EP1074043A4 - Process for ashing organic materials from substrates - Google Patents
Process for ashing organic materials from substratesInfo
- Publication number
- EP1074043A4 EP1074043A4 EP99904261A EP99904261A EP1074043A4 EP 1074043 A4 EP1074043 A4 EP 1074043A4 EP 99904261 A EP99904261 A EP 99904261A EP 99904261 A EP99904261 A EP 99904261A EP 1074043 A4 EP1074043 A4 EP 1074043A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrates
- organic materials
- ashing organic
- ashing
- materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/427—Stripping or agents therefor using plasma means only
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1469598A | 1998-01-28 | 1998-01-28 | |
US14695 | 1998-01-28 | ||
PCT/US1999/001560 WO1999039382A1 (en) | 1998-01-28 | 1999-01-26 | Process for ashing organic materials from substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1074043A1 EP1074043A1 (en) | 2001-02-07 |
EP1074043A4 true EP1074043A4 (en) | 2002-11-06 |
Family
ID=21767120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99904261A Ceased EP1074043A4 (en) | 1998-01-28 | 1999-01-26 | Process for ashing organic materials from substrates |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP1074043A4 (en) |
JP (1) | JP3358808B2 (en) |
KR (1) | KR100377711B1 (en) |
CN (1) | CN1154159C (en) |
CA (1) | CA2319018C (en) |
IL (1) | IL137513A (en) |
MY (1) | MY134851A (en) |
TW (1) | TWI239994B (en) |
WO (1) | WO1999039382A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6231775B1 (en) * | 1998-01-28 | 2001-05-15 | Anon, Inc. | Process for ashing organic materials from substrates |
US20050136681A1 (en) * | 2003-12-23 | 2005-06-23 | Tokyo Electron Limited | Method and apparatus for removing photoresist from a substrate |
KR100559947B1 (en) * | 2004-08-18 | 2006-03-13 | 동부아남반도체 주식회사 | Method for post treatment of metal wiring of semiconductor device |
US7387968B2 (en) | 2005-11-08 | 2008-06-17 | Tokyo Electron Limited | Batch photoresist dry strip and ash system and process |
US7381651B2 (en) * | 2006-03-22 | 2008-06-03 | Axcelis Technologies, Inc. | Processes for monitoring the levels of oxygen and/or nitrogen species in a substantially oxygen and nitrogen-free plasma ashing process |
US8043434B2 (en) * | 2008-10-23 | 2011-10-25 | Lam Research Corporation | Method and apparatus for removing photoresist |
CN104599962A (en) * | 2014-12-29 | 2015-05-06 | 上海华虹宏力半导体制造有限公司 | Thick aluminum etching polymer removing method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5037506A (en) * | 1990-09-06 | 1991-08-06 | Subhash Gupta | Method of stripping layers of organic materials |
JPH0475323A (en) * | 1990-07-17 | 1992-03-10 | Seiko Epson Corp | Removal method of resist |
FR2673763A1 (en) * | 1991-03-06 | 1992-09-11 | Centre Nat Rech Scient | Method of anisotropic etching of polymers by plasma |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59163826A (en) * | 1983-03-08 | 1984-09-14 | Toshiba Corp | Dry etching method |
EP0368732B1 (en) * | 1988-11-04 | 1995-06-28 | Fujitsu Limited | Process for forming resist mask pattern |
JP3084910B2 (en) * | 1992-03-18 | 2000-09-04 | ヤマハ株式会社 | Wiring formation method |
JPH05304089A (en) * | 1992-04-28 | 1993-11-16 | Dainippon Screen Mfg Co Ltd | Method and device of removing resist from surface of substrate |
JP2572924B2 (en) * | 1992-09-04 | 1997-01-16 | 醇 西脇 | Surface treatment method of metal by atmospheric pressure plasma |
US5550007A (en) * | 1993-05-28 | 1996-08-27 | Lucent Technologies Inc. | Surface-imaging technique for lithographic processes for device fabrication |
JP3391410B2 (en) * | 1993-09-17 | 2003-03-31 | 富士通株式会社 | How to remove resist mask |
US5824604A (en) * | 1996-01-23 | 1998-10-20 | Mattson Technology, Inc. | Hydrocarbon-enhanced dry stripping of photoresist |
US5763016A (en) * | 1996-12-19 | 1998-06-09 | Anon, Incorporated | Method of forming patterns in organic coatings films and layers |
-
1999
- 1999-01-26 KR KR10-2000-7008217A patent/KR100377711B1/en not_active IP Right Cessation
- 1999-01-26 CN CNB99802399XA patent/CN1154159C/en not_active Expired - Fee Related
- 1999-01-26 CA CA002319018A patent/CA2319018C/en not_active Expired - Fee Related
- 1999-01-26 JP JP2000529750A patent/JP3358808B2/en not_active Expired - Fee Related
- 1999-01-26 IL IL13751399A patent/IL137513A/en not_active IP Right Cessation
- 1999-01-26 MY MYPI99000277A patent/MY134851A/en unknown
- 1999-01-26 WO PCT/US1999/001560 patent/WO1999039382A1/en not_active Application Discontinuation
- 1999-01-26 EP EP99904261A patent/EP1074043A4/en not_active Ceased
- 1999-03-23 TW TW088101212A patent/TWI239994B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0475323A (en) * | 1990-07-17 | 1992-03-10 | Seiko Epson Corp | Removal method of resist |
US5037506A (en) * | 1990-09-06 | 1991-08-06 | Subhash Gupta | Method of stripping layers of organic materials |
FR2673763A1 (en) * | 1991-03-06 | 1992-09-11 | Centre Nat Rech Scient | Method of anisotropic etching of polymers by plasma |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 016, no. 291 (E - 1224) 26 June 1992 (1992-06-26) * |
See also references of WO9939382A1 * |
Also Published As
Publication number | Publication date |
---|---|
TWI239994B (en) | 2005-09-21 |
JP3358808B2 (en) | 2002-12-24 |
CA2319018A1 (en) | 1999-08-05 |
MY134851A (en) | 2007-12-31 |
IL137513A0 (en) | 2001-07-24 |
IL137513A (en) | 2004-05-12 |
EP1074043A1 (en) | 2001-02-07 |
CA2319018C (en) | 2004-08-24 |
JP2002502125A (en) | 2002-01-22 |
CN1154159C (en) | 2004-06-16 |
WO1999039382A1 (en) | 1999-08-05 |
KR20010040431A (en) | 2001-05-15 |
CN1289452A (en) | 2001-03-28 |
KR100377711B1 (en) | 2003-03-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20000808 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20020924 |
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AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE |
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17Q | First examination report despatched |
Effective date: 20030612 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED |
|
18R | Application refused |
Effective date: 20060413 |