for the manufacture of electrical connectors with a composition of essentially 0.5 to 3% by weight nickel, 0.1 to 0.9% tin, 0.08 to 0.8% by weight Silicon, 0.1 to 3 wt% zinc, 0.007 to 0.25 wt% iron, 0.001 to 0.2 wt% Phosphorus and 0.001 to 0.2% magnesium with the main constituent copper as Rest including the unavoidable impurities.
- the known metal bands or the connectors thereof have in the Proven practice.
- increasingly the technical and qualitative Requirements of the contact components with regard to the mechanical and electrical Properties This is especially true when using the contact components below difficult or aggressive environmental conditions, for example for Connector in automotive electrical and here especially in the engine electronics.
- requirements can be especially in terms of temperature resistance, relaxation resistance, corrosion resistance and adhesion of the coating occur in which the known Contact components reach their limit. It can then be used to exfoliate (exfoliate) the Surface coating come.
- the invention is - based on the prior art - the task in economically advantageous a material for a metal strip for the production of to provide electrical contact components, which good electrical and mechanical properties with an improvement in adhesion between Base material and coating combined.
- the material consists of a copper alloy with nickel shares between 0.5 and 3.5 wt .-%, silicon contents of 0.08 to 1.0 wt .-%, tin content of 0.1 to 1.0 wt .-%, zinc contents of 0.1 to 1.0 wt .-%, zirconium shares between 0.005 to 0.2% by weight and silver contents of 0.02 to 0.5% by weight.
- the tin content in the material itself decreases its conductivity, but increases this strength and toughness.
- the decrease in conductivity is due to the Addition of silver compensated.
- the main purpose of the silver share is to as a matrix component under the influence of temperature on diffusion processes with the Coating material of a metal band to participate and the expected influence diffusion-controlled phase formation of intermetallic compounds.
- the silver content is therefore between 0.02 wt .-% and 0.5 wt .-%.
- Zirconium with a proportion between 0.005 and 0.2 wt .-% increases the corrosion and Temperature resistance and improves the thermoformability.
- the material preferably contains a silver content of less than 0.15% by weight. (Claim 2).
- a manganese content of less than 0.5 wt .-% promotes temperature resistance (Claim 3).
- Magnesium with a proportion of less than 0.2 wt .-% (claim 4) improved the strength and the stress relaxation property at elevated temperature of Alloy with only slight impairment of electrical conductivity, the based on the main component copper. Magnesium dissolves in the copper matrix.
- Indium is added according to claim 5, between 0.1 wt .-% and 5 wt .-%, although the melting point is lowered, but the total Resistance to external conditions improved. In addition, the Soldering properties positively influenced.
- the ratio of silver to zinc is greater than 0.1 (Claim 8).
- a further advantageous feature is achieved according to claim 9, if the ratio of magnesium and zirconium is greater than 0.01 tin.
- the peeling behavior of the material is determined according to the characteristics of Patent claim 10 significantly improved when the ratio (nickel + silicon) to (Tin + zinc + silver + magnesium) greater than 1.5, but smaller than 4 is measured.
- the metal strip using the material described above according to Claim 11 is initially characterized by its good electrical and mechanical properties, in particular by its good conductivity and Relaxation resistance with good formability and peel resistance of Coating. A stable contact resistance is ensured.
- the Metal strip has a high temperature resistance with low Contact resistance on. It is abrasion and abrasion resistant with higher hardness, nevertheless, it is easily deformable and easy to solder. The insertion and removal forces are low with improved friction corrosion resistance.
- the metal strip is economically advantageous because during its production Copper scrap can be used with tin components. In the material cycle becomes a achieved balanced tin balance. This can be a consistent quality of be ensured under scrap insert produced metal strips.
- tinned Scrap and Neumetall can be tinned depending on the thickness of the tin plating
- a base material can be obtained as a cast product with a tin content from 0.02 to 1% by weight. Process advantages are castings with a Tin content between 0.25 and 0.5 wt .-%.
- the intermetallic phase between the base material and the coating is fine-grained and even. This results in a good formability, in particular bendability, higher shear strengths and low moduli of elasticity and a high creep resistance of the metal strip.
- the alloy components zinc and silver influence the diffusion behavior in the intermetallic phase between the base material and the according to Claim 12 made of tin-silver coating.
- the inevitable by diffusion of copper in the tin layer resulting copper-tin phases are in their manifestation over temperature and time in the sense of a Slowing down and obstructing education, especially the so-called epsilon phase affected. This results in a much better strength between Base material and coating guaranteed. With this, detachment phenomena, in particular the peeling (exfoliation) of the coating even in unfavorable and difficult conditions of use of the metal strip or produced therefrom Connector shifted to higher temperatures and longer times.
- the main reason for a possible age-related failure of the coating just at temperatures above 150 ° C is a disproportionately fast conversion of the so-called ⁇ -phase (Cu 6 Sn 5 ) in the ⁇ -phase (Cu 3 Sn) in training, starting from the Phase boundary between base material and coating due to high diffusion rates.
- the invention now recognizes the fact that the presence of the ⁇ phase alone does not necessarily lead to detachment processes at the boundary between the base material and the coating, not even in the case of a stress state of a connector caused by the forming process. If the expression of the ⁇ phase is prevented or hindered, this has a positive effect on the intermetallic phase and long-term stability of the coating.
- Zinc and silver as well as the nickel present in the material are in their According to the invention provided shares suitable in the diffusion process and their Participation in the formation of the intermetallic phase specifically by enrichment in the phase boundary is the fast conversion from the ⁇ -phase to the £ -phase suppress or significantly slow down with the success of a homogeneous highly adhesive bond between base material and coating.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Contacts (AREA)
- Laminated Bodies (AREA)
- Clamps And Clips (AREA)
- Package Frames And Binding Bands (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Adornments (AREA)
Abstract
Description
Claims (12)
- Werkstoff für ein Metallband zur Fertigung von elektrischen Kontaktbauteilen, welcher - in Gewichtsprozenten ausgedrückt - folgende Zusammensetzung aufweist:
Nickel (Ni) 0,5 - 3,5 % Silizium (Si) 0,08-1,0 % Zinn (Sn) 0,1 - 1,0% Zink(Zn) 0,1-1,0% Zirkonium (Zr) 0,005 - 0,2 % Silber (Ag) 0,02 - 0,5 %, - Werkstoff nach Patentanspruch 1, welcher Silber (Ag) mit einem Anteil kleiner als 0,15 % enthält.
- Werkstoff nach Patentanspruch 1 oder 2, welcher Mangan (Mn) mit einem Anteil kleiner als 0,5 % enthält.
- Werkstoff nach einem der Patentansprüche 1 bis 3, welcher Magnesium (Mg) mit einem Anteil kleiner als 0,2 % enthält.
- Werkstoff nach einem der Patentansprüche 1 bis 4, welcher Indium (In) mit einem Anteil von 0,1 bis 5 % enthält.
- Werkstoff nach einem der Patentansprüche 1 bis 5, in welchem Zinn und Zink in einem Verhältnis von etwa 1 : 1 enthalten sind.
- Werkstoff nach einem der Patentansprüche 1 bis 6, in welchem Zinn und Silber in einem Verhältnis von etwa 1 : 4 enthalten sind.
- Werkstoff nach einem der Patentansprüche 1 bis 7 mit einem Verhältnis Ag größer 0,1 Zn.
- Werkstoff nach einem der Patentansprüche 4 bis 8 mit einem Verhältnis (Mg + Zr) größer 0,01 Sn.
- Werkstoff nach einem der Patentansprüche 4 bis 9, bei welchem das Verhältnis (Ni + Si) zu (Sn + Zn + Ag + Mg) größer 1,5, jedoch kleiner 4 bemessen ist.
- Verwendung eines Werkstoffs gemäß einem der Patentansprüche 1 bis 10 für ein beschichtetes, elektrisch leitfähiges Metallband zur Fertigung von elektrischen Kontaktbauteilen, insbesondere Teilen von in höheren Temperaturbereichen des Kraftfahrzeugbaus (Motorraum) einsetzbaren Steckverbindern.
- Verwendung eines Werkstoffs nach Patentanspruch 11, für ein mit einer Zinn-Silber-Legierung beschichtetes Metallband.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK02017970T DK1288321T3 (da) | 2001-08-21 | 2002-08-10 | Materiale til et metalbånd |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10139953 | 2001-08-21 | ||
DE10139953A DE10139953A1 (de) | 2001-08-21 | 2001-08-21 | Werkstoff für ein Metallband |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1288321A1 true EP1288321A1 (de) | 2003-03-05 |
EP1288321B1 EP1288321B1 (de) | 2005-06-08 |
Family
ID=7695446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02017970A Expired - Lifetime EP1288321B1 (de) | 2001-08-21 | 2002-08-10 | Werkstoff für ein Metallband |
Country Status (11)
Country | Link |
---|---|
US (1) | US6716541B2 (de) |
EP (1) | EP1288321B1 (de) |
JP (1) | JP2003119528A (de) |
KR (1) | KR100874396B1 (de) |
CN (1) | CN1407123A (de) |
AT (1) | ATE297475T1 (de) |
DE (2) | DE10139953A1 (de) |
DK (1) | DK1288321T3 (de) |
ES (1) | ES2240619T3 (de) |
PT (1) | PT1288321E (de) |
TW (1) | TWI315879B (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019224197A1 (de) | 2018-05-23 | 2019-11-28 | Aurubis Stolberg Gmbh & Co. Kg | Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder |
WO2022073575A1 (de) * | 2020-10-05 | 2022-04-14 | Wieland-Werke Ag | Elektrisch leitendes material mit beschichtung |
US12071692B2 (en) | 2020-10-05 | 2024-08-27 | Wieland-Werke Ag | Electrically conducting material with coating |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1457743B1 (de) * | 2003-03-12 | 2013-12-25 | Behr France Rouffach SAS | Elektrische Heizeinrichtung, insbesondere für ein Kraftfahrzeug |
CN102146533B (zh) * | 2011-03-25 | 2012-11-14 | 富威科技(吴江)有限公司 | 一种铜镍锡合金带材的生产工艺 |
DK2906733T3 (en) * | 2012-10-10 | 2016-09-26 | Kme Germany Gmbh & Co Kg | Material for electrical contact components |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4338769A1 (de) * | 1992-11-13 | 1994-05-19 | Mitsubishi Shindo Kk | Kupferlegierung mit sehr guter Warmbearbeitbarkeit und Stanzbarkeit für elektrische und elektronische Teile |
EP1024212A2 (de) * | 1999-01-27 | 2000-08-02 | Dowa Mining Co., Ltd. | Verschliessfester Kupfer oder Kupferlegierung, Verfahren zu ihrer Herstellung und damit hergestelltes elektrisches Bauteil |
EP1158618A2 (de) * | 2000-05-20 | 2001-11-28 | STOLBERGER METALLWERKE GMBH & CO. KG | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
EP1157820A1 (de) * | 2000-05-20 | 2001-11-28 | STOLBERGER METALLWERKE GMBH & CO. KG | Elektrisch leitfähiges Metallband und Steckverbinder |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62227051A (ja) | 1986-03-28 | 1987-10-06 | Mitsubishi Shindo Kk | Cu合金製電気機器用コネクタ |
DE4005836C2 (de) * | 1990-02-23 | 1999-10-28 | Stolberger Metallwerke Gmbh | Elektrisches Steckverbinderpaar |
JP2898627B2 (ja) * | 1997-03-27 | 1999-06-02 | 日鉱金属株式会社 | 銅合金箔 |
US5893953A (en) * | 1997-09-16 | 1999-04-13 | Waterbury Rolling Mills, Inc. | Copper alloy and process for obtaining same |
-
2001
- 2001-08-21 DE DE10139953A patent/DE10139953A1/de not_active Withdrawn
-
2002
- 2002-08-09 KR KR1020020046994A patent/KR100874396B1/ko active IP Right Grant
- 2002-08-10 EP EP02017970A patent/EP1288321B1/de not_active Expired - Lifetime
- 2002-08-10 DK DK02017970T patent/DK1288321T3/da active
- 2002-08-10 ES ES02017970T patent/ES2240619T3/es not_active Expired - Lifetime
- 2002-08-10 DE DE50203318T patent/DE50203318D1/de not_active Expired - Lifetime
- 2002-08-10 AT AT02017970T patent/ATE297475T1/de active
- 2002-08-10 PT PT02017970T patent/PT1288321E/pt unknown
- 2002-08-19 TW TW091118660A patent/TWI315879B/zh not_active IP Right Cessation
- 2002-08-19 US US10/224,739 patent/US6716541B2/en not_active Expired - Lifetime
- 2002-08-20 CN CN02129871A patent/CN1407123A/zh active Pending
- 2002-08-20 JP JP2002239286A patent/JP2003119528A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4338769A1 (de) * | 1992-11-13 | 1994-05-19 | Mitsubishi Shindo Kk | Kupferlegierung mit sehr guter Warmbearbeitbarkeit und Stanzbarkeit für elektrische und elektronische Teile |
EP1024212A2 (de) * | 1999-01-27 | 2000-08-02 | Dowa Mining Co., Ltd. | Verschliessfester Kupfer oder Kupferlegierung, Verfahren zu ihrer Herstellung und damit hergestelltes elektrisches Bauteil |
EP1158618A2 (de) * | 2000-05-20 | 2001-11-28 | STOLBERGER METALLWERKE GMBH & CO. KG | Elektrisch leitfähiges Metallband und Steckverbinder hieraus |
EP1157820A1 (de) * | 2000-05-20 | 2001-11-28 | STOLBERGER METALLWERKE GMBH & CO. KG | Elektrisch leitfähiges Metallband und Steckverbinder |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019224197A1 (de) | 2018-05-23 | 2019-11-28 | Aurubis Stolberg Gmbh & Co. Kg | Kupferband zur herstellung von elektrischen kontakten und verfahren zur herstellung eines kupferbandes und steckverbinder |
WO2022073575A1 (de) * | 2020-10-05 | 2022-04-14 | Wieland-Werke Ag | Elektrisch leitendes material mit beschichtung |
US12071692B2 (en) | 2020-10-05 | 2024-08-27 | Wieland-Werke Ag | Electrically conducting material with coating |
Also Published As
Publication number | Publication date |
---|---|
KR20030017327A (ko) | 2003-03-03 |
DK1288321T3 (da) | 2005-10-03 |
KR100874396B1 (ko) | 2008-12-17 |
PT1288321E (pt) | 2005-08-31 |
US6716541B2 (en) | 2004-04-06 |
CN1407123A (zh) | 2003-04-02 |
DE50203318D1 (de) | 2005-07-14 |
EP1288321B1 (de) | 2005-06-08 |
TWI315879B (en) | 2009-10-11 |
DE10139953A1 (de) | 2003-03-27 |
ES2240619T3 (es) | 2005-10-16 |
US20030044635A1 (en) | 2003-03-06 |
JP2003119528A (ja) | 2003-04-23 |
ATE297475T1 (de) | 2005-06-15 |
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