EP0849775A3 - Anlage und Verfahren zur Abscheidung aus der Dampfphase - Google Patents
Anlage und Verfahren zur Abscheidung aus der Dampfphase Download PDFInfo
- Publication number
- EP0849775A3 EP0849775A3 EP97122152A EP97122152A EP0849775A3 EP 0849775 A3 EP0849775 A3 EP 0849775A3 EP 97122152 A EP97122152 A EP 97122152A EP 97122152 A EP97122152 A EP 97122152A EP 0849775 A3 EP0849775 A3 EP 0849775A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- vapor deposition
- rotator
- wafer substrate
- wafer
- feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007740 vapor deposition Methods 0.000 title abstract 6
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 5
- 239000010409 thin film Substances 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 230000007704 transition Effects 0.000 abstract 1
Classifications
-
- H01L21/205—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45502—Flow conditions in reaction chamber
- C23C16/45508—Radial flow
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
- H01L21/02573—Conductivity type
- H01L21/02579—P-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP354382/96 | 1996-12-19 | ||
JP8354382A JPH10177961A (ja) | 1996-12-19 | 1996-12-19 | 気相成長装置及び気相成長方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0849775A2 EP0849775A2 (de) | 1998-06-24 |
EP0849775A3 true EP0849775A3 (de) | 1999-04-28 |
Family
ID=18437188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP97122152A Withdrawn EP0849775A3 (de) | 1996-12-19 | 1997-12-16 | Anlage und Verfahren zur Abscheidung aus der Dampfphase |
Country Status (5)
Country | Link |
---|---|
US (1) | US6132519A (de) |
EP (1) | EP0849775A3 (de) |
JP (1) | JPH10177961A (de) |
KR (1) | KR100490013B1 (de) |
TW (1) | TW432492B (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10177961A (ja) * | 1996-12-19 | 1998-06-30 | Toshiba Ceramics Co Ltd | 気相成長装置及び気相成長方法 |
JPH1167675A (ja) * | 1997-08-21 | 1999-03-09 | Toshiba Ceramics Co Ltd | 高速回転気相薄膜形成装置及びそれを用いる高速回転気相薄膜形成方法 |
WO2007072863A1 (ja) * | 2005-12-20 | 2007-06-28 | Sintokogio, Ltd. | 投射機による投射条件情報の推定方法及びその装置 |
JP2009021533A (ja) * | 2007-06-15 | 2009-01-29 | Nuflare Technology Inc | 気相成長装置及び気相成長方法 |
JP2011171450A (ja) * | 2010-02-17 | 2011-09-01 | Nuflare Technology Inc | 成膜装置および成膜方法 |
US9196471B1 (en) | 2012-06-01 | 2015-11-24 | Yen Fui Choo | Scanner for wafers, method for using the scanner, and components of the scanner |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5972718A (ja) * | 1982-10-20 | 1984-04-24 | Toshiba Corp | 縦型気相成長装置 |
US4709655A (en) * | 1985-12-03 | 1987-12-01 | Varian Associates, Inc. | Chemical vapor deposition apparatus |
JPH0590167A (ja) * | 1991-09-30 | 1993-04-09 | Toshiba Corp | 気相成長方法 |
JPH0750260A (ja) * | 1991-04-23 | 1995-02-21 | Toshiba Corp | 気相成長装置 |
JPH08291385A (ja) * | 1995-04-20 | 1996-11-05 | Tokyo Electron Ltd | 処理装置のシャワーヘッド構造及び処理ガスの供給方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2043966A (en) * | 1934-04-21 | 1936-06-09 | Kathon Ltd | Apparatus for depositing metal by electrode dispersion |
JPH06140335A (ja) * | 1992-10-23 | 1994-05-20 | Fujitsu Ltd | 成膜装置 |
JPH06283449A (ja) * | 1993-03-24 | 1994-10-07 | Tokyo Electron Ltd | 真空排気方法及び真空装置 |
JPH07201756A (ja) * | 1993-12-28 | 1995-08-04 | Tokyo Electron Ltd | 熱処理装置 |
JPH0745524A (ja) * | 1993-07-28 | 1995-02-14 | Hitachi Ltd | 半導体製造装置 |
JPH07111259A (ja) * | 1993-10-09 | 1995-04-25 | Tokyo Electron Ltd | プラズマ処理装置 |
JP3077516B2 (ja) * | 1994-07-15 | 2000-08-14 | 住友金属工業株式会社 | プラズマ処理装置 |
JPH10177961A (ja) * | 1996-12-19 | 1998-06-30 | Toshiba Ceramics Co Ltd | 気相成長装置及び気相成長方法 |
-
1996
- 1996-12-19 JP JP8354382A patent/JPH10177961A/ja active Pending
-
1997
- 1997-12-16 US US08/991,409 patent/US6132519A/en not_active Expired - Lifetime
- 1997-12-16 EP EP97122152A patent/EP0849775A3/de not_active Withdrawn
- 1997-12-17 KR KR1019970069900A patent/KR100490013B1/ko not_active IP Right Cessation
- 1997-12-18 TW TW086119168A patent/TW432492B/zh not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5972718A (ja) * | 1982-10-20 | 1984-04-24 | Toshiba Corp | 縦型気相成長装置 |
US4709655A (en) * | 1985-12-03 | 1987-12-01 | Varian Associates, Inc. | Chemical vapor deposition apparatus |
JPH0750260A (ja) * | 1991-04-23 | 1995-02-21 | Toshiba Corp | 気相成長装置 |
JPH0590167A (ja) * | 1991-09-30 | 1993-04-09 | Toshiba Corp | 気相成長方法 |
JPH08291385A (ja) * | 1995-04-20 | 1996-11-05 | Tokyo Electron Ltd | 処理装置のシャワーヘッド構造及び処理ガスの供給方法 |
US5595606A (en) * | 1995-04-20 | 1997-01-21 | Tokyo Electron Limited | Shower head and film forming apparatus using the same |
Non-Patent Citations (4)
Title |
---|
GADGIL P N: "OPTIMIZATION OF A STAGNATION POINT FLOW REACTOR DESIGN FOR METALORGANIC CHEMICAL VAPOR DEPOSITION BY FLOW VISUALIZATION", JOURNAL OF CRYSTAL GROWTH, vol. 134, no. 3/04, 1 December 1993 (1993-12-01), pages 302 - 312, XP000415696 * |
PATENT ABSTRACTS OF JAPAN vol. 008, no. 181 (E - 261) 21 August 1984 (1984-08-21) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 431 (E - 1411) 10 August 1993 (1993-08-10) * |
PATENT ABSTRACTS OF JAPAN vol. 095, no. 005 30 June 1995 (1995-06-30) * |
Also Published As
Publication number | Publication date |
---|---|
EP0849775A2 (de) | 1998-06-24 |
TW432492B (en) | 2001-05-01 |
KR100490013B1 (ko) | 2005-09-02 |
KR19980064236A (ko) | 1998-10-07 |
US6132519A (en) | 2000-10-17 |
JPH10177961A (ja) | 1998-06-30 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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RHK1 | Main classification (correction) |
Ipc: H01L 21/205 |
|
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REG | Reference to a national code |
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RTI1 | Title (correction) |
Free format text: VAPOUR DEPOSITION METHOD |
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STAA | Information on the status of an ep patent application or granted ep patent |
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18D | Application deemed to be withdrawn |
Effective date: 20030614 |