TW355747B - Device for inserting at least one semiconductor component into a receiving portion - Google Patents

Device for inserting at least one semiconductor component into a receiving portion

Info

Publication number
TW355747B
TW355747B TW086105094A TW86105094A TW355747B TW 355747 B TW355747 B TW 355747B TW 086105094 A TW086105094 A TW 086105094A TW 86105094 A TW86105094 A TW 86105094A TW 355747 B TW355747 B TW 355747B
Authority
TW
Taiwan
Prior art keywords
semiconductor component
receiving portion
receiving
moving
receiving space
Prior art date
Application number
TW086105094A
Other languages
English (en)
Inventor
Harro Moewes
Hans-Joachim Kremer
Original Assignee
Mci Comp Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mci Comp Gmbh filed Critical Mci Comp Gmbh
Application granted granted Critical
Publication of TW355747B publication Critical patent/TW355747B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW086105094A 1996-04-19 1997-04-19 Device for inserting at least one semiconductor component into a receiving portion TW355747B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19615674A DE19615674A1 (de) 1996-04-19 1996-04-19 Meßvorrichtung für integrierte Schaltkreise

Publications (1)

Publication Number Publication Date
TW355747B true TW355747B (en) 1999-04-11

Family

ID=7791870

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105094A TW355747B (en) 1996-04-19 1997-04-19 Device for inserting at least one semiconductor component into a receiving portion

Country Status (5)

Country Link
US (1) US6204675B1 (zh)
EP (1) EP0894271A1 (zh)
DE (1) DE19615674A1 (zh)
TW (1) TW355747B (zh)
WO (1) WO1997040393A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8441275B1 (en) * 2010-01-14 2013-05-14 Tapt Interconnect, LLC Electronic device test fixture
MY168237A (en) * 2012-10-12 2018-10-15 Jf Microtechnology Sdn Bhd Ground contact of an integrated circuit testing apparatus
US9846193B2 (en) * 2014-05-14 2017-12-19 Asm Technology Singapore Pte Ltd Semiconductor package testing apparatus
CN110007213B (zh) * 2019-04-19 2021-06-15 重庆慧聚成江信息技术合伙企业(有限合伙) 一种防损伤的具有固定功能的高精度芯片检测设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4009785A (en) * 1974-10-02 1977-03-01 Motorola, Inc. Fixture and system for handling plate like objects
US4257637A (en) * 1979-09-28 1981-03-24 International Business Machines Corporation Contactless air film lifting device
DE3440896A1 (de) * 1984-11-09 1986-06-05 Heinz Dahinten Vorrichtung zum temperieren integrierter elektronischer bauteile
US4781494A (en) * 1986-05-16 1988-11-01 Daymarc Corporation Air-assist accumulating and transfer unit for an electronic device test handler
JPH0680602B2 (ja) * 1987-11-28 1994-10-12 株式会社村田製作所 電子部品チップ保持治具および電子部品チップ取扱い方法
DE3812202A1 (de) * 1988-04-13 1989-10-26 Heigl Helmuth Vorrichtung zum aufnehmen, kontaktieren und sortieren von elektronischen bauteilen
ATE95949T1 (de) * 1988-07-15 1993-10-15 Balzers Hochvakuum Haltevorrichtung fuer eine scheibe sowie anwendung derselben.
US4940935A (en) * 1989-08-28 1990-07-10 Ried Ashman Manufacturing Automatic SMD tester
DE4109908C2 (de) * 1991-03-26 1994-05-05 Erich Reitinger Anordnung zur Prüfung von Halbleiter-Wafern
US5169196A (en) * 1991-06-17 1992-12-08 Safabakhsh Ali R Non-contact pick-up head
US5208529A (en) 1991-07-03 1993-05-04 Sym-Tek Systems, Inc. Electric device contact assembly
JP3270871B2 (ja) 1993-04-28 2002-04-02 ソニー株式会社 半導体装置の測定用ソケット
DE4338071C2 (de) * 1993-11-08 1997-12-04 Helmuth Dr Heigl Vorrichtung zur Aufnahme von elektronischen Bauelementen
JPH08304509A (ja) * 1995-04-28 1996-11-22 Advantest Corp 半導体試験装置

Also Published As

Publication number Publication date
US6204675B1 (en) 2001-03-20
EP0894271A1 (de) 1999-02-03
WO1997040393A1 (de) 1997-10-30
DE19615674A1 (de) 1997-10-23

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