EP0752739B1 - Connector with integrated pcb assembly - Google Patents

Connector with integrated pcb assembly Download PDF

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Publication number
EP0752739B1
EP0752739B1 EP95201811A EP95201811A EP0752739B1 EP 0752739 B1 EP0752739 B1 EP 0752739B1 EP 95201811 A EP95201811 A EP 95201811A EP 95201811 A EP95201811 A EP 95201811A EP 0752739 B1 EP0752739 B1 EP 0752739B1
Authority
EP
European Patent Office
Prior art keywords
connector
cover plate
layer
tracks
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95201811A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP0752739A1 (en
Inventor
Bernardus Lambertus Franciscus Paagman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Berg Electronics Manufacturing BV
Original Assignee
Berg Electronics Manufacturing BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE69519226T priority Critical patent/DE69519226T2/de
Application filed by Berg Electronics Manufacturing BV filed Critical Berg Electronics Manufacturing BV
Priority to EP95201811A priority patent/EP0752739B1/en
Priority to US08/973,811 priority patent/US6540558B1/en
Priority to CN96195255A priority patent/CN1244959A/zh
Priority to DE69634005T priority patent/DE69634005T2/de
Priority to JP50528397A priority patent/JP3784836B2/ja
Priority to EP96922643A priority patent/EP0836756B1/en
Priority to PCT/US1996/011214 priority patent/WO1997002627A1/en
Priority to IN1222CA1996 priority patent/IN190516B/en
Priority to TW085108154A priority patent/TW369740B/zh
Publication of EP0752739A1 publication Critical patent/EP0752739A1/en
Priority to KR10-1997-0709959A priority patent/KR100394531B1/ko
Application granted granted Critical
Publication of EP0752739B1 publication Critical patent/EP0752739B1/en
Priority to JP2005339404A priority patent/JP4486028B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6598—Shield material
    • H01R13/6599—Dielectric material made conductive, e.g. plastic material coated with metal

Definitions

  • the present invention relates to a connector as defined in the preambles of claims 1 or 2.
  • Such a connector is known from JP-A-06/177497.
  • This document shows a multilayer printed circuit board comprising two external-layer printed circuit boards and an intermediate, internal-layer insulating board, which are all integrally fixed to one another. At one edge of the multilayer circuit board, the internal-layer board is notched, thus providing an opening. Conducting tracks on the external-layer boards extend within the opening. The conducting tracks of the external-layer boards are plated with nickel and gold to form pairs of contact faces of female-type terminals within the opening. Another printed circuit board having terminal pads on its outside surface can be inserted into the opening for providing electrical contact between conducting tracks within the multilayer board and conducting tracks on the printed circuit board.
  • right angle connectors are now widely used and available in many different configurations.
  • the usual method of manufacture consists of stitching terminals into a suitable housing following by tail bending per row.
  • the method of bending the tails of each of the terminals is complex, especially since the bending is different for each row.
  • the bending for each row must be done in such a way that each of the board contact terminals substantially extend the same distance from the connector body.
  • each of said board contact terminals, in the assembled state of the connector must be positioned in such a way that the pattern of board contact terminals correspond to the pattern of holes in the pcb into which they will be inserted.
  • An additional difficulty is related to the EMC coupling between the tails for high-frequency applications.
  • a controlled-impedance tail section is preferred with additional ground shielding options.
  • US Patent 4,571,014 describes a right angle connector which is manufactured from one or more integrated pcb assemblies.
  • Each of the pcb assemblies comprises one insulated substrate, one spacer, and one cover plate which are attached to one another.
  • the insulating substrate is provided with a predetermined pattern of conducting tracks, while ground tracks are provided between the conducting tracks.
  • the conducting tracks are connected at one end to a female contact terminal and at the other end to a male contact terminal.
  • Each of the cover plates are conductive shield members.
  • the insulating substrates are rather thick to allow plated blind holes to be made for the construction of female-type contacts for mating contact with male-type pins of a mating connector or the like.
  • the female contacts are connected to conducting tracks on the surface of the insulating substrate through a thin metal tail extending from the plated blind hole through the material of the insulating substrate to the corresponding track.
  • it is very difficult to produce such constructions with thin metal tails in a cheap and reliable way.
  • the object of the present invention is to provide a connector which uses the basic technology proposed in JP-A-06/177 497 and US Patent 4,571,014.
  • This object is obtained by the present invention by providing a connector according to the preamble of claim 1 and which is characterized by the characterizing portion of claim 1.
  • a connector according to the preamble of claim 1 and which is characterized by the characterizing portion of claim 1.
  • ground tracks may be provided between them upon the first surface, whereas a ground layer may be provided on a second surface opposite the first surface.
  • each of the cover plates are made of insulating material and are provided with cover plate conducting tracks and cover plate ground tracks in a predetermined pattern on a first cover plate surface facing said insulating substrate, each of said cover plate conducting tracks having one end for connection to one of said first set of contact terminals and another end for connection to one of said second set of conductive elements, each of said cover plates having a second cover plate surface opposite said first cover plate surface and being covered by a cover plate ground layer.
  • each of the first contact terminals is connected to one second contact terminal through one conducting track on the insulating substrate and through a conducting track on the cover plate. Thereby, the electrical resistance between a first contact terminal and a respective second contact terminal is reduced.
  • the pattern of conducting tracks on the insulating substrate and the pattern of conducting tracks on the cover plate may have a mirrored relation to each other.
  • the ground tracks on the insulating substrate and the cover plate ground tracks on the cover plate, respectively are connected to the ground layer on the second surface of the insulating substrate and to the cover plate ground layer, respectively, through plate through-holes.
  • This can be easily achieved, by starting the production of a connector according to the invention with an insulating substrate having metal layers at both sides. One side of the substrate is, then, patterned to be provided with suitable conducting tracks and ground tracks in a predetermined pattern, in accordance with known pcb manufacturing techniques. The ground tracks may then be electrically connected to the metal layer at the opposite side by plated through-holes, which can be made by well known manufacturing techniques. This method of establishing electrical contact between each of the ground tracks and a ground layer is much more reliable than the method described in US Patent 4,571,014.
  • each of the first set of separate first openings are designed for entirely accommodating one of said first set of contact terminals in such a way that, in the assembled state, none of the first set of contact terminals extend outside the connector.
  • the connector is provided with a shielding ground layer, a better extent of shielding is obtained, since it is possible to enclose each of the contact terminals to a greater extent.
  • Each of the second set of conducting elements may be selected from the group comprising press-fit pins, surface mount terminals and solder contact pins for connecting the connector to a printed circuit board or the like.
  • the connector may also comprise an insulating connector body accommodating each of said one or more integrated pcb assemblies and provided with a metallized shielding layer on its outer surface. Thereby, the electromagnetic interference caused by such a connector to the environment is further reduced.
  • the connector may be provided with suitable filter elements by arranging at least one electrical component within the connector, for instance selected from the group of components comprising resistors, capacitors and inductors.
  • Figure 1 shows an integrated pcb assembly having an insulating body 13.
  • the insulating body 13 may be provided with shielding ground layers 9 at either main outer surface. However, depending on the application one of the shielding ground layers, or both, may be omitted.
  • the body 13 is provided with a first series of holes 2 in a first side surface for accommodating suitable contact terminals 4. At a second side surface, the body 13 is provided with similar holes 3 for accommodating suitable board contact terminals 7. Each of said holes 2 and 3 are metallized. They may be entirely or partly metallized.
  • Each of the contact terminals 4 is shown to have a female-type contact portion 14, a tail connect portion 6 and a body connect portion 5.
  • Each of the body connect portions 5 is designed to be received by one of the metallized holes 2 and to be electrically connected to the metal layer within the hole 2, e.g. by soldering or a press-fit connection.
  • each of the female-type contact portions 14 may be substituted by male-type contact portions or hermaphrodite-type contact portions, as is known to any person skilled in the art.
  • Each of the board contact terminals 7 is shown to have a board contact portion 15 and a body connect portion 8.
  • Each of the body connect portions 8 is to be received by one metallized hole 3 and to be connected e.g. by soldering or by a press-fit connection thereto.
  • Each of the board contact portions 15 is designed to be received by an appropriate hole in a printed circuit board and to be connected thereto e.g. by soldering. However, a press-fit connection can also be provided instead.
  • the board contact portion 15 may be designed to be suitable for surface mount connection to a printed circuit board. It is observed that the phrase "printed circuit board" is not used in a limiting sense, but is meant to include any kind of substrate to which connectors and right angle connectors may be connected, as is known by a person skilled in the art.
  • Each of the metallized holes 2 are electrically connected to a corresponding metallized hole 3 by suitable conducting means within the body 13.
  • suitable conducting means may be conducting tracks 11 as will be explained below by reference to the other figures.
  • ground tracks 10 may be provided inbetween.
  • Ground tracks 10 may e.g. be present between adjacent groups of two conducting means 11 thus having a twinax-type configuration.
  • Figures 2a through 2c show subsequent manufacturing steps of producing a right angle connector according to the invention in which standard methods of producing printed circuit boards are used.
  • Figure 2a shows an insulating substrate 16 provided with several parallel conducting tracks 11.
  • Conducting ground tracks 10 may be provided between adjacent conducting tracks 11.
  • the outermost conducting ground track 10 is provided with a ground contact terminal 7' to be connected to ground through the printed circuit board to which the connector is to be connected.
  • Methods of producing an insulating substrate 16 with parallel conducting tracks 10, 11 are widely known in the field of manufacturing printed circuit boards and need not be explained here.
  • Each of the conducting tracks 11 is connected to board contact terminals 7, the board contact portions 15 of which extending beyond the insulating substrate 16.
  • the board contact portions 15 are shown as solder contact terminals they might be replaced by suitable press-fit contact terminals or surface mount terminals as mentioned above.
  • the other ends of the conducting tracks 11 are connected to suitable contact terminals 4 which, in the embodiment shown in figures 2a through 2c, do not extend beyond the insulating substrate 16.
  • An insulating spacer 17 is provided having a first series of openings 24 for accommodating the contact terminals 4 and a second series of openings 25 for accommodating at least part of the board contact terminals 7.
  • An insulating cover plate 18, possibly provided with a ground layer 9, is provided.
  • each of the insulating cover plates 18 may be provided with suitable conducting tracks 11 one side of which is connected to a contact terminal 4 and the other side of which is connected to a board contact terminal 7. These conducting tracks may be provided in a mirrored relation to the conducting tracks 11 on the insulating substrate 16. Cover plate 18 may also be provided with ground tracks 10 between those conducting tracks 11 (not shown). These ground tracks 10 are preferably connected to the ground layer 9 by means of plated through holes 26. The manufacturing of plated through holes is known to persons skilled in the art and need no further explanation. Of course, substrate 16 may be provided with similar plated through holes 26 in order to connect ground tracks 10 to ground layer 9 at the outer surface of substrate 16.
  • Figure 2b shows one integrated pcb assembly manufactured from the components shown in figure 2a, i.e. an insulating substrate 16 to which an insulating spacer 17 is attached and an insulating cover plate 18 attached to the insulating spacer 17. Because of the first series of openings 24 in the insulating spacer 17 and the female-type contact terminals 4 suitable holes 2 are provided to receive contact terminals of a mating connector (not shown). It is to be understood that the female-type contact terminals 4 shown in figure 2a may be replaced by male-type or hermaphrodite-type contact terminals.
  • a cover plate could be provided in which suitable recesses are made for accommodating the contact terminals 4 and the board contact terminals 7. Such recesses would serve the same purpose as openings 24, 25 in spacer 17 shown in figure 2a. Alternatively, such recesses could be provided in substrate 16.
  • Figure 2c shows several integrated pcb assemblies as shown in figure 2b parallel to each other and to be inserted into a connector body 19.
  • the connector body 19 may be made of any insulating material and may be provided with a metallized outer surface to enhance the shielding effectiveness.
  • the connector body 19 may be provided with suitable guiding ridges 23 and one or more guiding extensions 22 for properly connecting the assembled connector to a mating connector (not shown).
  • each of the integrated pcb assemblies have at least one ground layer 9 at one of their main outer surfaces to shield the parallel integrated pcb assemblies from each other.
  • the outer surfaces of each of the outer integrated pcb assemblies in the configuration shown in figure 2c are also preferably provided with ground layers 9 to enhance the shielding effectiveness.
  • the connector body 19 is provided with suitable lead-in holes 20 in corresponding relationship with each of the contact terminals 4.
  • Each of the lead-in holes 20 is suitable for receiving a mating male-type contact terminal of a mating connector (not shown).
  • the lead-in holes 20 are arranged in columns and rows as is designated by arrows c and r.
  • FIG 3a several contact terminals 4 are shown adjoined on a carrier as one stamped part.
  • the additional joining metal between adjacent contact terminals 4 is stamped away as a final step during manufacturing.
  • the function of the carrier is to form a one stitch process.
  • board contact terminals 7 are shown to be adjoined on a carrier as one stamped part.
  • the additional joining metal between adjacent board contact terminals is stamped away as final step during manufacturing.
  • cover plate 18 may be provided with a plurality of suitable conducting tracks one side of which is to be connected to one contact terminal 4 and the other side of which is to be connected to one board contact terminal 7 in order to reduce the electrical resistance.
  • Either of the insulating substrates 16 or the insulating cover plates 18 may be provided with a suitable ground layer 9.
  • the insulating substrate, the insulating spacer and the insulating cover plate are adhered to each other by widely known means like glue, conductive adhesives in track areas and/or use of pressure in order to produce one integrated pcb assembly as shown in figure 3b.
  • spacer 17 could be omitted whereas, then, cover plate 18 could be provided with suitable recesses for accommodating those parts of contact terminals 4 and board contact terminals 7 not extending from substrate 16.
  • FIG. 3b Several parallel integrated pcb assemblies as shown in figure 3b are introduced in the rear side of a connector body 19 which is provided with suitable openings in the rear side to accommodate the extending contact terminals 4 (figure 3c).
  • shielding means will have to be provided within the connector body 19.
  • the connector according to figures 2a through 2c is preferred since in the embodiment according to figures 2a through 2c it is easier to provide for shielding measures between adjacent contact terminals 4.
  • the present invention is not limited to the embodiments shown in the figures. Especially, the invention is not limited to providing integrated pcb assemblies having one insulating substrate 16, one spacer 17 and one cover plate 18. Other numbers of substrates, spacers and cover plates are possible without going beyond the scope of the present invention as defined in the claims. Moreover, the substrate 16, spacer 17 and cover plate 18 may have any desired dimension. Since separate substrates, spacers, cover plates etc. may be used to manufacture connectors in accordance with the invention filter elements, like resistors, capacitors and inductors, can be easily incorporated within the connector by using well known pcb manufacturing techniques. They may be manufactured by well known thin film techniques.
  • any of the insulating substrates 16 may, e.g., be provided with suitable connecting pins to be received by suitable holes in the insulating cover plates 18 to provide easier alignment of parallel integrated pcb assemblies and to prevent shifting of integrated pcb assemblies when inserting several parallel integrated pcb assemblies into the rear side of the connector body 19.
  • the connector according to the invention can be manufactured by using standard and cheap pcb manufacturing methods without the stamping/moulding/bending processes which are now widely used and which are relatively expensive. Moreover, impedance matching can be easily obtained since the manufacturing tolerances can be easily controlled.
  • the connector according to the present invention can also be designed for mini coax or twinax applications.
  • the connector according to the invention is provided with a set of contact terminals 4 at one side and a set of board contact terminals 7 at another side it is to be understood that the principles of the invention also apply to connectors in which the board contact terminals 7 are substituted by contact terminals suitable for connection to a mating connector or the like.
  • the set of contact terminals 4 may be constructed as board contact terminals to be suited for connection to a printed circuit board or the like.

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
EP95201811A 1995-07-03 1995-07-03 Connector with integrated pcb assembly Expired - Lifetime EP0752739B1 (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
EP95201811A EP0752739B1 (en) 1995-07-03 1995-07-03 Connector with integrated pcb assembly
DE69519226T DE69519226T2 (de) 1995-07-03 1995-07-03 Verbinder mit integrierter Flachbaugruppe
PCT/US1996/011214 WO1997002627A1 (en) 1995-07-03 1996-07-02 Connector, preferably a right angle connector, with integrated pcb assembly
DE69634005T DE69634005T2 (de) 1995-07-03 1996-07-02 Steckverbinder mit integriertem leiterplattenzusammenbau
JP50528397A JP3784836B2 (ja) 1995-07-03 1996-07-02 統合ｐｃｂアセンブリを有するライトアングルコネクタであるのが好ましいコネクタ
EP96922643A EP0836756B1 (en) 1995-07-03 1996-07-02 Connector with integrated pcb assembly
US08/973,811 US6540558B1 (en) 1995-07-03 1996-07-02 Connector, preferably a right angle connector, with integrated PCB assembly
CN96195255A CN1244959A (zh) 1995-07-03 1996-07-02 连接器,尤其是具有集成pcb组件的直角连接器
IN1222CA1996 IN190516B (ko) 1995-07-03 1996-07-03
TW085108154A TW369740B (en) 1995-07-03 1996-07-05 Connector, preferably a right angle connector, with integrated PCB assembly
KR10-1997-0709959A KR100394531B1 (ko) 1995-07-03 1997-12-30 일체형pcb조립체를갖춘직각커넥터
JP2005339404A JP4486028B2 (ja) 1995-07-03 2005-11-24 電気コネクタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP95201811A EP0752739B1 (en) 1995-07-03 1995-07-03 Connector with integrated pcb assembly

Publications (2)

Publication Number Publication Date
EP0752739A1 EP0752739A1 (en) 1997-01-08
EP0752739B1 true EP0752739B1 (en) 2000-10-25

Family

ID=8220449

Family Applications (2)

Application Number Title Priority Date Filing Date
EP95201811A Expired - Lifetime EP0752739B1 (en) 1995-07-03 1995-07-03 Connector with integrated pcb assembly
EP96922643A Expired - Lifetime EP0836756B1 (en) 1995-07-03 1996-07-02 Connector with integrated pcb assembly

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP96922643A Expired - Lifetime EP0836756B1 (en) 1995-07-03 1996-07-02 Connector with integrated pcb assembly

Country Status (8)

Country Link
EP (2) EP0752739B1 (ko)
JP (2) JP3784836B2 (ko)
KR (1) KR100394531B1 (ko)
CN (1) CN1244959A (ko)
DE (2) DE69519226T2 (ko)
IN (1) IN190516B (ko)
TW (1) TW369740B (ko)
WO (1) WO1997002627A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848944B2 (en) 2001-11-12 2005-02-01 Fci Americas Technology, Inc. Connector for high-speed communications
US7413450B2 (en) 2002-07-29 2008-08-19 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
CN101395760B (zh) * 2006-03-03 2011-05-04 Fci公司 高密度正交连接器

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2225151C (en) * 1997-01-07 2001-02-27 Berg Technology, Inc. Connector with integrated pcb assembly
US6083047A (en) * 1997-01-16 2000-07-04 Berg Technology, Inc. Modular electrical PCB assembly connector
US6183301B1 (en) * 1997-01-16 2001-02-06 Berg Technology, Inc. Surface mount connector with integrated PCB assembly
US5993259A (en) * 1997-02-07 1999-11-30 Teradyne, Inc. High speed, high density electrical connector
US5980321A (en) * 1997-02-07 1999-11-09 Teradyne, Inc. High speed, high density electrical connector
DE19742387A1 (de) * 1997-09-25 1998-10-29 Siemens Ag Mehrreihiger Baugruppensteckverbinder
US6120306A (en) * 1997-10-15 2000-09-19 Berg Technology, Inc. Cast coax header/socket connector system
JP3343719B2 (ja) * 1998-02-19 2002-11-11 日本航空電子工業株式会社 ケーブル用ライトアングルコネクタ
US6171149B1 (en) * 1998-12-28 2001-01-09 Berg Technology, Inc. High speed connector and method of making same
US6824391B2 (en) 2000-02-03 2004-11-30 Tyco Electronics Corporation Electrical connector having customizable circuit board wafers
WO2001057963A2 (en) * 2000-02-03 2001-08-09 Teradyne, Inc. High speed pressure mount connector
DE10310434A1 (de) 2003-03-11 2004-09-30 Krone Gmbh Verfahren zum HF-Abstimmen einer elektrischen Anordnung sowie eine hierzu geeignete Leiterplatte
DE10333913A1 (de) 2003-07-25 2005-02-24 Krone Gmbh Aderanschlussmodul für Leiterplatten
DE102004029536A1 (de) * 2004-06-18 2006-01-05 Robert Bosch Gmbh EMV-Stitchpin
US7163421B1 (en) * 2005-06-30 2007-01-16 Amphenol Corporation High speed high density electrical connector
DE102007021740A1 (de) * 2007-05-09 2008-11-13 Continental Automotive Gmbh Leiterplatte mit integriertem Pressfit-Pin
WO2009083460A1 (en) * 2007-12-28 2009-07-09 Fci Modular connector
JP5329870B2 (ja) * 2008-08-15 2013-10-30 富士通コンポーネント株式会社 コネクタ、及びコネクタの実装構造
US8202128B2 (en) 2008-11-25 2012-06-19 Adc Gmbh Telecommunications jack with adjustable crosstalk compensation
CN101915861A (zh) * 2010-08-04 2010-12-15 威胜集团有限公司 电能表的继电器与pcb板组件
CN104704682B (zh) 2012-08-22 2017-03-22 安费诺有限公司 高频电连接器
CN103151631A (zh) * 2013-03-27 2013-06-12 上海航天科工电器研究院有限公司 一种圆形接触件与刺破端子的转接结构
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KR102305642B1 (ko) 2020-10-06 2021-09-27 유철 공기조화기용 디퓨저
CN112736524B (zh) 2020-12-28 2022-09-09 东莞立讯技术有限公司 端子模组以及背板连接器
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Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338717A (en) * 1980-09-02 1982-07-13 Augat Inc. Method for fabricating a light emitting diode display socket
US4571014A (en) 1984-05-02 1986-02-18 At&T Bell Laboratories High frequency modular connector
CA1244531A (en) * 1985-08-05 1988-11-08 Amir-Akbar Sadigh-Behzadi High density, controlled impedance connector
US4846727A (en) * 1988-04-11 1989-07-11 Amp Incorporated Reference conductor for improving signal integrity in electrical connectors
EP0422785B1 (en) * 1989-10-10 1995-03-22 The Whitaker Corporation Impedance matched backplane connector
GB8928777D0 (en) * 1989-12-20 1990-02-28 Amp Holland Sheilded backplane connector
JP2739608B2 (ja) * 1990-11-15 1998-04-15 日本エー・エム・ピー株式会社 信号伝送用マルチコンタクト型コネクタ
US5169343A (en) * 1990-11-29 1992-12-08 E. I. Du Pont De Nemours And Company Coax connector module
JPH08500695A (ja) * 1992-08-31 1996-01-23 シーメンス アクチエンゲゼルシヤフト シールド付き電気的支持架
JPH06177497A (ja) * 1992-10-21 1994-06-24 Sumise Device:Kk 多層印刷回路基板のコネクターおよびその製造方法
NL9300971A (nl) * 1993-06-04 1995-01-02 Framatome Connectors Belgium Connectorsamenstel voor printkaarten.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848944B2 (en) 2001-11-12 2005-02-01 Fci Americas Technology, Inc. Connector for high-speed communications
US7310875B2 (en) 2001-11-12 2007-12-25 Fci Americas Technology, Inc. Connector for high-speed communications
US7413450B2 (en) 2002-07-29 2008-08-19 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
CN101395760B (zh) * 2006-03-03 2011-05-04 Fci公司 高密度正交连接器

Also Published As

Publication number Publication date
DE69519226D1 (de) 2000-11-30
EP0836756A1 (en) 1998-04-22
DE69519226T2 (de) 2001-08-23
EP0836756A4 (en) 1999-08-25
JP3784836B2 (ja) 2006-06-14
TW369740B (en) 1999-09-11
WO1997002627A1 (en) 1997-01-23
EP0836756B1 (en) 2004-12-08
DE69634005T2 (de) 2005-11-03
EP0752739A1 (en) 1997-01-08
DE69634005D1 (de) 2005-01-13
IN190516B (ko) 2003-08-02
KR100394531B1 (ko) 2003-09-19
JP2006108115A (ja) 2006-04-20
JP4486028B2 (ja) 2010-06-23
JP2001525974A (ja) 2001-12-11
CN1244959A (zh) 2000-02-16

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