EP1166310B1 - Method of producing substrate for plasma display panel and mold used in the method - Google Patents

Method of producing substrate for plasma display panel and mold used in the method Download PDF

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Publication number
EP1166310B1
EP1166310B1 EP00908677A EP00908677A EP1166310B1 EP 1166310 B1 EP1166310 B1 EP 1166310B1 EP 00908677 A EP00908677 A EP 00908677A EP 00908677 A EP00908677 A EP 00908677A EP 1166310 B1 EP1166310 B1 EP 1166310B1
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EP
European Patent Office
Prior art keywords
photo
mold
setting
rib
absorption edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP00908677A
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German (de)
English (en)
French (fr)
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EP1166310A1 (en
Inventor
Chikafumi Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
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Minnesota Mining and Manufacturing Co
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Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of EP1166310A1 publication Critical patent/EP1166310A1/en
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Publication of EP1166310B1 publication Critical patent/EP1166310B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242—Spacers between faceplate and backplate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
    • H01J11/12—AC-PDPs with at least one main electrode being out of contact with the plasma with main electrodes provided on both sides of the discharge space
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36—Spacers, barriers, ribs, partitions or the like

Definitions

  • the present invention relates to a method of producing a substrate for a plasma display panel (hereinafter also referred to as "PDP") and a mold used in the method.
  • PDP plasma display panel
  • PDP is expected to be used as a thin large-image display device.
  • PDP is equipped with a so-called substrate for PDP.
  • Typical substrate for PDP is composed of a pair of glass flat plates facing each other at a distance via a rib having a predetermined dimension (also referred to as a barrier rib, partition or barrier).
  • a rib separates space between a pair of glass plates into cells in an air-tight manner to form a plurality of discharge display cells capable of containing a discharge gas such as neon, helium or xenone.
  • a method of using a mold is known.
  • a molding material is filled up in the mold and is converted into a molded article capable of transferring to a plate-shaped base by a thermal or optical action.
  • the rib is produced and provided, nearly continuously, with comparatively high accuracy.
  • a base made of glass or ceramic and a rib are used.
  • a mold for a typical substrate for PDP is made of a metal, glass or ceramic as disclosed, for example, in JP-A-9-12336. Accordingly, the base and rib have almost the same hardness as or lower than that of the mold. As a result, when the mold is removed from the rib, there is a fear of causing breakage of the base or rib, or breakage of the mold itself. Such severe breakage often occurs when the rib is press-molded by using a mold made of glass, ceramic or metal as disclosed in JP-A- 9-283017. The mold is repeatedly used for mass production. It is not preferred to leave the broken rib in the mold, since it is necessary to wash the mold every time the rib is made, thereby lowering the productivity.
  • JP-A-9-134676 also discloses that a mold made of a silicone resin having a hardness lower than that of glass or ceramic is used.
  • the silicone resin is generally brittle. Accordingly, it cannot be expected to repeatedly use the mold made of the silicone resin for mass production.
  • WO-A-99/10909 and corresponding EP-A-0 935 275 disclose a process for fabricating a plasma display panel comprising a base and a rib wherein a mold formed of silicone is filled with a barrier rib paste and contacted with a base. Subsequently, the mold is removed and the rib precursor is fired.
  • EP-A-0 196 033 describes the photofabrication of master relief patterns by using a material comprising a photo-setting component and a photo-setting initiator.
  • WO-A-99/60446 discloses a method of producing a substrate for a plasma display panel using a photosensitive rib paste and a plastic mold.
  • a method of producing a substrate for a plasma display panel by providing a rib on a base which comprises the steps of claims 1 and 2, respectively.
  • the dependent claims relate to individual embodiments of the method.
  • absorption edge refers to a wavelength portion wherein an absorbency in a continuous light absorption spectrum of an object drastically decreases and it becomes transparent when the wavelength becomes longer than said wavelength portion.
  • a mold for a substrate for a plasma display panel comprising the features of claim 8.
  • the dependent claims relate to individual embodiments of the mold.
  • FIG. 1 In a partially exploded perspective view of Fig. 1, one embodiment of the substrate for PDP according to the present invention is schematically shown.
  • This substrate 10 for PDP is used so-called A.C. PDP and is preferably equipped with transparent flat plates made of easily available soda-lime glass, which are facing each other at a distance, i.e. a back plate 12 and a front plate 14. Between the back plate 12 and front plate 14, plural ribs 16 having a predetermined dimension are provided to separate the space between the plates into cells, thereby making it possible to form a plurality of discharge display cells 18.
  • the rib 16 shown in the figure is formed from a photosensitive paste (rib precursor).
  • Preferable photosensitive paste contains a first photo-setting component as a binder component, a photo-setting initiator having a first absorption edge and a ceramic powder and, if necessary, a glass powder.
  • the ceramic powder is used for affording a fixed shape to the rib, and is preferably made of alumina, silica, titania or wollastonite having high strength.
  • the first photo-setting component is photopolymerized in the presence of the photo-setting initiator having a first absorption edge, thereby making it possible to retain the shape of the rib 16.
  • the first photo-setting component is not specifically limited, but is preferably an acrylic resin.
  • the first photo-setting component may also be made from an acrylic monomer or oligomer, or a silane coupling agent having a methacryl group.
  • HEMA hydroxyethyl methacrylate
  • HEA hydroxyethyl acrylate
  • Bis GMA bis-phenol A diglycidylether methacrylate
  • the first photo-setting component is made of a silane coupling agent having a methacryl group
  • a network is formed by photopolymerization of the methacryl group, thereby making it possible to retain and contain the ceramic powder.
  • the first photo-setting component of the silane coupling agent forms polymeric silicon dioxide having a high melting point by calcination. This network due to the silane coupling agent is substantially retained by silicon dioxide event at comparatively high temperature after calcination, thereby making it possible to retain the ceramic powder or glass powder.
  • Such a silane coupling agent is preferably ⁇ -methacryloxypropylmethyltrimethoxy silane, ⁇ -methacryloxypropylmethyldimethoxysilane, ⁇ -methacryloxypropyltriethoxysilane or ⁇ -methacryloxypropylmethyldiethoxysilane having a molecular weight of 232 to 290 in view of availability.
  • the glass powder is used to enhance the strength by affording a dense structure to the rib.
  • the glass powder is used in the amount enough to fill up small space between the network made of silicon dioxide and the ceramic powder surrounded with the network. When the network does not exist, it is not necessary that the glass powder does not fill up large space between ceramic powders. As a result, the strength of the rib can be increased by a comparatively small amount of the glass powder. For example, even if the glass powder exclusively contains lead having high mass adsorption coefficient, the rate of photo-setting is hardly influenced. Use of the glass powder made of expensive glass having a low melting point can also be inhibited.
  • the glass powder is contained in the amount of 10 to 70% by volume.
  • the glass powder is contained in the amount of 20 to 50% by volume, thereby further increasing the strength of the rib.
  • the glass powder When the front plate 14 or back plate 12 is, for example, made of glass having an annealing point of 550°C, the glass powder preferably has a softening point of 450 - 550°C lower than the annealing point of the plates. Even if the glass powder having such a softening point is heated together with the front plate or back plate of glass to flow into a gap, a thermal deformation of the front plate 14 or back plate 12 can be prevented.
  • the glass powder is made of lead glass containing boron, zinc, phosphoric acid, lead, titanium or a combination thereof, aluminum phosphate glass, boron-titanium glass, bismuth glass or zinc glass.
  • boron, zinc, phosphoric acid, titanium or a combination thereof is preferably contained. In this case, each composition is not specifically limited.
  • an address electrode 20 is provided on a back plate 12 along a rib 16.
  • a transparent bus electrode 22 made of an indium tin oxide (ITO) is provided vertically to the rib 16.
  • a discharge gas such as neon, helium, xenone or the like is contained between the address electrode 20 and bus electrode 22, thereby making it possible to emit light by discharge.
  • a fluorescent layer 24 is provided in a predetermined order, thereby making it possible to perform color display.
  • a transparent dielectric layer 26 is provided to coat the bus electrode 22, thereby making it possible to extend life of PDP by inhibition of sputtering of the bus electrode 22.
  • a mold 30 having a concave portion 28 corresponding to the shape of a rib 16 is prepared (see Fig. 2(A)).
  • the concave portion 28 may have a section in the shape of trapezoid.
  • releasability may also be imparted to the mold by coating the surface of the concave portion with a releasing agent.
  • This mold 30 can be obtained by photo-setting of a second photo-setting component in the presence of a second photo-setting initiator having a second absorption edge.
  • a second photo-setting component an acrylic monomer or oligomer can be used.
  • an acrylic monomer or oligomer an aliphatic urethane acrylate, commercially available from Henschel Co. in the tradename of "Photomer 6010", or 1,6-hexanediol diacrylate commercially available from Shin-Nakamura Chemical Co. can be preferably used. Since the mold is molded by photopolymerization, cutting of the resulting mold 30 is not required. Since photopolymerization proceeds comparatively quickly, the mold 30 can be easily obtained in a short time.
  • Such a mold 30 has a hardness lower than that of general glass or ceramic, breakage of the rib and base can be avoided in case of removing the mold from the substrate. As a result, the mold can be repeatedly used without being washed.
  • photopolymerization of the second photo-setting component is conducted in the presence of the second photo-setting initiator having a second absorption edge whose wavelength is shorter than a wavelength corresponding to the first absorption edge of the first photo-setting initiator.
  • Such a second photo-setting initiator cannot absorb light whose wavelength is longer than a wavelength corresponding to the second absorption edge.
  • the rib precursor is set by light having a wavelength longer than a wavelength corresponding to the second absorption edge, only the first photo-setting component is set by photopolymerization, thereby making it possible to avoid simultaneous photopolymerization of the second photo-setting component, even ifunreacted second photo-setting component is remained in the mold 30.
  • Preferable photo-setting initiator includes, for example, aminoketones (400 - 430 nm), bisacylphosphine oxide (440 nm), camphorquinone (500 nm), metallocene hydroxyketone (500 nm) and benzyl dimethyl ketal (380 nm), and are commercially available from Ciba Geigy Co.
  • Irgacure 2959 (370 nm), Irgacure 184 (380 nm), Dalocure 1173 (380 nm), Irgacure 500 (380 nm), Irgacure 1000 (380 nm), Irgacure 651 (390 nm), Irgacure 907 (400 nm), Irgacure 149 (420 nm), Irgacure 1700 (440 nm), Irgacure 1850 (440 nm), Irgacure 819 (450 nm), Irgacure 369 (480 nm) and Irgacure 784 (500 nm).
  • a combination of the first photo-setting initiator and second photo-setting initiator includes, for example, Dalocure 1173 having an absorption edge at a wavelength corresponding to 380 nm and Irgacure 819 having an absorption edge at a wavelength corresponding to 440 - 450 nm, Irgacure 1700 and Irgacure 1850, or the like.
  • the photosensitive paste 32 preferably has a viscosity of 1 Pas to 100 Pas (1 x 10 3 to 1 x 10 5 cps). By using the viscosity within such a range, filling up of the photosensitive paste can be conducted with high accuracy.
  • the photosensitive paste containing a silane coupling agent as the first photo-setting component may contain a mineral acid such as hydrochloric acid, nitric acid or the like to hydrolyze the silane coupling agent, thereby providing a photosensitive paste in the form of a sol.
  • a photosensitive paste is not gelled by drying, thereby making it possible to disperse the ceramic powder and ceramic powder. Furthermore, the viscosity does not depend on the amount of water.
  • a back plate 12 is made contact with the photosensitive paste 32 (see Fig. 2(C)).
  • the second photo-setting component mentioned above can impart flexibility to the mold 30 on photopolymerization.
  • the mold 30 is made contact with the photosensitive paste 32 from one end by bending the mold. Accordingly, an air between the back plate 12 and the photosensitive paste 32 is efficiently removed out to the exterior and infiltration of the air into the photosensitive paste 32 is also avoided.
  • the first photo-setting component is polymerized by exposing the photosensitive paste 32 to light (uv) having a wavelength longer than that of the second absorption edge of the second photo-setting component, thereby obtaining a rib molded article 34 (see Fig. 2(C)).
  • the polymerization is basically conducted only by light exposure and does not require heat management whose control is difficult, in principle.
  • the second photo-setting component of the present embodiment can also impart transparency to the mold 30 on photopolymerization. When the mold 30 is transparent, exposure of the photosensitive paste 30 to light can be conducted simultaneously from both surfaces through not only the back plate 12 but also through the mold 30.
  • Light used for exposure has a comparatively long wavelength and is absorbed only in the first photo-setting initiator. Therefore, light is not substantially absorbed by the second photo-setting initiator, and only the polymerization of the first photo-setting component is initiated to obtain the molded article 34. As a result, even if the unreacted second photo-setting component is remained in the mold 30, it is possible to inhibit the unreacted second photo-setting component from reacting with the first photo-setting component. That is, the molded article 34 is capable of avoiding adhesion to the mold 30 by photopolymerization.
  • the molded article 34 is removed from the mold 30, thereby transferring the molded article 34 integrally to the back plate (see Fig. 2(D)).
  • adhesion of the molded article 34 to the mold is avoided. Accordingly, such a removal can be easily conducted without causing breakage of the back plate 12 or molded article 34 or its free end, thereby to leave it in the mold 30.
  • both of the molded article 34 and back plate 12 are put in a calcining oven (not shown) and calcined at a predetermined temperature to obtain a rib 16 (see Fig. 2(E)).
  • a calcining oven not shown
  • a predetermined temperature to obtain a rib 16 (see Fig. 2(E)).
  • retention of the network mentioned above is substantially made, thereby reducing shrinkage of the molded article. Accordingly, it is possible to make a rib corresponding to the shape of the concave portion with good accuracy.
  • an address electrode may also be formed between ribs on the back plate, and fluorescent layer may be provided on the address electrode.
  • a transparent front plate, on which a bus electrode has previously been formed may also be disposed to face with the back plate via a rib.
  • the peripheral portions of the front plate and back plate may be sealed in an air-tight manner by using a sealing material which is not shown in the drawing, thereby forming a discharge display cell between the front plate and back plate. Thereafter, the discharge display cell may be evacuated and a discharge gas may be introduced to form a substrate for PDP.
  • a photosensitive paste was prepared in the following procedure. First, 4g of ⁇ -methacryloxypropylmethyldimethoxysilane (manufactured by Nippon Unicar Co.) as a first photo-setting component was prepared. In addition, 1g of a mixed solution of an aqueous 0.01N nitric acid solution and ethanol in a molar ratio of 2:1 was prepared. After these components were mixed and sufficiently stirred, the mixture was reacted by allowing to standing at 70°C for 12 hours. Then, the reaction product was dried at 70°C, and water and alcohol were removed by evaporation.
  • ⁇ -methacryloxypropylmethyldimethoxysilane manufactured by Nippon Unicar Co.
  • a first photo-setting initiator To 4g of this dried reaction product, 0.03g of a first photo-setting initiator and 16g of a ceramic powder were added.
  • the first photo-setting initiator bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide commercially available from Ciba Geigy Co. under the trade name of Irgacure 819 was used. This first photo-setting initiator has an absorption edge at a wavelength of about 450 nm.
  • an ⁇ -alumina commercially available from Showa Denko Co. under the trade name of Al-45-2 was used. This ⁇ -alumina has an average particle diameter of 2.1 ⁇ m.
  • a mold having a concave portion corresponding to the shape of a rib was prepared.
  • This mold was formed from a second photo-setting component in the presence of 1% by weight of a second photo-setting initiator.
  • a second photo setting component an aliphatic urethane acrylate oligomer commercially available from Henschel Co. under the trade name of Photomer 6010 was used.
  • the second photo-setting initiator 2-hydroxy-2-methyl-1-phenyl-propan-1-one commercially available from Ciba Geigy Co. under the trade name of Dalocure 1173 was used. This initiator has an absorption edge at a wavelength corresponding to 380 nm.
  • Photopolymerization of the second photo-setting component was conducted by exposure to ultraviolet light of 200 to 450 nm from an ultraviolet light source (trade name: Unicure) manufactured by Ushio Denki Co.
  • the concave portion of the mold was filled with the above photosensitive paste. Then, a transparent back plate was placed on this mold, thereby making contact with photosensitive paste in the concave portion.
  • photopolymerization of the first photo-setting component was conducted by exposure to light having a wavelength of 400 to 500 nm for 30 seconds. Exposure to light was conducted simultaneously from both sides of the transparent mold and transparent substrate. Then, a molded article together with the back plate was removed from the mold. In this case, removal of the molded article from the mold could be conducted without causing breakage of the molded article or back plate. Then, the molded article and back plate were put in a calcinating oven at 500°C to obtain a rib.
  • Example 2 the same photosensitive paste and mold as those in Example 1 were used.
  • photopolymerization of the first photo-setting component was conducted by using the above ultraviolet light source in place of a fluorescent lamp manufactured by Philips Co.
  • the back plate could not be removed from the mold, together with back plate, because of strong adhesion between the mold and molded article.
  • the molded article was forcibly removed from the mold, resulting in breakage of the molded article.
  • the same photosensitive paste as that in Example I was used.
  • the mold in this example was made by using the second photo-setting component and first photo-setting initiator of Example 1 in place of the second photo-setting component and second photo-setting initiator.
  • photopolymerization of the second photo-setting component for obtaining the mold was conducted by using the above ultraviolet light source.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Gas-Filled Discharge Tubes (AREA)
EP00908677A 1999-03-25 2000-02-16 Method of producing substrate for plasma display panel and mold used in the method Expired - Lifetime EP1166310B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8200399 1999-03-25
JP8200399 1999-03-25
PCT/US2000/003953 WO2000058990A1 (en) 1999-03-25 2000-02-16 Method of producing substrate for plasma display panel and mold used in the method

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EP1166310A1 EP1166310A1 (en) 2002-01-02
EP1166310B1 true EP1166310B1 (en) 2005-11-30

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EP00908677A Expired - Lifetime EP1166310B1 (en) 1999-03-25 2000-02-16 Method of producing substrate for plasma display panel and mold used in the method

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EP (1) EP1166310B1 (zh)
KR (1) KR100721728B1 (zh)
CN (1) CN1280862C (zh)
AU (1) AU2997700A (zh)
DE (1) DE60024425T2 (zh)
WO (1) WO2000058990A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001020636A1 (en) * 1999-09-13 2001-03-22 3M Innovative Properties Company Barrier rib formation on substrate for plasma display panels and mold therefor
US6878333B1 (en) 1999-09-13 2005-04-12 3M Innovative Properties Company Barrier rib formation on substrate for plasma display panels and mold therefor
US7033534B2 (en) * 2001-10-09 2006-04-25 3M Innovative Properties Company Method for forming microstructures on a substrate using a mold
US7176492B2 (en) 2001-10-09 2007-02-13 3M Innovative Properties Company Method for forming ceramic microstructures on a substrate using a mold and articles formed by the method
KR100450832B1 (ko) * 2002-07-15 2004-10-12 엘지전자 주식회사 모세관 몰딩법에 의한 플라즈마 디스플레이 소자의 격벽제조방법 및 그것의 페이스트 조성물
KR20060112451A (ko) * 2005-04-27 2006-11-01 삼성전자주식회사 디스플레이 패널용 플라스틱 기판 및 그 제조방법

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JP2760381B2 (ja) * 1988-12-09 1998-05-28 大日本印刷株式会社 スタンパ
JP3791022B2 (ja) * 1995-06-26 2006-06-28 旭硝子株式会社 基板上への隔壁形成方法
FR2738393B1 (fr) * 1995-09-06 2000-03-24 Kyocera Corp Substrat d'affichage a plasma et procede pour sa fabrication
JPH10125219A (ja) * 1996-10-22 1998-05-15 Kyocera Corp プラズマディスプレイパネル用隔壁の製造方法
SE511824C2 (sv) * 1997-08-22 1999-12-06 Ericsson Telefon Ab L M Avkopplingskondensator samt chipsmodul
TW396365B (en) * 1997-08-27 2000-07-01 Toray Industries Plasma display decive and its method of manufacture
JP3866413B2 (ja) * 1998-05-18 2007-01-10 スリーエム カンパニー 感光性成形材料及びそれを使用したｐｄｐ用基板の製造方法

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EP1166310A1 (en) 2002-01-02
DE60024425T2 (de) 2006-08-03
AU2997700A (en) 2000-10-16
DE60024425D1 (de) 2006-01-05
KR20020009581A (ko) 2002-02-01
CN1280862C (zh) 2006-10-18
WO2000058990A1 (en) 2000-10-05
CN1345455A (zh) 2002-04-17
KR100721728B1 (ko) 2007-05-28

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