EP1177708B1 - Ameliorations apportees a des elements chauffants, notamment dans le domaine des elements chauffants en couche epaisse - Google Patents

Ameliorations apportees a des elements chauffants, notamment dans le domaine des elements chauffants en couche epaisse Download PDF

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Publication number
EP1177708B1
EP1177708B1 EP00927490A EP00927490A EP1177708B1 EP 1177708 B1 EP1177708 B1 EP 1177708B1 EP 00927490 A EP00927490 A EP 00927490A EP 00927490 A EP00927490 A EP 00927490A EP 1177708 B1 EP1177708 B1 EP 1177708B1
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EP
European Patent Office
Prior art keywords
heating element
thick film
element assembly
assembly
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00927490A
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German (de)
English (en)
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EP1177708A1 (fr
EP1177708B2 (fr
Inventor
Robert Andrew O'neill
Robin Keith Moore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Otter Controls Ltd
Original Assignee
Otter Controls Ltd
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Publication date
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Application filed by Otter Controls Ltd filed Critical Otter Controls Ltd
Priority to DE60024253T priority Critical patent/DE60024253T3/de
Publication of EP1177708A1 publication Critical patent/EP1177708A1/fr
Application granted granted Critical
Publication of EP1177708B1 publication Critical patent/EP1177708B1/fr
Publication of EP1177708B2 publication Critical patent/EP1177708B2/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/78—Heating arrangements specially adapted for immersion heating
    • H05B3/82—Fixedly-mounted immersion heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/262—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an insulated metal plate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/78—Heating arrangements specially adapted for immersion heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters

Definitions

  • This invention concerns improvements relating to electric heating elements and, more particularly, concerns heating elements of the so-called thick film type comprising a substrate, commonly formed of stainless steel, carrying a resistance heating track or layer which, as appropriate having regard to the nature of the substrate, may be formed on an electrically-insulating layer, commonly of glass, provided on the substrate. An additional electrically-insulating layer may be provided over the resistance heating track or layer as a protective measure.
  • Thick film heating elements are employed in a variety of applications and are currently becoming popular in the field of electrically-heated water boiling vessels, domestic kettles and hot water jugs for example, where their clean appearance as compared to the conventional immersion heating element of metal sheathed construction has aesthetic advantages.
  • a thick film heating element to accommodate a greater power density than is readily accommodated with conventional sheathed heating elements, leading to more rapid boiling times.
  • thick film heating elements are commonly formed on a stainless steel substrate, for example by first providing an electrically-insulating layer of glass on one or both surfaces of a stainless steel plate or disc and then screen-printing a resistance heating track onto the glass surface using electrically conductive inks which are then fired. As abovementioned, a further layer of glass may then be provided over the resistive track.
  • International PCT Patent Application No. WO 96/17496 discloses one such element that comprises, as aforementioned, a stainless steel substrate that is overlaid with an electrically insulating layer, a resistive heating track, and finally with a further insulating layer.
  • the invention of our British Patent Application No. 2349322 proposed to form the substrate of a thick film heating element with a slightly domed curvature, form the heating element track or layer on the convex surface of the domed substrate, and bond the thus formed thick film heating element to a planar surface to be heated by a process which flattens the domed thick film heating element onto the planar surface.
  • any material may be used for the intermediate heat dispersion layer, provided it has a thermal conductivity significantly greater than the stainless steels used, i.e. about 20W/sqM/°C.
  • Preferred materials are copper and aluminium, chosen for their thermal conductivity, relatively low cost and compatibility with the proposed assembly processes.
  • the joining process may be the same as or similar to any of the existing known methods of attaching aluminium mounting plates as for Blitzkocher type elements, i.e. impact pressure bonding, welding or brazing, with any of the known sources of heat.
  • the preferred method because of its controllability, is induction brazing.
  • This technique claims to give a good quality, repeatable, joint with few voids.
  • the join of the heat dispersion layer to the vessel may be done first, for example by impact bonding, and the heating element may be induction brazed separately, giving the opportunity of inspecting the quality of the vessel/dispersion layer joint. Vents could be left in the part of the dispersion layer which extends beyond the heating element to allow the escape of flux and fumes generated during brazing.
  • the assembly is desirably pressed together with a clamping force, possibly as much as 4 tons, to ensure that the plates are flattened together without any gaps in the joint area.
  • a clamping force possibly as much as 4 tons
  • the illustrated embodiment comprises a thick film heating element 1 of relatively small diameter which is bonded to a heat dispersion plate 2, formed of aluminium or copper for example and having a diameter greater than that of the thick film heating element 1, which in turn is bonded to a heating surface 3 shown in the example as a thin metal plate adapted to be fitted into the bottom of a water heating appliance, the alternative edge details shown in Figures 2A and 2B are, respectively, intended to provide a water-retaining well around the heating element periphery to facilitate sealing of the element into a vessel body by providing a cooler sealing environment and to facilitate interfacing with the vessel body; other edge configurations are of course possible.
  • a thick film heating element having a power density of more than 30W/cm 2 will give rise to unacceptable noise. This equates to an overall power output of about 3kW on an element formed on a 120mm diameter disc with a plain sealing area left all round. It is proposed according to the teachings of the present invention to use a significantly higher power density heating element formed on a disc of around 60mm, for example. It is proposed that the dispersion layer will spread the heat over an area extending about 10mm beyond the disc, thus giving a heating element of an effective diameter of 80mm. Bearing in mind that the material costs of a thick film heating element are proportion to its area (thickness being constant), a conventional 80mm diameter element would use 78% more material than one of 60mm diameter constructed according to the present invention, which represents a significant saving.
  • the dispersion layer taught by the present invention heat can flow laterally as well as transversely, so that a more uniform heat distribution is obtained on the liquid heating surface.
  • the power density on the liquid heating surface is close to the calculated value of the power divided by the surface area, rather than to the value of the power divided by the (much smaller) heater track area. The result is a lower effective power density and a significant reduction in noise generated.
  • the following values are taken from present production elements.
  • the heater track power density is 68W/cm 2 .
  • the area of the heater could be reduced to less than half, whilst maintaining the same power density on the liquid heating surface.
  • the heater can be reduced still further in size. The net result of this is a major reduction in the cost of the materials of the element.
  • a disc of 77mm diameter has half the area of one of 110mm, and taking into account the dispersion layer, this gives an element diameter of approximately 60mm, the value used in the example above.
  • substrates of between 1.2 and 1.5mm are used to achieve satisfactory mechanical rigidity and resistance to thermal and mechanical shock.
  • reduce the substrate thickness for example to 0.3mm, to allow the use of high power density without a penalty in increased track running temperatures.
  • the improved heat transfer efficiency afforded by the dispersion layer will reduce the track running temperature to acceptable values, but this will only be possible by reducing the thermal resistance of the whole sandwich to values similar to those at present, taking into account the narrow thermal path of the present designs.
  • the thin substrate becomes possible because of the support and cushioning of the dispersion layer, further supported by the water treating plate and/or vessel wall.
  • the complete assembly will be able to withstand mechanical impact and thermal shock better than an element with a unitary substrate of the present thickness.
  • the vessel wall which is preferably formed of a 300 series stainless steel commonly used in stainless steel cooking vessels like saucepans, is also reduced to around 0.3mm. This compares with 0.5mm normally found in stainless steel kettles.
  • the arrangement of the sandwich is preferably such that the thermal resistance between the printed heater tracks and the heating surface is not more than that of a conventionally made thick film heating element on a 1.2mm substrate of 400 series (S430D or S444) stainless steel, with a dielectric thickness of no more than 100 ⁇ .
  • the complete heating element sandwich can be made as an "Easifix” (GB 2330064A) type element or as a Strix "Sure Seal” (WO 96/18331) for fitting to a moulded vessel, or it may be made directly onto the base of a stainless steel vessel.
  • This latter option is a very cost effective method of fitting a thick film heater to a stainless steel appliance, something that, so far as we are aware, has only been done by Pifco - Russell Hobbs by using the same (costly) plastic securing ring as was developed for the Millennium kettle. Examples of such mountings are in Pifco's GB 2 291 324 and GB 2 319 154 which show the complexity of the method.
  • a further advantage of the small element proposed by the present invention which gives rise to savings in the manufacturing cost of the elements, is that they may be processed several at a time.
  • the number of elements which can be printed simultaneously is limited by the area of the screen printer and by the width of the processing ovens.
  • the diameter of the element four times as many may be printed and processed together on the same equipment. Depending on the type of equipment used, this may be achieved by carrying the elements in a strip and separating them on completion, or by automated handling, placing individual discs into location jigs for printing and onto the oven belts for drying and firing. It is believed that retaining the discs in a strip for processing will lead to reduced distortion, as a result of the support of the strip. In any case, measures such as this may be desirable to reduce the effects of distortion.
  • the small diameter element has an additional operational advantage, in that it is less sensitive to being operated on a slope whilst heating liquids.
  • the dispersion layer will ensure that, as liquid boils away, the exposed area of the heater is cooled to some extent by the remaining liquid until a protector can operate.
  • any thermal protector will tend to cover a larger proportion of the heating element and give protection over a wider area.
  • the proposal of the invention may be considered to be similar in principle to the Blitzkocher type of heating element construction, where a sheathed heating element is secured to a heat transfer plate which in turn is secured to a steel plate which is part of a liquid heating vessel.
  • the power density available from a sheathed heating element is limited by the insulation of the mineral filling of the sheath and by the robustness of the joint between the sheath and the heat dispersion material. If the power density of a Blitzkocher heating element is too great, the thermal expansion of the sheath causes it to peel away from its support, leading to further overheating and subsequent premature failure.

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  • Cookers (AREA)
  • Resistance Heating (AREA)

Claims (21)

  1. Groupe d'éléments chauffants comprenant un élément chauffant (1), composé d'un film épais fixé à une surface à chauffer (3), caractérisé en ce qu'une couche de dispersion de la chaleur à haute conductivité thermique (2) est prévue entre l'élément chauffant (1) et la surface à chauffer (3), la couche de dispersion de la chaleur (2) s'étendant latéralement au-delà de la périphérie de l'élément chauffant (1).
  2. Groupe d'éléments chauffants selon la revendication 1, dans lequel l'élément chauffant (1) comprend un substrat d'acier inoxydable.
  3. Groupe d'éléments chauffants selon la revendication 2, dans lequel ledit substrat est d'une épaisseur inférieure à 0,5 mm.
  4. Groupe d'éléments chauffants selon l'une quelconque des revendications précédentes, dans lequel ladite couche de dispersion de la chaleur (2) comprend du cuivre ou de l'aluminium.
  5. Groupe d'éléments chauffants selon l'une quelconque des revendications précédentes, dans lequel la densité calorifique de l'élément chauffant à film épais (1), mesurée sur sa superficie totale, est sensiblement supérieure à 30 W/cm2.
  6. Groupe d'éléments chauffants selon la revendication 5, dans lequel la densité calorifique de l'élément chauffant à film épais (1), mesurée sur sa superficie totale, est d'au moins 60 W/cm2.
  7. Groupe d'éléments chauffants selon l'une quelconque des revendications précédentes, dans lequel la superficie de l'élément chauffant à film épais (1) est de l'ordre de un tiers à la moitié de la superficie de la surface à chauffer.
  8. Groupe d'éléments chauffants selon la revendication 7, dans lequel la surface à chauffer (3) est un disque d'environ 100 ou 110 mm de diamètre, et l'élément chauffant à film épais (1) est un disque d'environ 60 à 80 mm de diamètre.
  9. Groupe d'éléments chauffants selon l'une quelconque des revendications précédentes, dans lequel la couche de dispersion de la chaleur (2) s'étend au moins à 10 mm au-delà de la périphérie de l'élément chauffant à film épais (1).
  10. Groupe d'éléments chauffants selon l'une quelconque des revendications précédentes, dans lequel la surface à chauffer (3) comprend une plaque chauffante adaptée pour être assemblée en une cuve chauffante pour liquides avec un corps en plastique.
  11. Groupe d'éléments chauffants selon la revendication 10, dans lequel la plaque chauffante est formée autour de sa périphérie avec une cavité.
  12. Groupe d'éléments chauffants selon l'une quelconque des revendications 1 à 9, dans lequel la surface à chauffer (3) comprend le fond d'une cuve chauffante pour liquides.
  13. Groupe d'éléments chauffants selon la revendication 12, dans lequel ledit fond de la cuve chauffante pour liquides est formé en acier inoxydable.
  14. Groupe d'éléments chauffants selon la revendication 13, dans lequel le fond de la cuve chauffante est formé en acier inoxydable série 300.
  15. Groupe d'éléments chauffants selon la revendication 13 ou 14, dans lequel ledit acier inoxydable est d'une épaisseur inférieure à 0,5 mm, préférablement de 0,3 mm.
  16. Groupe d'éléments chauffants selon l'une quelconque des revendications 10 à 15, dans lequel la surface à chauffer (3), vue du côté sur lequel est appliqué l'élément chauffant à film épais, forme un creux dans lequel est appliqué l'élément chauffant à film épais.
  17. Groupe chauffant selon la revendication 1, dans lequel l'élément chauffant à film épais (1) fournit une sortie ayant une densité calorifique prédéterminée, et dans lequel la couche de dispersion de la chaleur (2) a pour effet de fournir au groupe global une densité calorifique sensiblement inférieure à celle de l'élément chauffant à film épais (1) lui-même.
  18. Cuve chauffante pour liquides, comprenant un groupe d'éléments chauffants selon la revendication 1, dans laquelle ledit élément chauffant à film épais (1) est significativement plus petit que ladite surface à chauffer (3), et ladite couche de dispersion de la chaleur (2) est significativement plus grande que l'élément chauffant à film épais (1).
  19. Cuve chauffante pour liquides selon la revendication 18, dans laquelle ledit élément chauffant à film épais est d'un diamètre inférieur à la moitié du diamètre de ladite surface à chauffer.
  20. Cuve chauffante pour liquides selon la revendication 18 ou 19, dans laquelle ladite couche de dispersion de la chaleur est d'un diamètre qui se rapproche du double du diamètre dudit élément chauffant à film épais.
  21. Cuve chauffante pour liquides comprenant un groupe d'éléments chauffants (1, 2, 3), selon l'une quelconque des revendications 1 à 17.
EP00927490A 1999-05-04 2000-05-04 Ameliorations apportees a des elements chauffants, notamment dans le domaine des elements chauffants en couche epaisse Expired - Lifetime EP1177708B2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE60024253T DE60024253T3 (de) 1999-05-04 2000-05-04 Verbesserungen für heizelemente, insbesondere für dickschichtheizelemente

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9910286 1999-05-04
GB9910286A GB2351894B (en) 1999-05-04 1999-05-04 Improvements relating to heating elements
PCT/GB2000/001695 WO2000067527A1 (fr) 1999-05-04 2000-05-04 Ameliorations apportees a des elements chauffants, notamment dans le domaine des elements chauffants en couche epaisse

Publications (3)

Publication Number Publication Date
EP1177708A1 EP1177708A1 (fr) 2002-02-06
EP1177708B1 true EP1177708B1 (fr) 2005-11-23
EP1177708B2 EP1177708B2 (fr) 2012-12-12

Family

ID=10852772

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00927490A Expired - Lifetime EP1177708B2 (fr) 1999-05-04 2000-05-04 Ameliorations apportees a des elements chauffants, notamment dans le domaine des elements chauffants en couche epaisse

Country Status (6)

Country Link
EP (1) EP1177708B2 (fr)
CN (1) CN1162044C (fr)
AT (1) ATE311083T1 (fr)
DE (1) DE60024253T3 (fr)
GB (1) GB2351894B (fr)
WO (1) WO2000067527A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3338598A3 (fr) * 2016-12-23 2018-07-18 Vorwerk & Co. Interholding GmbH Recipient de cuisson pour robot menager, robot menager et procédé de fabrication d'un 'élément chauffant

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Publication number Priority date Publication date Assignee Title
US8680443B2 (en) 2004-01-06 2014-03-25 Watlow Electric Manufacturing Company Combined material layering technologies for electric heaters
GB2481217B (en) 2010-06-15 2017-06-07 Otter Controls Ltd Thick film heaters
TWI503903B (zh) * 2011-10-26 2015-10-11 矽品精密工業股份有限公司 打線機台之加熱治具
WO2015160890A1 (fr) 2014-04-16 2015-10-22 Spectrum Brands, Inc. Appareil de cuisson utilisant un élément chauffant à film mince
WO2015161120A1 (fr) * 2014-04-16 2015-10-22 Spectrum Brands, Inc. Système de récipient portable pour chauffer une boisson
PL3145273T3 (pl) * 2015-09-21 2020-03-31 E.G.O. Elektro-Gerätebau GmbH Urządzenie grzewcze do ogrzewania wody i sposób działania takiego urządzenia grzewczego
CN106686773B (zh) * 2016-01-06 2019-09-10 黄伟聪 一种双面高导热能力的厚膜发热元件
CN106686771B (zh) * 2016-02-03 2019-09-06 黄伟聪 一种覆盖层具有高导热能力的厚膜元件
CN106686770B (zh) * 2016-02-03 2019-09-10 黄伟聪 一种涂覆基质具有高导热能力的厚膜元件
CN108261068B (zh) * 2016-12-30 2021-06-01 佛山市顺德区美的电热电器制造有限公司 电水壶
CN108784334B (zh) * 2017-04-26 2021-04-20 佛山市顺德区美的电热电器制造有限公司 电水壶
WO2019080590A1 (fr) * 2017-10-27 2019-05-02 佛山市顺德区美的电热电器制造有限公司 Ensemble récipient interne et dispositif de chauffage de liquide
CN109717735B (zh) * 2017-10-27 2021-03-19 佛山市顺德区美的电热电器制造有限公司 内胆组件以及液体加热器
FR3088413B1 (fr) * 2018-11-09 2020-12-18 Rosinox Systeme de chauffe et appareil de cuisson le comportant

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3338598A3 (fr) * 2016-12-23 2018-07-18 Vorwerk & Co. Interholding GmbH Recipient de cuisson pour robot menager, robot menager et procédé de fabrication d'un 'élément chauffant
US10874256B2 (en) 2016-12-23 2020-12-29 Vorwerk & Co. Interholding Gmbh Cooking pot for a food processor, food processor and method for the production of a heating element
AU2018200033B2 (en) * 2016-12-23 2023-10-19 Vorwerk & Co. Interholding Gmbh Cooking pot for a food processor, food processor and method for the production of a heating element

Also Published As

Publication number Publication date
GB2351894B (en) 2003-10-15
EP1177708A1 (fr) 2002-02-06
GB2351894A (en) 2001-01-10
CN1162044C (zh) 2004-08-11
EP1177708B2 (fr) 2012-12-12
DE60024253T3 (de) 2013-05-29
CN1358402A (zh) 2002-07-10
GB9910286D0 (en) 1999-06-30
WO2000067527A1 (fr) 2000-11-09
DE60024253D1 (de) 2005-12-29
DE60024253T2 (de) 2006-08-24
ATE311083T1 (de) 2005-12-15

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