EP0714226B1 - Procédé de montage d'une broche à un panneau à circuit imprimé flexible - Google Patents

Procédé de montage d'une broche à un panneau à circuit imprimé flexible Download PDF

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Publication number
EP0714226B1
EP0714226B1 EP95117349A EP95117349A EP0714226B1 EP 0714226 B1 EP0714226 B1 EP 0714226B1 EP 95117349 A EP95117349 A EP 95117349A EP 95117349 A EP95117349 A EP 95117349A EP 0714226 B1 EP0714226 B1 EP 0714226B1
Authority
EP
European Patent Office
Prior art keywords
heat insulating
printed circuit
circuit board
flexible printed
insulating film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP95117349A
Other languages
German (de)
English (en)
Other versions
EP0714226A1 (fr
Inventor
Haruo c/o Sumimoto Wiring Sys Ltd Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP6291531A external-priority patent/JP2806279B2/ja
Priority claimed from JP6291530A external-priority patent/JP2921417B2/ja
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of EP0714226A1 publication Critical patent/EP0714226A1/fr
Application granted granted Critical
Publication of EP0714226B1 publication Critical patent/EP0714226B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Definitions

  • the present invention relates to a method of mounting a terminal to a flexible printed circuit board and, more particularly, to a method of soldering a terminal to a land formed on a flexible printed circuit board made of a material having a softening point below 230°C.
  • Flow soldering and reflow soldering techniques using conventional solder are not applicable to a flexible printed circuit board (referred to hereinafter as an FPC) having a substrate made of polyethylene terephthalate (referred to hereinafter as PET) since the softening point of PET ranges from 220°C to 230 °C which is substantially equal to the melt temperature of the conventional solder.
  • FPC flexible printed circuit board
  • PET polyethylene terephthalate
  • Soldering by local heating using solder having a low melting point below 200°C may be considered but presents the problems of costs and safety depending on the types of materials to be added to lower the melting point of the solder.
  • a thermal insulation holder 1 including a phenolic paper base copper clad laminate board, a paper base epoxy resin board, or a glass fabric base epoxy resin board is prepared.
  • a land 3 is formed on a FPC 2 made of PET, and a terminal 4 is received through the FPC 2 generally centrally of the land 3.
  • An opening 5 which is substantially equal in size to the land 3 is then formed in the thermal insulation holder 1.
  • the thermal insulation holder 1 is brought into contact with a surface of the FPC 2 to which solder is applied so that the land 3 and the terminal 4 are located within the opening 5. With the contact maintained, soldering is performed.
  • the opening 5 is designed to be equal in size to the land 3 on its contact surface side and to be greater than the land 3 on the opposite side thereof. That, is, the opening 5 is of a trapezoidal configuration in vertical section.
  • the opening 5 formed in the thermal insulation holder 1 has the size similar to that of the land 3 on the FPC 2 and is very small.
  • the thermal insulation holder 1 positioned downside, to perform soldering, the solder 6 does not reach the land 3 due to the surface tension of the molten solder 6 in some cases, resulting in poor soldering.
  • Soldering a multiplicity of terminals such as connector terminals requires an equal number of lands and, accordingly, a large number of openings corresponding to the respective lands.
  • fabrication of a multiplicity of openings of a trapezoidal cross-sectional configuration adds to the number of fabrication steps and fabrication costs.
  • DE-A-2833480 discloses a method of mounting a terminal made of a conductive material to an FPC by soldering the terminal to a land formed on the FPC.
  • the holder for said FPC (which can be connected to said FPC before or after soldering by means of an insulating adhesive film) is made of a material having high heat conductivity.
  • the present invention provides a method of mounting a terminal made of a conductive material to a flexible printed circuit board made of a material having a softening point below 230°C by soldering the terminal to a land formed on the flexible printed circuit board.
  • the method comprises the steps of: forming an opening rectangular in vertical section and larger than the land in a flat heat insulating holder, the heat insulating holder being for contacting a surface of the flexible printed circuit board to which solder is applied; and bringing the heat insulating holder into contact with the surface of the flexible printed circuit board so that the land and the terminal are located within the opening, and soldering the terminal by a flow soldering or reflow soldering process, with the contact maintained and the terminal extending through the land into the opening.
  • the present invention provides a method of mounting a plurality of terminals made of a conductive material to a flexible printed circuit board made of a material having a softening point below 230°C by soldering the terminals to a plurality of lands formed on the flexible printed circuit board, respectively.
  • the method comprises the steps of: forming a rectangular opening being rectangular in vertical section and slightly larger than a minimum rectangle defined to surround a row or a rectangular array of the lands in a heat insulating holder, the heat insulating holder being for contacting a surface of the flexible printed circuit board to which solder is applied; and bringing the heat insulating holder into contact with the surface of the flexible printed circuit board so that the lands and the terminals are located within the opening, and soldering the terminals by a flow soldering or reflow soldering process, with the contact maintained and the terminals extending through the lands into said opening.
  • thickness of the heat insulating holder is about one-tenth to seven times the thickness of the flexible printed circuit board.
  • the present invention provides a method of mounting a terminal made of a conductive material to a flexible printed circuit board made of a material having a softening point below 230°C by soldering the terminal to a land formed on the flexible printed circuit board.
  • the method comprises the steps of: forming a through aperture having a size substantially equal to the size of the land in a heat insulating film provided in contact with a surface of the flexible printed circuit board to which solder is applied; forming an opening larger than the land in a heat insulating holder, the heat insulating holder being for contacting a surface of the heat insulating film which is opposite from the flexible printed circuit board; and soldering the terminal by a flow soldering or reflow soldering process, with the heat insulating film in contact with the surface of the flexible printed circuit board so that the land and the terminal are located within the through aperture and with the heat insulating holder in contact with the surface of the heat insulating film so that the land and the terminal are located within the opening.
  • the heat insulating holder is provided with a plurality of guide pins in corners thereof, and the flexible printed circuit board and the heat insulating film have through apertures formed therein for the guide pins; and the guide pins are respectively inserted into the through apertures to bring the heat insulating holder into contact with the heat insulating film and to bring the heat insulating film into contact with the flexible printed circuit board.
  • the heat insulating holder is formed with a guide frame for receiving the flexible printed circuit board and the heat insulating film therein; and the heat insulating film comes into contact with the flexible printed circuit board, and the heat insulating holder comes into contact with the heat insulating film.
  • the opening of the heat insulating holder is rectangular in vertical section and larger than the land on the flexible printed circuit board to permit molten solder to readily reach the land through the opening, preventing the occurrence of poor soldering.
  • the opening need not be worked into a conventional trapezoidal configuration in vertical section, thereby simplifying the step of forming the opening in the thermal insulation holder.
  • the thickness of the heat insulating holder is one-tenth to seven times the thickness of the flexible printed circuit board.
  • the short distance between the surface of the molten solder and the land allows the molten solder to readily reach the land through the opening, preventing the occurrence of poor soldering.
  • the heat insulating film is provided in contact with the solder-applied surface of the flexible printed circuit board, and the heat insulating holder is provided in contact with the surface of the heat insulating film opposite from the flexible printed circuit board.
  • the provision of the heat insulating film between the flexible printed circuit board and the heat insulating holder prevents the deterioration of the thermal insulation effects in the case of the thin heat insulating holder to perform the soldering by using the flow soldering or reflow soldering process. Further, the molten solder may readily reach the land through the opening and through aperture, preventing the occurrence of poor soldering.
  • the contact between the heat insulating holder and the heat insulating film and the contact between the heat insulating film and the flexible printed circuit board may be readily made by inserting the plurality of guide pins formed in the corners of the heat insulating holder into the through apertures for the respective guide pins formed in the flexible printed circuit board and heat insulating film in accordance with the fifth aspect of the present invention, or by forming the guide frame on the heat insulating holder for receiving the flexible printed circuit board and the heat insulating film therein.
  • an opening 17 is formed in a 2.6-mm thick, flat heat insulating holder 11 including a phenolic paper base copper clad laminate board, a paper base epoxy resin board, or a glass fabric base epoxy resin board and to be brought into contact with a surface of an FPC 12 made of PET to which solder is applied.
  • the opening 17 is greater in size than a land 13 formed on the FPC 12 and has a rectangular configuration in vertical section.
  • the size of the opening 17 is about 2 to 3.5 times the area of the land 13.
  • the heat insulating holder 11 is brought into contact with the solder-applied surface of the FPC 12 so that the land 13 and a terminal 14 made of a conductive material are located within the opening 17. With the contact maintained, soldering is performed by using the flow soldering or reflow soldering technique to mount the terminal 14 to the FPC 12.
  • the opening 17 in the heat insulating holder 11 is greater than the land 13 on the FPC 12 to permit molten solder to readily reach the land 13 through the opening 17 without the need to form the opening 17 into the conventional trapezoidal configuration in vertical section, insuring prevention of the occurrence of poor soldering.
  • the present invention may be applied to the soldering of a plurality of terminals 14 mounted to a connector housing 18.
  • Formed in the thermal insulation holder 11 is a rectangular opening 19 slightly greater than a minimum rectangle defined to surround rows of lands 13.
  • the formation of the opening 19 slightly greater than the minimum rectangle defined to surround the rows of lands 13 insures the soldering of the plurality of connector terminals 14 to the FPC 12 by using the flow soldering or reflow soldering technique.
  • the need to form an opening for each connector terminal in the conventional manner is eliminated, but only one opening 19 is required for the plurality of connector terminals 14. This simplifies the step of forming the opening 19.
  • a heat insulating holder 25 for use in the soldering has a thickness ranging from 30 ⁇ m to 2 mm which is about one-tenth to seven times the thickness of the FPC 12.
  • Formed in the heat insulating holder 25 is a rectangular opening 27 slightly greater than a minimum rectangle defined to surround rows of lands 13.
  • the third preferred embodiment insures soldering of the plurality of connector terminals 14 to the FPC 12 by using the flow soldering or reflow soldering technique.
  • the present invention is similarly applicable to the soldering of leads of a device in place of the terminals.
  • a heat insulating film 30 made of a high-heat-resistant material such as polyimide, polyethylene terephthalate, polyparabanic acid, aramid, polyamide, polysulfone, polyether sulfone, polyphenylene sulfide, polyether etherketone, polyether imide, polyarylate, polyethylene naphthalate, fluorocarbon polymer or the like.
  • the heat insulating film 30 is provided in contact with the solder-applied surface of the FPC 12 so that the lands 13 and the terminals 14 are located within the through apertures 31.
  • An opening 34 greater than the lands 13 are formed in a heat insulating holder 33 including a phenolic paper base copper clad laminate board, a paper base epoxy resin board, or a glass fabric base epoxy resin board.
  • the heat insulating holder 33 is provided in contact with the opposite surface of the heat insulating film 30 from the FPC 12 so that the lands 13, the terminals 14 and the through apertures 31 are located within the opening 34.
  • the heat insulating film 30 and the heat insulating holder 33 are bonded respectively to the FPC 12 and the heat insulating film 30 with a pressure-sensitive adhesive or an adhesive.
  • the molten solder 28 readily reaches the lands 13 through the opening 34 and the through apertures 31 to prevent poor soldering because of the provision of the heat insulating film 30 in contact with the solder-applied surface of the FPC 12 so that the lands 13 and the terminals 14 are located within the through apertures 31 of the heat insulating film 30 and the provision of the heat insulating holder 33 in contact with the opposite surface of the heat insulating film 30 from the FPC 12 so that the lands 13 and the terminals 14 are located within the opening 34.
  • the provision of the heat insulating film 30 between the FPC 12 and the heat insulating holder 33 allows soldering by the flow soldering or reflow soldering technique without deterioration of thermal insulation effects in the case of the thin heat insulating holder 33.
  • Bonding the heat insulating film 30 and the heat insulating holder 33 respectively to the FPC 12 and the heat insulating film 30 with a pressure-sensitive adhesive or an adhesive facilitates the contact between the heat insulating holder 33 and the heat insulating film 30 and the contact between the heat insulating film 30 and the FPC 12.
  • the high-heat-resistant material for the heat insulating film 30, such as polyimide, polyethylene terephthalate, polyparabanic acid, aramid, polyamide or the like, provides for the repeated uses thereof.
  • the heat insulating holder 33 is implanted with guide pins 36 in four corners thereof, respectively, and through apertures 37 for the guide pins 36 are formed in the FPC 12 and the heat insulating film 30, respectively.
  • the contact between the heat insulating holder 33 and the heat insulating film 30 and the contact between the heat insulating film 30 and the FPC 12 may be made with the guide pins 36 received through the through apertures 37.
  • the fifth preferred embodiment provides effects similar to those of the fourth preferred embodiment.
  • a guide frame 39 is formed on the heat insulating holder 33.
  • the guide frame 39 receives the FPC 12 and the heat insulating film 30 therein for contact between the heat insulating holder 33 and the heat insulating film 30 and contact between the heat insulating film 30 and the FPC 12.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Claims (12)

  1. Procédé de montage d'une borne (14) constituée d'un matériau conducteur sur une carte à circuit imprimé souple (12) constituée d'un matériau ayant un point de fusion au-dessous de 230°C en soudant la borne (14) à une plage de connexion (13) formée sur la carte à circuit imprimé souple (12), ledit procédé comportant les étapes consistant à :
    former une ouverture (17) rectangulaire en coupe verticale et plus grande que ladite plage de connexion (13) dans un support calorifuge plat (11), ledit support calorifuge (11) étant destiné à venir en contact avec une surface de ladite carte à circuit imprimé souple (12) à laquelle une soudure (28) est appliquée, et
    mettre ledit support calorifuge (11) en contact avec ladite surface de ladite carte à circuit imprimé souple (12) de sorte que ladite plage de connexion (13) et ladite borne (14) sont situées à l'intérieur de ladite ouverture (17), et souder ladite borne (14) à l'aide d'un procédé de soudure à la vague ou de soudure par fusion, le contact étant maintenu et la borne (14) s'étendant à travers ladite plage de connexion (13) dans ledit ouverture (17).
  2. Procédé de montage d'une pluralité de bornes (14) constituées d'un matériau conducteur sur une carte à circuit imprimé souple (12) constituée d'un matériau ayant un point de fusion au-dessous de 230°C en soudant les bornes (14) à une pluralité de plages de connexion (13) respectivement formées sur la carte à circuit imprimé souple (12), ledit procédé comportant les étapes consistant à :
    former une ouverture rectangulaire (19) qui est rectangulaire en coupe verticale et légèrement plus grande qu'un rectangle minimum défini pour entourer une rangée ou un réseau rectangulaire desdites plages de connexion (13) dans un support calorifuge (11), ledit support calorifuge (11) étant destiné à venir en contact avec une surface de ladite carte à circuit imprimé souple (12) à laquelle une soudure (28) est appliquée, et
    mettre ledit support calorifuge (11) en contact avec ladite surface de ladite carte à circuit imprimé souple (12) de sorte que lesdites plages de connexion (13) et lesdits bornes (14) sont situées à l'intérieur de ladite ouverture (19), et souder lesdites bornes (14) à l'aide d'un procédé de soudure à la vague ou de soudure par fusion, le contact étant maintenu et les bornes (14) s'étendant à travers lesdites plages de connexion (13) dans ladite ouverture (19).
  3. Procédé selon la revendication 1 ou 2, dans lequel l'épaisseur dudit support calorifuge (11) est comprise entre environ un dixième et sept fois l'épaisseur de ladite carte à circuit imprimé souple (12).
  4. Procédé selon la revendication 1, 2 ou 3, dans lequel ladite carte à circuit imprimé souple (12) est constituée de polyéthylène-téréphtalate.
  5. Procédé selon l'une quelconque des revendications 1 à 4, dans lequel ledit support calorifuge (11) inclut une carte laminée plaquée de cuivre à base de papier phénolique, une carte de résine époxy à base de papier, ou une carte de résine époxy à base de verre silionne.
  6. Procédé de montage d'une borne (14) constituée d'un matériau conducteur sur une carte à circuit imprimé souple (12) constituée d'un matériau ayant un point de fusion au-dessous de 230°C en soudant la borne (14) à une plage de connexion (13) formée sur la carte à circuit imprimé souple (12), ledit procédé comportant les étapes consistant à :
    former un trou traversant (31) ayant une taille pratiquement égale à la taille de ladite plage de connexion (13) dans un film calorifuge (30) agencé en contact avec une surface de ladite carte à circuit imprimé souple (12) à laquelle une soudure (28) est appliquée,
    former une ouverture (34) qui est plus grande que ladite plage de connexion (13) dans un support calorifuge (33), ledit support calorifuge (33) étant destiné à venir en contact avec une surface dudit film calorifuge (30) qui est en vis-à-vis de ladite carte à circuit imprimé souple (12), et
    souder ladite borne (14) à l'aide d'un procédé de soudure à la vague ou de soudure par fusion, ledit film calorifuge (30) étant en contact avec ladite surface de ladite carte à circuit imprimé souple (12), de sorte que ladite plage de connexion (13) et ladite borne (14) sont situées à l'intérieur dudit trou traversant (31), et ledit support calorifuge (33) étant en contact avec ladite surface dudit film calorifuge (30) de sorte que ladite plage de connexion (13) et ladite borne (14) sont situées à l'intérieur de ladite ouverture (34).
  7. Procédé selon la revendication 6, dans lequel ledit support calorifuge (33) est muni d'une pluralité de broches de guidage (36) dans des coins de celui-ci, et ladite carte à circuit imprimé souple (12) et ledit film calorifuge (30) ont des trous traversants (37) formés à l'intérieur pour lesdites broches de guidage (36), et dans lequel lesdites broches de guidage (36) sont respectivement insérées dans lesdits trous traversants (37) pour mettre ledit support calorifuge (33) en contact avec ledit film calorifuge (30) et pour mettre ledit film calorifuge (30) en contact avec ladite carte à circuit imprimé souple (12).
  8. Procédé selon la revendication 6, dans lequel ledit support calorifuge (33) est formé avec un cadre de guidage (39) afin de recevoir ladite carte à circuit imprimé souple (12) et ledit film calorifuge (30) dans celui-ci, et dans lequel ledit film calorifuge (30) vient en contact avec ladite carte à circuit imprimé souple (12), et ledit support calorifuge (33) vient en contact avec ledit film calorifuge (30).
  9. Procédé selon l'une quelconque des revendications 6 à 8, dans lequel ledit film calorifuge (30) est constitué de polyamide, de polyéthylène-téréphtalate, d'acide polyparabanique, d'aramide, de polyamide, de polysulfone, de polyéther sulfone, de sulfure de polyphénylène, de polyéther éthercétone, de polyéther imide, de polyarylate, de polyéthylène naphtalate, ou d'un polymère de fluorocarbone.
  10. Procédé selon l'une quelconque des revendications 6 à 9, dans lequel ledit support calorifuge (33) inclut une carte laminée plaquée de cuivre à base de papier phénolique, une carte de résine époxy à base de papier, ou une carte de résine époxy à base de verre silionne.
  11. Procédé selon l'une quelconque des revendications 6 à 10, dans lequel ladite carte à circuit imprimé souple (12) est constituée de polyéthylène-téréphtalate.
  12. Procédé selon l'une quelconque des revendications 6 à 11, dans lequel ledit film calorifuge (30) et ledit support calorifuge (33) sont liés respectivement à ladite carte à circuit imprimé souple (12) et audit film calorifuge (30) à l'aide d'un adhésif autocollant ou d'un adhésif.
EP95117349A 1994-11-25 1995-11-03 Procédé de montage d'une broche à un panneau à circuit imprimé flexible Expired - Lifetime EP0714226B1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP6291531A JP2806279B2 (ja) 1994-11-25 1994-11-25 フレキシブルプリント回路基板の半田付方法
JP6291530A JP2921417B2 (ja) 1994-11-25 1994-11-25 フレキシブルプリント回路基板の半田付方法
JP291530/94 1994-11-25
JP291531/94 1994-11-25
JP29153194 1994-11-25
JP29153094 1994-11-25

Publications (2)

Publication Number Publication Date
EP0714226A1 EP0714226A1 (fr) 1996-05-29
EP0714226B1 true EP0714226B1 (fr) 2000-02-02

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Application Number Title Priority Date Filing Date
EP95117349A Expired - Lifetime EP0714226B1 (fr) 1994-11-25 1995-11-03 Procédé de montage d'une broche à un panneau à circuit imprimé flexible

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US (1) US5692297A (fr)
EP (1) EP0714226B1 (fr)
DE (1) DE69514895T2 (fr)

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DE19809138A1 (de) * 1998-03-04 1999-09-30 Philips Patentverwaltung Leiterplatte mit SMD-Bauelementen
JP2000163797A (ja) 1998-11-27 2000-06-16 Mitsumi Electric Co Ltd 部品固定法
US6116492A (en) * 1999-04-28 2000-09-12 Behavior Tech Computer Corporation Jig for facilitating surface-soldering pin to laminated metal sheet
US6223973B1 (en) * 1999-11-16 2001-05-01 Visteon Global Technologies, Inc. Apparatus and method for connecting printed circuit boards through soldered lap joints
US6357864B1 (en) 1999-12-16 2002-03-19 Lexmark International, Inc. Tab circuit design for simplified use with hot bar soldering technique
US6327155B1 (en) * 1999-12-16 2001-12-04 Nortel Networks Limited Method and apparatus for preventing flamespread in an equipment assembly
US20040222271A1 (en) * 2003-05-06 2004-11-11 Visteon Global Technologies, Inc. Method and pallet assembly for reflow soldering of interconnections between printed circuits having low-temperature substrates
US20080241563A1 (en) * 2007-03-30 2008-10-02 Khamvong Thammasouk Polymer substrate for electronic components
CN101420817A (zh) * 2007-10-22 2009-04-29 鸿富锦精密工业（深圳）有限公司 具有改良焊盘的电路板
US20100319754A1 (en) * 2009-02-19 2010-12-23 Sajjad Basha S Photovoltaic module configuration
DE102015207891A1 (de) * 2014-07-07 2016-01-07 Conti Temic Microelectronic Gmbh Elektronische Komponente und Verfahren zur Herstellung einer elektronischen Komponente
JP6274196B2 (ja) * 2015-12-16 2018-02-07 株式会社オートネットワーク技術研究所 電気接続箱
US11452198B2 (en) 2019-07-25 2022-09-20 Borgwarner, Inc. Thermally insulated printed circuit board

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Also Published As

Publication number Publication date
EP0714226A1 (fr) 1996-05-29
DE69514895T2 (de) 2000-06-15
DE69514895D1 (de) 2000-03-09
US5692297A (en) 1997-12-02

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