EP0640151B1 - Constitution d'une perle de soudure sur une matrice de circuit integre - Google Patents

Constitution d'une perle de soudure sur une matrice de circuit integre Download PDF

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Publication number
EP0640151B1
EP0640151B1 EP93910682A EP93910682A EP0640151B1 EP 0640151 B1 EP0640151 B1 EP 0640151B1 EP 93910682 A EP93910682 A EP 93910682A EP 93910682 A EP93910682 A EP 93910682A EP 0640151 B1 EP0640151 B1 EP 0640151B1
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EP
European Patent Office
Prior art keywords
solder
bond pad
terminal
passivation layer
metal contact
Prior art date
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Expired - Lifetime
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EP93910682A
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German (de)
English (en)
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EP0640151A4 (fr
EP0640151A1 (fr
Inventor
Kevin D. Moore
Carl Missele
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Motorola Solutions Inc
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Motorola Inc
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Publication of EP0640151A4 publication Critical patent/EP0640151A4/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/1012—Auxiliary members for bump connectors, e.g. spacers
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    • H01L2224/13001—Core members of the bump connector
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    • H01L2224/13024—Disposition the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
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    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Definitions

  • This invention relates to forming a solder bump on an integrated circuit die. More particularly, this invention relates to such method that includes reflowing the solder alloy onto a terminal formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder.
  • solder bump interconnections that not only physically attach the die, but also electrically connect a circuit on the die to a circuit on the board for conducting electrical signals to and from the die for processing.
  • a metal pad is formed on the die.
  • a body of solder alloy such as a preformed microball, is placed onto the pad, heated and cooled to reflow the solder to form a bump that is attached to the die.
  • the area about the pad is covered by a material that is not wet by the solder to prevent the solder from spreading across the surface.
  • the die is then assembled with the board such that the bump rests upon a terminal on the board, whereafter the assembly is heated to reflow the solder, thereby bonding the bump to the board to complete the interconnection.
  • This invention contemplates an improved method for forming a solder bump on a terminal of an integrated circuit die.
  • the die is covered by a passivation layer and includes a metallic contact accessible through an opening in the layer.
  • the method includes forming a terminal of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. Electrically conductive and solderable composite materials comprising silver-coated copper powder and a polymeric binder of a resol-type phenolic resin are known from EP-A-0 467 575.
  • the terminal includes a bond pad overlying the passivation layer remote from the metal contact and a runner that extends from the pad to the metal contact.
  • a body of solder metal is reflowed onto the bond pad to form a bump bonded to the pad and electrically coupled through the runner.
  • the method of this invention allows the bond pads to be conveniently distributed across the surface of a die and coupled to metal contacts which may have been originally designed, for example, as wire bond pads.
  • an integrated circuit die 10 comprises a metal-resin composite terminal 12 formed in accordance with this invention.
  • a preferred die 10 comprises a silicon substrate 14 on which is preformed electronic features, including transistors (not shown) interconnected in a circuit for processing electrical signals to perform dynamic random access memory.
  • the circuit includes an aluminum metal contact 16 disposed adjacent edge 18.
  • Die 10 further comprises a passivation layer 20 formed of a dielectric polymer that substantially covers the substrate 14 to protect the electrical features and has an opening 22 through which contact 16 is accessible.
  • Die 10 is adapted for assembly with a printed circuit board to form a microelectronic package and includes a plurality of contacts similar to contact 16 that are adapted for connection to a circuit trace on the board for conducting electrical signals to and from the die for processing. Except for terminals such as terminal 12 formed in accordance with this invention, it is appreciated that die 10 features a conventional design wherein the contacts are arrayed about the die perimeter to facilitate formation of wire bond connections. It is a significant advantage that this invention makes use of a conventional die design that was initially intended for wire bonding and adapts the die for incorporation into a package by solder bump interconnections.
  • a silicon wafer is processed to form a plurality of dies concurrently and is thereafter sectioned to divide the discrete dies. It is another advantage that this invention may be carried out to form terminals 12 prior to sectioning, thereby permitting the terminals to be readily and conveniently formed on the several dies using common processing steps.
  • terminal 12 die 10 is fabricated with contact 16 exposed through opening 22 in passivation layer 20.
  • Terminal 12 is formed of a composite material composed of silver-plated copper powder in a resol type phenolic binder.
  • An ink is screen printed onto the die in the pattern of the desired terminal.
  • a preferred ink is composed of between about 80 and 90 weight percent silver-plated copper powder, between about 10 and 20 weight percent polymeric precursor for the binder, between about 5 and 15 weight percent dipropylene glycol methyl ether solvent, and includes minor (less than 1 weight percent) amounts of sobitan triolate, isopropyl thirsostearayl titanate, and ortho amino phenol compound, and is commercially available from Minico, under the trade designation M-6300 Solderable Copper Paste.
  • the precursor is a partially crosslinked reactive product of phenol and an excess of formaldehyde.
  • the ink is screen-printed onto the surface utilizing a stainless steel screen coated with a photodevelopable emulsion having an opening corresponding to the desired terminal.
  • the ink is applied, dried and cured in air at a temperature of about 165°C for about 30 minutes.
  • the resulting terminal has a thickness on the order of about 20 microns and is characterized by copper particles densely packed in a continuous network to provide a low electrical resistance path and tightly bonded by the resin.
  • Terminal 12 comprises a circular bond pad 24 overlying passivation layer 20 spaced apart from contact 16.
  • a runner 26 connects bond pad 24 with the contact 16. It is found that the screen printed composite material not only tightly adheres to the polyimide resin of layer 20, but also bonds to pad 16 to form a low resistance electrical connection.
  • solder bump 30 is applied to bond pad 24.
  • a stop 28 formed of a polymeric solder resist material is applied to runner 26 to confine the solder to bond pad 24.
  • a microsphere of a solder alloy such as tin-lead solder alloy containing about 40 weight percent lead and the balance tin, is pressed onto pad 24.
  • the assembly is heated to a temperature of about 183°C to melt the solder alloy, whereupon the solder alloy coalesces to form bump 30.
  • solder bump 30 solidifies and is bonded to pad 24.
  • die 10 is ready for mounting onto a printed circuit board or other suitable substrate by solder bump interconnections.
  • this invention provides a convenient method for adapting a conventional die having wire bond contacts for use in a package featuring solder bump interconnections. While this invention has been illustrated to form a single terminal 12, it is intended that the method be carried out to concurrently form a plurality of such terminals, each connected to a distinct contact. Also, in the described embodiment, bond pad 24 has a diameter greater than the width of the adjacent runner 26, and also greater than the width of contact 16. In this manner, the pad area may be optimized to form a bump 30 having a size greater than would otherwise be permitted if formed directly on the restricted area of contact 16.
  • the length and contour of the runner section 26 may be configured to arrange the bond pads into the desired pattern conducive to forming the interconnections, for example, by providing a runner having curved or intersecting linear sections.
  • bumps may be formed without a solder stop as in the described embodiment by limiting the spread of solder along the runner during reflow. This may be accomplished, particularly for relatively large bumps, by constricting the width of the runner section relative to the bond pad, or by limiting the time during which the solder is molten during reflow, or by selecting the composite material to reduce the capillary forces that would otherwise draw the solder along the runner.
  • the solder metal is applied as a preformed microball
  • the solder may be deposited by any suitable process, including vapor deposition or electroplating.
  • a paste comprising solder metal powder dispersed in a vaporizable vehicle may be applied and heated to melt the solder powder, whereupon the solder coalesces to form a microdroplet that is the basis for the bump.
  • the bump is formed of near-eutectic tin-lead solder alloy.
  • Such alloys generally contain between about 35 and 45 weight percent lead and the balance tin and may include minor additives of silver or other metals to enhance metallurgical properties.
  • the method may be suitable adapted to form bumps of other solder metals. These include tin-lead alloys composed of less than 10 weight percent lead, preferably about 5 weight percent, as well as tin-base alloys containing indium.
  • the method of this invention utilizes a composite material in forming the terminals 12.
  • the material is composed of a continuous network of copper particles bonded by a polymeric matrix.
  • the material comprises at least about 70 weight percent copper particles.
  • copper also is readily wet by molten solder, which wetting is essential to form a strong solder bond.
  • the copper particles also include a silver plating. While not limited to any particular theory, solder does not bond to polymer materials of the type utilized to form the binder. Thus, it is believed that the solder bonds to copper particles at the surface of the bond pad.
  • the silver plate is believed to protect the copper surface from oxidation that would otherwise inhibit wetting by the solder alloy.
  • the binder may be formed of any polymer that resists thermal degradation at solder reflow temperatures, typically between about 180 to 325°C, and is effective to bond the copper particles into an integral film that tightly adheres to the die surface, including both the metal and polymer regions.

Abstract

Procédé servant à constituer une perle de soudure sur une plaquette de circuit intégré et utilisant un terminal (12) constitué d'un matériau composite électriquement conducteur, compatible avec la soudure et composé de particules de cuivre et d'un liant polymère. Le terminal comprend une plage de liaison (24) recouvrant une couche de passivation (20) située sur la plaquette, ainsi qu'un canal central (26) reliant la plage de liaison à un contact métallique (16). On applique le terminal à la plaquette de la même manière que, par exemple, une encre de sérigraphie, ensuite on effectue le soudage par refusion d'un alliage de soudure sur la plage de liaison, afin de constituer la perle de soudure. Un matériau préféré du terminal est composé de particules de cuivre revêtues d'un plaquage d'argent, ainsi que d'un liant phénolique de type résol.

Claims (13)

  1. Procédé destiné à former une perle de soudure sur une puce de circuit intégré, comprenant un substrat, une couche de passivation recouvrant le substrat et un contact métallique exposé par une ouverture de la couche de passivation, ledit procédé comprenant les étapes consistant à :
    former une borne sur ladite puce de circuit intégré, ladite borne comprenant une pastille de contact recouvrant ladite couche de passivation à distance du contact métallique et une section de canal d'alimentation s'étendant entre la pastille de contact et les contacts métalliques pour conduire des signaux électriques, ladite borne étant formée d'un matériau composite mouillable par soudage, électriquement conducteur, composé de particules de cuivre et d'un liant polymère, et
    chauffer et refroidir un corps d'un métal à souder en contact avec la pastille de contact pour effectuer la refus ion du métal à souder pour former une perle de soudure liée à la pastille de contact.
  2. Procédé suivant la revendication 1, dans lequel les particules de cuivre comprennent un plaquage d'argent.
  3. Procédé suivant la revendication 1, dans lequel le liant polymère est composé d'une résine phénolique de type résol.
  4. Procédé destiné à former une perle de soudure sur une puce de circuit intégré, comprenant un substrat, une couche de passivation recouvrant le substrat et formée d'un matériau polymère diélectrique, et un contact métallique exposé par une ouverture de la couche de passivation, ledit procédé comprenant les étapes consistant à :
    imprimer une encre à poudre de cuivre sur la puce de circuit intégré suivant un motif correspondant à une borne présentant une pastille de contact recouvrant la couche de passivation à distance du contact métallique, et une section de canal d'alimentation s'étendant entre la pastille de contact et le contact métallique, ladite encre à poudre de cuivre comprenant au moins environ 70 % en poids de particules de cuivre et un support, ledit support comprenant une résine phénolique de type résol et un solvant évaporable, et
    sécher et durcir l'encre après ladite impression, pour lier les particules de cuivre en une pellicule unitaire pour former une borne mouillable par soudage, électriquement conductrice, et
    chauffer et refroidir un corps d'un alliage de soudure en contact avec la pastille de contact pour effectuer la refusion de l'alliage de soudure pour former une perle de soudure liée à la pastille de contact.
  5. Procédé suivant la revendication 4, dans lequel les particules de cuivre comportent un revêtement d'argent.
  6. Procédé suivant la revendication 4, comprenant en outre l'application d'une réserve de soudure à la section de canal d'alimentation de borne avant la formation de la perle de soudure, pour maintenir l'alliage de soudure sur la pastille de contact.
  7. Procédé suivant la revendication 4, dans lequel la borne comprend une pastille de contact généralement circulaire ayant un diamètre, et la section de canal d'alimentation présente une section linéaire s'étendant depuis la pastille de contact et ayant une largeur inférieure au diamètre.
  8. Procédé destiné à former une perle de soudure sur une puce de circuit intégré, comprenant un substrat, une couche de passivation recouvrant le substrat et formée en un matériau polymère diélectrique et un contact métallique en aluminium exposé par une ouverture de la couche de passivation, ledit procédé comprenant les étapes consistant à:
    imprimer une encre à poudre de cuivre sur la puce de circuit intégré suivant un motif correspondant à une borne ayant une pastille de contact recouvrant la couche de passivation à distance du contact métallique en aluminium et une section de canal d'alimentation s'étendant entre la pastille de contact et le contact métallique, ladite encre à poudre de cuivre comprenant au moins environ 70 % en poids de particules de cuivre recouvertes d'argent et un support, ledit support comprenant une résine phénolique de type résol et un solvant évaporable,
    chauffer l'encre, après l'impression, pour durcir la résine phénolique de type résol pour lier les particules de cuivre revêtues d'argent en une pellicule unitaire pour former une borne mouillable, électriquement conductrice, et
    chauffer et refroidir un corps d'un alliage de soudure en contact avec la pastille de contact pour effectuer la refusion de l'alliage de soudure pour former une perle de soudure liée à la pastille de contact.
  9. Procédé suivant la revendication 8, comprenant en outre l'application d'une réserve de soudure à la section de canal d'alimentation avant la formation de la perle de soudure, pour maintenir l'alliage de soudure sur la pastille de contact pendant la refusion.
  10. Procédé suivant la revendication 8, dans lequel la borne comprend une pastille de contact généralement circulaire ayant un diamètre, et la section de canal d'alimentation comporte une section linéaire adjacente à la pastille de contact et ayant une largeur inférieure au diamètre.
  11. Procédé suivant la revendication 8, dans lequel l'alliage de soudage comprend de l'étain et du plomb.
  12. Puce de circuit intégré à perles de soudure comprenant
    un substrat,
    une couche de passivation recouvrant le substrat, ladite couche de passivation étant formée en un matériau non mouillable par un métal de soudage et définissant une ouverture,
    un contact métallique exposé par ladite ouverture,
    une borne formée en un matériau mouillable, électriquement conducteur, comprenant des particules de cuivre et un liant polymère, ladite borne comprenant une pastille de contact recouvrant ladite couche de passivation à distance du contact métallique et une section de canal d'alimentation s'étendant depuis la pastille de contact et connectée au contact métallique pour conduire des signaux électriques entre la pastille de contact et le contact métallique, et
    une perle de soudure liée à la pastille de contact.
  13. Puce de circuit intégré à perles de soudure suivant la revendication 12, comprenant :
    un substrat de silicum,
    une couche de passivation recouvrant le substrat de silicum et formée en un polymère diélectrique non mouillable par un métal de soudage, ladite couche de passivation définissant une ouverture,
    un contact métallique en aluminium sur ledit substrat de silicum, exposé par ladite ouverture,
    une borne formée en un matériau soudable, électriquement conducteur, comprenant des particules de cuivre revêtues d'argent et un liant de résine phénolique du type résol, ladite borne comprenant une pastille de contact recouvrant la couche de passivation à distance du contact métallique en aluminium et une section de canal d'alimentation s'étendant depuis la pastille de contact et connectée au contact métallique en aluminium pour conduire des signaux électriques entre la pastille de contact et le contact métallique en aluminium, et
    une perle de soudure liée à la pastille de contact.
EP93910682A 1992-04-30 1993-04-21 Constitution d'une perle de soudure sur une matrice de circuit integre Expired - Lifetime EP0640151B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US876147 1992-04-30
US07/876,147 US5281684A (en) 1992-04-30 1992-04-30 Solder bumping of integrated circuit die
PCT/US1993/003731 WO1993022475A1 (fr) 1992-04-30 1993-04-21 Constitution d'une perle de soudure sur une matrice de circuit integre

Publications (3)

Publication Number Publication Date
EP0640151A1 EP0640151A1 (fr) 1995-03-01
EP0640151A4 EP0640151A4 (fr) 1995-05-03
EP0640151B1 true EP0640151B1 (fr) 1997-07-30

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EP93910682A Expired - Lifetime EP0640151B1 (fr) 1992-04-30 1993-04-21 Constitution d'une perle de soudure sur une matrice de circuit integre

Country Status (6)

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US (2) US5281684A (fr)
EP (1) EP0640151B1 (fr)
JP (1) JPH07506462A (fr)
KR (1) KR950701396A (fr)
DE (1) DE69312709T2 (fr)
WO (1) WO1993022475A1 (fr)

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DE69312709D1 (de) 1997-09-04
WO1993022475A1 (fr) 1993-11-11
US5327013A (en) 1994-07-05
JPH07506462A (ja) 1995-07-13
US5281684A (en) 1994-01-25
DE69312709T2 (de) 1998-02-05
EP0640151A4 (fr) 1995-05-03
EP0640151A1 (fr) 1995-03-01
KR950701396A (ko) 1995-03-23

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