EP0641934A1 - Herstellungsverfahren einer Mikropumpe - Google Patents

Herstellungsverfahren einer Mikropumpe Download PDF

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Publication number
EP0641934A1
EP0641934A1 EP94107419A EP94107419A EP0641934A1 EP 0641934 A1 EP0641934 A1 EP 0641934A1 EP 94107419 A EP94107419 A EP 94107419A EP 94107419 A EP94107419 A EP 94107419A EP 0641934 A1 EP0641934 A1 EP 0641934A1
Authority
EP
European Patent Office
Prior art keywords
wafer
oxide layer
intended
fluid
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP94107419A
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English (en)
French (fr)
Other versions
EP0641934B1 (de
Inventor
Nicolaas Frans De Rooij
Sylvain Jeanneret
Volker Gass
Bart Van Der Schoot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EP Systems SA
Original Assignee
Fondation Pour Le Soutien A La Recherche Appliquee Et Orientee (fsrao)
Universite de Neuchatel
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Application filed by Fondation Pour Le Soutien A La Recherche Appliquee Et Orientee (fsrao), Universite de Neuchatel filed Critical Fondation Pour Le Soutien A La Recherche Appliquee Et Orientee (fsrao)
Publication of EP0641934A1 publication Critical patent/EP0641934A1/de
Application granted granted Critical
Publication of EP0641934B1 publication Critical patent/EP0641934B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F04B43/046—Micropumps with piezoelectric drive

Definitions

  • the present invention relates to a method for manufacturing devices produced by micromachining of silicon and called to contain or convey gaseous or liquid fluids. More particularly, the invention relates to the manufacture of silicon micropumps produced by photolithography machining techniques.
  • the solution to this problem mentioned in the aforementioned international patent application namely to make the surfaces in contact with the fluid to be conveyed hydrophilic, consists in oxidizing the pump body in silicon after its manufacture so as to form a very weak surface layer d silicon oxide which is hydrophilic and can thus considerably improve the wettability of the volumes of the pump in contact with the fluid to be conveyed. More specifically, in the aforementioned document, it is proposed to soak the completed pump body in boiling nitric acid for a period of time. sufficient to create a suitable thickness of the hydrophilic layer.
  • the presence of the oxide layer covering the silicon exposed to the fluid remains desirable, however, because it also has another advantage in that it makes it possible to protect the silicon against attack by the fluid provided that it naturally has an aggressive behavior.
  • the fluid consists of a corrosive gas, the harmful effects of which under these conditions are canceled under these conditions.
  • the oxide layer can constitute an electrical insulator, when the fluid is electrically conductive.
  • the object of the invention is to remedy the above-mentioned drawback of the prior art and to propose a method for manufacturing micro-machined devices of the type indicated above which makes it possible to guarantee a good bond between the silicon body. of the device and the glass closure plates, while retaining an oxide layer on the expired surfaces with the fluid.
  • said screen layer is made of silicon nitride and deposited on said wafer with the interposition of an intermediate oxide layer.
  • said intermediate oxide layer has a thickness less than that of said oxide layer promoting wettability, the method further consisting, after the elimination of said screen layer, in eliminating said intermediate oxide layer, while said oxide layer promoting wettability is exposed.
  • the invention also relates to a micro-machined device obtained by the method as defined above.
  • the micropump comprises a base plate 1 or first closure plate, preferably made of glass and pierced in its thickness by two channels 2 and 3 which are respectively the inlet channel and the outlet channel of the micropump.
  • a third relatively thin plate 5 made of glass, preferably.
  • This plate constitutes the second closing plate of the pump. It is surmounted by a piezoelectric transducer 6 extending over part of its outer surface, this transducer being intended, by virtue of its vibrational regime generated when it is excited by an electric voltage, to deform the second closure plate 5 and consequently to vary the volume of the pumping chamber of the pump during its operation.
  • a micropump thus constructed has a dimension in its general plane of 22 ⁇ 22 mm, the thicknesses of the plates 1, 4 and 5 being respectively 1.5 mm, 280 microns and 0.3 mm.
  • the intermediate plate 4 forming the pump body has an inlet chamber 7 (FIG. 2) communicating with the inlet channel 2 pierced in the base plate 1.
  • This inlet chamber 7 surrounds an inlet valve 8, the l shutter 9 is formed by a thin and deformable veil machined in the silicon of the plate 4.
  • the shutter 9 cooperates with a valve seat 10 which is not specially materialized, but is formed by the corresponding part of the surface of the base plate 1 on which the shutter rests. It will be noted that this shutter 9 has a ring-shaped lining 9a which is brought to it during the process of the invention, and which is intended to slightly arch the thin veil and thus guarantee proper application of the shutter 9 on its seat 10.
  • the shutter 9 is provided with a central communication hole 11 which opens, on the side of the veil opposite to the inlet chamber 7, in a pumping chamber 12 above which the piezoelectric transducer is placed 6. It is therefore the volume of this pumping chamber 12 which is caused to change periodically to obtain the action of pumping of the micropump.
  • the pumping chamber 12 is in communication with a transfer chamber 13 via a communication orifice 14, this transfer chamber surrounding a second valve of the pump which is the outlet valve 15 of the latter.
  • This valve is constructed substantially in the same way as the inlet valve and therefore comprises a shutter 16, a shutter lining 16a, a seat 17 and a central communication orifice 18.
  • the latter connects, if necessary it is ie when the outlet valve 15 is open, the transfer chamber 13 to an outlet chamber 19 located above the outlet valve 15.
  • This outlet chamber 19 in turn communicates with the outlet channel 3 of the pump via a communication orifice 20.
  • Figures 3a to 3j schematically show a partial sectional view of a pump body 4 taken along line III-III of Figures 1a and 1b, during the various stages of the method according to the invention. He is at note that in the description of the process which follows, the values of all the parameters such as layer thicknesses, temperatures, residence time in the ovens, etc., are only given by way of example and are not to be considered as limiting the present invention.
  • the thickness of the layer can be 1 micron and the step can be carried out in an oven in which an atmosphere of water vapor prevails which is brought to a temperature of 1100 ° C.
  • Water vapor can be generated in a bubbler in which oxygen is introduced at a flow rate of 0.5 l / min and nitrogen at a flow rate of 4 l / min.
  • the wafer thus provided with the oxide layers 22 is subjected to a conventional photolithography operation by which an attack of the oxide with hydrofluoric acid buffered with ammonium fluoride is carried out in a proportion of 1: 7 and at temperature ambient, through a photoresist mask, to keep only annular zones 23 intended to subsequently form the linings 9a and 16a of the valves.
  • a photolithography operation by which an attack of the oxide with hydrofluoric acid buffered with ammonium fluoride is carried out in a proportion of 1: 7 and at temperature ambient, through a photoresist mask, to keep only annular zones 23 intended to subsequently form the linings 9a and 16a of the valves.
  • Figures 3a to 3j show only the area corresponding to only one outlet valve 15).
  • the wafer resulting from the operation of the step of Figure 3b is then coated in its entirety with an oxide layer 24 of a predetermined thickness (in the example of 1000 ⁇ ngströms) by dry oxidation in a tubular oven at 1100 ° C in which a stream of oxygen circulates with a flow rate of 2 l / min.
  • the oxide layers thus obtained which act as a bonding layer are in turn coated with a layer 25 of silicon nitride (Si3N4) by chemical vapor deposition (LPCVD) at 800 ° C. and up to '' at a thickness of 1500 ⁇ ngströms.
  • the silicon nitride can be replaced by aluminum oxide (Al2O3) of the same thickness.
  • the next step of the process consists in selectively removing the layers 24 and 25 in order to delimit expanses 26 and 27 on the wafer in which the various cavities of the pump are subsequently formed.
  • these are respectively the outlet chamber 19 and the transfer chamber 13.
  • the annular zones corresponding to the linings 9a and 16a, respectively, are preserved.
  • This step therefore comprises a conventional photolithography operation using a photoresist during which the silicon nitride is first removed selectively by plasma etching, then the oxide by etching with buffered hydrofluoric acid.
  • the wafer 21 is then again subjected to an oxidation operation on the two faces, outside the zones already covered by the silicon nitride to form the layers 28 (see FIG. 3e).
  • This oxidation takes place in the same way as that which led to the formation of the layers 22 (see FIG. 3a), the thickness of the layers 28 being 3000 ⁇ ngströms, for example.
  • an opening 29 of circular shape is made in the oxide layer 28 at the places where the central passages of the valve 8 and 15 must be located.
  • This opening is produced by subjecting the wafer to photolithography operations using photoresist, the attack itself being carried out with buffered hydrofluoric acid. This results in the configuration shown in Figure 3f.
  • a cavity 30 is then formed in the silicon by subjecting the wafer to a KOH solution at a temperature between 40 and 60 ° C to attack it anisotropically until the depth of the cavity is approximately equal to 50 microns , after which we removes residual oxide not yet removed by KOH attack, by resubmitting the wafer to a solution of hydrofluoric acid buffered with ammonium fluoride in a proportion of 1: 7 and at room temperature, until that all the oxide has disappeared on both sides of the wafer.
  • This operation leads to the configuration shown in Figure 3g.
  • the wafer is then again subjected to an anisotropic attack with KOH by soaking in a solution of this compound for a sufficient time so that what has become the haze of each valve is only 50 microns thick.
  • This operation also leads to the piercing of the plate in the center of the valve and to the formation of the various cavities provided for the pump, as shown in Figure 3h.
  • the wafer is subjected to wet oxidation under the same conditions as those which led to the formation of layer 22 until an oxide layer 31 with a thickness of approximately 3000 ⁇ ngströms is obtained, this layer covering with oxide all the expanses of the pump intended to come into contact with the fluid.
  • the zones which have remained covered with silicon nitride during all the stages of the process which have just been described are not affected by this oxidation operation, as shown in FIG. 3i.
  • the next step in the process consists in removing the silicon nitride from the layer still present on the wafer by subjecting it to an 85% solution of phosphoric acid at a temperature of around 180 ° C. and then to a solution. hydrofluoric acid buffered to remove the oxide from layer 24, previously underlying the silicon nitride.
  • This latter operation also leads to the partial removal of the oxide layer 31.
  • the oxide layer 25 had a thickness of approximately 1000 ⁇ ngströms, the oxide removal operation carried out last allows to remain a sufficient thickness on the surfaces exposed to the fluid (approximately 2000 ⁇ ngströms) so that these surfaces have sufficient wettability and are sufficiently protected against possible attacks by this fluid. This last operation leads to the configuration shown in FIG. 3j, where it can be seen that an oxide layer 32 has remained present.
  • the hydrophilic and protective layer 32 is provided during the process of making up the pump body without requiring subsequent dipping operations capable of oxidizing not only the surfaces which must actually be, but also the surfaces 33 against which the closure plates of the pump are to be fixed, as was the case in the prior art.
  • the method of the invention makes it possible to easily obtain a thicker oxide layer than was the case in the prior art, so that it can provide better electrical insulation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Reciprocating Pumps (AREA)
  • Micromachines (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • External Artificial Organs (AREA)
  • Weting (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Lubricants (AREA)
EP94107419A 1993-05-24 1994-05-13 Herstellungsverfahren einer Mikropumpe Expired - Lifetime EP0641934B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9306281 1993-05-24
FR9306281A FR2705693B1 (fr) 1993-05-24 1993-05-24 Procédé de fabrication d'un dispositif micro-usiné à contenir ou à véhiculer un fluide.

Publications (2)

Publication Number Publication Date
EP0641934A1 true EP0641934A1 (de) 1995-03-08
EP0641934B1 EP0641934B1 (de) 1996-12-27

Family

ID=9447460

Family Applications (1)

Application Number Title Priority Date Filing Date
EP94107419A Expired - Lifetime EP0641934B1 (de) 1993-05-24 1994-05-13 Herstellungsverfahren einer Mikropumpe

Country Status (10)

Country Link
US (1) US5462839A (de)
EP (1) EP0641934B1 (de)
JP (1) JP3651809B2 (de)
AT (1) ATE146853T1 (de)
DE (1) DE69401250T2 (de)
DK (1) DK0641934T3 (de)
ES (1) ES2099991T3 (de)
FR (1) FR2705693B1 (de)
HK (1) HK1006739A1 (de)
SG (1) SG47036A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1129741A2 (de) 1997-11-19 2001-09-05 Microflow Engineering SA Sprühvorrichtung für einen Inhalator
US6405934B1 (en) 1998-12-01 2002-06-18 Microflow Engineering Sa Optimized liquid droplet spray device for an inhaler suitable for respiratory therapies
EP1792662A1 (de) 2005-11-30 2007-06-06 Microflow Engineering SA Tropferspendervorrichtung

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* Cited by examiner, † Cited by third party
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US6377155B1 (en) 1995-10-10 2002-04-23 Georgia Tech Research Corp. Microfabricated electromagnetic system and method for forming electromagnets in microfabricated devices
US6281560B1 (en) 1995-10-10 2001-08-28 Georgia Tech Research Corp. Microfabricated electromagnetic system and method for forming electromagnets in microfabricated devices
US5847631A (en) * 1995-10-10 1998-12-08 Georgia Tech Research Corporation Magnetic relay system and method capable of microfabrication production
US5879632A (en) * 1996-04-09 1999-03-09 Sarnoff Corporation Apportioning system
US20050214827A1 (en) * 1996-07-08 2005-09-29 Burstein Technologies, Inc. Assay device and method
US6342349B1 (en) 1996-07-08 2002-01-29 Burstein Technologies, Inc. Optical disk-based assay devices and methods
US6331275B1 (en) 1996-07-08 2001-12-18 Burstein Technologies, Inc. Spatially addressable, cleavable reflective signal elements, assay device and method
IL127938A (en) 1996-07-08 2002-09-12 Burstein Lab Inc A device with a main signal fixed for diagnostic applications and a test method
DE19705910C1 (de) * 1997-02-15 1998-06-18 Inst Physikalische Hochtech Ev Mikrokammerarray mit hoher Kammerdichte
DE19719862A1 (de) 1997-05-12 1998-11-19 Fraunhofer Ges Forschung Mikromembranpumpe
HUP0103577A2 (hu) * 1998-07-21 2002-01-28 Burstein Technologies, Inc. Optikai lemez alapú eszközök és eljárások
US6410360B1 (en) 1999-01-26 2002-06-25 Teledyne Industries, Inc. Laminate-based apparatus and method of fabrication
US6905614B1 (en) 2000-05-24 2005-06-14 Active Optical Networks, Inc. Pattern-transfer process for forming micro-electro-mechanical structures
US6827866B1 (en) * 2000-05-24 2004-12-07 Active Optical Networks, Inc. Deep-well lithography process for forming micro-electro-mechanical structures
AU2002241602A1 (en) * 2000-11-16 2002-06-11 Burstein Technologies, Inc. Methods and apparatus for detecting and quantifying lymphocytes with optical biodiscs
AU2002227181A1 (en) * 2000-11-16 2002-05-27 Burstein Technologies, Inc. Optical biodiscs with reflective layers
US7087203B2 (en) * 2000-11-17 2006-08-08 Nagaoka & Co., Ltd. Methods and apparatus for blood typing with optical bio-disc
US7026131B2 (en) * 2000-11-17 2006-04-11 Nagaoka & Co., Ltd. Methods and apparatus for blood typing with optical bio-discs
EP1236517A1 (de) * 2001-02-23 2002-09-04 Microflow Engineering SA Verfahren zur Herstellung eines Tröpfchen-Verneblers und ein solcher Vernebler
US7141416B2 (en) * 2001-07-12 2006-11-28 Burstein Technologies, Inc. Multi-purpose optical analysis optical bio-disc for conducting assays and various reporting agents for use therewith
US20030143637A1 (en) * 2001-08-31 2003-07-31 Selvan Gowri Pyapali Capture layer assemblies for cellular assays including related optical analysis discs and methods
US20030113925A1 (en) * 2001-09-07 2003-06-19 Gordon John Francis Nuclear morphology based identification and quantification of white blood cell types using optical bio-disc systems
US20050003459A1 (en) * 2002-01-30 2005-01-06 Krutzik Siegfried Richard Multi-purpose optical analysis disc for conducting assays and related methods for attaching capture agents
WO2003065355A2 (en) * 2002-01-31 2003-08-07 Burstein Technologies, Inc. Bio-safety features for optical analysis disc and disc system including same
US20040241381A1 (en) * 2002-01-31 2004-12-02 Chen Yihfar Microfluidic structures with circumferential grooves for bonding adhesives and related optical analysis discs
US20070274863A1 (en) * 2003-07-25 2007-11-29 Horacio Kido Fluidic circuits for sample preparation including bio-discs and methods relating thereto
US7723899B2 (en) 2004-02-03 2010-05-25 S.C. Johnson & Son, Inc. Active material and light emitting device
US7538473B2 (en) * 2004-02-03 2009-05-26 S.C. Johnson & Son, Inc. Drive circuits and methods for ultrasonic piezoelectric actuators
TWI580878B (zh) * 2016-07-19 2017-05-01 科際精密股份有限公司 單向閥組件
CN112016805B (zh) * 2020-07-23 2023-06-06 上海工程技术大学 一种磁流变液性能评价方法及系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990015929A1 (fr) * 1989-06-14 1990-12-27 Westonbridge International Limited Micropompe perfectionnee
WO1991007591A1 (en) * 1989-11-10 1991-05-30 Westonbridge International Limited Micropump with improved priming
EP0465229A1 (de) * 1990-07-02 1992-01-08 Seiko Epson Corporation Mikropumpe und Verfahren zur Herstellung einer Mikropumpe

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US4938742A (en) * 1988-02-04 1990-07-03 Smits Johannes G Piezoelectric micropump with microvalves
US5171132A (en) * 1989-12-27 1992-12-15 Seiko Epson Corporation Two-valve thin plate micropump

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990015929A1 (fr) * 1989-06-14 1990-12-27 Westonbridge International Limited Micropompe perfectionnee
WO1991007591A1 (en) * 1989-11-10 1991-05-30 Westonbridge International Limited Micropump with improved priming
EP0465229A1 (de) * 1990-07-02 1992-01-08 Seiko Epson Corporation Mikropumpe und Verfahren zur Herstellung einer Mikropumpe

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ESASHI,SHOJI & NAKANO: "Normally closed microvalve an dmicropump fabricated on a silicon wafer", SENSORS AND ACTUATORS, vol. 20, no. 1/2, 1 November 1989 (1989-11-01), LAUSANNE CH, pages 163 - 169, XP000135240 *
SHOJI AND ESASHI: "A study of a high-pressure micropump for integrated chemical analysing systems", SENSORS AND ACTUATORS A, vol. 32, no. 1/3, 1 April 1992 (1992-04-01), LAUSANNE CH, pages 335 - 339, XP026576996, DOI: doi:10.1016/0924-4247(92)80008-Q *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1129741A2 (de) 1997-11-19 2001-09-05 Microflow Engineering SA Sprühvorrichtung für einen Inhalator
EP1149602A2 (de) 1997-11-19 2001-10-31 Microflow Engineering SA Sprühvorrichtung für einen für die Atemtherapie geeigneten Inhalator
US6405934B1 (en) 1998-12-01 2002-06-18 Microflow Engineering Sa Optimized liquid droplet spray device for an inhaler suitable for respiratory therapies
EP1792662A1 (de) 2005-11-30 2007-06-06 Microflow Engineering SA Tropferspendervorrichtung
US9604242B2 (en) 2005-11-30 2017-03-28 Aptar France Sas Volatile liquid droplet dispenser device

Also Published As

Publication number Publication date
DK0641934T3 (da) 1997-10-13
US5462839A (en) 1995-10-31
DE69401250D1 (de) 1997-02-06
FR2705693A1 (fr) 1994-12-02
FR2705693B1 (fr) 1995-07-28
EP0641934B1 (de) 1996-12-27
SG47036A1 (en) 1998-03-20
JPH0719170A (ja) 1995-01-20
ES2099991T3 (es) 1997-06-01
DE69401250T2 (de) 1997-07-10
ATE146853T1 (de) 1997-01-15
HK1006739A1 (en) 1999-03-12
JP3651809B2 (ja) 2005-05-25

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