EP0970492B1 - Inductance de puce - Google Patents

Inductance de puce Download PDF

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Publication number
EP0970492B1
EP0970492B1 EP98924025A EP98924025A EP0970492B1 EP 0970492 B1 EP0970492 B1 EP 0970492B1 EP 98924025 A EP98924025 A EP 98924025A EP 98924025 A EP98924025 A EP 98924025A EP 0970492 B1 EP0970492 B1 EP 0970492B1
Authority
EP
European Patent Office
Prior art keywords
winding
coil core
chip inductor
lugs
system carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP98924025A
Other languages
German (de)
English (en)
Other versions
EP0970492A1 (fr
Inventor
Gerhard Proks
Elmar Walter
Hans-Dieter Eckardt
Manfred Espenhain
Jörg-Rudolf MAIER
Kurt Marth
Wilfried Scherer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP0970492A1 publication Critical patent/EP0970492A1/fr
Application granted granted Critical
Publication of EP0970492B1 publication Critical patent/EP0970492B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H01F2027/295—Surface mounted devices with flexible terminals

Definitions

  • the invention relates to a chip inductor with a wound coil core, which is arranged standing on pads that are part of a system carrier.
  • Such a chip inductance is from the EP 0 212 812 A1 known.
  • This embodiment in which the board-side end face of the core and the connecting parts lie in the system tray level, is characterized in that the influence of the metallic system carrier parts is reduced to the electromagnetic field produced by the coil.
  • it is difficult to position the bobbin and the electrical pads with sufficient accuracy on the leadframe terminals.
  • a miniature inductive component in which a wound ferrite core is placed on a system carrier with connection tabs and glued to this. Measures for positioning the ferrite core are not mentioned in the document.
  • the object of the present invention is therefore to further develop the chip inductance of the type mentioned at the beginning in such a way that a better positioning accuracy of coil core and electrical contacts on the terminals is achieved, without degrading the electrical properties.
  • the pads have tabs with which the coil core is positioned and fixed and which serve the electrical connection of winding and terminals, that the coil core is located within a space that exists between the Stirnebenen the spool and the tabs , And that the remaining parts of the connections are arranged outside this space.
  • a bobbin 1 is arranged with arranged winding 2.
  • the bobbin 1 is with its board-side end face on pads 5, which are part of a system support 6 made of sheet metal.
  • the winding tension causes bending of the terminals 5 due to their elasticity.
  • tumbling movements of the coil core 1 which exclude precise winding patterns and, consequently, too lead to increased dispersion of the electrical coil data.
  • the connections to reduce the core tumbling must be prevented as close as possible to the core 1 on the movement.
  • the adjacent bobbins are connected to each other by the system carrier for automated production, which are on the system carriers per bobbin two winding bases.
  • the winding wire sections between guide plates and the winding support points lie after winding on the connections in the system carrier level, which are formed perpendicular to the longitudinal direction of the system carrier. In this case, hold-downs would be required from both sides of the system carrier, but the winding wire sections passing through the connections and the winding support points would be disturbing.
  • the known design requires a two-sided, mechanical cutting of the winding wire sections not required for the application.
  • the automated production is also carried out with the system carriers 6, on which per coil core 1 but only one winding support 8 is.
  • the winding wire sections 9 between the lugs 7 and the winding support 8 are not after winding on the terminals in system tray level, which are formed parallel to the longitudinal direction of the system carrier 6.
  • connection and system support structure can be realized for the Starkdrahteln hold-down from one side of the system, so that the winding sections 9 and the winding support 8 are not in the work area of the hold-down. Furthermore, in the embodiment according to the invention, only one-sided cutting of the unwanted winding wire sections 9 is required.
  • the embodiment according to the invention therefore leads to closer tolerancing of the electrical coil data through better reproducible winding patterns and to easier separation of the excess winding wire.
  • welded joints are required because they are more temperature stable than solder joints.
  • a direct welding connection by means of the known ultrasonic method is associated with cycle times of about 1 s and therefore leads to high production costs.
  • the tabs 4 which improve the positioning of the spool core 1 and the adhesive strength, are partly formed with and partly without winding hooks. With wrap hooks, they also serve as electrical connections positioned with low tolerances. For Starkdrahtwicklitch those tabs 4, where the electrical connection of the coil end and terminal is divided by two slots 10, wherein the part connected to the winding 2 part flaps prevent the springing of the winding wire, since they are not melted, while the through the winding wire section 9 with the Winding base 8 connected part flaps the material for the Welding beads for indirect laser welding according to DE 44 32 740 A1 deliver.
  • the chip inductances are separated by disconnecting the terminals 5 at the dashed lines 12 from the system carrier 6.
  • the electrical connections are made, which are required for soldering in boards.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)

Claims (5)

  1. Inductance pastille comprenant un noyau (1) de bobine enroulé, qui est disposé verticalement sur des surfaces (5) de connexion faisant partie d'un support (6) de système ,
    caractérisée
    en ce que les surfaces (5) de connexion ont des pattes (7) par lesquelles le noyau (1) de bobine est mis en position et est immobilisé et qui servent à la liaison électrique de l'enroulement (2) et de bornes, en ce que le noyau (1) de bobine se trouve à l'intérieur d'un espace qui est constitué entre les plans frontaux du noyau (1) de bobine et les pattes (7) et en ce que les autres parties des bornes sont disposées à l'extérieur de cet espace.
  2. Inductance pastille suivant la revendication 1,
    caractérisée en ce que
    le noyau (1) de bobine est fixé au support (6) de système au moyen d'un joint collé.
  3. Inductance pastille suivant la revendication 1 ou 2,
    caractérisée en ce que
    les extrémités (9) de bobine sont reliées aux pattes (7) s'appliquant au noyau (1) de bobine au moyen d'un soudage laser indirect.
  4. Inductance pastille suivant l'une des revendications 1 ou 3,
    caractérisée en ce que
    les pattes (7) reliées aux extrémités (9) de bobine sont en deux parties et en ce qu'une partie fournit la matière pour une perle de soudage.
  5. Inductance pastille suivant l'une des revendications 1 à 4,
    caractérisée en ce que
    elle est montée en ayant les bornes parallèles à la direction longitudinale de la bande support sur un support (6) de système, qui n'a qu'un point (8) d'appui d'enroulement par inductance pastille.
EP98924025A 1997-03-27 1998-03-19 Inductance de puce Expired - Lifetime EP0970492B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19713147A DE19713147C2 (de) 1997-03-27 1997-03-27 Chip-Induktivität
DE19713147 1997-03-27
PCT/DE1998/000812 WO1998044518A1 (fr) 1997-03-27 1998-03-19 Inductance de puce

Publications (2)

Publication Number Publication Date
EP0970492A1 EP0970492A1 (fr) 2000-01-12
EP0970492B1 true EP0970492B1 (fr) 2007-08-15

Family

ID=7824948

Family Applications (1)

Application Number Title Priority Date Filing Date
EP98924025A Expired - Lifetime EP0970492B1 (fr) 1997-03-27 1998-03-19 Inductance de puce

Country Status (5)

Country Link
US (1) US6249208B1 (fr)
EP (1) EP0970492B1 (fr)
JP (1) JP2001516509A (fr)
DE (2) DE19713147C2 (fr)
WO (1) WO1998044518A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005027943A1 (de) * 2005-06-16 2006-12-28 Epcos Ag Trägervorrichtung für eine Ringkerndrossel, Halterung für ein induktives Bauelement und induktives Bauelement

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3001600C2 (de) * 1980-01-17 1982-02-11 Siemens AG, 1000 Berlin und 8000 München Verfahren zur festen Verbindung elektrischer Anschlußelemente mit einem elektrischen Bauelement
JPS58223306A (ja) * 1982-06-22 1983-12-24 Toko Inc リ−ドレス型固定インダクタの製造方法
DE3510638C1 (de) * 1985-03-23 1986-10-16 Neosid Pemetzrieder Gmbh & Co Kg, 5884 Halver Induktives Miniatur-Bauelement, insbesondere Miniatur-Spule sowie Verfahren zur Herstellung eines solchen Bauelements
JPS625618A (ja) * 1985-07-02 1987-01-12 Matsushita Electric Ind Co Ltd チツプ・インダクタ
FR2606544B1 (fr) * 1986-11-07 1990-05-18 Thomson Csf Inductance
DE4039527C1 (fr) * 1990-12-11 1992-06-25 Siemens Matsushita Components Gmbh & Co. Kg, 8000 Muenchen, De
JPH04273112A (ja) 1991-02-28 1992-09-29 Murata Mfg Co Ltd モールド型チップ電子部品
DE4432740A1 (de) * 1994-09-14 1996-03-21 Siemens Matsushita Components Chip-Induktivität

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
EP0970492A1 (fr) 2000-01-12
DE19713147C2 (de) 1999-09-09
DE19713147A1 (de) 1998-10-08
WO1998044518A1 (fr) 1998-10-08
US6249208B1 (en) 2001-06-19
JP2001516509A (ja) 2001-09-25
DE59814075D1 (de) 2007-09-27

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