EP1127285A1 - Module electro-optique et son procede de production - Google Patents

Module electro-optique et son procede de production

Info

Publication number
EP1127285A1
EP1127285A1 EP99971928A EP99971928A EP1127285A1 EP 1127285 A1 EP1127285 A1 EP 1127285A1 EP 99971928 A EP99971928 A EP 99971928A EP 99971928 A EP99971928 A EP 99971928A EP 1127285 A1 EP1127285 A1 EP 1127285A1
Authority
EP
European Patent Office
Prior art keywords
optical component
circuit board
electro
printed circuit
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99971928A
Other languages
German (de)
English (en)
Inventor
Hans Kragl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harting Elecktro Optische Bauteile GmbH and Co KG
Original Assignee
Harting Elecktro Optische Bauteile GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE1998151265 external-priority patent/DE19851265C2/de
Application filed by Harting Elecktro Optische Bauteile GmbH and Co KG filed Critical Harting Elecktro Optische Bauteile GmbH and Co KG
Publication of EP1127285A1 publication Critical patent/EP1127285A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Definitions

  • the invention relates to an assembly consisting of a printed circuit board with an electro-optical component and an optical component.
  • the invention further relates to an approach for the manufacture of such an assembly.
  • Electro-optical components for example laser diodes, LEDs and
  • Photodetectors are coupled to an optical component, for example an optical fiber or a waveguide.
  • the electro-optical components are arranged on a substrate on which the optical component is also arranged.
  • An example of such an assembly is from the German publication
  • a photo detector gate is coupled to an optical fiber.
  • the pholodetector and the optical fiber are accommodated in a two-part substrate, a waveguide trench being provided in one substrate part, which trench separates the optically transparent one used when the two substrate parts are glued together
  • Adhesive is filled so that a waveguide coupling the photodetector and the optical fiber is formed.
  • the electro-optical component can only be precisely positioned relative to the optical component with great effort, for example using guide bevels which are intended to ensure the optimal alignment. Examples of such designs can be found in German Offenlegungsschriflcn 44 01 219 and 42 32 608 known.
  • the optical element which is coupled to the electro-optical component that is to say the waveguide in the example mentioned, is only formed when the two substrate parts are bonded together. If the waveguide is faulty, this means that the photodetector is also part of the committee because it is inseparable from the assembly.
  • Waveguides which can have dimensions down to 1 ⁇ m, are not sufficient.
  • the invention creates an assembly in which an optical component is arranged with the desired accuracy relative to an electro-optical component.
  • the invention also provides a method for producing such an assembly, which is characterized by a high bulge.
  • An assembly according to the invention consists of a printed circuit board and an optical component, the printed circuit board being provided with at least one electro-optical component, at least one conductor track for the connection of the electro-optical component and a three-dimensional, microstructured adjustment configuration, relative to which the electronic optical component is precisely arranged, and wherein a three-dimensional positional arrangement is provided on the optical component, which interacts with the Justicrgcstallung the circuit board such that the optical component is precisely coupled to the electro-optical component of the circuit board.
  • the assembly consists of two sub-assemblies, namely the printed circuit board with the electro-optical component and the optical component itself. These are individually functional so that they can be tested separately. So it can be checked with regard to the circuit board whether the
  • Conductor tracks for the connection of the electro-optical component, the connection of the electro-optical component with the conductor tracks and finally the electro-optical component itself are fully functional.
  • the optical component it can be checked whether the optical component, for example a waveguide or a
  • the electro-optical component is only coupled to the optical component when the circuit board and the optical component are joined, passively via the adjustment and the positional configuration.
  • the circuit board is an injection molded part which is partially provided with a metallization.
  • a heat sink is arranged at the bottom of the depression in which the electro-optical component is accommodated. This heatsink is used to
  • the heat sink can consist, for example, of a melamine layer which is formed at the same time as the metallization of the printed circuit board.
  • the heat sink can be used as one of the connections for the electro-optical component if it is connected to the heat sink in an electrically conductive manner, for example by means of adhesive.
  • the press fit ensures the precise arrangement of the electro-optical component in the recess without additional measures for securing the electro-optical component being required.
  • the electro-optical component has a rectangular base area and the depression is formed by a circular receiving milling hole, the dimensions of which are smaller than the diagonals of the base area, and that four adjustment holes are provided, which are assigned to the corners of the component are and their cut edges with the wall of the receiving milling hole serve for precise alignment of the component.
  • the recess of the electro-optical component can be formed in a very precise manner with a flat base surface by means of the receiving milling hole.
  • the adjustment holes then make it possible to hold the electro-optical component in a precise alignment in the receiving milling hole.
  • Parabolic reflector that forms the emitted light to the optical
  • Electro-optical components that In particular, LED chips emit light without a preferred direction. The light emitted by the LED chip, which is emitted outside the acceptance angle of the associated optical component, would be lost if, for example, the parabolic reflector is not used for beam shaping. Such a parabolic reflector replaces a converging lens, which could be used as an alternative, but which means a much higher expenditure on the lens.
  • the reflective layer of the parabolic reflector can be formed in a particularly simple manner from the metallization that is applied to the circuit board in order to also form the conductor tracks.
  • an optical fiber can be used as the optical component, the outer contour of which forms the positional configuration, and the adjustment design of the printed circuit board which interacts with the positional configuration can be achieved by a guide groove for the
  • Optical fiber can be formed in which it is received.
  • the optical component is thus directly aligned with the adjustment design, and thus relative to the electro-optical component of the printed circuit board, so that the desired coupling between the electro-optical and the optical component is obtained.
  • the guide groove is preferably formed with a V-shaped cross section.
  • the optical component can be arranged on a substrate on which the positional configuration is formed, which is microstructured.
  • the optical component is thus aligned indirectly with the interposition of the substrate relative to the electro-optical component.
  • the optical component is a waveguide or a mirror.
  • the optical components quasi need the substrate as a support structure. This is because the waveguide is usually formed in a well channel in the substrate, and the mirror can be formed by a reflectively designed surface with a suitable geometric structure, so that, for example, a concave mirror is provided, which is similar to a parabolic reflector from the electro-optical one Bautcil bundles provided light to another optical component, for example the end face of an optical fiber.
  • a method for producing an assembly from a printed circuit board, on which at least one electro-optical component is arranged, and an optical component, which is coupled to the electro-optical component contains the following steps: wherein a recess for receiving the electro-optical component and a three-dimensional adjustment design are formed. Then the circuit board blank. Completed by partially metallizing it to form a circuit board. The electro-optical component is then arranged in the depression and connected to the conductor track. Furthermore, an optical component is provided separately from the printed circuit board, on which a three-dimensional positioning design is provided. Finally, the printed circuit board and the optical component are joined together, the adjustment and the positioning design intermeshing and leading to a precise alignment of the printed circuit board and the optical component relative to one another.
  • circuit board and optical component are attached to each other.
  • This method enables the assembly to be manufactured particularly economically since, as is preferably provided, both the electro-optical component of the circuit board and the optical component can be tested separately for their correct function before the circuit board and optical component are connected. If correct functioning cannot be determined, only the corresponding subassembly belongs to the committee, so that the overall committee rate of the process is considerably improved.
  • the precise alignment of the components relative to one another required for the coupling between the electro-optical component and the optical component is quasi automatically obtained passively by the interlocking of the adjustment design and the positioning configuration.
  • the depression for receiving the electro-optical component and the three-dimensional adjustment design are molded from the injection mold so that it can be processed with the required precision without further processing steps be received.
  • the printed circuit board is heated in order to arrange the electro-optical component in the recess.
  • the thermal expansion that occurs during heating makes it possible to insert the component freely into the recess.
  • the shrinkage that occurs during cooling then leads to the electro-optical component being held securely and reliably in the recess with a suitable press fit, without further steps being necessary.
  • circuit board and optical component are glued directly to one another. In this way, the circuit board and the optical component are glued directly to one another.
  • the adhesive can also be used to fill any space between the mutually assigned surfaces of the electro-optical component and the optical component. This is not absolutely necessary, but increases the quality of the coupling between the two components if the adhesive is made of highly transparent material and completely fills the space in the siren path between the electro-optical and the optical component.
  • the optical component is attached to a substrate. where the positioning design is formed and which is connected to the circuit board. This gives more freedom in terms of the type of connection between the circuit board and the optical component.
  • the adhesive bonding mentioned above it can also be provided that the printed circuit board and the substrate are soldered to one another.
  • FIG. 1 is a schematic sectional view of an assembly according to a first embodiment of the invention
  • FIG. 2 is a plan view of a printed circuit board used in the assembly of Figure 1 before assembly with the electro-optical component;
  • FIG. 4 shows a top view of a silicon master part which is used for producing the printed circuit board blank from FIG. 2;
  • FIG. 6 shows a sectional view corresponding to the plane V-V of FIG. 4, a nickel workpiece which was obtained by molding the silicon master part from FIG. 5:
  • FIG. 7 shows, in a schematic plan view, a depression which can be used to hold an electro-optical component in a printed circuit board
  • FIG. 8 is a sectional view taken along the line VIII-VIII of Figure 12;
  • - Figure 9 is a schematic sectional view of an assembly according to a second embodiment of the invention.
  • FIG. 11 is a schematic sectional view of an assembly according to a fourth embodiment of the invention.
  • FIG. 13a shows a schematic sectional view of an assembly according to a sixth embodiment of the invention.
  • FIG. 14 shows, in a schematic sectional view, a first step for arranging the electro-optical component in a recess in the printed circuit board
  • FIG. 15 shows a schematic sectional view of a second step for arranging the electro-optical component in the depression of the printed circuit board
  • FIG. 16 is a schematic sectional view of an alternative second step for arranging the electro-optical component in a recess of the circuit board;
  • FIG. 18 is a perspective schematic view of the assembly of the seventh embodiment of the invention.
  • Figure 19 is a perspective exploded view of an assembly according to an eighth embodiment of the invention. and - Figure 20 in a rope view a part of the assembly of the eighth embodiment of the invention.
  • FIG. This consists of a circuit board 10 and two optical signals
  • Components here a mirror 54 and a waveguide 56, which are formed on a substrate 50.
  • the printed circuit board 10 (see also FIGS. 2 and 3) is preferably produced in an impression process, in particular in injection molding technology.
  • a Justicrgcstaltung 12 is formed on the surface of the circuit board, which here consists of a raised adjustment cross.
  • a depression 14 is formed in its surface, which is used to hold an electro-optical component 16.
  • the electro-optical component can be, in particular, a cyclo-optical chip, for example a laser diode, an LED, a VCSEL chip or a Pholodctektor.
  • Both the alignment cross 12 and the recess 14 are precisely microstructured with regard to their geometric shape and their arrangement relative to one another. This means that a desired geometry with a very high
  • two grooves 18 are further molded, which will later be used to form conductor tracks. At one end of the grooves 18 there are bores 20 for receiving contact pins 22.
  • the surface of the printed circuit board blank 10' must be covered with a
  • Metallization can be provided.
  • the blank is first plasma-cleaned, and then the surface is metallized by a chemical process or a vacuum evaporation process.
  • the metallization formed on the surface in this way is very thin, so that it can be polished or ground off without problems on all raised areas, that is to say all areas apart from the tying 14 and the trenches 18.
  • a metal layer 26 can be formed on the bottom of the depression 14, which serves as a heat sink for the electro-optical component that is later inserted into the depression 14.
  • the heat sink extends into an extension 14a of the depression, so that a larger area is available for the cooling effect.
  • different voltages can be applied to the metallizations in the grooves 18 or at the bottom of the depression 14 in order to use different amounts of material to deposit there.
  • the electro-optical component 16 is inserted into the depression 14 and connected to the two conductor tracks 24 by a bonding wire 28 each. It is also possible to get the electrical connection by gluing.
  • the heat sink 26 can also be used as an electrical connection of the electro-optical component 16.
  • the underside of the component 16 is connected to the heat sink 26 in an electrically conductive manner by soldering or conductive adhesive. Then only one bonding wire 18 is required to form the second connection of the electro-optical component via one of the conductor tracks 18. Regardless of the type of electrical connection of the electro-optical component, a good heat-conducting connection to the heat sink 26 must be ensured.
  • the electro-optical component 16 is now precisely arranged relative to the adjustment cross 12.
  • a positioning configuration 52 is formed on the substrate 50, which consists of a geometric structure that is inverse to the adjustment configuration 12 of the printed circuit board, in this case, therefore, of a recessed adjustment cross.
  • the substrate 50 is further provided with the two optical components mirror 54 and waveguide 56 mentioned briefly above.
  • the waveguide can be formed by known methods
  • Microstructure technology can be formed, and the mirror 54 can be formed by a metallization applied to an inclined surface of the substrate.
  • the positioning design 52 is the same as that
  • Adjustment design 12 mikroslrukturicrl, and the two optical components 54 and 56 of the substrate are precisely arranged relative to the positioning design.
  • the assembly is then obtained by joining the circuit board 10 and the substrate 50 together.
  • the printed circuit board and the substrate and thus the components attached to them are precisely aligned relative to one another.
  • the electro-optical component 16 of the circuit board is thus in the position which is required for optical coupling with the mirror 54 and the waveguide 56. This is indicated by a schematically illustrated beam path 60.
  • circuit board 10 and the substrate 50 are connected to one another. This can be done, for example, by soldering, for which purpose metallized areas on the printed circuit board 10 and the substrate 50 are advantageously used.
  • the circuit board and the substrate are preferably bonded to one another, with a suitable choice of the adhesive completely filling the space between the electro-optical component of the circuit board and the optical component of the substrate in the region of the beam path between the two components with a highly transparent adhesive can to improve the optical coupling.
  • the printed circuit board blank 10 'shown in FIG. 2 carries raised and recessed structures at the same time, the tool for its manufacture cannot be produced by the microstructure technology which is widespread in the field of integrated optics, since this generally does not allow material application. It is therefore necessary to use the technique of galvanic copying, with which raised and deepened structures can be formed. In addition, there is the problem of the depression 14 in the printed circuit board being vertical
  • FIG. 4 shows a silicon master part 10 ′′, the surface of which is inverse to the circuit board blank 10 ′ was formed using silicon micromechanics.
  • the adjustment cross 12 raised on the circuit board blank 10 ′ is designed as a recessed adjustment cross 12 ′′ (by KOH Etching), and the grooves 18 for the conductor tracks, which are formed in a recessed manner on the printed circuit board blank 10 ', are locally raised by removing the outer edge regions of the recessed structures by RIE ablation.
  • the outer edge areas of the depression 14 to be formed on the printed circuit board blank 10 ' have been etched away, so that the areas 14 "which later correspond to the depression 14 appear raised, to be precise with respect to that local environment.
  • the silicon master part 10 is now copied simply (or an odd number of times) so that the tool 10 '" shown in FIG. 6 is made of nickel, which is the first, third, ... generation.
  • This tool can now be structured in the desired manner using an NC drilling and milling machine.
  • Figures 7 and 8 is a
  • Example of the tying 14 shown for receiving the electro-optical component The recess 14 is formed by a large receiving hole, which is a milling hole with a straight bottom surface up to one Diameter of approx. 300 ⁇ m is currently technically feasible.
  • the cylindrical wall 14 ′ formed in this way has a diameter that is smaller than a diagonal of the electro-optical component that is later to be received in the depression 14.
  • an adjustment bore is formed with a diameter that is smaller than the diameter of the receiving bore and in particular can have a value of less than 100 ⁇ m.
  • the adjustment bores and the receiving bore overlap, so that the walls 14 "of the adjustment bores also intersect with the wall 14 'of the receiving bores.
  • the resulting eight cutting edges serve for the precise alignment of the electro-optical component in the recess 14, in each case by attack two cut edges on one and the other side of each corner of the electro-optical component.
  • FIG. 8 shows very well the flat base surface which is formed in this way and which later serves for the precise arrangement of the electro-optical component in the recess.
  • the edges of the component accommodated in the depression 14 are indicated in FIG.
  • a component with a square base in the same way, a component with a generally rectangular base area could also be used. In this case, only the receiving bore would have to be formed with an elongated hole-like shape.
  • FIG. 9 shows a second embodiment of an assembly according to the invention.
  • two substrates 50 are used, one carrying a mirror 54 and the other carrying a waveguide 56.
  • Each substrate is provided with a positional arrangement 52, so that the two optical components 54, 56 are optimally aligned and the electro-optical component 16 is connected to the waveguide 56 by end face coupling via the mirror 54.
  • FIG. 10 shows a third embodiment of an assembly according to the invention.
  • a mirror 54 is used as the optical component, which is formed by a metallized surface of the substrate 50. Since this the substrate 50 is not an integrated optical substrate, the substrate 50 can be produced, for example, as an injection molded part with the required precision.
  • an optical fiber 58 is used as the optical component, which is coupled via the mirror 54 to the electro-optical component 16 by end face coupling.
  • the optical fiber 58 is received in a guide groove in the circuit board.
  • the guide groove serves as a slurry of glass and the outer contour of the optical fiber 58 serves as a positional arrangement which, in cooperation with the juslier design, precisely aligns the optical fiber relative to the mirror 54 and the electro-optical component 16.
  • FIG. 11 shows a fourth embodiment of an assembly according to the invention.
  • the mirror In this embodiment, the mirror
  • the substrate 50 formed on the substrate 50 as a concave mirror so that it can be used for beam shaping.
  • the electro-optical component 16 used emits light without a preferred direction perpendicular to the surface, as is the case, for example, with an LED chip.
  • the curved surface on the substrate 50 required to produce the mirror 54 can be achieved, for example, by molding in an injection molding process.
  • FIG. 12 shows a circuit board for an assembly according to a fifth embodiment of the invention.
  • the parabolic surface can easily be achieved by using a correspondingly ground cutter for reworking the milling bore, as is known in principle from FIGS. 7 and 8.
  • the reflective coating of the reflector 32 can be achieved by means of the metallization used to produce the
  • Conductor tracks 24 is applied. It should be noted here that the bonding wires used to connect the electro-optical component 26
  • This embodiment is also electro-optical
  • Component 16 glued to a heat sink 26 on the bottom of the Well 14 is formed.
  • FIGS. 13a and 13b show an assembly according to a sixth embodiment.
  • a channel medium is inserted into the recess 14 as a cllro-optical component.
  • Lascrdiodc 16 used. This is coupled directly, that is to say without an interposed mirror, etc., to the optical component, which is designed here as an optical fiber 58.
  • a guide groove 12 with a V-shaped cross section serves as the adjustment mechanism.
  • the outer contour 52 of the optical fiber 58 which is shaped with the required precision in order to obtain the required alignment relative to the edge emitter LD, serves as the positional design.
  • FIGS. 14 to 16 show method steps such as the electro-optical component 16 safely and reliably in the recess
  • FIG. 14 shows the printed circuit board 10 and the electro-optical component 16 in the initial state.
  • the dimensions of the depression 14 are slightly smaller than the dimensions of the electro-optical component 16.
  • the printed circuit board 10 is heated from its initial temperature, which may be 20 ° C., for example, to a temperature of 100 ° C., for example.
  • the thermal expansion that occurs ensures that the dimensions of the depression 14 increase, so that the electro-optical component can now be inserted into the depression without problems.
  • the circuit board 10 has cooled back to its initial temperature, the walls of the depression 14 have come into contact with the electro-optical component 16 due to the painterly shrinkage that occurs, so that the latter is held reliably in the depression 14 with a press fit. No further measures are therefore required to attach the electro-optical component to the printed circuit board 10.
  • the electro-optical component 16 is replaced by a Press fit held in the recess 14.
  • this type of attachment is only suitable if the printed circuit board 10 has sufficient elasticity.
  • FIGS. 17 and 18 show an assembly according to a seventh
  • the printed circuit board 10 is provided with large contact areas 70 which have been produced by a suitable metallization.
  • the circuit board can be inserted into a SIMM connector with the contact areas in a manner comparable to howling
  • FIGS. 19 and 20 show an assembly according to an eighth embodiment of the invention.
  • the groove 18 in the substrate 50 serves as a positioning design 52 for the circuit board 10 to be used.
  • This is provided with adjustment structures 12 which are formed by the outer edges of an extension.
  • the parabolic mirror 54 is arranged in this continuous salt, in the interior of which a transmitting chip 16 is arranged.
  • This embodiment is characterized in that no separate positional circuits are required, but that the walls of the groove 18, which are already structured with high accuracy, ensure the alignment of the circuit board.
  • the substrate as a plug, which carries the optical components, for example in the form of optical fibers, and can be plugged onto the suitably structured printed circuit board.
  • Another advantage is that in addition to the Justiergcstaltung on the surface of the circuit board
  • Locking structures can be provided for different components, for example V-shaped grooves, so that the precise construction of lock-coupled integrated optical components, of fiber and fiber ribbon connectors or of fiber and fiber ribbon is possible on the circuit board.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un module contenant une carte de circuits (10) et un composant optique (54, 56, 58). La carte de circuits (10) comporte au moins un composant électro-optique (16), au moins un tracé conducteur (24) pour le raccordement du composant électro-optique (16) ainsi qu'un moyen de réglage microstructuré, tridimensionnel (12) par rapport auquel le composant électro-optique (16) est placé avec précision. Un moyen de positionnement tridimensionnel (52) prévu au niveau du composant optique (54, 56, 58) coopère avec le moyen de réglage (12) de la carte de circuits (10) de sorte que le composant optique (54, 56, 58) soit couplé avec précision au composant électro-optique (16) de la carte de circuits (10). Le composant électro-optique (16) est logé dans un évidement (14) de la carte de circuits. Dans un mode de réalisation de l'invention, le composant optique est une fibre optique (58).
EP99971928A 1998-11-06 1999-11-05 Module electro-optique et son procede de production Withdrawn EP1127285A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE1998151265 DE19851265C2 (de) 1998-11-06 1998-11-06 Elektro-optische Baugruppe sowie Verfahren zur Herstellung einer solchen Baugruppe
DE19851265 1998-11-06
PCT/EP1999/008485 WO2000028362A1 (fr) 1998-11-06 1999-11-05 Module electro-optique et son procede de production

Publications (1)

Publication Number Publication Date
EP1127285A1 true EP1127285A1 (fr) 2001-08-29

Family

ID=7886951

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99971928A Withdrawn EP1127285A1 (fr) 1998-11-06 1999-11-05 Module electro-optique et son procede de production

Country Status (6)

Country Link
US (1) US6504107B1 (fr)
EP (1) EP1127285A1 (fr)
JP (1) JP2002529787A (fr)
KR (1) KR20010086003A (fr)
DE (1) DE19861162A1 (fr)
WO (1) WO2000028362A1 (fr)

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US6504107B1 (en) 2003-01-07
WO2000028362A1 (fr) 2000-05-18
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JP2002529787A (ja) 2002-09-10
DE19861162A1 (de) 2000-06-29

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