FR2890067B1 - Procede de scellement ou de soudure de deux elements entre eux - Google Patents
Procede de scellement ou de soudure de deux elements entre euxInfo
- Publication number
- FR2890067B1 FR2890067B1 FR0552612A FR0552612A FR2890067B1 FR 2890067 B1 FR2890067 B1 FR 2890067B1 FR 0552612 A FR0552612 A FR 0552612A FR 0552612 A FR0552612 A FR 0552612A FR 2890067 B1 FR2890067 B1 FR 2890067B1
- Authority
- FR
- France
- Prior art keywords
- solding
- sealing
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/002—Aligning microparts
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- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
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- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0552612A FR2890067B1 (fr) | 2005-08-30 | 2005-08-30 | Procede de scellement ou de soudure de deux elements entre eux |
JP2008528559A JP2009506565A (ja) | 2005-08-30 | 2006-08-21 | 2つの要素を互いにシーリングまたは溶接する方法 |
PCT/FR2006/050807 WO2007026093A1 (fr) | 2005-08-30 | 2006-08-21 | Procède de scellement ou de soudure de deux éléments entre eux. |
EP06808248A EP1919822A1 (fr) | 2005-08-30 | 2006-08-21 | Procède de scellement ou de soudure de deux éléments entre eux. |
US12/013,624 US7772041B2 (en) | 2005-08-30 | 2008-01-14 | Method of sealing or welding two elements to one another |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0552612A FR2890067B1 (fr) | 2005-08-30 | 2005-08-30 | Procede de scellement ou de soudure de deux elements entre eux |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2890067A1 FR2890067A1 (fr) | 2007-03-02 |
FR2890067B1 true FR2890067B1 (fr) | 2007-09-21 |
Family
ID=36581810
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0552612A Expired - Fee Related FR2890067B1 (fr) | 2005-08-30 | 2005-08-30 | Procede de scellement ou de soudure de deux elements entre eux |
Country Status (5)
Country | Link |
---|---|
US (1) | US7772041B2 (fr) |
EP (1) | EP1919822A1 (fr) |
JP (1) | JP2009506565A (fr) |
FR (1) | FR2890067B1 (fr) |
WO (1) | WO2007026093A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2473285A (en) * | 2009-09-08 | 2011-03-09 | Astron Advanced Materials Ltd | Low temperature joining process |
US8393526B2 (en) * | 2010-10-21 | 2013-03-12 | Raytheon Company | System and method for packaging electronic devices |
CN103384639B (zh) | 2011-02-10 | 2017-05-10 | 埃普科斯股份有限公司 | 包括凸点下金属化层的微机电系统器件 |
CN102371410A (zh) * | 2011-09-07 | 2012-03-14 | 中国航天科技集团公司第九研究院第七七一研究所 | 一种在晶圆上真空钎焊制作无空洞高可靠凸点的工艺 |
CN102923638B (zh) * | 2012-11-08 | 2016-02-03 | 姜利军 | 气密封装组件以及封装方法 |
FR3008228B1 (fr) | 2013-07-02 | 2015-07-17 | Commissariat Energie Atomique | Procede d'assemblage de deux composants electroniques, de type flip-chip par recuit uv, assemblage obtenu |
JP6314690B2 (ja) * | 2014-06-26 | 2018-04-25 | 株式会社島津製作所 | 真空容器の形成方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61206245A (ja) * | 1985-03-08 | 1986-09-12 | Sumitomo Metal Mining Co Ltd | ハ−メチツクシ−ルカバ−及びその製造方法 |
US5448014A (en) * | 1993-01-27 | 1995-09-05 | Trw Inc. | Mass simultaneous sealing and electrical connection of electronic devices |
FR2705832B1 (fr) * | 1993-05-28 | 1995-06-30 | Commissariat Energie Atomique | Procédé de réalisation d'un cordon d'étanchéité et de tenue mécanique entre un substrat et une puce hybridée par billes sur le substrat. |
US6008071A (en) * | 1995-09-20 | 1999-12-28 | Fujitsu Limited | Method of forming solder bumps onto an integrated circuit device |
FR2780200B1 (fr) * | 1998-06-22 | 2003-09-05 | Commissariat Energie Atomique | Dispositif et procede de formation d'un dispositif presentant une cavite a atmosphere controlee |
JP2000307016A (ja) * | 1999-04-19 | 2000-11-02 | Hitachi Ltd | 半導体装置、半導体モジュール及びその製造方法 |
US6969667B2 (en) * | 2002-04-01 | 2005-11-29 | Hewlett-Packard Development Company, L.P. | Electrical device and method of making |
US6879035B2 (en) * | 2003-05-02 | 2005-04-12 | Athanasios J. Syllaios | Vacuum package fabrication of integrated circuit components |
US20050253282A1 (en) * | 2004-04-27 | 2005-11-17 | Daoqiang Lu | Temperature resistant hermetic sealing formed at low temperatures for MEMS packages |
-
2005
- 2005-08-30 FR FR0552612A patent/FR2890067B1/fr not_active Expired - Fee Related
-
2006
- 2006-08-21 WO PCT/FR2006/050807 patent/WO2007026093A1/fr active Application Filing
- 2006-08-21 JP JP2008528559A patent/JP2009506565A/ja active Pending
- 2006-08-21 EP EP06808248A patent/EP1919822A1/fr not_active Withdrawn
-
2008
- 2008-01-14 US US12/013,624 patent/US7772041B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1919822A1 (fr) | 2008-05-14 |
FR2890067A1 (fr) | 2007-03-02 |
US7772041B2 (en) | 2010-08-10 |
US20080110013A1 (en) | 2008-05-15 |
JP2009506565A (ja) | 2009-02-12 |
WO2007026093A1 (fr) | 2007-03-08 |
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