EP0992183A1 - Component-handling machine - Google Patents

Component-handling machine

Info

Publication number
EP0992183A1
EP0992183A1 EP99911975A EP99911975A EP0992183A1 EP 0992183 A1 EP0992183 A1 EP 0992183A1 EP 99911975 A EP99911975 A EP 99911975A EP 99911975 A EP99911975 A EP 99911975A EP 0992183 A1 EP0992183 A1 EP 0992183A1
Authority
EP
European Patent Office
Prior art keywords
component
nozzle
pick
components
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99911975A
Other languages
German (de)
French (fr)
Inventor
Franciscus L. Vermeulen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Assembleon BV
Original Assignee
Koninklijke Philips Electronics NV
Assembleon BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV, Assembleon BV filed Critical Koninklijke Philips Electronics NV
Priority to EP99911975A priority Critical patent/EP0992183A1/en
Publication of EP0992183A1 publication Critical patent/EP0992183A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Definitions

  • the invention relates to a component-handling machine having a robot with a component-handling head which is provided with a vacuum pick-up nozzle and having means for creating a suction force at a nozzle opening of the pick-up nozzle for sucking a component to the nozzle opening and keeping it there.
  • Such component handling-machines are generally known, e.g. from US-A- 5 722 527 (PHN 15255), and used to pick up components, usually small components (SMDs), from a storage and place them on printed circuit boards.
  • the size of the opening of the pick-up nozzle is adapted to the size of the components to be picked up. For a specific pick-up nozzle only a few components, having sizes which are close to each other, can be used. If, e.g. smaller components should be picked up, a smaller opening of the nozzle must be used. This is done by exchanging the pick-up nozzle for another nozzle with a smaller suction opening.
  • the nozzle is adapted to pick up of a component of a certain size and this nozzle is used to pick up a smaller component, there is a risk that such a smaller component is totally sucked into the tube or sucked askew against the edge of the nozzle opening. If, on the other hand, bigger components should be picked up, there is a risk that the suction force is too small.
  • the component-handling machine is characterised in that the nozzle opening of the pick-up nozzle is provided with a gas-permeable cover against which components of different sizes can be sucked and held during operation.
  • the cover Due to this gas-permeable cover, a wide range of components can be picked up and placed e.g. on a printed circuit board without the necessity to stop the machine and change the pick-up nozzle.
  • the cover also causes an increase of the surface of the component on which the suction force is acting.
  • the invention results in greater flexibility and better handling of the placement process.
  • the cover represents a very simple and cheap means to solve the problem of changing the pick-up nozzle.
  • the picked up component is always positioned flat against the cover.
  • the suction force should, of course, be adapted to the largest component to be picked up.
  • DE-A-41 00 023 discloses a vacuum pick-up tube for SMD components having a diaphragm nozzle with an adjustable nozzle opening which can be adapted to the size of the components. Such a construction however is much more complicated.
  • a fine-meshed gauze or porous foam is used as the gas- permeable cover.
  • the invention also relates to a component-handling head having a pick-up nozzle for use in a component-handling machine as described above.
  • the invention also relates to a vacuum pick-up nozzle for use in a component-handling head of a component-handling machine as described above.
  • Fig.1 schematically shows a component-placement machine
  • Fig.2 shows a pick-up nozzle according to the invention.
  • the component-placement machine comprises a machine frame 1 to which a robot 2 is connected.
  • the robot comprises a slide 3 mounted on two parallel guide beams 4 of the frame.
  • the slide can be moved over the beams in the Y- direction.
  • a component-placement head 5 is fastened on the slide 3 and can be moved along the slide in the X-direction.
  • the component-placement head comprises a pick-up nozzle 6 which can be moved in the placement head in the Z-direction.
  • the pick-up nozzle can also 3 rotate about the Z-axis in order to make a rotational correction during the placement of components.
  • the machine has a transport mechanism for transporting printed circuit boards 7 through the machine.
  • the component-placement head 5 picks up components 9 from a storage or feeder 10 and places them on the printed circuit board 7.
  • the component-placement machine is provided with means 11 which create a suction force at the nozzle opening 12 of the pick-up nozzle 6.
  • Fig.2 the lower end part of the pick-up nozzle 6 is shown.
  • the nozzle is in the form of a metal tube.
  • the nozzle opening 12 is provided with a cover 13 of a gas-permeable material, such as a fine-meshed gauze or a porous foam.
  • the cover could be made of stiff material or flexible material stretched over the nozzle opening and fastened to the nozzle e.g. by means of a clamping bush 14 situated around the tube, or by laser welding.
  • a component 9 can be sucked up and held against the cover 13 by means of a suction force created at the nozzle opening 12.
  • the cover has a flat surface, the component always takes a flat position, i.e.
  • the surface of the component, on which the suction force is acting is defined by the size of the opening 12 of the nozzle.
  • gas air
  • Fig.2 the cover material between the edge 16 of the nozzle opening and the component 9, as indicated by arrows in Fig.2. This results in an increase of the surface area on which the suction force is acting, so that the component is held in a more reliable and more stable manner.
  • pick-up nozzles have a circular suction opening.
  • the 4 suction opening may also have a rectangular or oval shape.
  • component-handling machines are used for placing electronic components (chips, SMDs) on printed circuit boards or other substrates.
  • the invention can also be used in other kinds of component-handling machines, such as a component-taping machine. This is a machine in which components are placed in pockets of a tape which is subsequently wound on a reel. Later on the reeled tapes are used in a feeder for a component-placement machine to pick up the components and place them on a substrate.
  • the invention can also be used in machines for handling other components, e.g. small mechanical parts, which have to be picked up and placed in a certain position in or on a device.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)

Abstract

The invention relates to a vacuum pick-up nozzle (6) for use in a component-placement head of a component-placement machine. By means of the pick-up nozzle, components (9) to be placed on a printed circuit board can be picked up and held by a suction force. To increase the range of components which can be picked up by one nozzle, the nozzle opening (12) is provided with a gas-permeable cover (13) against which components of different sizes (9, 9a, 9b, 9c) can be sucked and held during operation.

Description

Component-handling machine.
The invention relates to a component-handling machine having a robot with a component-handling head which is provided with a vacuum pick-up nozzle and having means for creating a suction force at a nozzle opening of the pick-up nozzle for sucking a component to the nozzle opening and keeping it there.
Such component handling-machines are generally known, e.g. from US-A- 5 722 527 (PHN 15255), and used to pick up components, usually small components (SMDs), from a storage and place them on printed circuit boards. The size of the opening of the pick-up nozzle is adapted to the size of the components to be picked up. For a specific pick-up nozzle only a few components, having sizes which are close to each other, can be used. If, e.g. smaller components should be picked up, a smaller opening of the nozzle must be used. This is done by exchanging the pick-up nozzle for another nozzle with a smaller suction opening. If the nozzle is adapted to pick up of a component of a certain size and this nozzle is used to pick up a smaller component, there is a risk that such a smaller component is totally sucked into the tube or sucked askew against the edge of the nozzle opening. If, on the other hand, bigger components should be picked up, there is a risk that the suction force is too small.
It is an object of the invention to find a solution to the above- described problem, so that during operation of the component-handling machine the process of placing components can be continued while components of different sizes are used.
According to the invention, the component-handling machine is characterised in that the nozzle opening of the pick-up nozzle is provided with a gas-permeable cover against which components of different sizes can be sucked and held during operation. 2
Due to this gas-permeable cover, a wide range of components can be picked up and placed e.g. on a printed circuit board without the necessity to stop the machine and change the pick-up nozzle. The cover also causes an increase of the surface of the component on which the suction force is acting. The invention results in greater flexibility and better handling of the placement process. The cover represents a very simple and cheap means to solve the problem of changing the pick-up nozzle. The picked up component is always positioned flat against the cover. The suction force should, of course, be adapted to the largest component to be picked up.
It should be noted here that DE-A-41 00 023 discloses a vacuum pick-up tube for SMD components having a diaphragm nozzle with an adjustable nozzle opening which can be adapted to the size of the components. Such a construction however is much more complicated.
Preferably, a fine-meshed gauze or porous foam is used as the gas- permeable cover. The invention also relates to a component-handling head having a pick-up nozzle for use in a component-handling machine as described above.
The invention also relates to a vacuum pick-up nozzle for use in a component-handling head of a component-handling machine as described above.
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter.
In the drawings:
Fig.1 schematically shows a component-placement machine, Fig.2 shows a pick-up nozzle according to the invention.
In the schematic drawing of Fig. l, only the main parts of a component-placement machine are shown. The component-placement machine comprises a machine frame 1 to which a robot 2 is connected. The robot comprises a slide 3 mounted on two parallel guide beams 4 of the frame. The slide can be moved over the beams in the Y- direction. A component-placement head 5 is fastened on the slide 3 and can be moved along the slide in the X-direction. The component-placement head comprises a pick-up nozzle 6 which can be moved in the placement head in the Z-direction. The pick-up nozzle can also 3 rotate about the Z-axis in order to make a rotational correction during the placement of components. The machine has a transport mechanism for transporting printed circuit boards 7 through the machine. Only the conveyor belt 8 of this transport mechanism is shown. The component-placement head 5 picks up components 9 from a storage or feeder 10 and places them on the printed circuit board 7. For picking up a component, the component-placement machine is provided with means 11 which create a suction force at the nozzle opening 12 of the pick-up nozzle 6.
In Fig.2 the lower end part of the pick-up nozzle 6 is shown. The nozzle is in the form of a metal tube. According to the invention the nozzle opening 12 is provided with a cover 13 of a gas-permeable material, such as a fine-meshed gauze or a porous foam. The cover could be made of stiff material or flexible material stretched over the nozzle opening and fastened to the nozzle e.g. by means of a clamping bush 14 situated around the tube, or by laser welding. During operation of the machine, a component 9 can be sucked up and held against the cover 13 by means of a suction force created at the nozzle opening 12. As the cover has a flat surface, the component always takes a flat position, i.e. perpendicular to the central axis 15 of the nozzle. Different sizes of the components 9a,9b,9c can be used now, as is indicated by broken lines. Often a component is held to the nozzle opening in an off-center position, as shown for component 9b. Without a cover, this component 9b would be sucked askew against the edge 16 of the nozzle opening. This would result in an improper placement of the component on the printed circuit board, if no other appropriate steps were taken. Usually, such an improperly sucked up component will be detected by visual means and then removed. Due to the cover, component 9b remains in a flat and correct position.
Without a gas-permeable cover, the surface of the component, on which the suction force is acting, is defined by the size of the opening 12 of the nozzle. By virtue of the presence of the cover, gas (air) is also sucked through the cover material between the edge 16 of the nozzle opening and the component 9, as indicated by arrows in Fig.2. This results in an increase of the surface area on which the suction force is acting, so that the component is held in a more reliable and more stable manner.
The suction of gas (air) through the gas-permeable cover could lead to impurities being caught in the cover and hence to a reduction in suction force. If such a problem arises, a solution might be to instantaneously reverse the gas stream, i.e. blow out the impurities. This could be done just before picking up every component or e.g. before every tenth component to be picked up.
Usually pick-up nozzles have a circular suction opening. However, the 4 suction opening may also have a rectangular or oval shape.
Usually component-handling machines are used for placing electronic components (chips, SMDs) on printed circuit boards or other substrates. However, the invention can also be used in other kinds of component-handling machines, such as a component-taping machine. This is a machine in which components are placed in pockets of a tape which is subsequently wound on a reel. Later on the reeled tapes are used in a feeder for a component-placement machine to pick up the components and place them on a substrate. But the invention can also be used in machines for handling other components, e.g. small mechanical parts, which have to be picked up and placed in a certain position in or on a device.

Claims

CLAIMS:
1. A component-handling machine having a robot with a component handling head which is provided with a vacuum pick-up nozzle and having means for creating a suction force at a nozzle opening of the pick-up nozzle for sucking and a component to the nozzle opening and keeping it there, characterised in that the nozzle opening of the pick-up nozzle is provided with a gas-permeable cover against which components of different sizes can be sucked and held during operation.
2. A component-handling machine as claimed in claim 1, characterised in that the cover is a fine-meshed gauze.
3. A component-handling machine as claimed in claim 1, characterised in that the cover is made of a porous foam.
4. A component-handling head having a pick-up nozzle for use in a component-handling machine as claimed claim 1.
5. A vacuum pick-up nozzle for use in a component-handling head of a component-handling machine as claimed in claim 1.
EP99911975A 1998-04-28 1999-04-15 Component-handling machine Withdrawn EP0992183A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP99911975A EP0992183A1 (en) 1998-04-28 1999-04-15 Component-handling machine

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP98201372 1998-04-28
EP98201372 1998-04-28
PCT/IB1999/000663 WO1999056518A1 (en) 1998-04-28 1999-04-15 Component-handling machine
EP99911975A EP0992183A1 (en) 1998-04-28 1999-04-15 Component-handling machine

Publications (1)

Publication Number Publication Date
EP0992183A1 true EP0992183A1 (en) 2000-04-12

Family

ID=8233654

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99911975A Withdrawn EP0992183A1 (en) 1998-04-28 1999-04-15 Component-handling machine

Country Status (3)

Country Link
EP (1) EP0992183A1 (en)
JP (1) JP2002505624A (en)
WO (1) WO1999056518A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828304A (en) * 1986-09-09 1989-05-09 Kabushiki Kaisha Yakult Honsha Vacuum adsorption hand
DE3763395D1 (en) * 1986-11-10 1990-08-02 Haas Laser Systems Ag METHOD FOR TRANSPORTING PERFORATED PLATE-SHAPED OBJECTS.
US5208975A (en) * 1990-07-06 1993-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for mounting electronic parts
JP3058708B2 (en) * 1991-04-09 2000-07-04 松下電器産業株式会社 Component mounting machine
EP0554592B1 (en) * 1992-02-04 1995-12-13 House Food Industrial Co., Ltd. A suction-type robot hand
JP3368923B2 (en) * 1992-12-28 2003-01-20 松下電器産業株式会社 Electronic component mounting equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9956518A1 *

Also Published As

Publication number Publication date
WO1999056518A1 (en) 1999-11-04
JP2002505624A (en) 2002-02-19

Similar Documents

Publication Publication Date Title
JPH09293995A (en) Part vacuum-sucking method
US6868603B2 (en) Method of mounting component on circuit board
JP6240159B2 (en) Component mounter
EP0992183A1 (en) Component-handling machine
JP2001352196A (en) Electronic component mounting apparatus
CN212122307U (en) Full-automatic kludge of cell-phone PCBA board
JP4306303B2 (en) Electronic component mounting apparatus and electronic component mounting method
JP2011009315A (en) Device and method for mounting electronic component
JPH04105399A (en) Installating device for electronic component
JP7480081B2 (en) Component supply method and component removal device
US5048664A (en) Reciprocating staging fixture
KR100420875B1 (en) Method and apparatus for the delivery of belted components to an onserting apparatus
JPH06112687A (en) Flexible substrate supplying equipment
US20130170936A1 (en) Self-Aligning Pick and Place Collet for Tape and Reel Machine
JPH04304000A (en) Method of mounting chiplike circuit parts
JP2023007881A (en) Component mounting system and component mounting method
JP2566087Y2 (en) Electronic component mounting equipment
JP2579014Y2 (en) Component mounting device
JPH0719198Y2 (en) Chip-shaped electronic component mounting device template
JP2000107956A (en) Chip mounter
JPH0547519Y2 (en)
JP2023023749A (en) Work machine and method for placing component to placing area
JPH09321491A (en) Part mounting device
JPH08316696A (en) Component suction nozzle for mounting machine
JP2596012B2 (en) Electronic component suction device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): CH DE FR GB LI NL

17P Request for examination filed

Effective date: 20000504

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ASSEMBLEON N.V.

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN

18W Application withdrawn

Withdrawal date: 20011029