EP1252554A1 - Korrektur von bildverzerrungen bei der herstellung von leiterplatten - Google Patents

Korrektur von bildverzerrungen bei der herstellung von leiterplatten

Info

Publication number
EP1252554A1
EP1252554A1 EP00969787A EP00969787A EP1252554A1 EP 1252554 A1 EP1252554 A1 EP 1252554A1 EP 00969787 A EP00969787 A EP 00969787A EP 00969787 A EP00969787 A EP 00969787A EP 1252554 A1 EP1252554 A1 EP 1252554A1
Authority
EP
European Patent Office
Prior art keywords
layer
pattern
image data
conductive material
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00969787A
Other languages
English (en)
French (fr)
Inventor
Itzhak Taff
Yossef Atiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak IL Ltd
Original Assignee
Kodak IL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodak IL Ltd filed Critical Kodak IL Ltd
Priority claimed from PCT/IL2000/000667 external-priority patent/WO2002033492A1/en
Publication of EP1252554A1 publication Critical patent/EP1252554A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • Post-etch punching of inner layers offered the following advantages as compared to pre-exposure methods:
  • the tooling pattern is punched in the inner layer after etching. All material movement resulting from artwork instability, etching, black oxidizing, etc. is compensated for by offset and global scale.
  • linear scaling error may be characterized by a single correction factor per axis for a given type of layer
  • non-linear scaling errors require a more complex correction scheme.
  • second order non-linearity which requires two correction factors through higher degrees of non-linearity, which require a number of correction factors equal to the degree of non-linearity to the most complex case where the required correction factor is as complex as the image file itself.
  • An actual conductor pattern (produced from an initial map or stored image data, and produced by a defined process on defined apparatus) on at least one inner layer (artificially termed "a first inner layer,” even though it does not have to be the first layer) is scanned by an image scanner to produce a scanned map or scanned image data.
  • the information from the scanned image of the first inner layer includes either the entire pattern of the conductor pattern, substantially all areas of the conductor pattern which contain conductor sites, or a segmented (discontinuous) pattern identifying the location of all conductor sites in the first inner layer, or a preselected portion of conductor sites.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
EP00969787A 2000-10-19 2000-10-19 Korrektur von bildverzerrungen bei der herstellung von leiterplatten Withdrawn EP1252554A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IL2000/000667 WO2002033492A1 (en) 1999-07-06 2000-10-19 Nonlinear image distortion correction in printed circuit board manufacturing

Publications (1)

Publication Number Publication Date
EP1252554A1 true EP1252554A1 (de) 2002-10-30

Family

ID=11043004

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00969787A Withdrawn EP1252554A1 (de) 2000-10-19 2000-10-19 Korrektur von bildverzerrungen bei der herstellung von leiterplatten

Country Status (5)

Country Link
EP (1) EP1252554A1 (de)
JP (1) JP4791681B2 (de)
KR (1) KR20020074163A (de)
CN (1) CN1434932A (de)
AU (1) AU2000279433A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108901119A (zh) * 2018-06-22 2018-11-27 广州兴森快捷电路科技有限公司 用于测量激光钻机孔位精度的治具及方法
CN116362957A (zh) * 2021-12-27 2023-06-30 广州镭晨智能装备科技有限公司 Pcb板卡图像对齐的方法、装置、介质和电子设备
CN117141037A (zh) * 2023-10-30 2023-12-01 山西昌鸿电力器材有限公司 一种电力金具加工工艺

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100526035B1 (ko) * 2003-05-07 2005-11-08 홍성국 메탈 마스크 검사 장치 및 그의 검사 방법
JP4844835B2 (ja) * 2004-09-14 2011-12-28 株式会社ニコン 補正方法及び露光装置
US7368207B2 (en) * 2006-03-31 2008-05-06 Eastman Kodak Company Dynamic compensation system for maskless lithography
CN103097956B (zh) * 2010-02-26 2016-01-27 密克罗尼克麦达塔公司 用于执行图案对准的方法和装置
CN111694226B (zh) * 2020-05-25 2022-05-17 合肥芯碁微电子装备股份有限公司 水平度测量方法和直接式成像设备
KR102385554B1 (ko) * 2020-06-16 2022-04-13 재단법인 아산사회복지재단 나노구조체 기반의 표면증강라만 기판 및 그 제조 방법
CN114485409A (zh) * 2022-04-18 2022-05-13 深圳市元硕自动化科技有限公司 原料板质量检测方法、装置、设备及可读存储介质

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3291176B2 (ja) * 1995-05-15 2002-06-10 松下電工株式会社 回路パターンの検査方法および検査装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0233492A1 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108901119A (zh) * 2018-06-22 2018-11-27 广州兴森快捷电路科技有限公司 用于测量激光钻机孔位精度的治具及方法
CN116362957A (zh) * 2021-12-27 2023-06-30 广州镭晨智能装备科技有限公司 Pcb板卡图像对齐的方法、装置、介质和电子设备
CN116362957B (zh) * 2021-12-27 2024-05-14 广州镭晨智能装备科技有限公司 Pcb板卡图像对齐的方法、装置、介质和电子设备
CN117141037A (zh) * 2023-10-30 2023-12-01 山西昌鸿电力器材有限公司 一种电力金具加工工艺
CN117141037B (zh) * 2023-10-30 2024-02-02 山西昌鸿电力器材有限公司 一种电力金具加工工艺

Also Published As

Publication number Publication date
KR20020074163A (ko) 2002-09-28
JP2004512678A (ja) 2004-04-22
CN1434932A (zh) 2003-08-06
AU2000279433A1 (en) 2002-04-29
JP4791681B2 (ja) 2011-10-12

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