EP0615651B1 - Contact avec un revetement de contact en argent et procede pour sa fabrication - Google Patents

Contact avec un revetement de contact en argent et procede pour sa fabrication Download PDF

Info

Publication number
EP0615651B1
EP0615651B1 EP92923688A EP92923688A EP0615651B1 EP 0615651 B1 EP0615651 B1 EP 0615651B1 EP 92923688 A EP92923688 A EP 92923688A EP 92923688 A EP92923688 A EP 92923688A EP 0615651 B1 EP0615651 B1 EP 0615651B1
Authority
EP
European Patent Office
Prior art keywords
contact
silver
solder
intermediate layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92923688A
Other languages
German (de)
English (en)
Other versions
EP0615651A1 (fr
Inventor
Manfred Schneider
Dietmar Clauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0615651A1 publication Critical patent/EP0615651A1/fr
Application granted granted Critical
Publication of EP0615651B1 publication Critical patent/EP0615651B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0231—Composite material having a noble metal as the basic material provided with a solder layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53796—Puller or pusher means, contained force multiplying operator
    • Y10T29/53896—Puller or pusher means, contained force multiplying operator having lever operator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53796—Puller or pusher means, contained force multiplying operator
    • Y10T29/53896—Puller or pusher means, contained force multiplying operator having lever operator
    • Y10T29/539—Plier type means

Definitions

  • the invention relates to a contact piece with a switching silver contact pad, which is soldered onto a contact carrier by means of an intermediate silver layer and a solder, and to a method for its production.
  • Such contact pieces are used in relays and switches of various types, among others.
  • solders required for soldering are available as flat material in specialist shops. They already contain metered surcharges for soldering aids. It is known to connect strips of contact silver and pure silver to one another by hot rolling and then to roll the flat solder material as a third layer onto this two-layer strip. The contacts are then cut off from this three-layer tape and soldered onto the contact carriers. It is a peculiarity of this manufacturing process that the rolling edges have to be trimmed so that waste is produced. Also, the cutting of the contacts with increasing contact strengths becomes increasingly problematic.
  • the invention is therefore based on the object of showing a way in which the manufacture of contact pieces can be simplified without impairing the quality.
  • the position of the solder on the silver intermediate layer of the two-layer contact should remain reliably guaranteed.
  • the solder should also be prevented from creeping up onto the switching silver contact pad when soldering to the contact carrier.
  • this object is achieved according to the invention in that the solder is attached to the intermediate silver layer in the form of a plate before the actual soldering process. As a result, the solder remains reliably on the the silver intermediate layer is positioned without slipping or falling off prematurely, i.e. before the contact carrier is soldered on. In this way, a prerequisite for reliable handling of the parts to be soldered to one another is created.
  • this object is achieved in that the intermediate silver layer is pressed onto the switching silver contact pad and then the solder is attached to the intermediate silver layer in the form of a plate and then the contact carrier is placed on the solder plate and soldered.
  • This sequence in the manufacturing process ensures reliable manufacture of the contact pieces with regard to the position of the solder plate and with regard to the quality of the soldering process. At the same time, it reduces the cost of the manufacturing process.
  • solder plate is located in a recess of the intermediate silver layer before the soldering in a development of the invention.
  • the result of this is that during the soldering process the solder plate is enclosed by this edge of the intermediate silver layer resting on the contact carrier and cannot easily flow away to the side.
  • This depression can be produced by a press or embossing cut.
  • the solder plate can be stapled by welding.
  • the ultrasound welding of the solder plate on the silver intermediate layer has proven to be particularly advantageous, since this prevents the solder plate from heating up. The latter could otherwise reduce the quality of the subsequent soldering.
  • the solder plate can be pressed against the silver intermediate layer via a pressure plate with small punctiform elevations during the ultrasonic welding. This measure ensures that the ultrasonic welding is carried out only under the few contact points of the point elevations and can therefore be carried out with much less pressure force and ultrasonic energy. This in turn has the consequence that the side of the silver layer facing the solder layer has small depressions at those points where the point elevations of the pressure plate were located.
  • the prerequisite for a completely flat support on the contact carrier during subsequent soldering is created.
  • the lateral sealing of the solder plate by the intermediate silver layer thus produced prevents the solder from flowing out laterally when soldering to the contact carrier, because the solder is bound in the edge material of the intermediate silver layer. This also prevents the solder material from creeping up on the sides of the switching silver during soldering.
  • this step can replace a separate pre-embossing of the silver intermediate layer.
  • Figure 1 shows the structure of the contact piece 1 in an exploded view. It consists of a contact silver contact pad 2, an intermediate silver layer 4, a solder plate 6 and a contact carrier 8.
  • the contact silver contact pad 2 consists of a known contact silver alloy in the exemplary embodiment. In the exemplary embodiment, it has the shape of a rectangular plate with the dimensions of the subsequent contact. However, it could just as well have the shape of a flat round disk or a hemispherical dome.
  • the silver intermediate layer 4 can be seen in FIG. 1, the dimensions of which are matched to the outline of the switching silver contact pad 2.
  • the silver intermediate layer 4 consists of pure silver in the exemplary embodiment.
  • the soldering plate 6 can be seen under the intermediate silver layer 4.
  • the soldering plate essentially consists of copper and silver and contains the commercially available one Embodiment already all necessary soldering aids. It has been cut from a commercially available solder strip of the desired width. Its contour is adapted to the contour of the silver intermediate layer 4, but is surmounted on all sides by approximately 1 mm from the silver intermediate layer. Under the solder plate 6, the contact carrier 8 for the contact piece 1 is shown in FIG. It consists of a flat material made of steel, which is coated on the surface with copper.
  • the switching silver contact pad 2 is first pressed in a pressing tool with the silver intermediate layer 4 cut off from a flat silver material to a two-layer contact.
  • the solder plate 6 previously cut off from a strip of solder flat material is placed, positioned and attached or welded on by means of a sonotrode 10 using ultrasound.
  • the sonotrode 10 has a support surface facing the solder 6, which is provided with small elevations 12. In the exemplary embodiment, these are small pyramid-shaped tips 12 which press the solder plate 6 against the silver intermediate layer 4.
  • this contact surface of the sonotrode 10 swings in the direction parallel to the support surface onto the solder 6.
  • the surface elements of the solder plate 6 located below the conical elevations 12 of the support surface of the sonotrode 10 and thus increasingly pressed against the silver interlayer, weld with the silver interlayer 4. while the solder plate remains cold.
  • the two-layer contact 2, 4 provided with the soldering plate 6 in this way is subsequently placed under a pressing tool and pressed flat with a pressing pressure of several tons per cm2.
  • the solder plate 6 is pressed into the silver intermediate layer 4, so that the silver intermediate layer surrounds the solder plate on all sides, with the exception of the surface to be soldered on the contact carrier 8 later.
  • the two-layer contact is placed on the contact carrier 8 and soldered to the contact carrier 8.
  • the previous plan pressing ensures that the contact lies completely flat on the contact carrier 8 during soldering.
  • this plane pressing has the result that the solder plate is pressed into the silver intermediate layer and, with the exception of the contact surface on the contact carrier 8, is enclosed on all sides by the silver intermediate layer 4. As a result, excess solder alloys with the silver border and is thus prevented from crawling up onto the switching silver contact pad.
  • solder plate 6 can be reliably positioned on the silver intermediate layer 4 of the switching silver contact pad without having previously been heated to a temperature close to the soldering temperature. This avoids the risk that disadvantages in later soldering with the contact carrier 8 have to be accepted due to the heating of the solder. Furthermore, the handling of the parts has been simplified and made cheaper.
  • the ultrasonic welding of the solder on the silver intermediate layer can be demonstrated in the micrograph.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Switches (AREA)

Abstract

Il existe différents procédés de fabrication de ces revêtements de contact en argent mais ces procédés comportent des opérations de manipulation du revêtement de contact en argent, de la couche intermédiaire en argent, de la plaquette de contact et du porte-contact ainsi que des opérations de soudage de ces pièces qui sont très fastidieuses, ou bien ils consistent à employer en premier lieu un matériau en bande de composition appropriée, à laminer ces bandes l'une sur l'autre et à découper leurs bords. Ce dernier procédé produit cependant des déchets de métal noble. Pour éviter ces inconvénients, il est prévu dans l'invention que la soudure sous la forme d'une plaquette (6) soit fixée sur la couche intermédiaire d'argent (4) avant le processus proprement dit. Il est particulièrement avantageux que cette fixation s'effectue par soudage aux ultrasons. L'invention s'applique à tous les contacts en argent.

Claims (15)

  1. Pièce de contact ayant un revêtement (2) de contact en argent, qui est brasé au moyen d'une couche intermédiaire (4) d'argent et d'un métal d'apport (6) sur un support (8) de contact, caractérisée en ce que le métal d'apport est fixé sous la forme d'une plaquette (6), avant le processus de brasage proprement dit, sur la couche intermédiaire (4) en argent.
  2. Pièce de contact suivant la revendication 1, caractérisée en ce que la plaquette (6) de métal d'apport se trouve, avant le brasage, dans une cavité de la couche intermédiaire (4) en argent.
  3. Pièce de contact suivant la revendication 1 ou 2, caractérisée en ce que la fixation s'effectue par soudage.
  4. Pièce de contact suivant la revendication 3, caractérisée en ce que la fixation s'effectue par soudage par ultrasons.
  5. Pièce de contact suivant la revendication 4, caractérisée en ce que la face de la couche d'argent, qui est tournée vers la couche de métal d'apport, comporte de petites cavités.
  6. Pièce de contact suivant la revendication 1 ou 2, caractérisée en ce que la fixation s'effectue par collage.
  7. Procédé de fabrication d'une pièce de contact, notamment suivant l'une des revendications 1 à 6, caractérisé en ce qu'il consiste à appliquer une couche intermédiaire (4) en argent sur un revêtement (2) de contact en argent et ensuite, à fixer un métal d'apport (6) sous la forme d'une plaquette sur la couche intermédiaire (4) d'argent et enfin, à mettre sur le métal d'apport et à y souder un support de contact (8).
  8. Procédé suivant la revendication 7, caractérisé en ce qu'il consiste à effectuer la fixation de la plaquette (6) de métal d'apport par soudage.
  9. Procédé suivant la revendication 7 ou 8, caractérisé en ce qu'il consiste à effectuer la fixation de la plaquette (6) de métal d'apport par soudage par ultrasons sur la couche intermédiaire (4) d'argent.
  10. Procédé suivant la revendication 7, caractérisé en ce qu'il consiste à effectuer la fixation de la plaquette (6) de métal d'apport par collage.
  11. Procédé suivant l'une des revendications 7 à 9, caractérisé en ce qu'il consiste pendant le soudage par ultrasons, à appliquer la plaquette (6) de métal d'apport à la couche intermédiaire (4) d'argent par l'intermédiaire d'une plaque (10) d'application d'une pression ayant de petites surélévations (12) ponctuelles.
  12. Procédé suivant la revendication 11, caractérisé en ce que les surélévations (12) ponctuelles sont en forme de cônes.
  13. Procédé suivant la revendication 11 ou 12, caractérisé en ce que les vibrations ultrasonores de la plaque (10) d'application d'une pression sont dirigées tangentiellement à la surface d'appui de la plaquette (6) de métal d'apport.
  14. Procédé suivant l'une des revendications 7 à 13, caractérisé en ce qu'il consiste à enfoncer la plaquette (6) de métal d'apport avant le brasage de manière qu'elle soit à affleurement dans la couche intermédiaire (4) d'argent.
  15. Procédé suivant l'une des revendications 7 à 14, caractérisé en ce qu'il consiste à chauffer par induction, lors de l'opération de brasage, le support de contact (8), la plaquette (6) de métal d'apport, la couche intermédiaire (4) d'argent et le revêtement de contact (2) en argent.
EP92923688A 1991-12-04 1992-11-30 Contact avec un revetement de contact en argent et procede pour sa fabrication Expired - Lifetime EP0615651B1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4139998 1991-12-04
DE4139998A DE4139998A1 (de) 1991-12-04 1991-12-04 Kontaktstueck mit einer schaltsilber-kontaktauflage und verfahren zu seiner herstellung
PCT/DE1992/000998 WO1993011550A1 (fr) 1991-12-04 1992-11-30 Contact avec un revetement de contact en argent et procede pour sa fabrication

Publications (2)

Publication Number Publication Date
EP0615651A1 EP0615651A1 (fr) 1994-09-21
EP0615651B1 true EP0615651B1 (fr) 1995-04-26

Family

ID=6446266

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92923688A Expired - Lifetime EP0615651B1 (fr) 1991-12-04 1992-11-30 Contact avec un revetement de contact en argent et procede pour sa fabrication

Country Status (7)

Country Link
US (2) US5598629A (fr)
EP (1) EP0615651B1 (fr)
JP (1) JPH07501646A (fr)
BR (1) BR9206854A (fr)
DE (2) DE4139998A1 (fr)
ES (1) ES2071517T3 (fr)
WO (1) WO1993011550A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473425B1 (ko) * 1996-09-19 2005-03-07 지멘스 일렉트로미케니컬 컴포넌츠, 인코포레이티드 전자기계식 릴레이 및 그 제조방법
EP1019930B1 (fr) * 1997-09-30 2003-05-07 Siemens Energy & Automation, Inc. Procede pour joindre par ultrasons des composants electroconductrices
US6049046A (en) * 1997-09-30 2000-04-11 Siemens Energy & Automation, Inc. Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy
US6010059A (en) * 1997-09-30 2000-01-04 Siemens Energy & Automation, Inc. Method for ultrasonic joining of electrical parts using a brazing alloy
DE102019104318C5 (de) * 2019-02-20 2023-06-22 Auto-Kabel Management Gmbh Elektrischer Leiter sowie Verfahren zur Herstellung eines elektrischen Leiters

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL92647C (fr) * 1954-03-02
JPS4312322Y1 (fr) * 1966-11-02 1968-05-28
US3775067A (en) * 1971-12-06 1973-11-27 Textron Inc Copper backed electrical contact
JPS5116049B2 (fr) * 1972-08-18 1976-05-21
DE2540943B2 (de) * 1975-09-13 1978-02-02 W.C. Heraeus Gmbh, 6450 Hanau Kontaktkoerper fuer einen elektrischen steckkontakt
US4053728A (en) * 1975-10-24 1977-10-11 General Electric Company Brazed joint between a beryllium-base part and a part primarily of a metal that is retractable with beryllium to form a brittle intermetallic compound
CH595685A5 (fr) * 1976-08-19 1978-02-28 Rau Fa G
JPS5350461A (en) * 1976-10-18 1978-05-08 Okura Denki Co Ltd Structure for supporting movable core of vacuum switch
DE2844888C2 (de) * 1978-10-14 1983-02-24 W.C. Heraeus Gmbh, 6450 Hanau Vormaterial zur Herstellung elektrischer Kontakte
DE2939997C2 (de) * 1979-10-03 1984-04-26 Degussa Ag, 6000 Frankfurt Verfahren und Vorrichtung zur Aufbringung von Kontaktkörpern auf Kontaktträger
DE3107665A1 (de) * 1981-02-28 1982-09-16 W.C. Heraeus Gmbh, 6450 Hanau "metallhalbzeug"
DE3437981C2 (de) * 1984-10-17 1986-08-21 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim Verfahren zum Herstellen eines Halbzeugs für elektrische Kontakte
JPS6326906U (fr) * 1986-08-04 1988-02-22
EP0283536A1 (fr) * 1987-03-24 1988-09-28 INOVAN GmbH & Co. KG Metalle und Bauelemente Procédé de fabrication de plaquettes à contact en argent/Meo ayant une face soudable ou pouvant étre brasée
DE3767487D1 (de) * 1987-07-14 1991-02-21 Inovan Stroebe Verfahren zum herstellen von silber/me0-kontaktplaettchen mit loet- oder schweissfaehiger unterseite.
DE3866298D1 (de) * 1987-07-22 1992-01-02 Siemens Ag Verfahren zum verbinden von werkstuecken durch widerstandserwaermung mittels eines kurzzeit-energieimpulses.
DE4216224C2 (de) * 1992-05-19 1994-03-17 Heraeus Gmbh W C Vormaterial und Halbzeug für elektrische Kontakte sowie Verfahren zur Herstellung
DE4331913A1 (de) * 1993-09-20 1995-03-23 Siemens Ag Verfahren zum Verbinden von einer Kontaktauflage aus Silber-Metalloxid-Werkstoff mit einem metallischen Kontaktträger

Also Published As

Publication number Publication date
BR9206854A (pt) 1995-12-05
US5598629A (en) 1997-02-04
DE59202048D1 (de) 1995-06-01
ES2071517T3 (es) 1995-06-16
WO1993011550A1 (fr) 1993-06-10
DE4139998A1 (de) 1993-06-09
EP0615651A1 (fr) 1994-09-21
JPH07501646A (ja) 1995-02-16
US5799771A (en) 1998-09-01

Similar Documents

Publication Publication Date Title
EP0650189B1 (fr) Procédé de fabrication d'un module semi-conducteur
DE2820403A1 (de) Verfahren zur kontaktierung der klebstoffseitigen elektrode eines elektrischen bauteiles
DE3326580A1 (de) Verfahren und anordnung zur herstellung einer duesenplatte fuer tintenstrahldrucker
EP0615651B1 (fr) Contact avec un revetement de contact en argent et procede pour sa fabrication
DE2532009A1 (de) Verfahren zur herstellung eines elektrischen bauteiles, bestehend aus mindestens zwei durch eine isolierschicht getrennte bauelemente
DE2631502A1 (de) Greifwerkzeug fuer eine saugpinzette
EP1456543A1 (fr) Element de maintien ou de fixation presentant une surface adhesive destinee au collage sur une surface support
DE1280419B (de) Fliesspress-Verfahren zur Herstellung eines Traegerkoerpers fuer Halbleiterbauelemente
CH652855A5 (de) Verfahren zur herstellung eines elektrischen verbundmaterialkontakts und vorrichtung zur ausfuehrung dieses verfahrens.
DE3806309C1 (fr)
DE3723236A1 (de) Verfahren zur herstellung einer schaltungsplatte
DE19714755A1 (de) Löt-Verfahren und Vorrichtung zur Erzeugung der dazu erforderlichen Zusatzwerkstoff-Depots
EP0027893B1 (fr) Procédé et dispositif pour fixer des pièces de contact sur des supports de contact
DE3786132T2 (de) Verfahren zum Verbinden metallischer Streifen beim Herstellen von elektrischen Bestandteilen und Bestandteile mit solchen Streifen.
EP0050767B1 (fr) Disposition pour le soudage d'une pièce de contact sur un support de contact
DE2947811C2 (de) Kontaktkörper
DE19741557C1 (de) Verfahren zum Aufbringen von Lötmittel auf vornehmlich elektrofeinmechanische Bauteile aus elektrisch leitenden Materialien
DE1564751A1 (de) Verfahren und Vorrichtung zum Verbinden von Kontaktkoerpern mit Kontakttraegern
DE4417333A1 (de) Spann- und/oder Fixierelement
DE4024941C2 (de) Verfahren zum Fügen und Schweißen von Teilen durch Ultraschall sowie Halbzeug zur Verwendung bei diesen Verfahren
DE1944614A1 (de) Verfahren zum Wiederstandsschweissen von beschichteten Blechen
DE9315652U1 (de) Auftragskopf zum Aufbringen von Klebstoff auf ein Substrat, insbesondere für eine Verklebung eines Chips mit einer Karte
DE2218757C2 (de) Reibkörper für Bremsen und Kupplungen und Verfahren zur Herstellung von derartigen Reibkörpern
DE69814557T2 (de) Verfahren zum Herstellen eines Leichtmetallstössels und hergestellter Stössel
DE1813164A1 (de) Verfahren zum Herstellen von Leitungsverbindungen an elektronischen schaltelementen

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19940419

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): CH DE ES FR GB GR IT LI PT SE

17Q First examination report despatched

Effective date: 19941012

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE ES FR GB GR IT LI PT SE

REF Corresponds to:

Ref document number: 59202048

Country of ref document: DE

Date of ref document: 19950601

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2071517

Country of ref document: ES

Kind code of ref document: T3

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19950605

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN

REG Reference to a national code

Ref country code: GR

Ref legal event code: FG4A

Free format text: 3016220

ET Fr: translation filed
SC4A Pt: translation is available

Free format text: 950608 AVAILABILITY OF NATIONAL TRANSLATION

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GR

Payment date: 19951121

Year of fee payment: 4

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19961025

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 19961112

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 19961119

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19970218

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 19970531

REG Reference to a national code

Ref country code: GR

Ref legal event code: MM2A

Free format text: 3016220

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 19971118

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19971124

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971201

Ref country code: ES

Free format text: LAPSE BECAUSE OF THE APPLICANT RENOUNCES

Effective date: 19971201

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19980121

Year of fee payment: 6

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19971130

EUG Se: european patent has lapsed

Ref document number: 92923688.3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990730

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990901

REG Reference to a national code

Ref country code: PT

Ref legal event code: MM4A

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 19990531

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20010402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051130