EP1090419A1 - Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee - Google Patents
Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controleeInfo
- Publication number
- EP1090419A1 EP1090419A1 EP99925122A EP99925122A EP1090419A1 EP 1090419 A1 EP1090419 A1 EP 1090419A1 EP 99925122 A EP99925122 A EP 99925122A EP 99925122 A EP99925122 A EP 99925122A EP 1090419 A1 EP1090419 A1 EP 1090419A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cover
- support
- fusible material
- component
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004320 controlled atmosphere Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 32
- 239000000463 material Substances 0.000 claims abstract description 61
- 239000011324 bead Substances 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 21
- 238000009396 hybridization Methods 0.000 claims description 11
- 230000004927 fusion Effects 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229910007116 SnPb Inorganic materials 0.000 claims description 3
- 229910016347 CuSn Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 206010001488 Aggression Diseases 0.000 description 1
- PMRMTSSYYVAROU-UHFFFAOYSA-N [Ti].[Ni].[Au] Chemical compound [Ti].[Ni].[Au] PMRMTSSYYVAROU-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000016571 aggressive behavior Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/032—Gluing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29011—Shape comprising apertures or cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/2901—Shape
- H01L2224/29012—Shape in top view
- H01L2224/29013—Shape in top view being rectangular or square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/731—Location prior to the connecting process
- H01L2224/73101—Location prior to the connecting process on the same surface
- H01L2224/73103—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Definitions
- the present invention relates to a method of encapsulating components and forming a device having one or more components formed in one or more cavities with controlled atmosphere.
- controlled atmosphere cavity is meant both a cavity in which a vacuum has been established and a cavity containing a gas of controlled composition and / or pressure.
- Such a cavity defined for example by a cover fitted onto a substrate, makes it possible to accommodate sensitive components such as electronic, electro-optical components or micro-mechanical components.
- the invention finds applications for the hermetic encapsulation of electronic chips, pressure or acceleration sensors, or even electromagnetic sensors such as bolometric sensors.
- a first operation consists in positioning a cover 10 on a support 12, such as a substrate, in a region comprising a component 14.
- the cover 10 has a depression 16, turned towards the support 12 and intended to house the component 14.
- the depression 16 is surrounded by an edge 18.
- the mutual positioning of the cover 10 and the support 12 is achieved by alignment means shown very schematically with the reference 22. These means make it possible to make the depression 16 of the cover coincide with the component 14 and to have the edge 18 facing the sealing bead 20.
- Figure 1 shows that all of the parts to be assembled, as well as the alignment means, are arranged in an enclosure 24 in which the desired controlled atmosphere is established.
- FIG. 2 The actual sealing step, carried out after positioning the cover, is illustrated in FIG. 2.
- the cover 10 is applied to the support so that the sealing bead tightly connects the border 18 on the upper surface of substrate 12.
- the assembly of the support and of the cover can be brought to a temperature sufficient to melt the fusible material.
- the heating of the cover and of the support which always takes place in the enclosure 24 with a controlled atmosphere, is implemented, for example, by means of a heating hearth 28 on which the support 12 rests. example support
- the reference 10a designates a first cover already sealed on the support 12.
- the reference 10b designates a second cover applied against the support 2, in the sealing phase.
- a third cover 10c which is not yet applied to the support is positioned above a component 14.
- the positioning of the covers and their sealing takes place successively.
- the means 22 for aligning the covers although bulky and bulky, must be housed in the enclosure 24 with a controlled atmosphere.
- the method described with reference to FIG. 3 therefore poses problems of housing the alignment means and proves to be ill-suited to the installation of a large number of covers on a support.
- a partial solution to the problems mentioned above is provided by a hood transfer system as illustrated in FIG. 4.
- This system uses an intermediate holding part 26 on which the covers 10a, 10b, 10c are transferred by their face which does not come into contact with the final support 12.
- the intermediate part 26, equipped with covers is introduced with the support 12 in an enclosure with controlled atmosphere and the sealing or the edge of the covers can take place collectively.
- the method of FIG. 4 however requires means of alignment 22 of the intermediate piece 24 with the support.
- the intermediate part must be removed after the covers have been transferred.
- the object of the present invention is to propose a method of encapsulating one or more components which does not present the difficulties and constraints mentioned above.
- the method is intended to be encapsulated components that can be either reported in advance on a substrate, 'either directly integrated in the substrate (chip, integrated sensors, ...)
- An object of the invention is in particular to propose such a method which can be implemented in an enclosure with a controlled atmosphere devoid of means for aligning hoods on the components. Another object is to propose such a method making it possible to align with precision and to collectively seal a large number of covers above corresponding components.
- the invention more specifically relates to a process for encapsulation under a controlled atmosphere of at least one component by sealing at least one cover on at least one zone of a support comprising the component.
- at least one of the cover and support is fitted with sealing means surrounding an area corresponding to said component, and at least one shim made of a fusible material,
- the cover and the substrate are positioned mutually so that the cover is arranged substantially opposite a zone corresponding to the component
- the assembly formed by the cover and the support is heated in an enclosure with controlled atmosphere at a temperature sufficient to melt the shim of fusible material.
- the shim of fusible material is produced with an initial height before fusion sufficient to prevent the sealing means from sealingly connecting the cover to the support, and so as to have a height after fusion sufficiently low to allow tight contact of the sealing means both with the cover and the support. Thanks to the shims of fusible material, it is possible to set up and position the covers on the support before introducing the support into the enclosure with controlled atmosphere.
- the shims prevent the space between the cover and the support from forming a closed and insulated cavity before the final sealing.
- the controlled atmosphere such as a vacuum for example, can therefore be established around the component.
- the shims can also be used as an electrical connection between the support and the cover, for example for the transmission of electrical signals.
- the mutual positioning of the cover and the support which can be produced under an ambient atmosphere is not very critical. Indeed, the final and exact positioning of the cover can be obtained automatically by surface tension forces exerted in the fusible material when the latter is melted.
- the method of the invention can be implemented for a single cover but is particularly advantageous when a large number of covers have to be transferred to the same substrate.
- the sealing means may comprise a bead of fusible material capable of melting during heating.
- the fusible material of the cord is preferably the same material as that of the wedges or a material having a melting point close to that of the wedges.
- materials such as AuSn, SnPb or CuSn can be selected. These materials allow hybridization without flow from the cover to the support.
- the fusible material melts and forms a tight seal between the cover and the support.
- the sealing means may also include a bead of another material such as a bead of screen-printed glue.
- this bead can be designed so as to have an initial height before fusion less than the initial height of the wedges of fusible material and a height after fusion, called hybridization height , greater than the height of hybridization of the holds.
- Such an embodiment is particularly suitable when the cord and the shims are arranged in the same plane between the facing surfaces of the cover and the support.
- the height of hybridization of an element of fusible material is understood to mean the height that this element would have between the cover and the support after being melted and in the absence of external constraints.
- the height of hybridization of the wedges is defined independently of that of the cord and vice versa.
- the hybridization height of the shims or that of the cord depends on the quantity of fusible material used for the production of these elements and on the adhesion surface of these elements to the cover and to the support.
- the surfaces of the reception areas can be adjusted according to a desired hybridization height.
- the invention also relates to a device comprising a support and at least one cover capable of being sealed to the support to form with the support at least one cavity with controlled atmosphere around at least one component.
- a device comprising a support and at least one cover capable of being sealed to the support to form with the support at least one cavity with controlled atmosphere around at least one component.
- at least one of the covers and supports is fitted with shims of fusible material and a sealing bead formed around the component.
- the shims of fusible material have a sufficient thickness to prevent the sealing bead from coming into contact with both the cover and the support when these are assembled.
- FIGS. 1 and 2 already described, are simplified schematic sections of a substrate and a cover, illustrating successive steps of a known method of encapsulating a component.
- FIG. 3 is a simplified schematic section of a substrate and covers, illustrating an implementation of the encapsulation process applied to several components of the substrate.
- - Figure 4 already described, is a schematic section of a substrate and an intermediate support piece illustrating a known improvement of the encapsulation process.
- - Figure 5 is a simplified schematic section of a support substrate and a cover illustrating the device, and the encapsulation method of the invention.
- FIG. 6 is a simplified schematic view of an upper face of the substrate of the support, facing the cover.
- FIG. 7 is a simplified schematic section of the substrate and the cover of Figure 5, after sealing.
- - Figures 8 and 9 are also simplified schematic sections of the substrate and the cover and show possible uses of shims of fusible material as an electrical connection.
- the reference 100 in FIG. 5 indicates a support substrate, such as for example a wafer of. semiconductor material, on which a component 102 is made.
- Component 102 can be an electronic circuit, a micromechanical sensor, such as an accelerometer or even the sensitive element of a bolometer, for example.
- a cover 104 is intended to protect the component 102 from external aggressions and to maintain the component in a controlled atmosphere.
- the cover 104 is shown in a state where it is transferred to the support 100 so as to cover the component 102, but where it is not yet sealed on the support.
- the cover is equipped with pads 106a, 108a whose surface is made of a material wettable by a fusible material, and which correspond to similar pads 106b, 108b of the support.
- the pads 106a, 106b, 108a, 108b are formed for example by photolithography in a stack of thin layers of titanium-nickel-gold type.
- the pads 106b of the support are, for example, in the form of circular pads and are intended to accommodate balls of fusible material 110.
- the pads 106b have for example a diameter of 80 ⁇ m to accommodate balls of a diameter of 140 ⁇ m .
- the area 108b of the support is in the form of a strip which forms a frame around the area comprising the component 102.
- This strip is intended to receive a cord 112 of fusible material.
- the strip has for example a width of 40 ⁇ m to accommodate a bead with a section width of 50 ⁇ m.
- the shape of the wettable material areas 106b, 108b of the support 100 is also visible in FIG. 6 which shows an upper face of the support facing the cover.
- the wettable areas 106a and 108a of the cover are similar in shape and substantially superimposable on the corresponding areas 106b and 108b of the support. However, it is observed that the pellets forming the pads 106a of the cover have a diameter greater than that of the pellets forming the pads 106b on the support.
- the role of the upper diameter of the hood discs is explained in the following text.
- the balls of fusible material 110 and the cord 112 are arranged on the support.
- the fusible material may be an AuSn weld deposit formed through a mask, not shown, according to a screen printing, evaporation or electrolytic growth technique, for example.
- the cord and / or balls of fusible material can also be initially placed on the cover.
- the diameter of the pellets for receiving the balls on the cover is preferably less than that of the corresponding pads of the support.
- FIG. 5 shows that the diameter of the balls of fusible material 110 is chosen to be sufficient to prevent the bead from being in contact with the area 108b of wettable material of the cover. The balls 110 thus form shims for supporting the cover.
- a space noted h is provided between the bead
- This spacing makes it possible to establish a controlled atmosphere in a cavity 114 defined around the component by the cover, the support and the cord.
- the balls and the bead can be designed to present respectively initial heights before welding of 70 ⁇ m and 28 ⁇ m.
- the cover can be placed on the support before the introduction of the entire structure into an enclosure with controlled atmosphere.
- Figure 7 shows the state of the device after sealing the cover on the substrate.
- the sealing is carried out by bringing the fusible material to a temperature greater than or equal to its melting temperature, for example of the order of 300 ° C.
- the melting temperature can be further reduced by replacing AuSn with SnPb.
- the cover collapses and the seal 112, also melted, comes to weld on the range of wettable material 108a of the cover.
- the cavity 114 is sealed.
- the balls 110 also come to be welded on the pellets forming the areas of wettable material 106a of the cover.
- the diameter of these pellets can be chosen so that the height of hybridization of the balls 110 is less than the height of hybridization of the cord 112.
- the diameter of the pads 106a of the cover is, for this purpose, chosen to be greater than the diameter of the pads 106b of the support 100.
- a surface tension effect in the meltable fusible material makes it possible to perfect the alignment of the cover by support. So a initial positioning of the fast and relatively imprecise cover ( ⁇ 10 ⁇ m) may be authorized.
- the foregoing description relates, for example, to the transfer of a single cover over a single component.
- the invention advantageously applies to the transfer of a plurality of covers of equal or different sizes on a substrate comprising a plurality of identical or different components.
- These covers can be put in place and positioned before the introduction of the support into an enclosure with controlled atmosphere.
- the enclosure can thus be devoid of means for positioning and aligning the covers.
- the cover may be made of a transparent material, in particular to infrared radiation.
- the method of the invention is suitable for the simultaneous processing of a plurality of substrates.
- FIG. 8 shows a device similar to the device of FIG. 7, in which the shims 110, made of an electrically conductive fusible material, are used as elements of electrical connection between the support 100 and the cover 104.
- the wedges 110 are formed on pads 106b made of a wettable material, also electrically conductive, and connected by means of electrical connections 118 to components of the support 100. In the example of FIG. 8, the connection pads are connected to the component 102.
- connection pads 106a of the cover are connected to external contact pads 122 flush with a free upper surface of the cover.
- the electrical connection between the connection pads 106a and the pads 122 is provided by metallized tracks 124, or "vias" passing through the cover.
- FIG. 9 shows another possible embodiment of the device in which the shims of fusible material are used to connect components located on the support with components located on the cover.
- the component 102 of the support is connected to another component 130 located on the face of the cover facing the support 100.
- the connection is ensured successively by an internal link 118, a connection pad for the support 106b , a wedge 110, a connection pad 106a of the cover and a metal layer 132 deposited on the surface of the cover facing the support.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Fuses (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9807841 | 1998-06-22 | ||
FR9807841A FR2780200B1 (fr) | 1998-06-22 | 1998-06-22 | Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee |
PCT/FR1999/001457 WO1999067818A1 (fr) | 1998-06-22 | 1999-06-17 | Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1090419A1 true EP1090419A1 (fr) | 2001-04-11 |
Family
ID=9527670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99925122A Ceased EP1090419A1 (fr) | 1998-06-22 | 1999-06-17 | Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee |
Country Status (4)
Country | Link |
---|---|
US (1) | US6566170B1 (fr) |
EP (1) | EP1090419A1 (fr) |
FR (1) | FR2780200B1 (fr) |
WO (1) | WO1999067818A1 (fr) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6384353B1 (en) * | 2000-02-01 | 2002-05-07 | Motorola, Inc. | Micro-electromechanical system device |
EP1272422A2 (fr) * | 2000-02-02 | 2003-01-08 | Raytheon Company | Fabrication avec encapsulation sous vide de dispositifs de systeme mecanique microelectrique comprenant des composants de circuits integres |
US6521477B1 (en) | 2000-02-02 | 2003-02-18 | Raytheon Company | Vacuum package fabrication of integrated circuit components |
US6479320B1 (en) | 2000-02-02 | 2002-11-12 | Raytheon Company | Vacuum package fabrication of microelectromechanical system devices with integrated circuit components |
US6690014B1 (en) * | 2000-04-25 | 2004-02-10 | Raytheon Company | Microbolometer and method for forming |
CA2312646A1 (fr) * | 2000-06-28 | 2001-12-28 | Institut National D'optique | Microconditionnement hybride de microdispositifs |
US6686653B2 (en) | 2000-06-28 | 2004-02-03 | Institut National D'optique | Miniature microdevice package and process for making thereof |
FR2816447B1 (fr) | 2000-11-07 | 2003-01-31 | Commissariat Energie Atomique | Dispositif de detection de rayonnements electromagnetiques tridimensionnel et procede de realisation de ce dispositif |
US6512300B2 (en) | 2001-01-10 | 2003-01-28 | Raytheon Company | Water level interconnection |
US6777681B1 (en) | 2001-04-25 | 2004-08-17 | Raytheon Company | Infrared detector with amorphous silicon detector elements, and a method of making it |
US7061100B2 (en) * | 2002-04-03 | 2006-06-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor built-in millimeter-wave band module |
US20040016995A1 (en) * | 2002-07-25 | 2004-01-29 | Kuo Shun Meen | MEMS control chip integration |
FR2843756B1 (fr) | 2002-08-26 | 2005-04-22 | Commissariat Energie Atomique | Procede de soudage d'une surface polymere avec une surface conductrice ou semi-conductrice et ses applications |
US6800946B2 (en) * | 2002-12-23 | 2004-10-05 | Motorola, Inc | Selective underfill for flip chips and flip-chip assemblies |
JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
EP1460037A1 (fr) * | 2003-03-18 | 2004-09-22 | SensoNor asa | Dispositif multicouche et son procédé de fabrication |
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JPS4831507B1 (fr) * | 1969-07-10 | 1973-09-29 | ||
US3591839A (en) * | 1969-08-27 | 1971-07-06 | Siliconix Inc | Micro-electronic circuit with novel hermetic sealing structure and method of manufacture |
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US6070321A (en) * | 1997-07-09 | 2000-06-06 | International Business Machines Corporation | Solder disc connection |
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1998
- 1998-06-22 FR FR9807841A patent/FR2780200B1/fr not_active Expired - Fee Related
-
1999
- 1999-06-17 US US09/701,435 patent/US6566170B1/en not_active Expired - Lifetime
- 1999-06-17 EP EP99925122A patent/EP1090419A1/fr not_active Ceased
- 1999-06-17 WO PCT/FR1999/001457 patent/WO1999067818A1/fr active Application Filing
Non-Patent Citations (1)
Title |
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Also Published As
Publication number | Publication date |
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WO1999067818A1 (fr) | 1999-12-29 |
US6566170B1 (en) | 2003-05-20 |
FR2780200B1 (fr) | 2003-09-05 |
FR2780200A1 (fr) | 1999-12-24 |
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