EP1205006B1 - Transition entre un guide d'ondes et une microbande - Google Patents

Transition entre un guide d'ondes et une microbande Download PDF

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Publication number
EP1205006B1
EP1205006B1 EP00949855A EP00949855A EP1205006B1 EP 1205006 B1 EP1205006 B1 EP 1205006B1 EP 00949855 A EP00949855 A EP 00949855A EP 00949855 A EP00949855 A EP 00949855A EP 1205006 B1 EP1205006 B1 EP 1205006B1
Authority
EP
European Patent Office
Prior art keywords
waveguide
substrate
transition
microstrip
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00949855A
Other languages
German (de)
English (en)
Other versions
EP1205006A1 (fr
Inventor
Sigmund Lenz
Achim Strouhal
Siegbert Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson AB
Original Assignee
Marconi Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Communications GmbH filed Critical Marconi Communications GmbH
Publication of EP1205006A1 publication Critical patent/EP1205006A1/fr
Application granted granted Critical
Publication of EP1205006B1 publication Critical patent/EP1205006B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
    • H01P5/107—Hollow-waveguide/strip-line transitions

Definitions

  • the present invention relates to a transition from a waveguide to a stripline, wherein extending on a substrate stripline protrudes through an opening in the waveguide and a belonging to the strip line grounding line is contacted with the waveguide wall.
  • Such a transition from a waveguide to a stripline is known from US 5,202,648.
  • the strip line runs on top of the substrate, and the associated ground line consists of a deposited on the opposite side of the substrate conductive surface which is contacted with the waveguide wall.
  • a weak point of such executed transitions between a waveguide and a stripline is often too low reflection attenuation and too high transmission loss.
  • EP-A2-0 920 071 describes a transition from a waveguide to a stripline formed in a multilayer substrate.
  • the junction may be enclosed within a hermetically sealed housing that includes a metal base, a first portion of the multi-layer substrate, a metal ring, and a metal cover.
  • the multilayer substrate has at least a first and a second dielectric layer, between which a first conductive layer is arranged.
  • the multi-layer substrate further includes the waveguide.
  • the walls of the waveguide are coated with an electromagnetically reflective material so that signals may propagate through reflection by the waveguide to the first dielectric layer.
  • vias are arranged to form an approximate outline around a protruding portion of the first dielectric layer.
  • a stripline is disposed on a second, separate portion of the multilayer substrate from the top of the first dielectric layer and connected to a T-shaped antenna disposed over the waveguide and within the waveguide extension.
  • the invention has for its object to provide a transition of the type mentioned, the one Has the highest possible reflection loss and the lowest possible insertion loss.
  • the ground line belonging to the strip line consists of a plurality of ground planes stacked in the substrate, all of which are contacted to each other by means of plated-through holes in the substrate.
  • the multi-layer ground line causes a more favorable field conversion of the stripline to the waveguide, which sets a high reflection loss and low transmission loss for the transition.
  • a plated-through in the substrate is provided at the acting as an antenna, projecting into the waveguide end of the strip line, the transition is broadband.
  • the substrate is fixed with at least one screw on a support on the waveguide wall, wherein the screw is passed through the ground surface and produces an electrical contact between these and the support.
  • a low transmission loss is achieved by the fact that the at least one screw rests with its head on one of the lateral next to the strip line on the substrate top applied ground surfaces and that between the screw head and the mass surface, a conductive tape is clamped, which is connected to the waveguide wall.
  • at least one conductive elastic body may be inserted between at least one of the two ground faces located laterally of the strip line and a projection of the waveguide wall projecting beyond the ground faces.
  • a conductive elastic body can be pressed between the head of the at least one screw and the projection of the waveguide wall.
  • a stripline 2 runs on a multilayer substrate 1 (multi-layer substrates).
  • a tongue 5 located on the substrate 1 in the Waveguide 3 protrudes.
  • the extending on the tongue 5 end of the strip line 2 acts as an antenna 6 for coupling the waveguide array to the stripline or vice versa.
  • ground planes 7 and 8 are applied to the substrate upper side next to the strip line 2, and in addition a plurality of ground planes are stacked within the multilayer substrate, all of which have the same ground potential.
  • the cross-section B-B shown in FIG. 3 through the waveguide 3 into the substrate 1 shows the multilayer ground surfaces 9 within the substrate 1.
  • the longitudinal section AA shown in Figure 2 shows the two symmetrical ground planes 7 and 8 on both sides of the strip line 2. These ground surfaces 7 and 8 on the substrate top are electrically conductively connected to the other within the substrate 1 stacked ground surfaces 9 through a plurality of plated through holes 10 , The locations and distances of the vias 10 are selected so that field propagation into the spaces between the ground planes of the multilayer substrate 1 is prevented. Because this could disrupt the function of arranged in the individual substrate layers circuits.
  • the ground surfaces 9 of the substrate 1 preferably protrude into the waveguide 3 by a few tenths of a millimeter in order to increase the positional tolerance of the substrate 1 relative to the waveguide 3.
  • the field configuration under the stripline 2 in the waveguide 3 is closely related to the position of the ground surfaces 9 together. If the position of the substrate 1 is now slightly changed, the field remains unchanged due to the positional tolerance of the ground surfaces 9.
  • a penetration depth of the ground surfaces 9 in the waveguide 3 of 0.5 - 1.0 mm makes sense.
  • the multilayer substrate 1 forms a larger virtual mass, thereby creating a field configuration that is better converted into a waveguide wave.
  • the field is namely formed by the greater extent of the mass (because of the many stacked mass surfaces) in the direction of the broad side of the waveguide 3 more intense in a field component of the fundamental mode of the waveguide.
  • FIGS. 2 and 3 show that through-plating 11 is provided at the end of the antenna 6 of the stripline 2 running on the substrate tongue 5.
  • This plated-11 at the end of the antenna 6 of the strip line leads to a broadening of the frequency band of the transition from the waveguide 3 to the stripline 2. Due to the thicker structure of the substrate 1, the feedthrough 11 at the end of the antenna 6 increases, resulting in a more favorable conversion of the stripline field contributes to the waveguide field.
  • the substrate 1 is fixed by means of at least one screw - in the embodiment shown in FIG. 2, two screws 12 and 13 - on a support 14 extending from the waveguide wall below the opening 4.
  • the screws are 12 and 13 with their heads on the side adjacent to the strip line 2 applied ground surfaces 7 and 8 and thus provide between the ground surfaces 7 and B and the stacked ground surfaces 9 in the substrate 1 and the waveguide wall 14 an electrical contact.
  • This contacting can, as shown in Figure 2, take place by means of conductive bands 15 and 16 which at one end between the heads of the screws 12 and 13 and the conductive surfaces 7 and 8 and at its other end in the parting plane 17 of two half-shells existing waveguide 3 are clamped.
  • FIG 3 Another variant for the contacting of the mass surfaces 7, 8 and screws 12, 13 with the waveguide wall is shown in FIG 3.
  • the waveguide 3 above its opening 4 a wall projection 18 which extends over the ground surfaces 7 and 8 on the upper side of the substrate 1 protrudes.
  • a wall projection 18 which extends over the ground surfaces 7 and 8 on the upper side of the substrate 1 protrudes.
  • one or more conductive elastic body 19 are clamped.
  • one or more conductive elastic bodies 20 can be pressed.

Landscapes

  • Waveguides (AREA)
  • Waveguide Aerials (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Electric Cable Installation (AREA)
  • Waveguide Switches, Polarizers, And Phase Shifters (AREA)
  • Optical Integrated Circuits (AREA)

Claims (7)

  1. Transition entre un guide d'onde et un ruban conducteur, dans lequel le ruban conducteur (2) qui s'étend sur un substrat (1) pénètre dans le guide d'onde (3) via une ouverture (4), et une ligne de masse (7, 8, 9) appartenant au ruban conducteur (2) est en contact avec la paroi du guide d'onde, caractérisée en ce que la ligne de masse est constituée de plusieurs surfaces de masse (7, 8, 9) disposées en plusieurs couches les unes au-dessus des autres dans le substrat (2), qui sont mises en contact les unes avec les autres au moyen de contacts traversants dans le substrat (2).
  2. Transition selon la revendication 1, caractérisée en ce qu'il est prévu un plaquage traversant (11) dans le substrat (2, 5), à l'extrémité du ruban conducteur (2) qui pénètre dans le guide d'onde (3) et qui fait office d'antenne (6).
  3. Transition selon la revendication 1, caractérisée en ce que des surfaces de masse (7, 8) sont appliquées sur le substrat (1) des deux côtés à côté du ruban conducteur (2), et en ce que lesdites surfaces de masse (7) sont mises en contact avec les autres surfaces de masse (9) disposées en couches les unes au-dessus des autres dans le substrat (1) via des contacts traversants (10).
  4. Transition selon la revendication 1, caractérisée en ce que le substrat (1) est fixé par au moins une vis (12, 13) sur un support (14) contre la paroi du guide d'onde, et en ce que la vis (12, 13) est menée à travers les surfaces de masse (7, 8, 9), et établit un contact électrique entre ces surfaces de masse et le support (14).
  5. Transition selon les revendications 3 et 4, caractérisée en ce que ladite au moins une vis (12, 13) s'applique par sa tête contre l'une des surfaces de masse (7, 8) appliquée sur la face supérieure du substrat latéralement à côté du ruban conducteur (2), et en ce qu'une bande conductrice (15, 16), qui est reliée à la paroi du guide d'onde, est serrée entre la tête de vis et la surface de masse (7, 8).
  6. Transition selon la revendication 3, caractérisée en ce qu'au moins un corps élastique conducteur (19) est inséré entre l'une au moins des surfaces de masse (7, 8) qui se trouvent des deux côtés du ruban conducteur (2) sur la face supérieure du substrat, et une saillie (18), qui dépasse au-dessus de cette surface de masse (7, 8), de la paroi du guide d'onde.
  7. Transition selon les revendications 4 et 6, caractérisé en ce qu'un corps élastique conducteur (20) est inséré entre la tête de ladite au moins une vis (12, 13) et la saillie (18) de la paroi du guide d'onde.
EP00949855A 1999-07-22 2000-07-19 Transition entre un guide d'ondes et une microbande Expired - Lifetime EP1205006B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19934351 1999-07-22
DE19934351A DE19934351A1 (de) 1999-07-22 1999-07-22 Übergang von einem Hohlleiter auf eine Streifenleitung
PCT/IB2000/001140 WO2001008252A1 (fr) 1999-07-22 2000-07-19 Transition entre un guide d'ondes et une microbande

Publications (2)

Publication Number Publication Date
EP1205006A1 EP1205006A1 (fr) 2002-05-15
EP1205006B1 true EP1205006B1 (fr) 2007-01-31

Family

ID=7915641

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00949855A Expired - Lifetime EP1205006B1 (fr) 1999-07-22 2000-07-19 Transition entre un guide d'ondes et une microbande

Country Status (8)

Country Link
US (1) US7002431B2 (fr)
EP (1) EP1205006B1 (fr)
CN (1) CN1196222C (fr)
AT (1) ATE353165T1 (fr)
AU (1) AU6311100A (fr)
DE (2) DE19934351A1 (fr)
NO (1) NO20020297L (fr)
WO (1) WO2001008252A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004110247A2 (fr) * 2003-05-22 2004-12-23 Stephen Ritland Guide intermusculaire pour l'insertion d'un ecarteur et procede d'utilisation
US7420436B2 (en) * 2006-03-14 2008-09-02 Northrop Grumman Corporation Transmission line to waveguide transition having a widened transmission with a window at the widened end
US7479842B2 (en) * 2006-03-31 2009-01-20 International Business Machines Corporation Apparatus and methods for constructing and packaging waveguide to planar transmission line transitions for millimeter wave applications
US20080048798A1 (en) * 2006-08-23 2008-02-28 Inventec Corporation Transmission line for in-circuit testing
US7847654B2 (en) * 2008-07-28 2010-12-07 Bosch Security Systems, Inc. Multilayer microstripline transmission line transition
CN202050037U (zh) * 2010-11-30 2011-11-23 中兴通讯股份有限公司 波导微带转换装置及设备
CN107534200B (zh) * 2015-05-19 2019-11-08 三菱电机株式会社 同轴微带线路转换电路
KR102457114B1 (ko) * 2020-12-16 2022-10-20 주식회사 넥스웨이브 다층 pcb의 전송선로와 웨이브가이드 간의 전이구조
CN114284676B (zh) * 2021-12-24 2022-07-29 电子科技大学 一种基于v型天线的波导-微带过渡结构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2675637B1 (fr) * 1991-04-16 1993-07-09 Bretagne Critt Transition ligne microruban/guide d'ondes.
US5202648A (en) * 1991-12-09 1993-04-13 The Boeing Company Hermetic waveguide-to-microstrip transition module
EP0552944B1 (fr) * 1992-01-21 1997-03-19 Sharp Kabushiki Kaisha Adapteur guide d'ondes-coaxiale et convertisseur d'antenne pour radiodiffusion par satéllites comprenant un tel guide d'ondes
TW212252B (fr) * 1992-05-01 1993-09-01 Martin Marietta Corp
GB9215707D0 (en) * 1992-07-23 1992-09-09 Cambridge Computer Rf waveguide signal transition apparatus
EP0874415B1 (fr) * 1997-04-25 2006-08-23 Kyocera Corporation Module à haute fréquence
US5982250A (en) * 1997-11-26 1999-11-09 Twr Inc. Millimeter-wave LTCC package
SE513288C2 (sv) * 1998-12-22 2000-08-21 Ericsson Telefon Ab L M Bredbandig mikrostrip-vågledarövergång

Also Published As

Publication number Publication date
ATE353165T1 (de) 2007-02-15
DE19934351A1 (de) 2001-02-08
WO2001008252A1 (fr) 2001-02-01
DE50014027D1 (de) 2007-03-22
CN1196222C (zh) 2005-04-06
US7002431B2 (en) 2006-02-21
NO20020297D0 (no) 2002-01-18
AU6311100A (en) 2001-02-13
US20050040911A1 (en) 2005-02-24
CN1364325A (zh) 2002-08-14
EP1205006A1 (fr) 2002-05-15
NO20020297L (no) 2002-03-15

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