EP0641934A1 - Herstellungsverfahren einer Mikropumpe - Google Patents
Herstellungsverfahren einer Mikropumpe Download PDFInfo
- Publication number
- EP0641934A1 EP0641934A1 EP94107419A EP94107419A EP0641934A1 EP 0641934 A1 EP0641934 A1 EP 0641934A1 EP 94107419 A EP94107419 A EP 94107419A EP 94107419 A EP94107419 A EP 94107419A EP 0641934 A1 EP0641934 A1 EP 0641934A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- wafer
- oxide layer
- intended
- fluid
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000012530 fluid Substances 0.000 claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 20
- 239000010703 silicon Substances 0.000 claims abstract description 20
- 238000003754 machining Methods 0.000 claims abstract description 11
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 8
- 230000003647 oxidation Effects 0.000 claims abstract description 7
- 238000000206 photolithography Methods 0.000 claims abstract description 7
- 230000001737 promoting effect Effects 0.000 claims abstract description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000005459 micromachining Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 36
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 10
- 238000005086 pumping Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- 206010001488 Aggression Diseases 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000016571 aggressive behavior Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- 208000031968 Cadaver Diseases 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 208000012761 aggressive behavior Diseases 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000012550 audit Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000763 evoking effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
Definitions
- the present invention relates to a method for manufacturing devices produced by micromachining of silicon and called to contain or convey gaseous or liquid fluids. More particularly, the invention relates to the manufacture of silicon micropumps produced by photolithography machining techniques.
- the solution to this problem mentioned in the aforementioned international patent application namely to make the surfaces in contact with the fluid to be conveyed hydrophilic, consists in oxidizing the pump body in silicon after its manufacture so as to form a very weak surface layer d silicon oxide which is hydrophilic and can thus considerably improve the wettability of the volumes of the pump in contact with the fluid to be conveyed. More specifically, in the aforementioned document, it is proposed to soak the completed pump body in boiling nitric acid for a period of time. sufficient to create a suitable thickness of the hydrophilic layer.
- the presence of the oxide layer covering the silicon exposed to the fluid remains desirable, however, because it also has another advantage in that it makes it possible to protect the silicon against attack by the fluid provided that it naturally has an aggressive behavior.
- the fluid consists of a corrosive gas, the harmful effects of which under these conditions are canceled under these conditions.
- the oxide layer can constitute an electrical insulator, when the fluid is electrically conductive.
- the object of the invention is to remedy the above-mentioned drawback of the prior art and to propose a method for manufacturing micro-machined devices of the type indicated above which makes it possible to guarantee a good bond between the silicon body. of the device and the glass closure plates, while retaining an oxide layer on the expired surfaces with the fluid.
- said screen layer is made of silicon nitride and deposited on said wafer with the interposition of an intermediate oxide layer.
- said intermediate oxide layer has a thickness less than that of said oxide layer promoting wettability, the method further consisting, after the elimination of said screen layer, in eliminating said intermediate oxide layer, while said oxide layer promoting wettability is exposed.
- the invention also relates to a micro-machined device obtained by the method as defined above.
- the micropump comprises a base plate 1 or first closure plate, preferably made of glass and pierced in its thickness by two channels 2 and 3 which are respectively the inlet channel and the outlet channel of the micropump.
- a third relatively thin plate 5 made of glass, preferably.
- This plate constitutes the second closing plate of the pump. It is surmounted by a piezoelectric transducer 6 extending over part of its outer surface, this transducer being intended, by virtue of its vibrational regime generated when it is excited by an electric voltage, to deform the second closure plate 5 and consequently to vary the volume of the pumping chamber of the pump during its operation.
- a micropump thus constructed has a dimension in its general plane of 22 ⁇ 22 mm, the thicknesses of the plates 1, 4 and 5 being respectively 1.5 mm, 280 microns and 0.3 mm.
- the intermediate plate 4 forming the pump body has an inlet chamber 7 (FIG. 2) communicating with the inlet channel 2 pierced in the base plate 1.
- This inlet chamber 7 surrounds an inlet valve 8, the l shutter 9 is formed by a thin and deformable veil machined in the silicon of the plate 4.
- the shutter 9 cooperates with a valve seat 10 which is not specially materialized, but is formed by the corresponding part of the surface of the base plate 1 on which the shutter rests. It will be noted that this shutter 9 has a ring-shaped lining 9a which is brought to it during the process of the invention, and which is intended to slightly arch the thin veil and thus guarantee proper application of the shutter 9 on its seat 10.
- the shutter 9 is provided with a central communication hole 11 which opens, on the side of the veil opposite to the inlet chamber 7, in a pumping chamber 12 above which the piezoelectric transducer is placed 6. It is therefore the volume of this pumping chamber 12 which is caused to change periodically to obtain the action of pumping of the micropump.
- the pumping chamber 12 is in communication with a transfer chamber 13 via a communication orifice 14, this transfer chamber surrounding a second valve of the pump which is the outlet valve 15 of the latter.
- This valve is constructed substantially in the same way as the inlet valve and therefore comprises a shutter 16, a shutter lining 16a, a seat 17 and a central communication orifice 18.
- the latter connects, if necessary it is ie when the outlet valve 15 is open, the transfer chamber 13 to an outlet chamber 19 located above the outlet valve 15.
- This outlet chamber 19 in turn communicates with the outlet channel 3 of the pump via a communication orifice 20.
- Figures 3a to 3j schematically show a partial sectional view of a pump body 4 taken along line III-III of Figures 1a and 1b, during the various stages of the method according to the invention. He is at note that in the description of the process which follows, the values of all the parameters such as layer thicknesses, temperatures, residence time in the ovens, etc., are only given by way of example and are not to be considered as limiting the present invention.
- the thickness of the layer can be 1 micron and the step can be carried out in an oven in which an atmosphere of water vapor prevails which is brought to a temperature of 1100 ° C.
- Water vapor can be generated in a bubbler in which oxygen is introduced at a flow rate of 0.5 l / min and nitrogen at a flow rate of 4 l / min.
- the wafer thus provided with the oxide layers 22 is subjected to a conventional photolithography operation by which an attack of the oxide with hydrofluoric acid buffered with ammonium fluoride is carried out in a proportion of 1: 7 and at temperature ambient, through a photoresist mask, to keep only annular zones 23 intended to subsequently form the linings 9a and 16a of the valves.
- a photolithography operation by which an attack of the oxide with hydrofluoric acid buffered with ammonium fluoride is carried out in a proportion of 1: 7 and at temperature ambient, through a photoresist mask, to keep only annular zones 23 intended to subsequently form the linings 9a and 16a of the valves.
- Figures 3a to 3j show only the area corresponding to only one outlet valve 15).
- the wafer resulting from the operation of the step of Figure 3b is then coated in its entirety with an oxide layer 24 of a predetermined thickness (in the example of 1000 ⁇ ngströms) by dry oxidation in a tubular oven at 1100 ° C in which a stream of oxygen circulates with a flow rate of 2 l / min.
- the oxide layers thus obtained which act as a bonding layer are in turn coated with a layer 25 of silicon nitride (Si3N4) by chemical vapor deposition (LPCVD) at 800 ° C. and up to '' at a thickness of 1500 ⁇ ngströms.
- the silicon nitride can be replaced by aluminum oxide (Al2O3) of the same thickness.
- the next step of the process consists in selectively removing the layers 24 and 25 in order to delimit expanses 26 and 27 on the wafer in which the various cavities of the pump are subsequently formed.
- these are respectively the outlet chamber 19 and the transfer chamber 13.
- the annular zones corresponding to the linings 9a and 16a, respectively, are preserved.
- This step therefore comprises a conventional photolithography operation using a photoresist during which the silicon nitride is first removed selectively by plasma etching, then the oxide by etching with buffered hydrofluoric acid.
- the wafer 21 is then again subjected to an oxidation operation on the two faces, outside the zones already covered by the silicon nitride to form the layers 28 (see FIG. 3e).
- This oxidation takes place in the same way as that which led to the formation of the layers 22 (see FIG. 3a), the thickness of the layers 28 being 3000 ⁇ ngströms, for example.
- an opening 29 of circular shape is made in the oxide layer 28 at the places where the central passages of the valve 8 and 15 must be located.
- This opening is produced by subjecting the wafer to photolithography operations using photoresist, the attack itself being carried out with buffered hydrofluoric acid. This results in the configuration shown in Figure 3f.
- a cavity 30 is then formed in the silicon by subjecting the wafer to a KOH solution at a temperature between 40 and 60 ° C to attack it anisotropically until the depth of the cavity is approximately equal to 50 microns , after which we removes residual oxide not yet removed by KOH attack, by resubmitting the wafer to a solution of hydrofluoric acid buffered with ammonium fluoride in a proportion of 1: 7 and at room temperature, until that all the oxide has disappeared on both sides of the wafer.
- This operation leads to the configuration shown in Figure 3g.
- the wafer is then again subjected to an anisotropic attack with KOH by soaking in a solution of this compound for a sufficient time so that what has become the haze of each valve is only 50 microns thick.
- This operation also leads to the piercing of the plate in the center of the valve and to the formation of the various cavities provided for the pump, as shown in Figure 3h.
- the wafer is subjected to wet oxidation under the same conditions as those which led to the formation of layer 22 until an oxide layer 31 with a thickness of approximately 3000 ⁇ ngströms is obtained, this layer covering with oxide all the expanses of the pump intended to come into contact with the fluid.
- the zones which have remained covered with silicon nitride during all the stages of the process which have just been described are not affected by this oxidation operation, as shown in FIG. 3i.
- the next step in the process consists in removing the silicon nitride from the layer still present on the wafer by subjecting it to an 85% solution of phosphoric acid at a temperature of around 180 ° C. and then to a solution. hydrofluoric acid buffered to remove the oxide from layer 24, previously underlying the silicon nitride.
- This latter operation also leads to the partial removal of the oxide layer 31.
- the oxide layer 25 had a thickness of approximately 1000 ⁇ ngströms, the oxide removal operation carried out last allows to remain a sufficient thickness on the surfaces exposed to the fluid (approximately 2000 ⁇ ngströms) so that these surfaces have sufficient wettability and are sufficiently protected against possible attacks by this fluid. This last operation leads to the configuration shown in FIG. 3j, where it can be seen that an oxide layer 32 has remained present.
- the hydrophilic and protective layer 32 is provided during the process of making up the pump body without requiring subsequent dipping operations capable of oxidizing not only the surfaces which must actually be, but also the surfaces 33 against which the closure plates of the pump are to be fixed, as was the case in the prior art.
- the method of the invention makes it possible to easily obtain a thicker oxide layer than was the case in the prior art, so that it can provide better electrical insulation.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
- Micromachines (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- External Artificial Organs (AREA)
- Weting (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Lubricants (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9306281 | 1993-05-24 | ||
FR9306281A FR2705693B1 (fr) | 1993-05-24 | 1993-05-24 | Procédé de fabrication d'un dispositif micro-usiné à contenir ou à véhiculer un fluide. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0641934A1 true EP0641934A1 (de) | 1995-03-08 |
EP0641934B1 EP0641934B1 (de) | 1996-12-27 |
Family
ID=9447460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94107419A Expired - Lifetime EP0641934B1 (de) | 1993-05-24 | 1994-05-13 | Herstellungsverfahren einer Mikropumpe |
Country Status (10)
Country | Link |
---|---|
US (1) | US5462839A (de) |
EP (1) | EP0641934B1 (de) |
JP (1) | JP3651809B2 (de) |
AT (1) | ATE146853T1 (de) |
DE (1) | DE69401250T2 (de) |
DK (1) | DK0641934T3 (de) |
ES (1) | ES2099991T3 (de) |
FR (1) | FR2705693B1 (de) |
HK (1) | HK1006739A1 (de) |
SG (1) | SG47036A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1129741A2 (de) | 1997-11-19 | 2001-09-05 | Microflow Engineering SA | Sprühvorrichtung für einen Inhalator |
US6405934B1 (en) | 1998-12-01 | 2002-06-18 | Microflow Engineering Sa | Optimized liquid droplet spray device for an inhaler suitable for respiratory therapies |
EP1792662A1 (de) | 2005-11-30 | 2007-06-06 | Microflow Engineering SA | Tropferspendervorrichtung |
Families Citing this family (30)
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US6377155B1 (en) | 1995-10-10 | 2002-04-23 | Georgia Tech Research Corp. | Microfabricated electromagnetic system and method for forming electromagnets in microfabricated devices |
US6281560B1 (en) | 1995-10-10 | 2001-08-28 | Georgia Tech Research Corp. | Microfabricated electromagnetic system and method for forming electromagnets in microfabricated devices |
US5847631A (en) * | 1995-10-10 | 1998-12-08 | Georgia Tech Research Corporation | Magnetic relay system and method capable of microfabrication production |
US5879632A (en) * | 1996-04-09 | 1999-03-09 | Sarnoff Corporation | Apportioning system |
US20050214827A1 (en) * | 1996-07-08 | 2005-09-29 | Burstein Technologies, Inc. | Assay device and method |
US6342349B1 (en) | 1996-07-08 | 2002-01-29 | Burstein Technologies, Inc. | Optical disk-based assay devices and methods |
US6331275B1 (en) | 1996-07-08 | 2001-12-18 | Burstein Technologies, Inc. | Spatially addressable, cleavable reflective signal elements, assay device and method |
IL127938A (en) | 1996-07-08 | 2002-09-12 | Burstein Lab Inc | A device with a main signal fixed for diagnostic applications and a test method |
DE19705910C1 (de) * | 1997-02-15 | 1998-06-18 | Inst Physikalische Hochtech Ev | Mikrokammerarray mit hoher Kammerdichte |
DE19719862A1 (de) | 1997-05-12 | 1998-11-19 | Fraunhofer Ges Forschung | Mikromembranpumpe |
HUP0103577A2 (hu) * | 1998-07-21 | 2002-01-28 | Burstein Technologies, Inc. | Optikai lemez alapú eszközök és eljárások |
US6410360B1 (en) | 1999-01-26 | 2002-06-25 | Teledyne Industries, Inc. | Laminate-based apparatus and method of fabrication |
US6905614B1 (en) | 2000-05-24 | 2005-06-14 | Active Optical Networks, Inc. | Pattern-transfer process for forming micro-electro-mechanical structures |
US6827866B1 (en) * | 2000-05-24 | 2004-12-07 | Active Optical Networks, Inc. | Deep-well lithography process for forming micro-electro-mechanical structures |
AU2002241602A1 (en) * | 2000-11-16 | 2002-06-11 | Burstein Technologies, Inc. | Methods and apparatus for detecting and quantifying lymphocytes with optical biodiscs |
AU2002227181A1 (en) * | 2000-11-16 | 2002-05-27 | Burstein Technologies, Inc. | Optical biodiscs with reflective layers |
US7087203B2 (en) * | 2000-11-17 | 2006-08-08 | Nagaoka & Co., Ltd. | Methods and apparatus for blood typing with optical bio-disc |
US7026131B2 (en) * | 2000-11-17 | 2006-04-11 | Nagaoka & Co., Ltd. | Methods and apparatus for blood typing with optical bio-discs |
EP1236517A1 (de) * | 2001-02-23 | 2002-09-04 | Microflow Engineering SA | Verfahren zur Herstellung eines Tröpfchen-Verneblers und ein solcher Vernebler |
US7141416B2 (en) * | 2001-07-12 | 2006-11-28 | Burstein Technologies, Inc. | Multi-purpose optical analysis optical bio-disc for conducting assays and various reporting agents for use therewith |
US20030143637A1 (en) * | 2001-08-31 | 2003-07-31 | Selvan Gowri Pyapali | Capture layer assemblies for cellular assays including related optical analysis discs and methods |
US20030113925A1 (en) * | 2001-09-07 | 2003-06-19 | Gordon John Francis | Nuclear morphology based identification and quantification of white blood cell types using optical bio-disc systems |
US20050003459A1 (en) * | 2002-01-30 | 2005-01-06 | Krutzik Siegfried Richard | Multi-purpose optical analysis disc for conducting assays and related methods for attaching capture agents |
WO2003065355A2 (en) * | 2002-01-31 | 2003-08-07 | Burstein Technologies, Inc. | Bio-safety features for optical analysis disc and disc system including same |
US20040241381A1 (en) * | 2002-01-31 | 2004-12-02 | Chen Yihfar | Microfluidic structures with circumferential grooves for bonding adhesives and related optical analysis discs |
US20070274863A1 (en) * | 2003-07-25 | 2007-11-29 | Horacio Kido | Fluidic circuits for sample preparation including bio-discs and methods relating thereto |
US7723899B2 (en) | 2004-02-03 | 2010-05-25 | S.C. Johnson & Son, Inc. | Active material and light emitting device |
US7538473B2 (en) * | 2004-02-03 | 2009-05-26 | S.C. Johnson & Son, Inc. | Drive circuits and methods for ultrasonic piezoelectric actuators |
TWI580878B (zh) * | 2016-07-19 | 2017-05-01 | 科際精密股份有限公司 | 單向閥組件 |
CN112016805B (zh) * | 2020-07-23 | 2023-06-06 | 上海工程技术大学 | 一种磁流变液性能评价方法及系统 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990015929A1 (fr) * | 1989-06-14 | 1990-12-27 | Westonbridge International Limited | Micropompe perfectionnee |
WO1991007591A1 (en) * | 1989-11-10 | 1991-05-30 | Westonbridge International Limited | Micropump with improved priming |
EP0465229A1 (de) * | 1990-07-02 | 1992-01-08 | Seiko Epson Corporation | Mikropumpe und Verfahren zur Herstellung einer Mikropumpe |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4938742A (en) * | 1988-02-04 | 1990-07-03 | Smits Johannes G | Piezoelectric micropump with microvalves |
US5171132A (en) * | 1989-12-27 | 1992-12-15 | Seiko Epson Corporation | Two-valve thin plate micropump |
-
1993
- 1993-05-24 FR FR9306281A patent/FR2705693B1/fr not_active Expired - Fee Related
-
1994
- 1994-05-13 SG SG1996003690A patent/SG47036A1/en unknown
- 1994-05-13 ES ES94107419T patent/ES2099991T3/es not_active Expired - Lifetime
- 1994-05-13 DK DK94107419.7T patent/DK0641934T3/da active
- 1994-05-13 AT AT94107419T patent/ATE146853T1/de not_active IP Right Cessation
- 1994-05-13 JP JP12333394A patent/JP3651809B2/ja not_active Expired - Fee Related
- 1994-05-13 EP EP94107419A patent/EP0641934B1/de not_active Expired - Lifetime
- 1994-05-13 DE DE69401250T patent/DE69401250T2/de not_active Expired - Fee Related
- 1994-05-23 US US08/247,550 patent/US5462839A/en not_active Expired - Lifetime
-
1998
- 1998-06-23 HK HK98106084A patent/HK1006739A1/xx not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990015929A1 (fr) * | 1989-06-14 | 1990-12-27 | Westonbridge International Limited | Micropompe perfectionnee |
WO1991007591A1 (en) * | 1989-11-10 | 1991-05-30 | Westonbridge International Limited | Micropump with improved priming |
EP0465229A1 (de) * | 1990-07-02 | 1992-01-08 | Seiko Epson Corporation | Mikropumpe und Verfahren zur Herstellung einer Mikropumpe |
Non-Patent Citations (2)
Title |
---|
ESASHI,SHOJI & NAKANO: "Normally closed microvalve an dmicropump fabricated on a silicon wafer", SENSORS AND ACTUATORS, vol. 20, no. 1/2, 1 November 1989 (1989-11-01), LAUSANNE CH, pages 163 - 169, XP000135240 * |
SHOJI AND ESASHI: "A study of a high-pressure micropump for integrated chemical analysing systems", SENSORS AND ACTUATORS A, vol. 32, no. 1/3, 1 April 1992 (1992-04-01), LAUSANNE CH, pages 335 - 339, XP026576996, DOI: doi:10.1016/0924-4247(92)80008-Q * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1129741A2 (de) | 1997-11-19 | 2001-09-05 | Microflow Engineering SA | Sprühvorrichtung für einen Inhalator |
EP1149602A2 (de) | 1997-11-19 | 2001-10-31 | Microflow Engineering SA | Sprühvorrichtung für einen für die Atemtherapie geeigneten Inhalator |
US6405934B1 (en) | 1998-12-01 | 2002-06-18 | Microflow Engineering Sa | Optimized liquid droplet spray device for an inhaler suitable for respiratory therapies |
EP1792662A1 (de) | 2005-11-30 | 2007-06-06 | Microflow Engineering SA | Tropferspendervorrichtung |
US9604242B2 (en) | 2005-11-30 | 2017-03-28 | Aptar France Sas | Volatile liquid droplet dispenser device |
Also Published As
Publication number | Publication date |
---|---|
DK0641934T3 (da) | 1997-10-13 |
US5462839A (en) | 1995-10-31 |
DE69401250D1 (de) | 1997-02-06 |
FR2705693A1 (fr) | 1994-12-02 |
FR2705693B1 (fr) | 1995-07-28 |
EP0641934B1 (de) | 1996-12-27 |
SG47036A1 (en) | 1998-03-20 |
JPH0719170A (ja) | 1995-01-20 |
ES2099991T3 (es) | 1997-06-01 |
DE69401250T2 (de) | 1997-07-10 |
ATE146853T1 (de) | 1997-01-15 |
HK1006739A1 (en) | 1999-03-12 |
JP3651809B2 (ja) | 2005-05-25 |
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