EP0894271A1 - Dispositif pour introduire au moins un composant a semiconducteur dans un logement - Google Patents

Dispositif pour introduire au moins un composant a semiconducteur dans un logement

Info

Publication number
EP0894271A1
EP0894271A1 EP97920713A EP97920713A EP0894271A1 EP 0894271 A1 EP0894271 A1 EP 0894271A1 EP 97920713 A EP97920713 A EP 97920713A EP 97920713 A EP97920713 A EP 97920713A EP 0894271 A1 EP0894271 A1 EP 0894271A1
Authority
EP
European Patent Office
Prior art keywords
semiconductor component
movement
gas
test
receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP97920713A
Other languages
German (de)
English (en)
Inventor
Harro MÖWES
Hans-Joachim Kremer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MCI Computer GmbH
Original Assignee
MCI Computer GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MCI Computer GmbH filed Critical MCI Computer GmbH
Publication of EP0894271A1 publication Critical patent/EP0894271A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • the invention relates to a device for inserting at least one semiconductor component into a receptacle, in particular into a test base for testing the electrical function of the semiconductor component.
  • the test station here has a plurality of test bases with receiving spaces into which the semiconductor components are automatically inserted through a receiving opening.
  • the semiconductor components to be tested are located in recesses in a transport tray that is moved under a test head of the test station.
  • the test head has several test bases which are positioned in accordance with the arrangement of the receiving recesses in the transport tray.
  • the receiving spaces of the test bases are open towards the bottom, so that the semiconductor components are moved into the receiving spaces of the test bases by lifting them out of the receiving recesses of the transport tray. Movement elements in the form of stamp-like projections, which are arranged on a common carrier, serve this purpose.
  • the semiconductor modules or the test socket may be damaged.
  • the semiconductor modules in the transport tray are not so precisely aligned relative to the test head that they move exactly upwards into the receiving spaces the test base can be fitted. Rather, the semiconductor components are only pushed into the desired position by the force of the stamp-like movement elements, in which position they can then be pressed through the receiving openings into the receiving spaces of the test base. For example, the connecting legs of the semiconductor components can bend.
  • the test bases wear out relatively quickly due to the strong friction of the semiconductor components, which is why they often have to be replaced.
  • the object of the invention is to create a device for inserting at least one semiconductor component into a receptacle, in which the risk of damage to the semiconductor component and / or the receptacle is reduced.
  • the invention provides a device for inserting at least one semiconductor component into a receptacle, in particular into a test base for testing the electrical function of the semiconductor component, the device being provided with at least one receiving space for the semiconductor component, the receiving space having a receiving opening, and at least one moving element for moving the semiconductor component in one direction of movement through the receiving opening into the receiving space, the moving element being a gas cushion generating device which produces a gas cushion which moves the semiconductor component into at least the receiving opening.
  • the device according to the invention has a moving element which is provided with a gas cushion generating device.
  • the semiconductor component At least in the phase of movement of the semiconductor component, within which the semiconductor component is moved into the receiving opening, there is a gas cushion between the end of the movement element facing the semiconductor component and the semiconductor component itself. If the semiconductor component is therefore moved into the receptacle from below, it floats on the gas cushion until it is in the receptacle opening of the receptacle space. The semiconductor component is centered in the receiving opening, which leads to movements of the semiconductor component relative to the movement element. Since the movement element is not yet mechanically in contact with the semiconductor component, the centering of the semiconductor component is therefore carried out gently, both for the semiconductor component itself and for the receptacle, which is in the case of a IC test station is the test socket. This significantly reduces wear and the risk of damage.
  • semiconductor components can thus be gently moved with little effort and low friction when transferred into a receptacle, for example a test base for testing the electrical function of the semiconductor component.
  • a receptacle for example a test base for testing the electrical function of the semiconductor component.
  • greater motive forces than those that can be generated by the gas cushion are required in order to move the semiconductor component completely into the receiving space.
  • test sockets for SOJ ICs In these test sockets, the IC with its connecting legs must be brought into mechanical contact with spring-loaded contact tongues of the test socket. This requires a certain minimum force that can as can no longer be applied by moving the moving element with the gas cushion generated on it in the direction of the semiconductor component without touching the semiconductor component. Therefore, it can happen that after the centering of the semiconductor component in the receiving opening of the test socket for SOJ-ICs, these are completely moved into the test socket by the movement element resting on the semiconductor component and by advancing the latter introduces the test socket.
  • the gas cushion generating device should in any case be sufficient to move the semiconductor component completely into the receiving space of the receptacle without mechanical contact with the movement element.
  • the gas cushion generating device has at least one gas outlet opening, which is arranged in the front surface of the movement element assigned to the semiconductor element and facing the semiconductor element.
  • This gas outlet opening is preferably designed as a diffuser.
  • the diffuser is in particular a spiral, which is arranged in the gas outlet opening.
  • the gas cushion generating device is also expediently provided with a gas flow generating device. see that is connected via gas supply lines to the gas outlet openings of the movement elements.
  • a plurality of movement elements are preferably arranged on a common carrier in order to be able to simultaneously move a multiplicity of semiconductor components into the receptacles assigned to them.
  • the gas supply lines of the movement elements are connected to one another and coupled together with the gas flow generating device.
  • the gas cushion generating device is designed as a closed air circuit, so that the gas emerging via the gas outlet openings is fed back to the gas supply lines.
  • the gas cushion generating device is preferably provided with a heating / cooling device for tempering the gas forming the gas cushion.
  • This configuration has the advantage that the semiconductor components to be tested by the can be brought to a desired temperature with tempered gas in order to be able to check the function of the semiconductor components at these temperatures.
  • the entire device is accommodated in a housing which is sealed off from the surroundings and which is thermally insulated from the surroundings in particular.
  • FIG. 1 schematically shows a cross-sectional view through a test station for semiconductor components, the semiconductor components being located in receiving recesses in a transport tray,
  • FIG. 2 shows a sectional view similar to that of FIG. 1, the semiconductor components being lifted out of the recesses in the transport tray and centered and prepositioned in the recesses in the test base,
  • FIG. 3 shows a sectional view of the test station in the case of semiconductor components completely moved into the test base by means of the movement elements
  • Fig. 4 is a sectional view along the plane IV-IV of Fig. 3 and
  • FIG. 5 shows a sectional view similar to that according to FIG. 4, but for an alternative embodiment of the invention.
  • FIGs. 1 to 3 are sectional views through a test station 10 in different operating positions.
  • the test station 10 is used to check the electrical functions of ICs 12.
  • Each IC 12 has a plastic housing 14 with connecting legs 16 protruding laterally therefrom, which are angled downward and bent at their ends towards the underside 18 of the housing 14.
  • the semiconductor components are located in receiving recesses 20 of a transport tray 22 with which they are brought into the test station 10.
  • the transport tray 22 has cutouts 23 on its underside, which are connected to the receiving recesses 20.
  • the receiving recesses 20 and the recesses 23 thus form transversely through the transport tray 22 7/40393 PC17EP97 / 01948
  • the transport tray 22 is located within the test station 10 between a test head 24 with a plurality of test bases 26 on the one hand and a movement member 28 for transferring the ICs 12 from the receiving recesses 20 into the test base 26 of the test head 24.
  • the movement member 28 has a carrier plate 30 with a channel 32 which extends through the plate 30 in extension.
  • the carrier plate 30 also has a plurality of protruding movement elements 34 which are positioned in accordance with the arrangement of the receiving recesses 20 of the transport tray 22.
  • Channels 36 which are connected to the channel 32, extend through the movement elements 34.
  • the channels 36 end at the free ends 38 of the movement elements 34 facing away from the plate 30. Openings 40 are located on these ends 38 facing the undersides 18 of the IC housing 14.
  • the movement element 28 is connected to an air flow generation pump 42 which supplies the channel 32 with air via a connecting line 44. This air emerges from the movement elements 34 via the channels 36 and the openings 40.
  • Each of the test sockets 26 has a receiving space 46 for receiving an IC 12.
  • the receiving space 46 there are contact tongues 48 for making electrical contact with the connection pins 16 of the ICs.
  • the contact tongues 48 At their free ends 50 facing the movement elements, the contact tongues 48 have sloping sections 52 which form a centering area 54 for the ICs 12. Furthermore, the free ends 50 define a receiving opening 56 of the receiving space 46, through which the latter is accessible from the outside.
  • the ICs 12 are raised and moved through the receiving openings 56 into the receiving areas 46 of the test base 26, where they are centered by the inclined sections 52 of the contact tongues 48.
  • This situation is shown in Fig. 2. In this situation, either the IC housings 14 are in contact with the contact tongues 48 or the connection legs 16 are in contact with the contact tongues 48.
  • the electrical functions of the ICs 12 are now tested.
  • the ICs 12 are then switched off using a mechanism which is not described in more detail here the test base 26 and into the receiving recesses 20 of the transport tray 22, whereupon the transport tray 22 is moved out of the test station 10.
  • the air cushion generating device 62 consisting of the movement element 28 with the channels 32 and 36 and the pump 42 enables the ICs 12 to be positioned gently in the region of the receiving openings 56 of the test socket 26, which leads to a reduction in wear and tear the risk of damage to both the ICs 12 and the test head 24.
  • FIG. 5 shows an alternative embodiment of the outlet openings 40 of the movement elements 34. According to FIG. 5, there are spiral elements 64 in the openings 40, as a result of which the openings 40 are designed as diffuser openings 66. The electrical functions at different temperatures of the ICs 12 can be checked in a particularly simple manner with the test station 10.
  • a heating and cooling device 68 is introduced into the air flow system, which brings the air emerging as air cushion 60 to a desired temperature.
  • the test station 10 is therefore suitable for testing the ICs 12 both at low temperatures (for example up to -50 ° C.), at room temperature and at high temperatures (for example up to approximately 85 ° C.).
  • the test station 10 should be provided with a closed air circuit so that cooled or heated air can escape from the test station 10 into the environment and penetration of ambient air into the Test station 10 is prevented.
  • the air return system required for the closed ventilation circuit is not shown in the drawing.
  • the test station 10 or the test head 24 should be equipped with heating and / or cooling devices.
  • the test head 24 can be designed as a block housing that can be cooled or heated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un dispositif pour introduire au moins un composant à semiconducteur dans un logement, notamment dans un socle pour tester le fonctionnement électrique du composant à semiconducteur. Ce dispositif est pourvu d'au moins un espace de logement (46) pour le composant à semiconducteur (12), présentant une ouverture (56). Ce dispositif présente en outre au moins un élément (34) pour déplacer le composant à semiconducteur (12) dans un sens de déplacement (58) à travers l'ouverture (56) dans l'espace de logement (46). L'élément de mouvement (34) présente un dispositif (62) qui génère un coussin de gaz (60) déplaçant le composant à semiconducteur (12) au moins jusqu'à l'intérieur de l'ouverture (56).
EP97920713A 1996-04-19 1997-04-18 Dispositif pour introduire au moins un composant a semiconducteur dans un logement Withdrawn EP0894271A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19615674 1996-04-19
DE19615674A DE19615674A1 (de) 1996-04-19 1996-04-19 Meßvorrichtung für integrierte Schaltkreise
PCT/EP1997/001948 WO1997040393A1 (fr) 1996-04-19 1997-04-18 Dispositif pour introduire au moins un composant a semiconducteur dans un logement

Publications (1)

Publication Number Publication Date
EP0894271A1 true EP0894271A1 (fr) 1999-02-03

Family

ID=7791870

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97920713A Withdrawn EP0894271A1 (fr) 1996-04-19 1997-04-18 Dispositif pour introduire au moins un composant a semiconducteur dans un logement

Country Status (5)

Country Link
US (1) US6204675B1 (fr)
EP (1) EP0894271A1 (fr)
DE (1) DE19615674A1 (fr)
TW (1) TW355747B (fr)
WO (1) WO1997040393A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8441275B1 (en) * 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
MY168237A (en) * 2012-10-12 2018-10-15 Jf Microtechnology Sdn Bhd Ground contact of an integrated circuit testing apparatus
US9846193B2 (en) * 2014-05-14 2017-12-19 Asm Technology Singapore Pte Ltd Semiconductor package testing apparatus
CN110007213B (zh) * 2019-04-19 2021-06-15 重庆慧聚成江信息技术合伙企业(有限合伙) 一种防损伤的具有固定功能的高精度芯片检测设备
KR102808608B1 (ko) * 2023-01-25 2025-05-20 주식회사 아테코 디바이스 성능 테스트 시스템

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US4009785A (en) * 1974-10-02 1977-03-01 Motorola, Inc. Fixture and system for handling plate like objects
US4257637A (en) * 1979-09-28 1981-03-24 International Business Machines Corporation Contactless air film lifting device
DE3440896A1 (de) * 1984-11-09 1986-06-05 Heinz Dahinten Vorrichtung zum temperieren integrierter elektronischer bauteile
US4781494A (en) * 1986-05-16 1988-11-01 Daymarc Corporation Air-assist accumulating and transfer unit for an electronic device test handler
JPH0680602B2 (ja) * 1987-11-28 1994-10-12 株式会社村田製作所 電子部品チップ保持治具および電子部品チップ取扱い方法
DE3812202A1 (de) * 1988-04-13 1989-10-26 Heigl Helmuth Vorrichtung zum aufnehmen, kontaktieren und sortieren von elektronischen bauteilen
ES2043970T3 (es) * 1988-07-15 1994-01-01 Balzers Hochvakuum Dispositivo de fijacion para un disco, asi como su aplicacion.
US4940935A (en) * 1989-08-28 1990-07-10 Ried Ashman Manufacturing Automatic SMD tester
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5169196A (en) * 1991-06-17 1992-12-08 Safabakhsh Ali R Non-contact pick-up head
US5208529A (en) 1991-07-03 1993-05-04 Sym-Tek Systems, Inc. Electric device contact assembly
JP3270871B2 (ja) 1993-04-28 2002-04-02 ソニー株式会社 半導体装置の測定用ソケット
DE4338071C2 (de) * 1993-11-08 1997-12-04 Helmuth Dr Heigl Vorrichtung zur Aufnahme von elektronischen Bauelementen
JPH08304509A (ja) * 1995-04-28 1996-11-22 Advantest Corp 半導体試験装置

Non-Patent Citations (1)

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Title
See references of WO9740393A1 *

Also Published As

Publication number Publication date
DE19615674A1 (de) 1997-10-23
WO1997040393A1 (fr) 1997-10-30
TW355747B (en) 1999-04-11
US6204675B1 (en) 2001-03-20

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