WO1993020537A1 - Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction - Google Patents

Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction Download PDF

Info

Publication number
WO1993020537A1
WO1993020537A1 PCT/FI1993/000138 FI9300138W WO9320537A1 WO 1993020537 A1 WO1993020537 A1 WO 1993020537A1 FI 9300138 W FI9300138 W FI 9300138W WO 9320537 A1 WO9320537 A1 WO 9320537A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
microcircuit
socket
smart card
open recess
Prior art date
Application number
PCT/FI1993/000138
Other languages
English (en)
Inventor
Ahti Aintila
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Priority to EP93907879A priority Critical patent/EP0746826A1/fr
Publication of WO1993020537A1 publication Critical patent/WO1993020537A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Procédé de raccordement d'un circuit intégré (2) à la bobine de couplage par induction (1, 11) d'une carte à mémoire, et ensemble pour carte à mémoire à couplage par induction. Selon le procédé, pendant la phase de fabrication de ladite bobine (1), on intègre à cette dernière une douille (3) comprenant un ensemble à concavité/fente ouverte (15, 13), à laquelle douille sont fixées les extrémités des conducteurs (4, 7) de la bobine (1, 11) de manière qu'elles passent sur l'ensemble à concavité/fente ouverte (13, 15) de la douille, et on relie les zones de contact (5) du circuit intégré (2) aux sections desdits conducteurs (4, 7) qui passent sur l'ensemble à concavité/fente ouverte (13, 15).
PCT/FI1993/000138 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction WO1993020537A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP93907879A EP0746826A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI921420A FI89752C (fi) 1992-04-01 1992-04-01 Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort
FI921420 1992-04-01

Publications (1)

Publication Number Publication Date
WO1993020537A1 true WO1993020537A1 (fr) 1993-10-14

Family

ID=8535015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1993/000138 WO1993020537A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Country Status (3)

Country Link
EP (1) EP0746826A1 (fr)
FI (1) FI89752C (fr)
WO (1) WO1993020537A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281A1 (fr) * 1994-02-14 1995-08-18 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
WO1995026538A1 (fr) * 1994-03-28 1995-10-05 David Finn Procede de production d'une carte a puce et carte a puce ainsi realisee
FR2721733A1 (fr) * 1994-06-22 1995-12-29 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
WO1996007984A1 (fr) * 1994-09-05 1996-03-14 Siemens Aktiengesellschaft Procede de fabrication d'un module de carte a puce pour cartes a puce sans contact
WO1997004415A1 (fr) * 1995-07-17 1997-02-06 David Finn Module pour carte a circuits imprimes, ainsi que procede et dispositif pour sa fabrication
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
EP0786357A1 (fr) * 1994-09-22 1997-07-30 Rohm Co., Ltd. Carte de ci du type sans contact et procede de fabrication de cette carte
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19620242A1 (de) * 1996-05-20 1997-11-27 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters
US5946198A (en) * 1994-10-21 1999-08-31 Giesecke & Devrient Gmbh Contactless electronic module with self-supporting metal coil
US6233818B1 (en) 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
WO2006108289A1 (fr) * 2005-04-12 2006-10-19 Sierra Wireless, Inc. Antenne d'encapsulation dielectrique
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002806A1 (fr) * 1985-11-04 1987-05-07 Dalson Artacho Element portatif de memorisation de donnees et dispositif d'enregistrement et de lecture de donnees
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
US4960983A (en) * 1987-09-28 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Noncontact type IC card and system for noncontact transfer of information using the same
US4999742A (en) * 1988-12-27 1991-03-12 Eta Sa Fabriques D'ebauches Electronic module for a small portable object such as a card or a key incorporating an integrated circuit
WO1991016718A1 (fr) * 1990-04-19 1991-10-31 Ake Gustafson Procede d'assemblage d'une bobine sur un circuit imprime

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002806A1 (fr) * 1985-11-04 1987-05-07 Dalson Artacho Element portatif de memorisation de donnees et dispositif d'enregistrement et de lecture de donnees
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
US4960983A (en) * 1987-09-28 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Noncontact type IC card and system for noncontact transfer of information using the same
US4999742A (en) * 1988-12-27 1991-03-12 Eta Sa Fabriques D'ebauches Electronic module for a small portable object such as a card or a key incorporating an integrated circuit
WO1991016718A1 (fr) * 1990-04-19 1991-10-31 Ake Gustafson Procede d'assemblage d'une bobine sur un circuit imprime

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
EP0671705A2 (fr) * 1994-02-14 1995-09-13 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
EP0671705A3 (fr) * 1994-02-14 1998-06-17 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
FR2716281A1 (fr) * 1994-02-14 1995-08-18 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
WO1995026538A1 (fr) * 1994-03-28 1995-10-05 David Finn Procede de production d'une carte a puce et carte a puce ainsi realisee
FR2721733A1 (fr) * 1994-06-22 1995-12-29 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
WO1996007984A1 (fr) * 1994-09-05 1996-03-14 Siemens Aktiengesellschaft Procede de fabrication d'un module de carte a puce pour cartes a puce sans contact
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
EP0786357A1 (fr) * 1994-09-22 1997-07-30 Rohm Co., Ltd. Carte de ci du type sans contact et procede de fabrication de cette carte
EP0786357A4 (fr) * 1994-09-22 2000-04-05 Rohm Co Ltd Carte de ci du type sans contact et procede de fabrication de cette carte
US5946198A (en) * 1994-10-21 1999-08-31 Giesecke & Devrient Gmbh Contactless electronic module with self-supporting metal coil
WO1997004415A1 (fr) * 1995-07-17 1997-02-06 David Finn Module pour carte a circuits imprimes, ainsi que procede et dispositif pour sa fabrication
US6233818B1 (en) 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19620242C2 (de) * 1996-05-20 1999-11-04 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters bei der Herstellung einer Transpondereinheit
DE19620242A1 (de) * 1996-05-20 1997-11-27 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters
WO2006108289A1 (fr) * 2005-04-12 2006-10-19 Sierra Wireless, Inc. Antenne d'encapsulation dielectrique
US7345636B2 (en) 2005-04-12 2008-03-18 Sierra Wireless, Inc. Dielectric encapsulating antenna
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof

Also Published As

Publication number Publication date
FI921420A0 (fi) 1992-04-01
FI89752C (fi) 1993-11-10
EP0746826A1 (fr) 1996-12-11
FI89752B (fi) 1993-07-30

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