FR2748602B1 - Circuit integre comportant des plots de connexion debouchant sur une face - Google Patents

Circuit integre comportant des plots de connexion debouchant sur une face

Info

Publication number
FR2748602B1
FR2748602B1 FR9605698A FR9605698A FR2748602B1 FR 2748602 B1 FR2748602 B1 FR 2748602B1 FR 9605698 A FR9605698 A FR 9605698A FR 9605698 A FR9605698 A FR 9605698A FR 2748602 B1 FR2748602 B1 FR 2748602B1
Authority
FR
France
Prior art keywords
ending
integrated circuit
plots
connection
connection plots
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9605698A
Other languages
English (en)
Other versions
FR2748602A1 (fr
Inventor
Jean Noel Audoux
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to FR9605698A priority Critical patent/FR2748602B1/fr
Priority to PCT/FR1997/000790 priority patent/WO1997042656A1/fr
Priority to US09/180,321 priority patent/US6084303A/en
Priority to EP97923132A priority patent/EP0901688A1/fr
Publication of FR2748602A1 publication Critical patent/FR2748602A1/fr
Application granted granted Critical
Publication of FR2748602B1 publication Critical patent/FR2748602B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02377—Fan-in arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05541—Structure
    • H01L2224/05548—Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR9605698A 1996-05-07 1996-05-07 Circuit integre comportant des plots de connexion debouchant sur une face Expired - Fee Related FR2748602B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR9605698A FR2748602B1 (fr) 1996-05-07 1996-05-07 Circuit integre comportant des plots de connexion debouchant sur une face
PCT/FR1997/000790 WO1997042656A1 (fr) 1996-05-07 1997-05-05 Circuit integre comportant des plots de connexion debouchant sur une face
US09/180,321 US6084303A (en) 1996-05-07 1997-05-05 Integrated circuit comprising connection pads emerging on one surface
EP97923132A EP0901688A1 (fr) 1996-05-07 1997-05-05 Circuit integre comportant des plots de connexion debouchant sur une face

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9605698A FR2748602B1 (fr) 1996-05-07 1996-05-07 Circuit integre comportant des plots de connexion debouchant sur une face

Publications (2)

Publication Number Publication Date
FR2748602A1 FR2748602A1 (fr) 1997-11-14
FR2748602B1 true FR2748602B1 (fr) 1998-08-21

Family

ID=9491912

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9605698A Expired - Fee Related FR2748602B1 (fr) 1996-05-07 1996-05-07 Circuit integre comportant des plots de connexion debouchant sur une face

Country Status (4)

Country Link
US (1) US6084303A (fr)
EP (1) EP0901688A1 (fr)
FR (1) FR2748602B1 (fr)
WO (1) WO1997042656A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6246327B1 (en) * 1998-06-09 2001-06-12 Motorola, Inc. Radio frequency identification tag circuit chip having printed interconnection pads
WO2002017392A2 (fr) * 2000-08-24 2002-02-28 Polymer Flip Chip Corporation Redistribution polymere de plots de connexion par billes
EP2447985A1 (fr) 2010-10-29 2012-05-02 Gemalto SA Procédé pour réaliser des lignes d'interconnexion ou de redirection d'au moins un composant à circuit intégré
US10340241B2 (en) 2015-06-11 2019-07-02 International Business Machines Corporation Chip-on-chip structure and methods of manufacture

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3421206A (en) * 1965-10-19 1969-01-14 Sylvania Electric Prod Method of forming leads on semiconductor devices
US4723197A (en) * 1985-12-16 1988-02-02 National Semiconductor Corporation Bonding pad interconnection structure
JPH0815152B2 (ja) * 1986-01-27 1996-02-14 三菱電機株式会社 半導体装置及びその製造方法
US5047834A (en) * 1989-06-20 1991-09-10 International Business Machines Corporation High strength low stress encapsulation of interconnected semiconductor devices
US5006673A (en) * 1989-12-07 1991-04-09 Motorola, Inc. Fabrication of pad array carriers from a universal interconnect structure
US5665991A (en) * 1992-03-13 1997-09-09 Texas Instruments Incorporated Device having current ballasting and busing over active area using a multi-level conductor process
US5281684A (en) * 1992-04-30 1994-01-25 Motorola, Inc. Solder bumping of integrated circuit die
US5483100A (en) * 1992-06-02 1996-01-09 Amkor Electronics, Inc. Integrated circuit package with via interconnections formed in a substrate

Also Published As

Publication number Publication date
EP0901688A1 (fr) 1999-03-17
US6084303A (en) 2000-07-04
WO1997042656A1 (fr) 1997-11-13
FR2748602A1 (fr) 1997-11-14

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20160129