EP0962720A2 - Belüftungssystem für einen Raum zur Planarisierung - Google Patents

Belüftungssystem für einen Raum zur Planarisierung Download PDF

Info

Publication number
EP0962720A2
EP0962720A2 EP99107384A EP99107384A EP0962720A2 EP 0962720 A2 EP0962720 A2 EP 0962720A2 EP 99107384 A EP99107384 A EP 99107384A EP 99107384 A EP99107384 A EP 99107384A EP 0962720 A2 EP0962720 A2 EP 0962720A2
Authority
EP
European Patent Office
Prior art keywords
chamber
section
planarization
platen
exhaust
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99107384A
Other languages
English (en)
French (fr)
Other versions
EP0962720A3 (de
Inventor
Kazuhiko Hirata
Hisato Matsubara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SpeedFam Co Ltd
Original Assignee
SpeedFam Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SpeedFam Co Ltd filed Critical SpeedFam Co Ltd
Publication of EP0962720A2 publication Critical patent/EP0962720A2/de
Publication of EP0962720A3 publication Critical patent/EP0962720A3/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/02—Ducting arrangements
    • F24F13/06—Outlets for directing or distributing air into rooms or spaces, e.g. ceiling air diffuser
    • F24F13/068—Outlets for directing or distributing air into rooms or spaces, e.g. ceiling air diffuser formed as perforated walls, ceilings or floors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
    • F24F13/08—Air-flow control members, e.g. louvres, grilles, flaps or guide plates
    • F24F13/082—Grilles, registers or guards
    • F24F2013/088—Air-flow straightener

Definitions

  • the present invention relates to a ventilation structure of a planarization chamber housing a planarization apparatus such as a polishing or lapping apparatus.
  • FIG. 10 is a schematic sectional view of a ventilation structure of a polishing chamber of the related art.
  • a polishing chamber 1 housing a polishing apparatus 100 is defined by a ceiling section 10, a floor section 11, and four side sections 12.
  • the polishing apparatus 100 is provided with a lower platen 101 and a carrier 102 capable of picking up and holding a wafer W.
  • This polishing apparatus as shown by the two-dot chain line in FIG. 10, polishes the wafer W picked up and held by the carrier 102 by pressing and rotating the wafer W on the rotating lower platen 101.
  • a not shown slurry is supplied on to the lower platen 101 to increase the efficiency of polishing the wafer W. Coagulated abrasive of the slurry, polishing dross, and other particles are sprayed into the air in the chamber 1.
  • the ventilation structure of the polishing chamber exhausts these particles to the outside and is comprised of intake ducts 2-1, 2-2 provided at the ceiling section 10 and an exhaust blower 3 provided at a side section 12.
  • the particles lower than the polishing surface 101a were liable to be lifted up to the polishing surface side of the lower platen 101 by the suction force of the exhaust blower 3, deposit on the polishing surface of the lower platen 101, and again enter between the wafer W and the lower platen 101.
  • An object of the present invention is to provide a ventilation structure of a planarization chamber which prevents the scratching of a workpiece by making the flow of air in the planarization chamber substantially laminar and thereby eliminating the lifting and agitation of the particles.
  • a ventilation structure of a planarization chamber for ventilating a planarization chamber which houses a planarization apparatus having a rotatable platen and rotatable pressing member for pressing a workpiece to the platen and which has a first section into which the platen is built, comprising: an intake duct provided at a section of the planarization chamber having a second section facing the first section and to which a dust collecting filter is attached; an exhaust device provided at least at one of the sections of the planarization chamber having side sections connected air-tightly to the sides of the first and second sections and the first section; and a perforated chamber defined near the inside of the second section facing substantially the entire second section and having a large number of perforations formed substantially uniformly at a surface facing the first section.
  • the air outside the planarization chamber is sucked into the perforated chamber from the intake duct provided at the second section and fills the perforated chamber. Further, the air filled in the perforated chamber is ejected from the large number of perforations formed substantially uniformly at the surface facing the first section. The air forms a substantially laminar flow which flows to the first section side, then is exhausted outside of the chamber by the exhaust device.
  • the diameter of the perforations of the perforated chamber is set to a value between 3 mm and 5 mm and the number of the perforations is set so that the sum of the areas of the openings of the perforations becomes a value between 10 percent and 20 percent of the area of the surface at which the perforations are formed.
  • an exhaust chamber is defined by a partition, attached inside the planarization chamber in a state loosely fit over the platen of the planarization apparatus by a hole so as to form a space around the platen, the first section, and the side sections and wherein an exhaust device is attached to at least one of the side sections and first section of the exhaust chamber.
  • a predetermined number of intake holes are provided in the partition of the exhaust chamber.
  • a ventilation structure of a planarization chamber for ventilating a planarization chanter which houses a planarization apparatus having a rotatable platen and rotatable pressing member for pressing a workpiece to the platen and which has a first section into which the platen is built, comprising: an intake duct provided at a section of the planarization chamber comprising a second section facing the first section and to which a dust collecting filter is attached; an exhaust chamber defined by a partition, attached inside the planarization chamber in a state loosely fit over the platen of the planarization apparatus by a hole so as to form a space around the platen, the first section, and side sections; and an exhaust device attached to at least one of the side sections and first section of the exhaust chamber.
  • a predetermined number of holes are provided in the partition of the exhaust chamber.
  • FIG. 1 is a schematic sectional view of a ventilation structure of a polishing chamber according to a first embodiment of the present invention. Note that members the same as members shown in FIG. 10 and FIG. 11 are explained given the same reference numerals.
  • a lower platen 101 of a polishing apparatus 100 is arranged inside a polishing chamber 1 in a state with the polishing surface 101a facing upward.
  • This lower platen 101 is designed to be driven to rotate by a motor 111 inside a drive chamber 110 below the floor section 11 defining part of the polishing chamber 1.
  • a carrier 102 (pressing member) of the polishing apparatus 100 is designed to be elevated or descend, oscillate, and rotate by a not shown elevator mechanism, oscillation mechanism, and rotation mechanism.
  • reference numeral 103 is an index table.
  • the carrier 102 is designed to pick up an unpolished wafer W (workpiece) arranged on this index table 103 and convey it to the polishing surface 101a of the lower platen 101 and to return the polished wafer W to the index table 103.
  • the polishing chamber 1 houses the polishing apparatus 100. Specifically, the polishing chamber 1 is defined by a floor section 11 (first section), a ceiling section 10 facing the floor section 11 (second section), and four side sections 12 connected air-tightly to the sides of the floor section 11 and ceiling section 10.
  • the ventilation structure of this polishing chamber 1 is comprised of intake ducts 2-1, 2-2 to which filter units 4-1, 4-2 are attached, a perforated chamber 5, and an exhaust blower 3 (exhaust device).
  • the intake ducts 2-1, 2-2 convey outside air to the inside of the polishing chamber 1. As shown in FIG. 2, the intake duct 2-1 is formed at substantially the center of the left half portion of the ceiling section 10 from the center line L, while the intake duct 2-2 is formed at substantially the center of the right half portion.
  • the filter units 4-1, 4-2 have ventilation fans 40 and dust-collecting filters 41 and are attached to the intake ducts 2-1, 2-2 in a state with the filters 41 facing downward. Due to this, when the ventilation fans 40 are driven, outside air can be made to flow into the polishing chamber 1.
  • the perforated chamber 5 is designed to make the air flowing from the intake ducts 2-1, 2-2 laminar and eject it to the inside of the polishing chamber 1 and is defined near the bottom of the ceiling section 10 facing substantially the entire surface of the ceiling section 10.
  • a perforated plate 50 is attached in parallel to the bottom of the ceiling section 10.
  • the center portion between the ceiling section 10 and the perforated plate 50 is partitioned by a partition 51.
  • the perforated plate 50 as shown in FIG. 3, is formed with a large number of perforations 52 substantially uniformly across the entire surface of the perforated plate 50.
  • the diameter of the perforations 52 is set to a value between 3 mm and 5 mm and the number of the perforations 52 is set so that the sum of the areas of the openings of the perforations 52 becomes a value between 10 percent and 20 percent of the area of the perforated plate 50.
  • the exhaust blower 3 is for exhausting air descending in the laminar flow state from the perforated chamber 5 to the outside of the polishing chamber 1.
  • the exhaust blower 3 is attached to the side section 12 of the left side in FIG. 1 and is arranged to be somewhat higher than the polishing surface 101a of the lower platen 101.
  • an unpolished wafer W is held by the carrier 102.
  • the wafer W is pressed against the polishing surface 101a of the rotating lower platen 101 and in that state the carrier 102 is made to rotate, whereupon the wafer W is polished by the polishing surface 101a of the lower platen 101.
  • Polishing dross or not shown coagulated abrasive etc. of slurry is sprayed around the lower platen 101 as the particles P.
  • the filter units 4-1, 4-2 are driven before this polishing operation, the outside air is sucked through the intake ducts 2-1, 2-2 to the perforated chamber 5 and the pressure inside the perforated chamber 5 rises.
  • the air A inside the perforated chamber 5 is ejected to the inside of the polishing chamber 1 from the large number of perforations 52 at a constant pressure. As shown by the arrows, it forms a laminar flow as a whole and descends.
  • the particles P pushed down to the floor section 11 side are exhausted to the outside of the polishing chamber 1 together with the air A.
  • FIG. 6 is a schematic sectional view of a ventilation structure of a polishing chamber according to a second embodiment of the present invention. Note that members the sane as members shown in FIG. 1 to FIG. 5 are explained given the same reference numerals.
  • the ventilation structure of a polishing chamber of this embodiment defines an exhaust chamber 6 below the lower platen 101 of the polishing apparatus 100 and has the exhaust blower 3 attached to this chamber 6.
  • a partition 60 having a hole 61 larger than the diameter of the lower platen 101 is loosely fit over the lower platen 101 through the hole 61, whereby a space 62 is formed between the hole 61 of the partition 60 and the lower platen 101.
  • the peripheral edges of the partition 60 are attached to a partition 63 standing on the floor section 11 and the side sections 12 to define the exhaust chamber 6. Further, the partition 63 is provided an intake hole 64 for communicating the polishing chamber 1 and the exhaust chamber 6.
  • the exhaust blower 3 is attached at a location at the left side of FIG. 6 corresponding to the exhaust chamber 6.
  • the particles P sprayed around the lower platen 101 during polishing operation are sucked into the exhaust chamber 6 together with the air A and then exhausted to the outside of the polishing chamber 1 by the exhaust blower 3.
  • FIG. 9 is a schematic sectional view of a ventilation structure of a polishing chamber according to a third embodiment of the present invention. Note that members the same as members shown in FIG. 1 to FIG. 8 are explained given the same reference numerals.
  • the ventilation structure of the polishing chamber of this embodiment is a combination of the ventilation structures of the first and second embodiments.
  • the exhaust blower 3 was arranged above the polishing surface 101a of the lower platen 101, so the situation might occur of the particles P pushed down to the floor section 11 side rising to close to the polishing surface 101a due to the suction force of the exhaust blower 3.
  • a perforated chamber 5 is provided below the ceiling section 10 having the intake ducts 2-1, 2-2 provided with the filter units 4-1, 4-2 and, in the same way as the second embodiment, an exhaust chamber 6 is provided below the lower platen 101 and an exhaust blower 3 is attached to this exhaust chamber 6.
  • the invention may also of course be applied to a lapping chamber and lapping apparatus.
  • partition plate 51 was provided in the perforated chamber 5 to divide the space in the perforated chamber into two, it is also possible not to provide the partition plate 51 and make the inside of the perforated chamber 5 a single space.
  • the two intake ducts 2-1, 2-2 not be provided, but a single intake duct 2-1 be provided at the center of the ceiling section 10 and a single filter unit 4-1 be attached to this intake duct 2-1.
  • the air ejected from the perforated chamber forms a substantially laminar flow which flows to a first section into which the platen of the polishing apparatus is built
  • the polishing dross of the workpiece formed during the polishing operation and the coagulated abrasive and other particles of the slurry are led to the first section side by the substantially laminar flow of air and exhausted by an exhaust device to the outside of the polishing chamber.
  • the air ejected from the perforated chamber can be made substantially completely a laminar flow in state and the effect of prevention of scratches can be further raised.
  • the particles sprayed around the platen are guided to the partition side of the exhaust chamber by the laminar flow of air and further the particles are sucked from the space between the platen and the hole of the partition to the inside of the exhaust chamber, so it is possible to reliably exhaust the particles sprayed around the platen to the outside of the polishing chamber.
  • the particles sprayed around the platen can be sucked through the space between the hole of the partition and the platen into the exhaust chamber and exhausted to the outside.
EP99107384A 1998-06-05 1999-04-23 Belüftungssystem für einen Raum zur Planarisierung Withdrawn EP0962720A3 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10174106A JPH11347937A (ja) 1998-06-05 1998-06-05 研磨加工室の換気構造
JP17410698 1998-06-05

Publications (2)

Publication Number Publication Date
EP0962720A2 true EP0962720A2 (de) 1999-12-08
EP0962720A3 EP0962720A3 (de) 2000-07-12

Family

ID=15972762

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99107384A Withdrawn EP0962720A3 (de) 1998-06-05 1999-04-23 Belüftungssystem für einen Raum zur Planarisierung

Country Status (3)

Country Link
EP (1) EP0962720A3 (de)
JP (1) JPH11347937A (de)
KR (1) KR20000005667A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006056095A1 (de) * 2004-11-26 2006-06-01 LK Luftqualität AG Flächenelement zur temperierung von raumluft
CN101693354A (zh) * 2002-12-27 2010-04-14 株式会社荏原制作所 基片抛光方法
NL2004886C2 (nl) * 2010-06-14 2011-12-15 Jong Air B V Luchtverversingsysteem en werkwijze.

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4708966B2 (ja) * 2005-11-11 2011-06-22 株式会社ディスコ 切削装置
CN102155771B (zh) * 2011-03-30 2013-02-27 四川电力设计咨询有限责任公司 汽机房降温通风系统及方法
JP5850788B2 (ja) * 2012-04-10 2016-02-03 株式会社ディスコ 切削装置
JP6927814B2 (ja) * 2017-09-08 2021-09-01 株式会社ディスコ ドライ研磨装置
CN107457705A (zh) * 2017-09-22 2017-12-12 彭欣莉 一种自动化多角度打磨装置
CN108581846A (zh) * 2018-04-25 2018-09-28 安徽天顺环保设备股份有限公司 一种车间用打磨除尘工作台

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1318364A (en) * 1969-09-15 1973-05-31 Nesher Ag Apparatus for controlling delivery of clean gas to a clean environment
FR2485698A1 (fr) * 1980-06-24 1981-12-31 Aurore Sa Poste de travail a ecoulements laminaires
GB2106240A (en) * 1981-09-22 1983-04-07 Howorth Air Eng Ltd Air-conditioned workstation
EP0710803A1 (de) * 1994-10-22 1996-05-08 Howorth Airtech Limited System für saubere Luft
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1318364A (en) * 1969-09-15 1973-05-31 Nesher Ag Apparatus for controlling delivery of clean gas to a clean environment
FR2485698A1 (fr) * 1980-06-24 1981-12-31 Aurore Sa Poste de travail a ecoulements laminaires
GB2106240A (en) * 1981-09-22 1983-04-07 Howorth Air Eng Ltd Air-conditioned workstation
EP0710803A1 (de) * 1994-10-22 1996-05-08 Howorth Airtech Limited System für saubere Luft
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101693354A (zh) * 2002-12-27 2010-04-14 株式会社荏原制作所 基片抛光方法
US7883394B2 (en) 2002-12-27 2011-02-08 Ebara Corporation Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
US8292694B2 (en) 2002-12-27 2012-10-23 Ebara Corporation Substrate holding mechanism, substrate polishing apparatus and substrate polishing method
WO2006056095A1 (de) * 2004-11-26 2006-06-01 LK Luftqualität AG Flächenelement zur temperierung von raumluft
CN100575805C (zh) * 2004-11-26 2009-12-30 Lk空气质量股份公司 用于热学地调节室内空气的扁平构件
NL2004886C2 (nl) * 2010-06-14 2011-12-15 Jong Air B V Luchtverversingsysteem en werkwijze.

Also Published As

Publication number Publication date
KR20000005667A (ko) 2000-01-25
EP0962720A3 (de) 2000-07-12
JPH11347937A (ja) 1999-12-21

Similar Documents

Publication Publication Date Title
EP0649705B1 (de) Trockengleitschleifenvorrichtung
EP0962720A2 (de) Belüftungssystem für einen Raum zur Planarisierung
US6106375A (en) Apparatus for processing waste liquid and waste gas in polishing device
JP3923067B2 (ja) 空気調和機
US4178654A (en) Floor polishing machines
US6783427B2 (en) Polishing system with air exhaust system
JP3992722B2 (ja) 空気調和機
JP3803130B2 (ja) ポリッシング装置及びポリッシング方法
JP2006183997A6 (ja) 空気調和機
US20020081962A1 (en) Clean room and method for fabricating semiconductor device
EP1195124B1 (de) Durchflusssystem für Staubsauger
JPH0938855A (ja) 端面研磨装置
KR200433114Y1 (ko) 그라인딩 디스크구조
JP7383118B2 (ja) 研削装置
JP3673792B2 (ja) ポリッシング装置
CN214723422U (zh) 一种砂光机废屑吸附装置
CN212550630U (zh) 一种集成电路板除尘装置
US11813716B2 (en) Substrate processing apparatus having chamber cover
JPH11151410A (ja) ミストの吸引除去装置
JP4943478B2 (ja) ポリッシング装置
JPS63139667A (ja) 回転研磨機の研磨部材
JPS6427611A (en) Air cleaner
KR20210137734A (ko) 로봇청소기
JPS61167420A (ja) バツグ・フイルタ装置
GB2416142A (en) A sander with dust extraction means

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

RIC1 Information provided on ipc code assigned before grant

Free format text: 7F 24F 13/068 A, 7F 24F 3/16 B

AKX Designation fees paid
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20010115