EP0754095A1 - Buse permettant l'application dosee de gouttes de colle - Google Patents

Buse permettant l'application dosee de gouttes de colle

Info

Publication number
EP0754095A1
EP0754095A1 EP95913854A EP95913854A EP0754095A1 EP 0754095 A1 EP0754095 A1 EP 0754095A1 EP 95913854 A EP95913854 A EP 95913854A EP 95913854 A EP95913854 A EP 95913854A EP 0754095 A1 EP0754095 A1 EP 0754095A1
Authority
EP
European Patent Office
Prior art keywords
adhesive
nozzle
coating
nozzle according
drops
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP95913854A
Other languages
German (de)
English (en)
Other versions
EP0754095B1 (fr
Inventor
Johann Melf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0754095A1 publication Critical patent/EP0754095A1/fr
Application granted granted Critical
Publication of EP0754095B1 publication Critical patent/EP0754095B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
    • B05B15/50—Arrangements for cleaning; Arrangements for preventing deposits, drying-out or blockage; Arrangements for detecting improper discharge caused by the presence of foreign matter

Definitions

  • adhesive doses are first applied by means of a metering device arranged in a positioning unit, onto which the SD modules are then placed.
  • the adhesive then hardens through exposure to temperature or UV radiation.
  • the SMD-blocks are then fixed in the correct position as determined on the circuit board, 'that the electrical connection in the wave soldering, vapor phase can be produced by reflow soldering or soldering in.
  • the metering devices used for applying the adhesive essentially consist of an adhesive cartridge which is arranged in a resilient holder and can be pressurized with compressed air, a metering nozzle inserted into the adhesive cartridge and a spacer assigned to the metering nozzle.
  • this metering device which is arranged in the positioning unit of the SMD placement machine, is lowered until the spacer is seated on the printed circuit board, the impact caused thereby being absorbed by the adhesive cartridge being deflected.
  • an adhesive drop is then pressed onto the circuit board by pressurized air with the adhesive cartridge, the amount of adhesive metered in depending on the metering time and the pressure applied to the adhesive cartridge by depends on the nozzle geometry and the viscosity of the adhesive. The dynamic viscosity in turn depends on the temperature of the adhesive.
  • a cooling and / or heating device for temperature stabilization of the adhesive passed through can therefore also be assigned to the dosing nozzle (cf. EP-A-0 282 748).
  • the influence of the nozzle geometry on the metered amount of adhesive is deliberately exploited by using nozzles of different sizes. However, if there are changes in the nozzle geometry due to the deposition of adhesive residues, this leads to an undesirable reduction in the amount of adhesive added.
  • the dosing nozzles must therefore be cleaned or replaced at regular intervals. In order to avoid the difficult and time-consuming cleaning of the metering nozzles, plastic nozzles are also used, which after being contaminated by adhesive residues simply being thrown away and replaced by new nozzles.
  • the problem specified in the invention is based on the problem of creating a nozzle for the metered application of drops of adhesive to a substrate, which can be more easily freed of adhesive residues and also enables the cleaning intervals to be extended.
  • the advantages achieved by the invention are, in particular, that the anti-adhesive coating of the nozzle is not or only slightly wetted by the adhesive and that, in addition to improved dosing accuracy, a considerable extension of the cleaning intervals can also be achieved. It is to be regarded as surprising that with the small outlet-side inner diameters of the nozzles, which for example are 0.3 mm, 0.44 mm and 0.6 mm in an adhesive application station of an SMD production line, an anti-adhesive coating achieving the desired effect is applied at all can be.
  • the extension of the anti-adhesive coating over the end face in the outlet area of the nozzle according to claim 2 facilitates the detachment of the adhesive drops from the nozzle. Because the entire drop of glue comes off and no glue gets stuck, this leads to a further increase in dosing accuracy.
  • the embodiment according to claim 3 facilitates the temperature stabilization of the adhesive passed through the nozzle with the aid of a cooling and / or heating device due to the good heat conduction of the metal.
  • the use of aluminum or aluminum alloys according to claim 4 has proven to be a particularly economical solution with a very good thermal conductivity of the metal.
  • the development according to claim 5 is characterized by the particularly good antiadhesive properties of the coating consisting of polytetrafluoroethylene.
  • the embodiment according to claim 6 enables the Ar-matching of an anti-adhesive surface layer to a material of the nozzle body that is otherwise not or only difficult to coat.
  • nickel or nickel alloys have proven particularly useful.
  • the embodiment according to claim 9 enables a permanent anti-adhesive coating which is still fully effective even after several cleaning processes.
  • a layer thickness of the entire coating of approximately 10 ⁇ m has been found to be optimal.
  • Figure 1 is a side view of a nozzle for the metered application of adhesive drops on a substrate and
  • FIG. 2 shows a partial longitudinal section through the outlet area of the nozzle shown in FIG. 1.
  • FIG. 1 shows a dosing nozzle labeled DD, which is used as a replaceable nozzle in the adhesive application station of an SMD production line.
  • the dosing nozzle DD consisting of AlMgSilF28, for example, has an inner diameter in the inlet area of 4.2 mm.
  • the inside diameter at the outlet end of the dosing nozzle DD is 0.44 mm. It is a medium-sized metering nozzle.
  • the other two dosing nozzles used in the same adhesive application station have inside diameters of 0.3 mm and 0.6 mm at the outlet end.
  • a coating B This is an antiadhesive, adhesive-repellent coating B, which is shown in FIG. 2 only in those areas in which they are required to improve the function and to simplify maintenance of the dosing nozzles DD. In fact, the coating B is applied over the entire surface inside and outside to the dosing nozzle DD.
  • a coating B having a total layer thickness of approximately 10 ⁇ m consists of a base layer, which cannot be identified in more detail, and an anti-adhesive, adhesive-repellent surface layer.
  • the base layer consists of a chemically applied nickel-phosphorus alloy, while polytetrafluoroethylene, which is usually referred to as PTFE for short, is applied as the surface layer.
  • PTFE polytetrafluoroethylene

Landscapes

  • Coating Apparatus (AREA)
  • Materials For Medical Uses (AREA)

Abstract

L'invention concerne une buse (DD) permettant d'appliquer des gouttes de colle sur un substrat. La paroi intérieure de cette buse comporte, au moins dans sa zone de sortie, un revêtement (B) anti-adhésif qui repousse la colle. Ce revêtement anti-adhésif (B) se présente de préférence sous forme d'une série de couches comprenant une couche de base constituée d'un alliage de nickel et de phosphore déposée par voie chimique et une couche supérieure de polytétrafluoroéthylène. Les buses (DD) produites selon l'invention s'utilisent de préférence dans le poste d'application de colle d'une chaîne de montage de composants montés en surface. Le revêtement anti-adhésif (B) facilite le nettoyage des buses (DD) et permet d'espacer les opérations de nettoyage.
EP95913854A 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle Expired - Lifetime EP0754095B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE9405332U 1994-03-29
DE9405332U DE9405332U1 (de) 1994-03-29 1994-03-29 Düse zum dosierten Auftragen von Klebstofftropfen
PCT/DE1995/000387 WO1995026237A1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Publications (2)

Publication Number Publication Date
EP0754095A1 true EP0754095A1 (fr) 1997-01-22
EP0754095B1 EP0754095B1 (fr) 1998-11-11

Family

ID=6906693

Family Applications (1)

Application Number Title Priority Date Filing Date
EP95913854A Expired - Lifetime EP0754095B1 (fr) 1994-03-29 1995-03-22 Buse permettant l'application dosee de gouttes de colle

Country Status (3)

Country Link
EP (1) EP0754095B1 (fr)
DE (2) DE9405332U1 (fr)
WO (1) WO1995026237A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11165115A (ja) * 1997-12-04 1999-06-22 Fuji Photo Film Co Ltd 光ディスク製造用スピンコート装置
JP5465168B2 (ja) * 2010-12-27 2014-04-09 日本発條株式会社 粘性液体供給ノズルへの潤滑性メッキ層の形成方法及び粘性液体供給ノズル
DE102020127868A1 (de) 2020-10-22 2022-04-28 Baumer Hhs Gmbh Klebstoffauftragsvorrichtung mit verbesserter Düse

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1219843A (fr) * 1982-11-15 1987-03-31 Robert A. Kidder Debiteur de colle
DE3903897A1 (de) * 1989-02-10 1990-08-16 Continental Ag Vorrichtung zum herstellen, ver- und/oder bearbeiten von kautschukmischungen
SE465756B (sv) * 1990-03-02 1991-10-28 Qenico Ab Anordning foer flaeckvis applicering av loedpasta, lim, e d, paa ett substrat

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9526237A1 *

Also Published As

Publication number Publication date
WO1995026237A1 (fr) 1995-10-05
DE9405332U1 (de) 1994-07-28
DE59504226D1 (de) 1998-12-17
EP0754095B1 (fr) 1998-11-11

Similar Documents

Publication Publication Date Title
DE69403044T2 (de) Verbesserung in einer Flussmittelvorrichtung zum Flusstragen auf einer Leiterplatte
EP1214154B1 (fr) Procede et dispositif de fabrication d'une couche protectrice amovible pour des surfaces, en particulier des surfaces vernies de vehicules motorises
DE69410930T2 (de) Verfahren und Vorrichtung zum Aufbringen von Haftgrundmaterialien auf Glaselementen von Kraftfahrzeugen
DE2052092C3 (de) Thermodruckkopf
EP1762303A1 (fr) Procédé pour préparer des aubes de turbine en vue de leur revêtement par pulvérisation et support pour fixer de telles aubes
DE69724194T2 (de) Verfahren und Vorrichtung zum Aufbringen von Lötflux auf Leiterplatten
DE3729206A1 (de) Verfahren zum ausbilden von tintenkanaelen in einem schreibkopf fuer eine tintenmosaikschreibeinrichtung
EP0754095A1 (fr) Buse permettant l'application dosee de gouttes de colle
DE68902168T2 (de) Vorrichtung und verfahren zum herstellen einer rotationssiebdruckschablone.
WO1987000507A1 (fr) Procede d'encollage pour recipients dans des etiqueteuses en utilisant par ex. des adhesifs a fusion
DE2543421A1 (de) Schaltungsplattenstift
EP0878249A3 (fr) Procédé pour la fabrication de substrats cylindriques
DE69715741T2 (de) Verfahren und Vorrichtung zum Auftragen eines flüssigen Beschichtungsmittels in atomisierter oder nichtatomisierter Form mittels einer einzigen Düse
EP3224214B1 (fr) Procédé pour la fabrication d'un réflecteur sur un corps de base de réflecteur en verre
DE102010047924A1 (de) Verfahren und Vorrichtung zum Erzeugen einer Oberfläche einer aushärtenden Flüssigkeit
DE2913805C2 (fr)
DE3939298A1 (de) Verfahren und vorrichtung zum auftragen einer farbe
DE2107081C3 (de) Vorrichtung zum Auftragen mikrodünner Streifenüberzüge auf die Oberfläche eines isolierenden Trägers mit einer auswechselbaren Auftragkammer für eine fließfähige, insbesondere zur Herstellung elektrischer Widerstände geeignete Kunststoffmasse
EP0307990A1 (fr) Elément de montage en surface d'une colle
DE10202746B4 (de) Werkzeug zum Auftragen oder Aufstempeln eines Klebstoffes auf ein Substrat
EP0451490A2 (fr) Thermode pour une tête à braser chauffée électriquement
DD158076A1 (de) Verfahren zum kleben von halbleiterchips auf traegerkoerpern
DE3829596A1 (de) Loetverfahren
EP0888826B1 (fr) Dispositif d'application de colle sur un matériau en bande
DE102007063388A1 (de) Verfahren zum Erzeugen von Lotkontakten an elektrischen Bauelementen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19960917

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): CH DE FR GB IT LI NL

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

17Q First examination report despatched

Effective date: 19980113

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE FR GB IT LI NL

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: SIEMENS SCHWEIZ AG

Ref country code: CH

Ref legal event code: EP

REF Corresponds to:

Ref document number: 59504226

Country of ref document: DE

Date of ref document: 19981217

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN P. & C. S.N.C.

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19990119

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20050303

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20050316

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20050331

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20050519

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20050607

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060322

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060331

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060331

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20060331

Year of fee payment: 12

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20061001

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20061003

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20060322

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 20061001

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20061130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20060331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070322