EP0688879B1 - High vacuum apparatus member and vacuum apparatus - Google Patents
High vacuum apparatus member and vacuum apparatus Download PDFInfo
- Publication number
- EP0688879B1 EP0688879B1 EP19950107446 EP95107446A EP0688879B1 EP 0688879 B1 EP0688879 B1 EP 0688879B1 EP 19950107446 EP19950107446 EP 19950107446 EP 95107446 A EP95107446 A EP 95107446A EP 0688879 B1 EP0688879 B1 EP 0688879B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- vacuum
- ppm
- vacuum apparatus
- oxygen
- hydrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture And Refinement Of Metals (AREA)
Description
Vacuum apparatus member | Composition | Out-gassing rate (Torr·1/sec.·cm2) | ||||
Electrolytic copper purity (%) | Zr (ppm) | Oxygen (ppm) | P (ppm) | |||
| 1 | 99.998 | 3 | 1.8 | - | 1.33 x 10-11 |
2 | 99.998 | 4 | 2.0 | - | 2.17 x 10-11 | |
3 | 99.998 | 3 | 1.7 | - | 2.34 x 10-11 | |
4 | 99.998 | 1 | 0.7 | - | 6.75 x 10-12 | |
5 | 99.998 | 7 | 1.8 | - | 8.98 x 10-12 | |
6 | 99.998 | 12 | 2.0 | - | 1.10 x 10-11 | |
7 | 99.998 | 14 | 2.7 | - | 2.14 x 10-11 | |
8 | 99.998 | 6 | 1.2 | - | 9.77 x 10-12 | |
9 | 99.998 | 11 | 1.5 | - | 7.29 x 10-12 | |
10 | 99.998 | 10 | 2.0 | - | 1.01 x 10-11 | |
Comparison | 1 | 99.998 | 7 | 5.0 * | - | 6.21 x 10-10 |
2 | 99.998 | 0.6 * | 1.8 | - | 2.70 x 10-10 | |
3 | 99.998 | 18 * | 1.2 | - | 8.29 x 10-11 | |
| 1 | 99.998 | - | 2.0 | 3.1 | 1.26 x 10-10 |
2 | 99.998 | - | 1.5 | 2.8 | 8.92 x 10-11 | |
3 | 99.998 | - | 2.5 | - | 1.94 x 10-10 | |
(Values marked with * are outside the range of the invention) |
Claims (3)
- Use of high-purity copper material containing, prior to annealing (baking), hydrogen, 3 ppm or less of oxygen and 1 to 15 ppm of Zr and having a purity of 99,99 weight % or higher as a material for the manufacture of high-vacuum apparatuses.
- The use of the material according to claim 1 containing 3 to 10 ppm of Zr for the same purpose as in claim 1.
- The use of the material according to any of claims 1 or 2 for constructing power transmitter tubes, external anodes which also serve as vacuum containers for microwave tubes, vacuum deposition and sputtering apparatuses and acceleration cavity containers for accelerators.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP160596/94 | 1994-06-20 | ||
JP16059694A JPH083664A (en) | 1994-06-20 | 1994-06-20 | Member for vacuum device and vacuum device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0688879A1 EP0688879A1 (en) | 1995-12-27 |
EP0688879B1 true EP0688879B1 (en) | 1998-02-04 |
Family
ID=15718373
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19950107446 Expired - Lifetime EP0688879B1 (en) | 1994-06-20 | 1995-05-17 | High vacuum apparatus member and vacuum apparatus |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0688879B1 (en) |
JP (1) | JPH083664A (en) |
DE (1) | DE69501569T2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4943095B2 (en) * | 2006-08-30 | 2012-05-30 | 三菱電機株式会社 | Copper alloy and manufacturing method thereof |
WO2016186070A1 (en) * | 2015-05-21 | 2016-11-24 | Jx金属株式会社 | Copper alloy sputtering target and method for manufacturing same |
JP7131376B2 (en) * | 2018-12-27 | 2022-09-06 | 三菱マテリアル株式会社 | Copper material for sputtering targets |
CN113290217B (en) * | 2021-05-28 | 2022-09-23 | 金川集团股份有限公司 | Vacuum continuous casting process of high-purity oxygen-free copper rod |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2175009B (en) * | 1985-03-27 | 1990-02-07 | Mitsubishi Metal Corp | Wire for bonding a semiconductor device and process for producing the same |
JPS62207834A (en) * | 1986-03-10 | 1987-09-12 | Nippon Mining Co Ltd | Copper material for use in high-vacuum atmosphere |
JPS62243727A (en) * | 1986-04-16 | 1987-10-24 | Hitachi Cable Ltd | Rolled copper foil for printed circuit board |
JPS63312934A (en) * | 1987-06-16 | 1988-12-21 | Hitachi Cable Ltd | Lead frame material for semiconductor |
JPS643903A (en) * | 1987-06-25 | 1989-01-09 | Furukawa Electric Co Ltd | Thin copper wire for electronic devices and manufacture thereof |
JP2726939B2 (en) * | 1989-03-06 | 1998-03-11 | 日鉱金属 株式会社 | Highly conductive copper alloy with excellent workability and heat resistance |
-
1994
- 1994-06-20 JP JP16059694A patent/JPH083664A/en not_active Withdrawn
-
1995
- 1995-05-17 DE DE1995601569 patent/DE69501569T2/en not_active Expired - Fee Related
- 1995-05-17 EP EP19950107446 patent/EP0688879B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69501569T2 (en) | 1998-06-10 |
DE69501569D1 (en) | 1998-03-12 |
JPH083664A (en) | 1996-01-09 |
EP0688879A1 (en) | 1995-12-27 |
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