EP1145301A2 - Couche de support pour piste conductrice destinee a etre stratifiee dans une carte a puce, carte a puce dotee de ladite couche de support et procede de fabrication d'une carte a puce - Google Patents

Couche de support pour piste conductrice destinee a etre stratifiee dans une carte a puce, carte a puce dotee de ladite couche de support et procede de fabrication d'une carte a puce

Info

Publication number
EP1145301A2
EP1145301A2 EP00965786A EP00965786A EP1145301A2 EP 1145301 A2 EP1145301 A2 EP 1145301A2 EP 00965786 A EP00965786 A EP 00965786A EP 00965786 A EP00965786 A EP 00965786A EP 1145301 A2 EP1145301 A2 EP 1145301A2
Authority
EP
European Patent Office
Prior art keywords
conductor track
conductor
support layer
screen printing
chip card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP00965786A
Other languages
German (de)
English (en)
Other versions
EP1145301A3 (fr
Inventor
Lothar Fannasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Publication of EP1145301A2 publication Critical patent/EP1145301A2/fr
Publication of EP1145301A3 publication Critical patent/EP1145301A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Definitions

  • the invention relates to a conductor track carrier layer for lamination into a chip card with at least one conductor track made of a screen printing paste applied to the conductor track carrier layer, preferably with a screen printing method, and with connection surfaces connected to the conductor track.
  • the stencil printing process or the use of a dispenser can also be considered.
  • a highly viscous, electrically conductive liquid can also be used as the material to be processed.
  • Conductor support layers of the type mentioned at the outset are preferably used for the production of chip cards, such chip cards in the form of telephone cards, access authorization cards for mobile radio telephones, bank cards etc. being used to a large extent.
  • a coil is usually applied to the conductor support layers of such chip cards, which has corresponding connection areas and is used for the energy supply and the data exchange of the card with external devices. When using coils for energy and data exchange, this exchange takes place without contact, so that one speaks of a contactless card.
  • chip cards are also known, in which, in addition to the information transmitted through the coil, information and energy can also be produced in a direct manner, with contact, by means of galvanically working contact surfaces.
  • the conductor track support layer used for the above-mentioned contactless or contact-making cards can be produced in accordance with a conventional method using the screen printing method.
  • the individual conductor tracks of the coil together with the connection surfaces for connecting the coil to additional electronic components arranged on the chip card, such as, for example, a chip module are applied to a plastic substrate by applying an electrically conductive screen printing paste. ger applied.
  • the finished printed conductor carrier layer is laminated to a plastic card body in a lamination press with further plastic layers, which can be partially labeled.
  • a lamination press After the lamination process, it is necessary to make recesses in the plastic card body for the chip module and / or other electronic components to be used and at the same time to expose the individual connection areas of the coil and further conductor tracks of the conductor track support layer in order to connect these connection areas with the corresponding contact areas of the chip module and to connect the other components, which is usually done by using a conductive adhesive and soldering.
  • the recesses must be made with the greatest care and accuracy, because in most cases there are also conductor tracks on the conductor track layer next to the connection surfaces to be exposed, which must not be damaged or completely severed under any circumstances. Even with high-precision milling tools, there is a high reject factor for chip cards due to damaged conductor tracks, since these usually only have a width of approx. 80 ⁇ m, whereas the corresponding connection areas mostly have orders of magnitude of 1 mm 2 .
  • the arrangement of the conductor tracks on the conductor track carrier layer is to be changed such that the distances between them in the area of the milled recess become larger in order to avoid a short circuit not possible in most cases, since the footprint of the conductor carrier layer is limited overall due to the standardized dimensions of the chip card.
  • the object of the invention is to provide a conductor track support layer of the type described at the outset, in which the risk of damage to the conductor tracks due to the exposure of the connecting surfaces connected to the conductor tracks during the milling process is exposed in a simple and inexpensive manner is excluded in the production of contactless or contact-based chip cards.
  • this object is achieved in that the conductor track carrier layer has depressions in the region of the connection surfaces, which are filled with the screen printing paste during the screen printing process.
  • connection areas of the conductor track support layer have a substantially greater thickness after the screen printing process than the conductor tracks. If, in the course of the manufacturing process, in the milling process carried out after the plastic card body of the chip card has been laminated, cutouts are made in the conductor track carrier layer on the side of the conductor track carrier layer on which there are no conductor tracks, the milling process can be carried out in good time before the conductor track level is reached because of the greater thickness of the connection surfaces be stopped so that damage to the sensitive conductor tracks is reliably excluded.
  • the conductor track carrier layer design the recesses in whole or in part as through bores with an opening in the rear side of the conductor track carrier layer opposite the conductor track side of the carrier layer.
  • the depressions can be easily carried out, for example, by an inexpensive punching process.
  • the fact that the depressions are made partly as through holes and partly as blind holes in the conductor track support layer results after the screen printing process
  • Connection surfaces of different thickness and therefore different connection levels for different electronic components within a finished laminated plastic card body allow the installation of electronic components of different thicknesses, such as displays or keyboard fields, so that the application possibilities of such chip cards provided with different components can be increased many times over compared to the current state of the art.
  • the conductor track carrier layer provided with through holes is provided with a thin cover film on the rear side facing away from the conductor tracks before the conductor tracks are applied.
  • This cover film prevents screen printing paste from escaping through the through holes on the back of the conductor support layer during the subsequent screen printing process, since the through holes are now closed at their lower end by the cover film.
  • the screen printing paste has a silver particle content of 70 to 80 percent by volume
  • the individual silver particles grain sizes should be in the range greater than 45 ⁇ m. Due to the silver particle proportion with the corresponding grain size of the individual particles, adequate contacting between the components and the connection surfaces can be ensured even with only partial exposure of the connection surfaces during the milling process when the connection surfaces of the conductor track carrier layer are subsequently exposed.
  • the invention also relates to a chip card with a chip card body, a chip module arranged in a recess of the chip card body and / or electronic components arranged in further recesses, and a conductor track carrier layer onto and with which at least one conductor track consisting of a screen printing paste Conductor-connected connection surfaces were applied using the screen printing process.
  • the object of the present invention is therefore also to provide a chip card of the generic type described above, in which the named problems of the prior art are eliminated, i. H. in which the recesses for the individual components to be placed in the chip card can thus be milled out in a cost-effective manner without damaging the conductor tracks on the conductor track support layer.
  • the conductor track carrier layer has depressions filled with screen printing paste in the area of the connection surfaces, in that the recess (s) for the chip module and / or additional electronic components is / are arranged on the flat side of the conductor track carrier layer not coated with the conductor track and / or that the recess (s) is / have such a depth that the bottom area extends into the conductor track carrier layer to such an extent that the depressions in the conductor track carrier layer filled with screen printing paste are just exposed.
  • connection surfaces to be exposed for the connection of the chip module and / or the other electronic components have a very much greater thickness than the conductor tracks applied to the surface of the conductor track support layer due to their screen printing paste, the milling process for the recesses can take place immediately after exposure of the connection areas are stopped without the risk of penetrating into the cross-sectional area of the chip card in which the sensitive conductor tracks are arranged.
  • the invention also relates to a method for producing a chip card, consisting of a multilayer plastic card body, at least one electronic component arranged in a recess in the plastic card body, preferably a chip module, in which at least one interconnect layer and at least two cover layers covering the interconnect layer on both flat sides are arranged precisely one above the other,
  • the card layers arranged one above the other are connected to one another in a lamination press by the influence of pressure and heat,
  • the component is inserted into the recess of the card body by establishing an electrical connection with the connection areas on the conductor track support layer, characterized by
  • the method according to the invention it has proven to be particularly advantageous to simplify the method step of introducing depressions into the conductor track layer by introducing the depressions as through holes in the conductor track layer as part of a stamping process.
  • a cover film can be placed on the entire conductor track support layer in order to prevent the screen printing paste from flowing through in the subsequent screen printing process.
  • Figure 1 shows an embodiment of the interconnect layer according to the invention in
  • FIG. 2 shows the conductor track carrier layer from FIG. 1 before the method step of applying the screen printing paste
  • Figure 3 shows a further embodiment of a conductor track support layer according to the invention in cross section before the application of the screen printing paste and
  • FIG. 4 section of a chip card according to the invention in cross section with built-in chip module.
  • FIG. 1 shows a conductor track carrier layer 1 for lamination into a chip card, such conductor track carrier layers being able to be supplied to the chip card manufacturers as semi-finished products by specialized manufacturers.
  • the conductor track carrier layer 1 shown in FIG. 1 is provided with a plurality of conductor tracks 2 made of a screen printing paste and applied to the conductor track carrier layer 1.
  • connection areas 3 Connected to the conductor tracks are connection areas 3 which, in contrast to the very narrow conductor tracks (width: approx. 85 ⁇ m), usually have a base area of 1 mm 2 or larger.
  • These connection surfaces serve for the electrical connection of the conductor tracks 2 to electronic components, such as a chip module, which are necessary as necessary components for the implementation of the card function, for example as an access authorization card, telephone card or the like.
  • the conductor track carrier layer 1 has depressions 4a, 4b and 4c in the region of the connection areas 3, which in the finished conductor track carrier layer shown in FIG. 1 are completely filled with the screen printing paste, from which the conductor tracks 2 also consist .
  • the depressions 4a, 4b and 4c have different depths in the exemplary embodiment in FIG. 1, so that the connection surfaces 3 have a different thickness.
  • FIG. 2 shows the conductor track support layer 1 of FIG. 1 again before the screen printing paste is applied in the context of a screen printing process.
  • This figure shows, as in FIG. 1, that the recess 4c as a through hole 6 cuts through the entire conductor track cross section and has an opening 7 on the rear side of the conductor track support layer 1.
  • connection surfaces 3 are only necessary in a thickness for an intended conductor carrier layer 1, it has proven to be particularly advantageous to punch out the conductor carrier layer 1 in the areas in which connection surfaces 3 are to be arranged, so that, in analogy to the thickness of the conductor carrier layer, from 300 to 350 mm later after application of the screen printing paste, the total thickness of the connection areas 3 is from 350 to 400 ⁇ m, since the conductor tracks 2 usually have a layer thickness of 50 ⁇ m on one side of the conductor track carrier layer 1.
  • connection areas 3 of different thicknesses in the conductor track support layer If it is necessary to attach connection areas 3 of different thicknesses in the conductor track support layer, the embodiment variant of FIG. 3 offers an inexpensive and easy to implement option for this.
  • FIG. 3 shows a conductor track carrier layer 1 prior to the application of the screen printing paste analogous to FIG. 2, but in this embodiment example the overall conductor track carrier layer 1 consists of several partial layers, which are identified in FIG. 3 by 18, 19 and 20.
  • the sublayers 18, 19 and 20 each have through holes 21 which have been introduced within the plan of the conductor track support layer at those points where connection surfaces 3 are to be provided. It is clear from FIG. 3 that after the through-holes 21 have been punched out, the sub-layers in the individual partial layers 18, 19 and 20 are arranged precisely one above the other. Due to the position of the individual through holes 21 of the individual sublayers, when positioning one above the other, either through holes analogous to positions 6 or 4c in FIGS.
  • this rear side 9 can be covered with a protective film 10 are provided (see Figure 1), which prevents the screen printing paste from running on the back 9 of the conductor track support layer 1.
  • the conductor tracks 2, which are applied to the conductor track support layer 1 as part of the screen printing process, can have the shape of a coil, for example, which is necessary after the installation of the conductor track support layer 1 in a chip card for data exchange or for supplying energy to the chip card with external devices.
  • the conductor carrier layers 1 described so far in their different configurations are used in contact or contactless chip cards after their production.
  • the schematic structure of such a chip card 8 is shown in FIG. 4. It is clear from this figure that the conductor track support layer 1 is located in the middle of the chip card 8 which is composed of several layers.
  • the conductor track support layer 1 is covered on both sides by cover layers 15 and 16, respectively.
  • chip cards in addition to the three layers shown in FIG. 4, 8 additional information carrier and protective film layers, for example printed, can be arranged on the back or front of the chip card, so that a chip card also consists of six or more Individual layers can be built up as part of a lamination process. The individual layers are joined together by the influence of pressure and heat in a lamination press.
  • a recess 12 must be made in the card body 16 in order to accommodate electronic components, such as the chip module 11.
  • This is usually done by a milling process in which, according to the invention, the cover layer 15 and any further layers arranged above it are partially milled away from the side facing away from the conductor tracks 2 located inside the card body 16, so that the conductor track support layer 1 is cut away the recess 12 is formed.
  • the depth of the recess 12 depends on the one hand on the thickness of the chip module 11, on the other hand it is clear from FIG. 4 that for contacting the chip module 11 with the connection surfaces 3 located within the card body 16, these connection surfaces are exposed within the conductor track support layer 1 is necessary.
  • connection surfaces 3 enable them to be easily exposed during the milling process, without the recess having to be made so deep that the conductor tracks 2 additionally arranged on the conductor track support layer 1 may touch in some way and can possibly be damaged, as is often the case with the conductor tracks known to date from the prior art.
  • contact surfaces 13 which are connected to the connection surfaces 3 by means of a conductive adhesive which u. U. serves at the same time for fixing the chip module 11 within the recess 12 of the chip card 8.

Abstract

Couche de support (1) pour piste conductrice, destinée à être stratifiée dans une carte à puce, qui comporte au moins une piste conductrice (2) constituée d'une pâte sérigraphique appliquée sur la couche de support (1) de piste conductrice selon un procédé sérigraphique, ainsi que des plots de connexion (3) reliés à la piste conductrice (2). Ladite couche de support est caractérisée en ce qu'elle possède dans la zone des plots de connexion (3) des évidements (4a, 4b, 4c) qui sont remplis de pâte sérigraphique pendant le processus de sérigraphie. La mesure selon la présente invention permet de fabriquer des couches de support pour pistes conductrices dotées de plots de connexion de différentes épaisseurs. Des couches de support de ce type permettent, après leur stratification dans une carte à puce, de ménager dans ladite carte à puce des évidements qui d'une part exposent les plots de connexion (3) pour connecter ces derniers à des composants électroniques et d'autre part permettent d'exclure que les pistes conductrices (2) fragiles se trouvant également dans la carte à puce soient endommagées. La présente invention concerne en outre une carte à puce dotée de ladite couche de support ainsi qu'un procédé de fabrication d'une telle carte à puce.
EP00965786A 1999-08-26 2000-08-24 Couche de support pour piste conductrice destinee a etre stratifiee dans une carte a puce, carte a puce dotee de ladite couche de support et procede de fabrication d'une carte a puce Withdrawn EP1145301A3 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19940480A DE19940480C2 (de) 1999-08-26 1999-08-26 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte
DE19940480 1999-08-26
PCT/DE2000/002889 WO2001017011A2 (fr) 1999-08-26 2000-08-24 Couche de support pour piste conductrice destinee a etre stratifiee dans une carte a puce, carte a puce dotee de ladite couche de support et procede de fabrication d'une carte a puce

Publications (2)

Publication Number Publication Date
EP1145301A2 true EP1145301A2 (fr) 2001-10-17
EP1145301A3 EP1145301A3 (fr) 2002-03-20

Family

ID=7919671

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00965786A Withdrawn EP1145301A3 (fr) 1999-08-26 2000-08-24 Couche de support pour piste conductrice destinee a etre stratifiee dans une carte a puce, carte a puce dotee de ladite couche de support et procede de fabrication d'une carte a puce

Country Status (5)

Country Link
US (1) US6783077B1 (fr)
EP (1) EP1145301A3 (fr)
AU (1) AU7642600A (fr)
DE (1) DE19940480C2 (fr)
WO (1) WO2001017011A2 (fr)

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DE10120254A1 (de) * 2001-04-25 2002-11-07 Infineon Technologies Ag Chipkartenmodul
US8704359B2 (en) 2003-04-01 2014-04-22 Ge Embedded Electronics Oy Method for manufacturing an electronic module and an electronic module
US8222723B2 (en) 2003-04-01 2012-07-17 Imbera Electronics Oy Electric module having a conductive pattern layer
FI115601B (fi) * 2003-04-01 2005-05-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi ja elektroniikkamoduuli
FI20031341A (fi) 2003-09-18 2005-03-19 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI117814B (fi) * 2004-06-15 2007-02-28 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
FI122128B (fi) * 2005-06-16 2011-08-31 Imbera Electronics Oy Menetelmä piirilevyrakenteen valmistamiseksi
US8225499B2 (en) * 2005-06-16 2012-07-24 Imbera Electronics Oy Method for manufacturing a circuit board structure, and a circuit board structure
FI119714B (fi) 2005-06-16 2009-02-13 Imbera Electronics Oy Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
DE102008036837A1 (de) * 2008-08-07 2010-02-18 Epcos Ag Sensorvorrichtung und Verfahren zur Herstellung
US20100236822A1 (en) * 2009-03-23 2010-09-23 Ibiden Co., Ltd. Wiring board and method for manufacturing the same

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FR2527036A1 (fr) * 1982-05-14 1983-11-18 Radiotechnique Compelec Procede pour connecter un semiconducteur a des elements d'un support, notamment d'une carte portative
DE4403753C1 (de) * 1994-02-08 1995-07-20 Angewandte Digital Elektronik Kombinierte Chipkarte
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
EP0824301A3 (fr) * 1996-08-09 1999-08-11 Hitachi, Ltd. Panneau à circuit imprimé, carte à puce, et leur procédé de fabrication
JPH10121012A (ja) * 1996-10-21 1998-05-12 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト及びこれを用いて製造された半導体装置
DE19703990A1 (de) * 1997-02-03 1998-08-06 Giesecke & Devrient Gmbh Modular aufgebauter, elektronischer Datenträger
DE19710144C2 (de) * 1997-03-13 1999-10-14 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte

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See references of WO0117011A3 *

Also Published As

Publication number Publication date
WO2001017011A3 (fr) 2002-01-10
WO2001017011A2 (fr) 2001-03-08
US6783077B1 (en) 2004-08-31
EP1145301A3 (fr) 2002-03-20
DE19940480A1 (de) 2001-03-08
AU7642600A (en) 2001-03-26
DE19940480C2 (de) 2001-06-13

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