EP2269168A1 - Carte à puce et son procédé de fabrication - Google Patents

Carte à puce et son procédé de fabrication

Info

Publication number
EP2269168A1
EP2269168A1 EP09732963A EP09732963A EP2269168A1 EP 2269168 A1 EP2269168 A1 EP 2269168A1 EP 09732963 A EP09732963 A EP 09732963A EP 09732963 A EP09732963 A EP 09732963A EP 2269168 A1 EP2269168 A1 EP 2269168A1
Authority
EP
European Patent Office
Prior art keywords
chip
flip
film
layer
chip card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP09732963A
Other languages
German (de)
English (en)
Inventor
Thomas Tarantino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient Mobile Security GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Publication of EP2269168A1 publication Critical patent/EP2269168A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • Chip card and method for its production
  • the invention relates to a method for producing smart cards in the form of plug-in SIMs or as standardized smart cards, in particular in ID-I format. These can also be dual-interface cards or cards with other form factors, for example in the form of a USB token with corresponding USB contact connections.
  • chip cards are subject to special cost constraints. Therefore, special efforts are made in this technical field to reduce the manufacturing costs.
  • chip modules are used in prefabricated chip card bodies, typically glued into a recess provided in the card body for this purpose.
  • the production of the chip modules and the production of the card bodies fall apart accordingly.
  • the card bodies are predominantly produced in laminating technology as sheets or rolls, and the chip modules are inserted into the card body before or after the card bodies have been punched out of the film composite.
  • the chip modules are usually provided on a film substrate in the form of a carrier tape and punched out of the carrier tape during insertion into the card body, so that a part of the carrier tape is also transferred.
  • On the front of the carrier tape are ISO contact surfaces for contact communication with external communication devices and on the back of the carrier tape are the chip and pads for the chip, over which the chip is electrically is conductively connected to the contact surfaces on the carrier tape front side.
  • the chip is mounted on the back contact surfaces in flip-chip technology. This saves the complicated Wirebond- wiring, and also on an encapsulation of the chip and the sensitive wires with epoxy resin or the like may be omitted if necessary.
  • the object of the present invention is to further reduce the production costs of such chip cards.
  • the film substrate which is provided on the front side with a plurality of contact layouts for the contact-type communication and on the back side with a plurality of contact layouts and flip-chips mounted or to be mounted thereon, together with at least one amplification layer to form a layer composite, from which then the individual chip cards are cut out with the final chip card dimensions.
  • the entire film substrate with the chip modules constructed thereon becomes a component of the layer composite as a whole, so that a substantial production step can be saved.
  • the foil substrate carrying the flip chips has a width and / or length which corresponds to a multiple of the width or length of the chip cards to be produced therefrom.
  • the film substrate - and, if the reinforcing layer is in the form of a film, also the reinforcing film - is provided as sheet or roll goods.
  • the contact surfaces at least on the front side and preferably also on the back side of the film substrate are advantageously realized as a metallization of the film surface.
  • the corresponding contact layout can be produced from an originally full-area metallization, for example by etching or additive etching.
  • the contact layout on the back can also have the necessary components of a coil for the additional contactless data exchange and / or the contactless power supply of the card (dual-interface card).
  • the layer composite can advantageously consist only of the two aforementioned layers.
  • an intermediate foil is placed between the foil substrate and the reinforcing layer to protect the flip-chip in the final card from mechanical stresses.
  • the intermediate foil may, according to a first variant, have recesses in which the fliograms lie.
  • the depth of the recess preferably corresponds approximately to the thickness of the flip chips, that is, it may also be insignificantly lower, but in any case should not be flatter than the flip-chip structure on the film substrate.
  • the recesses of the intermediate film can advantageously be present as continuous openings in the intermediate film, which can be produced inexpensively, for example by punching.
  • a material for the intermediate film which is softer than the materials of the film substrate and an associated reinforcing film can be selected for the protection of the flip chips.
  • the flip-chips can be embedded in the bonding of the film layers to the composite layer.
  • a material for the intermediate film a correspondingly flexible and plastically deformable material is suitable, in particular a foam material.
  • the film composite preferably consists only of the three layers mentioned, in order to keep production costs low, but if necessary can also consist of more than just three film layers.
  • adhesives can be used.
  • thermoplastic film layers can be dispensed with the use of adhesives.
  • the reinforcing layer as a film
  • it can alternatively be produced as an injection-molded layer by injection-molding of the film substrate or, if appropriate, the intermediate film.
  • the thickness of the layer composite is preferably chosen such that they correspond to the ISO standard thickness of ID-1 chip cards or corresponding plug-in SIMs. But they can also have other dimensions, for example, have the shape of USB tokens. As a USB token, the outer contact surfaces for communication with USB interfaces are formed, and the dimensions of the chip card are chosen so that the card with its USB interface into a USB port can be inserted. In this case, the ISO standard thickness can be exceeded in particular.
  • the chip cards can be personalized and / or printed in a further method step, whereby this method step is used for cost reasons. which preferably takes place before the chip cards are separated out of the layer composite.
  • FIG. 2 shows the layer structure of the chip card from FIG. 1 schematically in cross-section
  • FIG. 3 shows an alternative layer structure of the chip card of Figure 1 schematically in cross section
  • FIG. 4 shows a further alternative construction of the chip card from FIG. 1, schematically in cross section,
  • FIG. 5 schematically shows the steps for producing the chip card from FIG. 1 in a roll-to-roll process
  • FIG. 6 shows a chip card in the format of a USB token
  • Fig. 7 shows a further alternative layer structure of the chip card of Figure 1 schematically in cross section
  • FIG. 8 shows a strip-shaped layer composite according to Figure 7 in plan view, are already separated out of the individual smart cards.
  • FIG. 1 shows schematically in plan view a chip card 1 in the ID-I format with an external contact layout 2 for contact-type communication with and / or power supply by external data processing devices, such as payment terminals, access control devices, computers and the like.
  • the chip card 1 is embodied here as a dual-interface card and accordingly has a coil 3 integrated in the chip card for contactless data and / or energy transfer, which is shown in FIG. 1 by dashed lines.
  • the chip card 1 from FIG. 1 can also have other form factors instead of an ID-I chip card, for example that of a plug-in SIM, but as a rule without the coil 3.
  • FIGS. 2 to 4 show the chip card of Figure 1 according to three embodiments schematically in cross section.
  • the chip card 1 is realized as a two-layer laminate 12 and comprises a film substrate 4 as a first layer and a reinforcement film 5 as a second layer.
  • the contact layout 2 for the contact-type communication in FIG Form of an etched metallization provided.
  • a second contact layout 6 on which a flip-chip 7 is mounted in conventional flip-chip technology.
  • the connections of the flip-chip 7, which are not shown in detail here, are electrically conductively connected via the flip-chip contact layout 6 and further via the film substrate 4 to penetrating vias 8 with the communication contact layout 2 lying on the film substrate front side 4a.
  • the flip-chip contact layout 6 is also realized, for example, as etched metallization. Simultaneously with the production of the flip-chip contact layout 6, the turns 3a of the coil 3 have been produced (apart from the "bridge" spanning the turns of the coil), ie also preferably as etched metallization.
  • the film layers 4, 5 have a total thickness D corresponding to the thickness of the finished card.
  • the compound of the two film layers 4, 5 to the finished layer composite 12 with the total thickness D is carried out using increased pressure and elevated temperature.
  • thermoplastics are used as materials for the two film layers 4, 5, intimate bonding of the two layers can be achieved in this way without the use of an additional adhesive.
  • an adhesive is appropriate.
  • a thermally activated adhesive the use of increased pressure and elevated temperature is also useful here.
  • the second exemplary embodiment according to FIG. 3 differs from the exemplary embodiment from FIG. 2 solely in that the layer composite 12 has, as the third film layer, an intermediate film 9 between the film substrate 4 and the reinforcing film 5.
  • the intermediate film 9 has a recess 10 in which the flip-chip 7 is accommodated for protection against mechanical stress.
  • On the intermediate foil 9 with the recess 10 can be dispensed with, if the flip-chip 7 is very thin and flexible, as in the case of the embodiment of Figure 2.
  • It is also conceivable in the embodiment of Figure 2 is a recess in the reinforcing sheet 5 for To provide recording of the flip-chip 7. This recording would then corresponding to the depth of the thickness of the flip-chip 7 and the flip-chip structure, or slightly above.
  • the use of the intermediate foil 9 in the case of thicker and / or less flexible flip-chips 7 is advantageous because the recess 10 in this case can be produced as a through opening simply, for example in a punching step , Because the depth the recess only the thickness of the flip-chip 7 and the flip-chip structure, or slightly above, corresponds, the intermediate foil 9 can be selected with a correspondingly small thickness.
  • the third embodiment according to FIG. 4 shows another variant for protecting a comparatively thick and / or inflexible flip chip 7 against mechanical loads.
  • an intermediate foil 9 is provided between the foil substrate 4 and the reinforcing foil 5.
  • the intermediate film 9 does not have a cutout but consists of a material which is softer than the materials of the film substrate 4 and the reinforcing film 5. This applies at least to the time of joining the three film layers to the three-layer laminate 12.
  • the intermediate foil 9 has a lower softening point than the foil substrate 4 and the reinforcing foil 5, so that it is considerably softer when laminating the layers under elevated temperature than the foil layers of the foil substrate 4 and the reinforcing foil 5.
  • the intermediate film 9 may in particular also consist of a foam material which is hot or cold glued to the two other film layers 4, 5.
  • the region of the flip-chip 7 can be kept free during adhesive bonding, so that there is no firm connection between the flip-chip 7 and the intermediate layer 9. As a result, the flip-chip 7 is mechanically decoupled from the intermediate layer 9.
  • FIG. 5 shows by way of example the production of the chip cards 1 in a roll-to-roll method.
  • the chip cards 1 can also be produced from film layers made available in an arc shape.
  • the method begins with the provision of a film substrate 4, on which at least the communication contact layout 2 and the flip-chip contact layout 6 are present and electrically connected to one another by means of the vias 8 (FIG. 2). If not yet available, first flip-chips 2 are mounted on the flip-chip contact layouts 6. Subsequently, the film substrate 4 is brought together with the reinforcing film 5 and, in this case, the intermediate film 9. Before merging 11 recesses 10 are punched out of the intermediate foil 9 in a first punching station, in which then the flip-chips 7 come to rest. The film layers 4, 5, 9 are subsequently elevated using
  • the chip cards 1 are then punched out in a second punching station 13.
  • the rest of the film composite 12 is wound onto a waste bobbin.
  • the chip cards 1 can be personalized and / or printed prior to separation in a corresponding station, not shown here, e.g. by laser inscription.
  • FIG. 6 shows a chip card 1 in the form of a USB token.
  • the contact layout 2 for the contact-type communication with and power supply by an external device comprises the two leading outer pins 14, 15 for the supply voltage and the shorter pins 16, 17 for the data traffic.
  • FIG. 7 shows schematically in cross section a further exemplary embodiment of a layer structure 12, which differs essentially from the exemplary embodiments according to FIGS. 2 to 4 in that, instead of the reinforcing film 5, an injection-molded layer 5 1 is provided as the reinforcing layer in order to form the layer composite 12.
  • An intermediate film 9 with recesses 10 for receiving the flip chips 7, as described with reference to FIG. written, can be additionally provided.
  • the connection of the injection-molding layer 5 'to the film substrate 4 - or alternatively to the intermediate layer 9 - can be realized in a simple manner by back-molding the film substrate 4 with the injection-molding material of the injection-molding layer 5'.
  • either the entire film substrate 4 with the flip-chips 7 mounted thereon can be back-injected.
  • the film substrate 4 can be previously cut into strips and then back-injected with the injection-molding layer 5 '.
  • Such a strip is shown in FIG. From the strip-shaped layer composite 12, the chip cards 1 are then cut out, for example punched, and there are corresponding holes 18 in the layer composite 12th

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention porte sur une carte à puce sous la forme d'une carte ID-1, d'une carte SIM à enficher ou d'une clef USB qui comprend un agencement composite stratifié (12) comprenant deux (4, 5) ou trois (4, 5, 9) couches s'étendant sur la totalité de la carte à puce (1). Ce faisant, une couche mince (4) se trouvant à l'extérieur présente sur sa face antérieure (4a) tournée vers l'extérieur une maquette de contact de communication (2) et sur sa face postérieure (4b) une puce retournée (7) ainsi qu'une maquette de contact de la puce retournée (6) qui est reliée de manière électriquement conductrice avec la maquette de contact de communication (2) de la face antérieure.
EP09732963A 2008-04-18 2009-04-14 Carte à puce et son procédé de fabrication Ceased EP2269168A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008019571A DE102008019571A1 (de) 2008-04-18 2008-04-18 Chipkarte und Verfahren zu deren Herstellung
PCT/EP2009/002732 WO2009127395A1 (fr) 2008-04-18 2009-04-14 Carte à puce et son procédé de fabrication

Publications (1)

Publication Number Publication Date
EP2269168A1 true EP2269168A1 (fr) 2011-01-05

Family

ID=40973226

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09732963A Ceased EP2269168A1 (fr) 2008-04-18 2009-04-14 Carte à puce et son procédé de fabrication

Country Status (5)

Country Link
US (2) US8313981B2 (fr)
EP (1) EP2269168A1 (fr)
CN (1) CN102007503B (fr)
DE (1) DE102008019571A1 (fr)
WO (1) WO2009127395A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
DE102009023405A1 (de) * 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
DE102011103281A1 (de) * 2011-05-26 2012-11-29 Giesecke & Devrient Gmbh Tragbarer Datenträger zum kontaktbehafteten Datenaustausch mit einem Endgerät
CN102279942A (zh) * 2011-07-25 2011-12-14 上海祯显电子科技有限公司 一种新型智能卡
US9899238B2 (en) * 2014-12-18 2018-02-20 Intel Corporation Low cost package warpage solution
US10535046B2 (en) 2016-02-24 2020-01-14 CPI Card Group — Colorado, Inc. System and method for encoding IC chips for payment objects
US20190104612A1 (en) * 2017-09-29 2019-04-04 Iteq Corporation Polymer matrix composite for eliminating skew and fiber weave effect
US11568424B2 (en) 2018-10-18 2023-01-31 CPI Card Group—Colorado, Inc. Method and system for product authentication
DE102021005960A1 (de) * 2021-12-02 2023-06-07 Giesecke+Devrient Mobile Security Gmbh Kartenförmiger Datenträger mit einer Hinterspritzungsschicht und Verfahren zum Herstellen eines kartenförmigen Datenträgers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication
DE10141382C1 (de) * 2001-08-23 2002-11-14 Digicard Ges M B H Verfahren zur Herstellung einer Chipkarte
US20060124350A1 (en) * 2002-10-11 2006-06-15 Francois Droz Electronic module comprising an element exposed on one surfce and method for making same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE167319T1 (de) 1994-11-03 1998-06-15 Fela Holding Ag Basis folie für chip karte
DE19500925C2 (de) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Verfahren zur Herstellung einer kontaktlosen Chipkarte
FR2756955B1 (fr) * 1996-12-11 1999-01-08 Schlumberger Ind Sa Procede de realisation d'un circuit electronique pour une carte a memoire sans contact
FR2761498B1 (fr) 1997-03-27 1999-06-18 Gemplus Card Int Module electronique et son procede de fabrication et carte a puce comportant un tel module
FR2786009B1 (fr) * 1998-11-16 2001-01-26 Gemplus Card Int Procede de fabrication d'une carte a puce hybride par impression double face
DE19942932C2 (de) * 1999-09-08 2002-01-24 Giesecke & Devrient Gmbh Verfahren zum Herstellen von Chipkarten
DE10016715C1 (de) 2000-04-04 2001-09-06 Infineon Technologies Ag Herstellungsverfahren für laminierte Chipkarten
GB0024070D0 (en) * 2000-10-02 2000-11-15 Innavisions Ltd Mpulding apparatus and method
DE10344049A1 (de) * 2002-12-12 2004-06-24 Giesecke & Devrient Gmbh Tragbarer Datenträger
FR2872946B1 (fr) 2004-07-08 2006-09-22 Gemplus Sa Procede de fabrication d'un support de carte a puce mini uicc avec adaptateur plug-in uicc associe et support obtenu
DE202004019794U1 (de) * 2004-12-23 2005-02-24 Mühlbauer Ag Chipkarte mit integriertem SIM-Modul

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4344297A1 (de) * 1993-12-23 1995-06-29 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Ausweiskarten
WO2000042569A1 (fr) * 1999-01-13 2000-07-20 Brady Worldwide, Inc. Étiquette rfid stratifiee et son procede de fabrication
DE10141382C1 (de) * 2001-08-23 2002-11-14 Digicard Ges M B H Verfahren zur Herstellung einer Chipkarte
US20060124350A1 (en) * 2002-10-11 2006-06-15 Francois Droz Electronic module comprising an element exposed on one surfce and method for making same

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009127395A1 *

Also Published As

Publication number Publication date
US8313981B2 (en) 2012-11-20
WO2009127395A1 (fr) 2009-10-22
US20120112367A1 (en) 2012-05-10
DE102008019571A1 (de) 2009-10-22
CN102007503B (zh) 2013-10-30
US20110042830A1 (en) 2011-02-24
US8390132B2 (en) 2013-03-05
CN102007503A (zh) 2011-04-06

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