EP0754095B1 - Buse permettant l'application dosee de gouttes de colle - Google Patents

Buse permettant l'application dosee de gouttes de colle Download PDF

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Publication number
EP0754095B1
EP0754095B1 EP95913854A EP95913854A EP0754095B1 EP 0754095 B1 EP0754095 B1 EP 0754095B1 EP 95913854 A EP95913854 A EP 95913854A EP 95913854 A EP95913854 A EP 95913854A EP 0754095 B1 EP0754095 B1 EP 0754095B1
Authority
EP
European Patent Office
Prior art keywords
adhesive
nozzle
coating
drops
nozzle according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95913854A
Other languages
German (de)
English (en)
Other versions
EP0754095A1 (fr
Inventor
Johann Melf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0754095A1 publication Critical patent/EP0754095A1/fr
Application granted granted Critical
Publication of EP0754095B1 publication Critical patent/EP0754095B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter

Definitions

  • the metering device arranged in the positioning unit of the SMD placement machine is lowered until the spacer sits on the printed circuit board, the shock caused by this being absorbed by the adhesive cartridge being deflected.
  • an adhesive drop is then pressed onto the circuit board by pressurized air with the adhesive cartridge, the amount of adhesive metered in depending on the metering time and the pressure applied to the adhesive cartridge by depends on the nozzle geometry and the viscosity of the adhesive.
  • the dynamic viscosity in turn depends on the temperature of the adhesive.
  • a cooling and / or heating device for temperature stabilization of the adhesive passed through can therefore also be assigned to the dosing nozzle (cf. EP-A-0 282 748).
  • the influence of the nozzle geometry on the amount of adhesive added is achieved by using nozzles of different sizes consciously exploited.
  • the dosing nozzles must therefore be carried out regularly Intervals are cleaned or exchanged.
  • plastic nozzles are also used, which according to contamination caused by adhesive residues sticking easily thrown away and replaced with new nozzles.
  • WO-A-91 12 921 describes a device for metering Applying drops of adhesive known to a substrate, at which the adhesive continuously in an annular Metal pipe is circulated.
  • glue in the metal tube is its inner wall with an anti-adhesive, adhesive-repellent coating provided, for example, from polytetraflurethylene consists.
  • This anti-adhesive, adhesive-repellent coating however, does not extend to the actual one Dosing nozzle in the lower area of the annular metal tube is appropriate.
  • the invention specified in claim 1 is based on the problem a nozzle for the dosed application of adhesive drops to create a substrate that is lighter from adhesive residue can be exempt and also an extension which enables cleaning intervals.
  • the advantages achieved by the invention are, in particular, that the anti-adhesive coating of the nozzle is not or only slightly wetted by the adhesive and that, in addition to improved metering accuracy, it is also possible to achieve a considerable extension of the cleaning intervals.
  • the good heat conduction of the metal facilitates the temperature stabilization of the adhesive passed through the nozzle with the aid of a cooling and / or heating device. It is to be regarded as surprising that with the small outlet-side inner diameters of the nozzles, which for example are 0.3 mm, 0.44 mm and 0.6 mm in an adhesive application station of an SMD production line, an anti-adhesive coating which achieves the desired effect on the Inner wall of a nozzle made of metal can be applied at all.
  • polytetrafluoroethylene can only be exploited by applying it as a surface layer to a base layer made of nickel or a nickel alloy.
  • a base layer enables the surface layer made of polytetrafluoroethylene to be adapted to the inner wall of the nozzle body, which is otherwise not or only difficult to coat.
  • the design according to claim 5 enables permanent anti-adhesive coating, even after several cleaning processes is still fully effective.
  • a layer thickness of the whole Coating of about 10 microns according to claim 6 has it was found to be optimal.
  • Figure 1 shows a dosing nozzle labeled DD, which as exchangeable nozzle in the adhesive application station SMD production line is used.
  • DD dosing nozzle labeled
  • existing dosing nozzle DD has in the shown Embodiment an inner diameter in the entry area of 4.2 mm. At the outlet end of the dosing nozzle DD the inner diameter is 0.44 mm. These are around a medium-sized metering nozzle.
  • the other two in the dosing nozzles used in the same adhesive application station have an inside diameter of 0.3 at the outlet end mm and 0.6 mm.
  • the longitudinal section shown in Figure 2 through the exit area the dosing nozzle DD shows that the inner wall and the End face in the exit area with a coating B are provided. It is an anti-adhesive, adhesive-repellent coating B, which is shown in FIG those areas where it is shown to improve the function and to simplify the maintenance of the Dosing nozzles DD are required. In fact, the coating B all over the inside and outside of the dosing nozzle DD applied.
  • a total coating B having a layer thickness of approximately 10 ⁇ m from an unrecognizable base layer and one anti-adhesive, adhesive-repellent surface layer.
  • the Base layer consists of a chemically applied nickel-phosphorus alloy, while polytetrafluoroethylene as the surface layer is applied, which is usually briefly called PTFE referred to as.

Landscapes

  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)

Claims (6)

  1. Busette pour déposer de manière dosée des gouttes de colle sur un substrat, notamment pour le poste de dépôt de colle d'une ligne de fabrication SMD, comportant
    un élément en métal formant busette, et comportant
    un revêtement (B) anti-adhésif, repoussant la colle, déposé sur la paroi intérieure, au moins dans la zone de sortie,
    le revêtement (a) comprenant une couche de base en nickel ou en un alliage à base de nickel et une couche de surface en polytétrafluoréthylène.
  2. Busette suivant la revendication 1, caractérisée en ce que le revêtement (B) s'étend aussi sur la surface frontale dans la zone de sortie.
  3. Busette suivant la revendication 1 ou 2, caractérisée par un élément formant busette en aluminium ou en un alliage à base d'aluminium.
  4. Busette suivant les revendications 1 à 3, caractérisée par une couche de base en un alliage nickel-phosphore déposé par voie chimique.
  5. Busette suivant l'une des revendications précédentes, caractérisée en ce que le revêtement (B) est déposé en ayant une épaisseur de couche de 5 à 15 µm.
  6. Busette suivant l'une des revendications précédentes, caractérisée en ce que le revêtement (B) est déposé en ayant une épaisseur de couche d'environ 10 µm.
EP95913854A 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle Expired - Lifetime EP0754095B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE9405332U 1994-03-29
DE9405332U DE9405332U1 (de) 1994-03-29 1994-03-29 Düse zum dosierten Auftragen von Klebstofftropfen
PCT/DE1995/000387 WO1995026237A1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Publications (2)

Publication Number Publication Date
EP0754095A1 EP0754095A1 (fr) 1997-01-22
EP0754095B1 true EP0754095B1 (fr) 1998-11-11

Family

ID=6906693

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95913854A Expired - Lifetime EP0754095B1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Country Status (3)

Country Link
EP (1) EP0754095B1 (fr)
DE (2) DE9405332U1 (fr)
WO (1) WO1995026237A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165115A (ja) * 1997-12-04 1999-06-22 Fuji Photo Film Co Ltd 光ディスク製造用スピンコート装置
JP5465168B2 (ja) * 2010-12-27 2014-04-09 日本発條株式会社 粘性液体供給ノズルへの潤滑性メッキ層の形成方法及び粘性液体供給ノズル
DE102020127868A1 (de) 2020-10-22 2022-04-28 Baumer Hhs Gmbh Klebstoffauftragsvorrichtung mit verbesserter Düse

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1219843A (fr) * 1982-11-15 1987-03-31 Robert A. Kidder Debiteur de colle
DE3903897A1 (de) * 1989-02-10 1990-08-16 Continental Ag Vorrichtung zum herstellen, ver- und/oder bearbeiten von kautschukmischungen
SE465756B (sv) * 1990-03-02 1991-10-28 Qenico Ab Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat

Also Published As

Publication number Publication date
WO1995026237A1 (fr) 1995-10-05
EP0754095A1 (fr) 1997-01-22
DE9405332U1 (de) 1994-07-28
DE59504226D1 (de) 1998-12-17

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