EP0746826A1 - Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction - Google Patents

Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Info

Publication number
EP0746826A1
EP0746826A1 EP93907879A EP93907879A EP0746826A1 EP 0746826 A1 EP0746826 A1 EP 0746826A1 EP 93907879 A EP93907879 A EP 93907879A EP 93907879 A EP93907879 A EP 93907879A EP 0746826 A1 EP0746826 A1 EP 0746826A1
Authority
EP
European Patent Office
Prior art keywords
coil
microcircuit
socket
smart card
open recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP93907879A
Other languages
German (de)
English (en)
Inventor
Ahti Aintila
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Picopak Oy
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Publication of EP0746826A1 publication Critical patent/EP0746826A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process

Definitions

  • the present invention is related to a method according to the preamble of claim 1 for connecting a microcircuit to the inductive coupling coil of a smart card.
  • the invention also concerns an assembly for an inductively coupled smart card.
  • Inductively coupled smart cards are employed for instance as pay tokens in bus traffic, whereby a card of the same size as a credit card can be loaded with the value of prepaid tokens that can be paid off at card reader terminals of busses.
  • the card communicates with the external world via a coupling coil connected to a microcircuit provided with memory, thus requiring no mechanical contact between the card and the card reader as is necessary with the use of convention- al magnetic stripe cards.
  • the coil is advantageously designed for maximum possible diameter, and in practice the coil is conformant with the outer rim of the card.
  • Such coils are fabricated through automated production methods, and coils of desired design are commercially available with a desired number of turns from customer-specified conductor material. The coils are delivered with unterminated conductor ends.
  • WO publication 91/16718 discloses a method for connecting a coil of the above- described kind to a printed-circuit board, which has a microcircuit comprised of memory and control circuits bonded to it.
  • the embodiment according to the publication necessitates multiple time-consuming work phases: printed-circuit manufacturing, placement of the microcircuit onto the printed-circuit board, forming of bonding areas for the microcircuit onto the printed-circuit board, and finally connecting the printed-circuit board with the coil.
  • all these work phases can be automated as such, the great number of required operations causes a long product throughput time in the manufacturing process. It is an object of the present invention to overcome the above-described disad ⁇ vantages of prior-art technology and to achieve an entirely novel method for connecting a microcircuit with the inductive coupling coil of a smart card.
  • the invention is based on the concept of providing the coil already at its manu ⁇ facturing phase with a mounting socket for the microcircuit and then attaching • the conductor ends of the coil to predetermined positions in the socket. Further ⁇ more, the socket incorporates a mounting recess for the microcircuit permitting direct connection of the microcircuit from its contact areas to the coil conductor ends which are located at predetermined positions in the socket.
  • the invention provides significant benefits.
  • the attachment of the socket to the coil is integrated into the manufacturing process of the coil, and by virtue of the socket, the mounting of the microcircuit is simplified, whereby several work phases are obviated in respect to conven ⁇ tional techniques.
  • the reduction of work phases attains undeniable benefits in shortened work throughput time, and quality control is improved, since the number of work phases to be verified is reduced.
  • the product related to the invention namely the smart card
  • any production rate improvements associated with the manufacturing techniques of such a product will have a most significant economical value.
  • Figure 2 shows another inductively coupled smart card embodiment according to the invention in a top view.
  • the shape of the coil 1 is essentially conformant to the outside dimensions of a smart card.
  • the left lower corner of the coil 1 is in this embodiment wound in a slanted manner closer to the center of the coil 1.
  • the indented area left free in this manner is provided with, e.g., a plastic socket 3 which is appropriately coated with similar thermosetting adhesive as is also applied onto the conductor of the coil.
  • the first end 7 of the coil conductor is attached to the socket 3, and the winding of the coil is then continued until the other end 4 of the conductor of the coil 1 can be at ⁇ tached to the socket 3.
  • both the conductor of the coil 1 and the socket 3 are coated with a compatible thermosetting adhesive, these elements will firmly adhere to each other during a heating phase.
  • the heating phase is implemented by applying external heat onto the coil, or alternatively, applying a current pulse on the coil 1 , or using a combination of these two operations. Conse ⁇ quently, the end result of the winding operation is a semifabricated product comprising the coil 1 and, attached thereto, a socket 3 with the ends of the conductor of the coil 1 connected to said socket.
  • the socket 3 is designed so as to permit the routing of the coil conductor ends 4 and 7 crosswise over an unoccupied space 15, whereby the microcircuit 2 can be readily mounted in said socket 3 so that contact areas 5 of the microcircuit 2 are directly aligned over said coil conductor ends 4 and 5 in this unoccupied space 15.
  • this concept is implemented by providing the socket 3 with an open recess 15 over which the conductors 4 and 7 are routed crosswise.
  • the open recess 15 is designed to perform the alignment of the microcircuit 2 in place so that the contact areas 5 of the microcircuit 2 will be located at the conductor ends 4 and 7.
  • the dimensions of the open recess 15 must be essentially conformant to the outer dimensions of the microcircuit 2.
  • the conductor ends 4 and 7 are bonded to the contact areas 5 by soldering or weld ⁇ ing. After the bonding phase, excess material from the socket 3 and the conductor ends 4 and 7 are trimmed away along the marked line 9.
  • the coil 1 and the microcircuit 2 are protected with a suitable encapsulation structure by, e.g., laminating the structure from both sides with a suitable plastic material.
  • the encapsulating structure can also be formed by casting the coil 1 and the microcircuit 2 into a polymer resin.
  • the coil 11 in this embodiment is essentially conformant to the outer shape of the smart card, while the socket 10 is U- shaped.
  • the bonding of the coil conductors 4 and 7 is assured in this embodi- ment by routing the conductor ends crosswise over the U-shaped slot, thereby permitting direct alignment of the microcircuit 2, and in particular, its contact areas 5 under the conductor ends 4 and 7.
  • the U-shaped slot 13 has a width equal to that of the microcircuit 2. Correct insertion of the microcircuit into the U-shaped slot 13 is assured by firmly pushing the microcircuit 2 fully home to the bottom of the slot. Gravity assisted placement is also possible by tilting the combination coil 11/socket 10 so as to permit dropping the microcircuit in place. Removal of excess material is performed in the same manner along the marked line 9 as illustrated in the diagram of Fig. 1.
  • the microcircuit 2 is inserted into the socket 3 or 10 from, e.g., a carrier film, or alternatively, using a robot with machine vision.
  • a further characterizing requirement in the implementation of the invention is that at least one external dimension of the recess or slot arrangement 15, 13 is designed to be essentially conformant with an outer dimension of the microcircuit 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Procédé de raccordement d'un circuit intégré (2) à la bobine de couplage par induction (1, 11) d'une carte à mémoire, et ensemble pour carte à mémoire à couplage par induction. Selon le procédé, pendant la phase de fabrication de ladite bobine (1), on intègre à cette dernière une douille (3) comprenant un ensemble à concavité/fente ouverte (15, 13), à laquelle douille sont fixées les extrémités des conducteurs (4, 7) de la bobine (1, 11) de manière qu'elles passent sur l'ensemble à concavité/fente ouverte (13, 15) de la douille, et on relie les zones de contact (5) du circuit intégré (2) aux sections desdits conducteurs (4, 7) qui passent sur l'ensemble à concavité/fente ouverte (13, 15).
EP93907879A 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction Withdrawn EP0746826A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI921420A FI89752C (fi) 1992-04-01 1992-04-01 Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort
FI921420 1992-04-01
PCT/FI1993/000138 WO1993020537A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Publications (1)

Publication Number Publication Date
EP0746826A1 true EP0746826A1 (fr) 1996-12-11

Family

ID=8535015

Family Applications (1)

Application Number Title Priority Date Filing Date
EP93907879A Withdrawn EP0746826A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Country Status (3)

Country Link
EP (1) EP0746826A1 (fr)
FI (1) FI89752C (fr)
WO (1) WO1993020537A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073808B2 (ja) * 1990-04-19 1995-01-18 アキュ グスタフソ プリント回路上へのコイル組立て方法
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4410732C2 (de) * 1994-03-28 1997-05-07 Amatech Gmbh & Co Kg Verfahren zur Anordnung einer zumindest einen Chip und eine Drahtspule aufweisenden Transpondereinheit auf einem Substrat sowie Chipkarte mit entsprechend angeordneter Transpondereinheit
FR2721733B1 (fr) * 1994-06-22 1996-08-23 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
KR100355209B1 (ko) * 1994-09-22 2003-02-11 로무 가부시키가이샤 비접촉형ic카드및그제조방법
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
DE19525933C5 (de) * 1995-07-17 2004-02-19 Finn, David Verfahren und Vorrichtung zur Einbettung einer Spule in das Trägersubstrat einer IC-Karte
DE19620242C2 (de) * 1996-05-20 1999-11-04 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters bei der Herstellung einer Transpondereinheit
AU709049B2 (en) 1996-02-12 1999-08-19 Smartrac Ip B.V. Process and device for contacting a wire conductor
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
CN101156280A (zh) * 2005-04-12 2008-04-02 施克莱无线公司 绝缘封装天线
IL184260A0 (en) 2007-06-27 2008-03-20 On Track Innovations Ltd Mobile telecommunications device having sim/antenna coil interface
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR8505681A (pt) * 1985-11-04 1987-06-09 Dalson Artacho Elemento de dados portatil e dispositivo de leitura e gravacao de dados
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
JPH01157896A (ja) * 1987-09-28 1989-06-21 Mitsubishi Electric Corp 非接触型ｉｃカード及び非接触型カードリーダライタ
FR2641102B1 (fr) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
JPH073808B2 (ja) * 1990-04-19 1995-01-18 アキュ グスタフソ プリント回路上へのコイル組立て方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO9320537A1 *

Also Published As

Publication number Publication date
WO1993020537A1 (fr) 1993-10-14
FI89752B (fi) 1993-07-30
FI921420A0 (fi) 1992-04-01
FI89752C (fi) 1993-11-10

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