EP0615651B1 - Contact with a silver contact base and process for making it - Google Patents

Contact with a silver contact base and process for making it Download PDF

Info

Publication number
EP0615651B1
EP0615651B1 EP92923688A EP92923688A EP0615651B1 EP 0615651 B1 EP0615651 B1 EP 0615651B1 EP 92923688 A EP92923688 A EP 92923688A EP 92923688 A EP92923688 A EP 92923688A EP 0615651 B1 EP0615651 B1 EP 0615651B1
Authority
EP
European Patent Office
Prior art keywords
contact
silver
solder
intermediate layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP92923688A
Other languages
German (de)
French (fr)
Other versions
EP0615651A1 (en
Inventor
Manfred Schneider
Dietmar Clauss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP0615651A1 publication Critical patent/EP0615651A1/en
Application granted granted Critical
Publication of EP0615651B1 publication Critical patent/EP0615651B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H01H1/0231—Composite material having a noble metal as the basic material provided with a solder layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion
    • H01H11/045—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion with the help of an intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
    • Y10T29/49213—Metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53796—Puller or pusher means, contained force multiplying operator
    • Y10T29/53896—Puller or pusher means, contained force multiplying operator having lever operator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53796—Puller or pusher means, contained force multiplying operator
    • Y10T29/53896—Puller or pusher means, contained force multiplying operator having lever operator
    • Y10T29/539—Plier type means

Definitions

  • the invention relates to a contact piece with a switching silver contact pad, which is soldered onto a contact carrier by means of an intermediate silver layer and a solder, and to a method for its production.
  • Such contact pieces are used in relays and switches of various types, among others.
  • solders required for soldering are available as flat material in specialist shops. They already contain metered surcharges for soldering aids. It is known to connect strips of contact silver and pure silver to one another by hot rolling and then to roll the flat solder material as a third layer onto this two-layer strip. The contacts are then cut off from this three-layer tape and soldered onto the contact carriers. It is a peculiarity of this manufacturing process that the rolling edges have to be trimmed so that waste is produced. Also, the cutting of the contacts with increasing contact strengths becomes increasingly problematic.
  • the invention is therefore based on the object of showing a way in which the manufacture of contact pieces can be simplified without impairing the quality.
  • the position of the solder on the silver intermediate layer of the two-layer contact should remain reliably guaranteed.
  • the solder should also be prevented from creeping up onto the switching silver contact pad when soldering to the contact carrier.
  • this object is achieved according to the invention in that the solder is attached to the intermediate silver layer in the form of a plate before the actual soldering process. As a result, the solder remains reliably on the the silver intermediate layer is positioned without slipping or falling off prematurely, i.e. before the contact carrier is soldered on. In this way, a prerequisite for reliable handling of the parts to be soldered to one another is created.
  • this object is achieved in that the intermediate silver layer is pressed onto the switching silver contact pad and then the solder is attached to the intermediate silver layer in the form of a plate and then the contact carrier is placed on the solder plate and soldered.
  • This sequence in the manufacturing process ensures reliable manufacture of the contact pieces with regard to the position of the solder plate and with regard to the quality of the soldering process. At the same time, it reduces the cost of the manufacturing process.
  • solder plate is located in a recess of the intermediate silver layer before the soldering in a development of the invention.
  • the result of this is that during the soldering process the solder plate is enclosed by this edge of the intermediate silver layer resting on the contact carrier and cannot easily flow away to the side.
  • This depression can be produced by a press or embossing cut.
  • the solder plate can be stapled by welding.
  • the ultrasound welding of the solder plate on the silver intermediate layer has proven to be particularly advantageous, since this prevents the solder plate from heating up. The latter could otherwise reduce the quality of the subsequent soldering.
  • the solder plate can be pressed against the silver intermediate layer via a pressure plate with small punctiform elevations during the ultrasonic welding. This measure ensures that the ultrasonic welding is carried out only under the few contact points of the point elevations and can therefore be carried out with much less pressure force and ultrasonic energy. This in turn has the consequence that the side of the silver layer facing the solder layer has small depressions at those points where the point elevations of the pressure plate were located.
  • the prerequisite for a completely flat support on the contact carrier during subsequent soldering is created.
  • the lateral sealing of the solder plate by the intermediate silver layer thus produced prevents the solder from flowing out laterally when soldering to the contact carrier, because the solder is bound in the edge material of the intermediate silver layer. This also prevents the solder material from creeping up on the sides of the switching silver during soldering.
  • this step can replace a separate pre-embossing of the silver intermediate layer.
  • Figure 1 shows the structure of the contact piece 1 in an exploded view. It consists of a contact silver contact pad 2, an intermediate silver layer 4, a solder plate 6 and a contact carrier 8.
  • the contact silver contact pad 2 consists of a known contact silver alloy in the exemplary embodiment. In the exemplary embodiment, it has the shape of a rectangular plate with the dimensions of the subsequent contact. However, it could just as well have the shape of a flat round disk or a hemispherical dome.
  • the silver intermediate layer 4 can be seen in FIG. 1, the dimensions of which are matched to the outline of the switching silver contact pad 2.
  • the silver intermediate layer 4 consists of pure silver in the exemplary embodiment.
  • the soldering plate 6 can be seen under the intermediate silver layer 4.
  • the soldering plate essentially consists of copper and silver and contains the commercially available one Embodiment already all necessary soldering aids. It has been cut from a commercially available solder strip of the desired width. Its contour is adapted to the contour of the silver intermediate layer 4, but is surmounted on all sides by approximately 1 mm from the silver intermediate layer. Under the solder plate 6, the contact carrier 8 for the contact piece 1 is shown in FIG. It consists of a flat material made of steel, which is coated on the surface with copper.
  • the switching silver contact pad 2 is first pressed in a pressing tool with the silver intermediate layer 4 cut off from a flat silver material to a two-layer contact.
  • the solder plate 6 previously cut off from a strip of solder flat material is placed, positioned and attached or welded on by means of a sonotrode 10 using ultrasound.
  • the sonotrode 10 has a support surface facing the solder 6, which is provided with small elevations 12. In the exemplary embodiment, these are small pyramid-shaped tips 12 which press the solder plate 6 against the silver intermediate layer 4.
  • this contact surface of the sonotrode 10 swings in the direction parallel to the support surface onto the solder 6.
  • the surface elements of the solder plate 6 located below the conical elevations 12 of the support surface of the sonotrode 10 and thus increasingly pressed against the silver interlayer, weld with the silver interlayer 4. while the solder plate remains cold.
  • the two-layer contact 2, 4 provided with the soldering plate 6 in this way is subsequently placed under a pressing tool and pressed flat with a pressing pressure of several tons per cm2.
  • the solder plate 6 is pressed into the silver intermediate layer 4, so that the silver intermediate layer surrounds the solder plate on all sides, with the exception of the surface to be soldered on the contact carrier 8 later.
  • the two-layer contact is placed on the contact carrier 8 and soldered to the contact carrier 8.
  • the previous plan pressing ensures that the contact lies completely flat on the contact carrier 8 during soldering.
  • this plane pressing has the result that the solder plate is pressed into the silver intermediate layer and, with the exception of the contact surface on the contact carrier 8, is enclosed on all sides by the silver intermediate layer 4. As a result, excess solder alloys with the silver border and is thus prevented from crawling up onto the switching silver contact pad.
  • solder plate 6 can be reliably positioned on the silver intermediate layer 4 of the switching silver contact pad without having previously been heated to a temperature close to the soldering temperature. This avoids the risk that disadvantages in later soldering with the contact carrier 8 have to be accepted due to the heating of the solder. Furthermore, the handling of the parts has been simplified and made cheaper.
  • the ultrasonic welding of the solder on the silver intermediate layer can be demonstrated in the micrograph.

Abstract

There are various processes for making such silver contact bases which, however, are either very laborious in the manipulation of the silver contact base and intermediate layer, the contact plate and the contact bearer and their soldering or are based on strip material of suitable composition, rolling these strips on one another and cutting the edges. In the latter process, noble metal is wasted. To avoid these drawbacks, according to the invention the solder is applied in the form of a platelet (6) before the actual process on the intermediate silver layer (4). Here it is especially advantageous if this application is made by ultrasonic soldering. The invention is applicable to all silver contacts.

Description

Die Erfindung bezieht sich auf ein Kontaktstück mit einer Schaltsilber-Kontaktauflage, die mittels einer Silberzwischenschicht und eines Lotes auf einen Kontaktträger aufgelötet ist, und auf ein Verfahren zu seiner Herstellung. Solche Kontaktstücke werden unter anderem in Relais und Schaltern der verschiedensten Art verwendet.The invention relates to a contact piece with a switching silver contact pad, which is soldered onto a contact carrier by means of an intermediate silver layer and a solder, and to a method for its production. Such contact pieces are used in relays and switches of various types, among others.

Im Fachhandel sind die zum Löten erforderlichen Lote als Flachmaterial erhältlich. Sie enthalten bereits dosierte Zuschläge an Löthilfsmitteln. Es ist bekannt, Bänder aus Kontaktsilber und Reinsilber durch Warmwalzen miteinander zu verbinden und anschließend Lot-Flachmaterial als dritte Schicht auf dieses Zweischichtband aufzuwalzen. Von diesem so erstellten Dreischichtband werden dann die Kontakte abgeschnitten und auf den Kontaktträgern aufgelötet. Es ist eine Eigenart dieses Herstellverfahrens, daß die Walzränder beschnitten werden müssen, so daß Abfall anfällt. Auch wird das Abschneiden der Kontakte bei größeren Kontaktstärken zunehmend problematisch.The solders required for soldering are available as flat material in specialist shops. They already contain metered surcharges for soldering aids. It is known to connect strips of contact silver and pure silver to one another by hot rolling and then to roll the flat solder material as a third layer onto this two-layer strip. The contacts are then cut off from this three-layer tape and soldered onto the contact carriers. It is a peculiarity of this manufacturing process that the rolling edges have to be trimmed so that waste is produced. Also, the cutting of the contacts with increasing contact strengths becomes increasingly problematic.

Es ist auch bekannt, aus einer auf Kontaktabmessungen zugeschnittenen Silberzwischenschicht und einer aufgepreßten Schaltsilberkontaktauflage Zweischichtkontakte herzustellen und diese dann mittels eines Lotes und Lothilfsmitteln auf dem jeweiligen Kontaktträger aufzulöten. Bei dieser Arbeitsweise entsteht kein Abfall, sofern mit Bandmaterial gearbeitet wird, welches zumindest in der Breite mit einer Breite oder Länge des späteren Kontaktes übereinstimmt. Bei größeren Stückzahlen ist diese Arbeitsweise jedoch wegen der exakten Positionierung und Dosierung des Lotes bzw. der Lothilfsmittel relativ aufwendig.It is also known to produce two-layer contacts from a silver intermediate layer tailored to contact dimensions and a pressed-on switching silver contact pad and then to solder these onto the respective contact carrier by means of solder and soldering aids. With this method of working, there is no waste, provided that tape material is used which corresponds at least in width to a width or length of the subsequent contact. For larger quantities, however, this method of operation is relatively complex because of the exact positioning and metering of the solder or soldering aids.

Der Erfindung liegt daher die Aufgabe zugrunde, einen Weg zu weisen, wie die Herstellung von Kontaktstücken vereinfacht werden kann, ohne die Qualität zu beeinträchtigen. Insbesondere soll die Position des Lotes auf der Silberzwischenschicht des Zweischichtenkontaktes zuverlässig gewährleistet bleiben. Darüber hinaus soll auch ein Hochkriechen des Lotes auf die Schaltsilberkontaktauflage beim Verlöten mit dem Kontaktträger verhindert werden.The invention is therefore based on the object of showing a way in which the manufacture of contact pieces can be simplified without impairing the quality. In particular, the position of the solder on the silver intermediate layer of the two-layer contact should remain reliably guaranteed. The solder should also be prevented from creeping up onto the switching silver contact pad when soldering to the contact carrier.

Bezüglich des Kontaktstücks wird diese Aufgabe erfindungsgemäß dadurch gelöst, daß das Lot in Form eines Plättchens vor dem eigentlichen Lötvorgang auf der Silberzwischenschicht angeheftet ist. Dadurch bleibt das Lot zuverlässig auf der der Silberzwischenschicht positioniert, ohne vorzeitig, das heißt vor dem Auflöten des Kontaktträgers, zu verrutschen oder gar abzufallen. Auf diese Weise wird eine Voraussetzung für eine zuverlässige Handhabung der miteinander zu verlötenden Teile geschaffen.With regard to the contact piece, this object is achieved according to the invention in that the solder is attached to the intermediate silver layer in the form of a plate before the actual soldering process. As a result, the solder remains reliably on the the silver intermediate layer is positioned without slipping or falling off prematurely, i.e. before the contact carrier is soldered on. In this way, a prerequisite for reliable handling of the parts to be soldered to one another is created.

Bezüglich des Verfahrens wird diese Aufgabe dadurch gelöst, daß die Silberzwischenschicht auf der Schaltsilberkontaktauflage aufgepreßt und anschließend das Lot in Form eines Plättchens auf der Silberzwischenschicht angeheftet und danach der Kontaktträger auf das Lotplättchen gelegt und aufgelötet wird. Diese Reihenfolge im Herstellverfahren gewährleistet eine hinsichtlich der Position des Lotplättchens und hinsichtlich der Qualität des Lötvorgangs zuverlässige Herstellung der Kontaktstücke. Zugleich hat sie eine Verbilligung des Herstellverfahrens zur Folge.With regard to the method, this object is achieved in that the intermediate silver layer is pressed onto the switching silver contact pad and then the solder is attached to the intermediate silver layer in the form of a plate and then the contact carrier is placed on the solder plate and soldered. This sequence in the manufacturing process ensures reliable manufacture of the contact pieces with regard to the position of the solder plate and with regard to the quality of the soldering process. At the same time, it reduces the cost of the manufacturing process.

Es hat sich als besonders vorteilhaft erwiesen, wenn sich das Lotplättchen vor der Lötung in Weiterbildung der Erfindung in einer Vertiefung der Silberzwischenschicht befindet. Das hat zur Folge, daß das Lotplättchen beim Lötvorgang von diesem auf dem Kontaktträger aufliegenden Rand der Silberzwischenschicht umschlossen ist und nicht so leicht seitlich wegfließen kann. Diese Vertiefung läßt sich durch einen Preß- oder Prägeschnitt herstellen.It has proven to be particularly advantageous if the solder plate is located in a recess of the intermediate silver layer before the soldering in a development of the invention. The result of this is that during the soldering process the solder plate is enclosed by this edge of the intermediate silver layer resting on the contact carrier and cannot easily flow away to the side. This depression can be produced by a press or embossing cut.

In Ausgestaltung der Erfindung kann die Heftung des Lotplättchens durch Schweißen erfolgen. Hierbei hat sich wiederum das Ultraschallschweißen des Lotplättchens auf der Silberzwischenschicht als besonders vorteilhaft erwiesen, weil hierdurch ein Aufheizen des Lotplättchens vermieden wird. Letzteres könnte sonst die Qualität der späteren Lötung verringern.In an embodiment of the invention, the solder plate can be stapled by welding. Here again, the ultrasound welding of the solder plate on the silver intermediate layer has proven to be particularly advantageous, since this prevents the solder plate from heating up. The latter could otherwise reduce the quality of the subsequent soldering.

In weiterer vorteilhafter Ausgestaltung der Erfindung kann das Lotplättchen während des Ulbraschallschweißens über eine Andruckplatte mit kleinen punktuellen Erhebungen an die Silberzwischenschicht angepreßt werden. Durch diese Maßnahme wird erreicht, daß das Ultraschallschweißen nur unter den wenigen Anpreßpunkten der punktuellen Erhebungen erfolgt und damit mit sehr viel weniger Andruckkraft und Ultraschallenergie durchgeführt werden kann. Das wiederum hat zur Folge, daß die der Lotschicht zugewandte Seite der Silberschicht kleine Vertiefungen an jenen Stellen aufweist, an denen sich die punktuellen Erhebungen der Andruckplatte befanden.In a further advantageous embodiment of the invention, the solder plate can be pressed against the silver intermediate layer via a pressure plate with small punctiform elevations during the ultrasonic welding. This measure ensures that the ultrasonic welding is carried out only under the few contact points of the point elevations and can therefore be carried out with much less pressure force and ultrasonic energy. This in turn has the consequence that the side of the silver layer facing the solder layer has small depressions at those points where the point elevations of the pressure plate were located.

Dadurch, daß das Lotplättchen in besonders zweckmäßiger Weiterbildung der Erfindung vor der Lötung bündig in die Silberzwischenschicht eingepreßt wird, wird die Voraussetzung für eine völlig plane Auflage auf dem Kontaktträger beim späteren Auflöten geschaffen. Zugleich wird durch die so erzeugte seitliche Umschließung des Lötplättchens durch die Silberzwischenschicht ein seitliches Ausfließen des Lotes beim Verlöten mit dem Kontaktträger verhindert, weil das Lot im Randmaterial der Silberzwischenschicht eingebunden wird. Auf diese Weise wird auch verhindert, daß das Lotmaterial beim Löten an den Seiten des Schaltsilbers hochkriecht. Letztendlich kann dieser Arbeitsgang eine separat Vorprägung der Silberzwischenschicht ersetzen.Characterized in that the solder plate is pressed flush into the intermediate silver layer prior to soldering in a particularly expedient development of the invention, the prerequisite for a completely flat support on the contact carrier during subsequent soldering is created. At the same time, the lateral sealing of the solder plate by the intermediate silver layer thus produced prevents the solder from flowing out laterally when soldering to the contact carrier, because the solder is bound in the edge material of the intermediate silver layer. This also prevents the solder material from creeping up on the sides of the switching silver during soldering. Ultimately, this step can replace a separate pre-embossing of the silver intermediate layer.

Weiterbildungen der Erfindung sind in den Unteransprüchen gekennzeichnet. Weitere Ausgestaltungen der Erfindung werden anhand eines in den Figuren dargestellten Ausführungsbeispiels erläutert. Es zeigen:

  • Figur 1 eine Explosionszeichnung des Kontaktstücks;
  • Figur 2 eine Seitenansicht des Zweischichtkontaktes;
  • Figur 3 eine Ansicht des Zweischichtkontaktes nach dem Ultraschallschweißen des Lotes und
  • Figur 4 eine Seitenansicht des fertigen Dreischichtkontaktes vor dem Auflöten auf den Kontakträger.
Developments of the invention are characterized in the subclaims. Further refinements of the invention are explained on the basis of an exemplary embodiment shown in the figures. Show it:
  • Figure 1 is an exploded view of the contact piece;
  • Figure 2 is a side view of the two-layer contact;
  • Figure 3 is a view of the two-layer contact after the ultrasonic welding of the solder and
  • Figure 4 is a side view of the finished three-layer contact before soldering onto the contact carrier.

Die Figur 1 zeigt den Aufbau des Kontaktstücks 1 in Explosionszeichnung. Es besteht aus einer Schaltsilber-Konaktauflage 2, einer Silberzwischenschicht 4, einem Lötplättchen 6 und einem Kontaktträger 8. Die Schaltsilber-Kontaktauflage 2 besteht im Ausführungsbeispiel aus einer bekannten Schaltsilberlegierung. Sie hat im Ausführungsbeispiel die Form einer rechteckigen Platte mit den Abmessungen des späteren Kontaktes. Sie könnte aber ebensogut die Form einer flachen runden Scheibe oder einer halbkugelförmigen Kalotte haben. Unter der Schaltsilber-Kontaktauflage 2 erkennt man in der Figur 1 die Silberzwischenschicht 4, die in ihren Abmessungen an den Grundriß der Schaltsilber-Kontaktauflage 2 angpaßt ist. Die Silberzwischenschicht 4 besteht im Ausführungsbeispiel aus reinem Silber. Unter der Silberzwischenschicht 4 erkennt man das Lötplättchen 6. Das Lötplättchen besteht im wesentlichen aus Kupfer und Silber und enthält in seiner handelsüblichen Ausführungsform bereits alle erforderlichen Löthilfsmittel. Es ist aus einem handelsüblich erhältlichen Lotstreifen der gewünschten Breite abgeschnitten worden. Seine Kontur ist an die Kontur der Silberzwischenschicht 4 angepaßt, wird aber allseitig um ca. 1 mm von der Silberzwischenschicht überragt. Unter dem Lötplättchen 6 ist in der Figur 1 der Kontaktträger 8 für das Kontaktstück 1 dargestellt. Er besteht aus einem Flachmaterial aus Stahl, das oberflächlich mit Kupfer beschichtet ist.Figure 1 shows the structure of the contact piece 1 in an exploded view. It consists of a contact silver contact pad 2, an intermediate silver layer 4, a solder plate 6 and a contact carrier 8. The contact silver contact pad 2 consists of a known contact silver alloy in the exemplary embodiment. In the exemplary embodiment, it has the shape of a rectangular plate with the dimensions of the subsequent contact. However, it could just as well have the shape of a flat round disk or a hemispherical dome. Under the switching silver contact pad 2, the silver intermediate layer 4 can be seen in FIG. 1, the dimensions of which are matched to the outline of the switching silver contact pad 2. The silver intermediate layer 4 consists of pure silver in the exemplary embodiment. The soldering plate 6 can be seen under the intermediate silver layer 4. The soldering plate essentially consists of copper and silver and contains the commercially available one Embodiment already all necessary soldering aids. It has been cut from a commercially available solder strip of the desired width. Its contour is adapted to the contour of the silver intermediate layer 4, but is surmounted on all sides by approximately 1 mm from the silver intermediate layer. Under the solder plate 6, the contact carrier 8 for the contact piece 1 is shown in FIG. It consists of a flat material made of steel, which is coated on the surface with copper.

Bei der Herstellung des Kontaktstücks 1 wird zunächst die Schaltsilber-Kontaktauflage 2 in einem Preßwerkzeug mit der auf Kontaktmaß von einem Silberflachmaterial abgeschnittenen Silberzwischenschicht 4 zu einem Zweischichtkontakt verpreßt.In the manufacture of the contact piece 1, the switching silver contact pad 2 is first pressed in a pressing tool with the silver intermediate layer 4 cut off from a flat silver material to a two-layer contact.

Auf der Silberzwischenschicht 4 dieses Zweischichtkontaktes wird das zuvor von einem Lot-Flachmaterialstreifen abgeschnittene Lotplättchen 6 aufgelegt, positioniert und angeheftet bzw. mittels einer Sonotrode 10 mittels Ultraschall aufgeschweißt. Dabei hat die Sonotrode 10 eine dem Lot 6 zugewandte Auflagefläche, die mit kleinen Erhebungen 12 versehen ist. Im Ausführungsbeispiel sind dies kleine pyramidenförmige Spitzen 12, die das Lotplättchen 6 gegen die Silberzwischenschicht 4 pressen. Beim Aktivieren der Piezokeramik schwingt diese Anpreßfläche der Sonotrode 10 in Richtung parallel zur Auflagefläche auf das Lot 6. Dabei verschweißen die unter den kegelförmigen Erhebungen 12 der Auflagefläche der Sonotrode 10 befindlichen und somit verstärkt gegen die Silberzwischenschicht angepreßten Flächenelemente des Lotplättchens 6 mit der Silberzwischenschicht 4, während das Lotplättchen im übrigen kalt bleibt. Alternativ wäre es auch möglich, das Lotplättchen auf der Silberzwischenschicht durch Kleben mit einem organischen Kontaktkleber anzuheften. Dieser verdampft beim anschließenden Lötvorgang.On the silver intermediate layer 4 of this two-layer contact, the solder plate 6 previously cut off from a strip of solder flat material is placed, positioned and attached or welded on by means of a sonotrode 10 using ultrasound. The sonotrode 10 has a support surface facing the solder 6, which is provided with small elevations 12. In the exemplary embodiment, these are small pyramid-shaped tips 12 which press the solder plate 6 against the silver intermediate layer 4. When the piezoceramic is activated, this contact surface of the sonotrode 10 swings in the direction parallel to the support surface onto the solder 6. The surface elements of the solder plate 6 located below the conical elevations 12 of the support surface of the sonotrode 10 and thus increasingly pressed against the silver interlayer, weld with the silver interlayer 4. while the solder plate remains cold. Alternatively, it would also be possible to attach the solder plate to the intermediate silver layer by gluing with an organic contact adhesive. This evaporates during the subsequent soldering process.

Der auf diese Weise mit dem Lötplättchen 6 versehene Zweischichtkontakt 2, 4 wird nachfolgend unter ein Preßwerkzeug gelegt und mit einem Preßdruck von mehreren Tonnen pro cm² plangepreßt. Dabei wird das Lotplättchen 6 in die Silberzwischenschicht 4 hineingedrückt, so daß die Silberzwischenschicht das Lotplättchen mit Ausnahme der später auf dem Kontaktträger 8 aufzulötenden Fläche allseitig umfaßt. Nach dem Preßvorgang wird der Zweischichtkontakt auf den Kontaktträger 8 gelegt und mit dem Kontaktträger 8 verlötet. Dazu wird der Kontaktträger 8 mitsamt dem Lotplättchen 6, der Silberzwischenschicht 4 und dem Schaltsilber 2 induktiv auf ca. 750 °C aufgeheizt. Durch das vorausgegangene Planpressen wird erreicht, daß der Kontakt beim Löten völlig plan auf dem Kontaktträger 8 aufliegt. Das hat zur Folge, daß exakt reproduzierbare, gleichmäßige Verhältnisse über die gesamte Lötfläche hinweg herrschen. Dies ist eine Voraussetzung für die Automatisierung des Lötvorgangs und für die Verkürzung der induktiven Heizzeit auf ca. 1 Sekunde, ohne lokale unkontrollierte Überhitzungen befürchten zu müssen. Darüber hinaus hat dieses Planpressen zur Folge, daß das Lotplättchen in die Silberzwischenschicht eingedrückt wird und mit Ausnahme der Auflagefläche auf dem Kontaktträger 8 allseitig von der Silberzwischenschicht 4 umschlossen wird. Dadurch legiert überschüssiges Lot mit der Silberumrandung und wird so daran gehindert, seitlich auf die Schaltsilber-Kontaktauflage hochzukriechen.The two-layer contact 2, 4 provided with the soldering plate 6 in this way is subsequently placed under a pressing tool and pressed flat with a pressing pressure of several tons per cm². The solder plate 6 is pressed into the silver intermediate layer 4, so that the silver intermediate layer surrounds the solder plate on all sides, with the exception of the surface to be soldered on the contact carrier 8 later. After the pressing process, the two-layer contact is placed on the contact carrier 8 and soldered to the contact carrier 8. For this purpose, the contact carrier 8 together with the solder plate 6, the silver intermediate layer 4 and the Switching silver 2 inductively heated to approx. 750 ° C. The previous plan pressing ensures that the contact lies completely flat on the contact carrier 8 during soldering. As a result, exactly reproducible, uniform conditions prevail over the entire soldering area. This is a prerequisite for automating the soldering process and for reducing the inductive heating time to approx. 1 second without having to fear local uncontrolled overheating. In addition, this plane pressing has the result that the solder plate is pressed into the silver intermediate layer and, with the exception of the contact surface on the contact carrier 8, is enclosed on all sides by the silver intermediate layer 4. As a result, excess solder alloys with the silver border and is thus prevented from crawling up onto the switching silver contact pad.

Es ist ein großer Vorteil dieses Herstellverfahrens, daß das Lotplättchen 6 zuverlässig auf der Silberzwischenschicht 4 der Schaltsilber-Kontaktauflage positioniert werden kann, ohne hierzu vorher auf eine Temperatur nahe der Löttemperatur erwärmt worden zu sein. Dadurch wird die Gefahr vermieden, daß durch die Erwärmung des Lotes Nachteile bei der späteren Lötung mit dem Kontaktträger 8 in Kauf genommen werden müssen. Des weiteren ist auf diese Weise die Handhabung der Teile vereinfacht und verbilligt worden.It is a great advantage of this manufacturing method that the solder plate 6 can be reliably positioned on the silver intermediate layer 4 of the switching silver contact pad without having previously been heated to a temperature close to the soldering temperature. This avoids the risk that disadvantages in later soldering with the contact carrier 8 have to be accepted due to the heating of the solder. Furthermore, the handling of the parts has been simplified and made cheaper.

Das Ultraschallschweißen des Lotes auf der Silberzwischenschicht kann im Schliffbild nachgewiesen werden.The ultrasonic welding of the solder on the silver intermediate layer can be demonstrated in the micrograph.

Claims (15)

  1. Contact (1) with a silver contact base (2) which is soldered onto a contact carrier (8) by means of a silver intermediate layer (4) and a solder (6), characterized in that the solder in the form of a platelet (6) is fastened to the silver intermediate layer (4) prior to the actual soldering operation.
  2. Contact according to Claim 1, characterized in that the solder platelet (6) is located in an indentation of the silver intermediate layer (4) prior to the soldering.
  3. Contact according to Claim 1 or 2, characterized in that the fastening has been performed by welding.
  4. Contact according to Claim 3, characterized in that the fastening has been performed by ultrasonic welding.
  5. Contact according to Claim 4, characterized in that the side of the silver layer facing towards the solder layer has small indentations.
  6. Contact according to Claim 1 or 2, characterized in that the fastening has been performed by bonding.
  7. Process for producing a contact, in particular according to one of Claims 1 to 6, characterized in that a silver intermediate layer (4) is pressed onto a silver contact base (2) and then a solder (6) in the form of a platelet is fastened to the silver intermediate layer (4) and then a contact carrier (8) is placed on the solder and soldered on.
  8. Process according to Claim 7, characterized in that the fastening of the solder platelet (6) is performed by welding.
  9. Process according to Claim 7 and 8, characterized in that the fastening of the solder platelet (6) is performed by ultrasonic welding to the silver intermediate layer (4).
  10. Process according to Claim 7, characterized in that the fastening of the solder platelet (6) is performed by bonding.
  11. Process according to one of Claims 7 to 9, characterized in that the solder platelet (6) is pressed onto the silver intermediate layer (4) during the ultrasonic welding via a pressure plate (10) having small dot-like protrusions (12).
  12. Process according to Claim 11, characterized in that the dot-like protrusions (12) are conical in shape.
  13. Process according to Claim 11 or 12, characterized in that the ultrasonic vibrations of the pressure plate (10) are aligned at a tangent to the contact surface of the solder platelet (6).
  14. Process according to one of Claims 7 to 13, characterized in that the solder platelet (6) is pressed flush into the silver intermediate layer (4) prior to the soldering.
  15. Process according to one of Claims 7 to 14, characterized in that the contact carrier (8), the solder platelet (6), the silver intermediate layer (4) and the silver contact base (2) are inductively heated in the soldering operation.
EP92923688A 1991-12-04 1992-11-30 Contact with a silver contact base and process for making it Expired - Lifetime EP0615651B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE4139998 1991-12-04
DE4139998A DE4139998A1 (en) 1991-12-04 1991-12-04 CONTACT PIECE WITH A SILVER CONTACT PAD AND METHOD FOR ITS PRODUCTION
PCT/DE1992/000998 WO1993011550A1 (en) 1991-12-04 1992-11-30 Contact with a silver contact base and process for making it

Publications (2)

Publication Number Publication Date
EP0615651A1 EP0615651A1 (en) 1994-09-21
EP0615651B1 true EP0615651B1 (en) 1995-04-26

Family

ID=6446266

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92923688A Expired - Lifetime EP0615651B1 (en) 1991-12-04 1992-11-30 Contact with a silver contact base and process for making it

Country Status (7)

Country Link
US (2) US5598629A (en)
EP (1) EP0615651B1 (en)
JP (1) JPH07501646A (en)
BR (1) BR9206854A (en)
DE (2) DE4139998A1 (en)
ES (1) ES2071517T3 (en)
WO (1) WO1993011550A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100473425B1 (en) * 1996-09-19 2005-03-07 지멘스 일렉트로미케니컬 컴포넌츠, 인코포레이티드 An electromechanical relay and method of manufacturing same
DE69814432T2 (en) * 1997-09-30 2004-03-18 Siemens Energy & Automation, Inc. METHOD FOR CONNECTING TWO ELECTRICALLY CONDUCTIVE PARTS USING ULTRASOUND
US6049046A (en) * 1997-09-30 2000-04-11 Siemens Energy & Automation, Inc. Electric circuit protection device having electrical parts ultrasonically joined using a brazing alloy
US6010059A (en) * 1997-09-30 2000-01-04 Siemens Energy & Automation, Inc. Method for ultrasonic joining of electrical parts using a brazing alloy
DE102019104318C5 (en) * 2019-02-20 2023-06-22 Auto-Kabel Management Gmbh Electrical conductor and method for producing an electrical conductor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE536121A (en) * 1954-03-02
JPS4312322Y1 (en) * 1966-11-02 1968-05-28
US3775067A (en) * 1971-12-06 1973-11-27 Textron Inc Copper backed electrical contact
JPS5116049B2 (en) * 1972-08-18 1976-05-21
DE2540943B2 (en) * 1975-09-13 1978-02-02 W.C. Heraeus Gmbh, 6450 Hanau CONTACT BODY FOR AN ELECTRIC CONNECTOR
US4053728A (en) * 1975-10-24 1977-10-11 General Electric Company Brazed joint between a beryllium-base part and a part primarily of a metal that is retractable with beryllium to form a brittle intermetallic compound
CH595685A5 (en) * 1976-08-19 1978-02-28 Rau Fa G
JPS5350461A (en) * 1976-10-18 1978-05-08 Okura Denki Co Ltd Structure for supporting movable core of vacuum switch
DE2844888C2 (en) * 1978-10-14 1983-02-24 W.C. Heraeus Gmbh, 6450 Hanau Raw material for the production of electrical contacts
DE2939997C2 (en) * 1979-10-03 1984-04-26 Degussa Ag, 6000 Frankfurt Method and device for applying contact bodies to contact carriers
DE3107665A1 (en) * 1981-02-28 1982-09-16 W.C. Heraeus Gmbh, 6450 Hanau Semi-finished metal product
DE3437981C2 (en) * 1984-10-17 1986-08-21 Doduco KG Dr. Eugen Dürrwächter, 7530 Pforzheim Process for producing a semi-finished product for electrical contacts
JPS6326906U (en) * 1986-08-04 1988-02-22
EP0283536A1 (en) * 1987-03-24 1988-09-28 INOVAN GmbH & Co. KG Metalle und Bauelemente Process for making silver/MeO contact plates with a solderable or weldable backing
DE3767487D1 (en) * 1987-07-14 1991-02-21 Inovan Stroebe METHOD FOR THE PRODUCTION OF SILVER / ME0 CONTACT PLATES WITH A LETERABLE OR WELDABLE BASE.
DE3866298D1 (en) * 1987-07-22 1992-01-02 Siemens Ag METHOD FOR CONNECTING WORKPIECES BY RESISTANCE HEATING BY MEANS OF A SHORT-TIME ENERGY PULSE.
DE4216224C2 (en) * 1992-05-19 1994-03-17 Heraeus Gmbh W C Pre-material and semi-finished product for electrical contacts as well as manufacturing processes
DE4331913A1 (en) * 1993-09-20 1995-03-23 Siemens Ag Method for connecting a contact pad made of silver-metal oxide material to a metallic contact carrier

Also Published As

Publication number Publication date
US5598629A (en) 1997-02-04
EP0615651A1 (en) 1994-09-21
ES2071517T3 (en) 1995-06-16
BR9206854A (en) 1995-12-05
DE4139998A1 (en) 1993-06-09
US5799771A (en) 1998-09-01
DE59202048D1 (en) 1995-06-01
JPH07501646A (en) 1995-02-16
WO1993011550A1 (en) 1993-06-10

Similar Documents

Publication Publication Date Title
EP0650189B1 (en) Method of manufacture of a semiconductor module
DE2820403A1 (en) METHOD OF CONTACTING THE ADHESIVE ELECTRODE OF AN ELECTRICAL COMPONENT
DE3326580A1 (en) METHOD AND ARRANGEMENT FOR PRODUCING A NOZZLE PLATE FOR INK JET PRINTER
EP0615651B1 (en) Contact with a silver contact base and process for making it
DE2532009A1 (en) METHOD OF MANUFACTURING AN ELECTRICAL COMPONENT, COMPOSING AT LEAST TWO COMPONENTS SEPARATED BY AN INSULATING LAYER
DE2517347A1 (en) CONTACT BODY AND MANUFACTURING PROCESS FOR IT
DE2631502A1 (en) Suction type forceps for small components - have passage from union to nozzle formed by groove covered by plate
EP1456543A1 (en) Retaining or fixing element with an adhesive surface for sticking to a support surface
DE1280419B (en) Extrusion process for the production of a carrier body for semiconductor components
CH652855A5 (en) METHOD FOR PRODUCING AN ELECTRICAL COMPOSITE MATERIAL CONTACT AND DEVICE FOR CARRYING OUT THIS METHOD.
DE3806309C1 (en)
EP0299136A2 (en) Method of making a circuit board
DE19714755A1 (en) Soldering method for joining thin sheet metal
EP0027893B1 (en) Method and apparatus for applying contact pieces to contact carriers
EP0050767B1 (en) Arrangement for welding a contact piece to a contact support
DE19741557C1 (en) Applying solder to electromechanical precision components made of electroconductive materials
DE1564751A1 (en) Method and device for connecting contact bodies with contact carriers
DE4417333A1 (en) Clamp component for connecting or joining workpieces in vehicle body assembly
DE4024941C2 (en) Ultrasonic joining and welding of parts and semi-finished products for use in these methods
DE1944614A1 (en) Process for resistance welding of coated sheets
DE2218757C2 (en) Friction bodies for brakes and clutches and a method for producing such friction bodies
DE69814557T2 (en) Process for manufacturing a light metal tappet and tappets produced
DE1813164A1 (en) Method for establishing line connections on electronic switching elements
DE2743423A1 (en) Nickel foil to aluminium component connection - uses combined ultrasonic and resistance welding
EP0300197A1 (en) Contact for brazing on a support by means of resistance-pressure welding using a short-time energy pulse

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19940419

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): CH DE ES FR GB GR IT LI PT SE

17Q First examination report despatched

Effective date: 19941012

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): CH DE ES FR GB GR IT LI PT SE

REF Corresponds to:

Ref document number: 59202048

Country of ref document: DE

Date of ref document: 19950601

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2071517

Country of ref document: ES

Kind code of ref document: T3

GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19950605

ITF It: translation for a ep patent filed

Owner name: STUDIO JAUMANN

REG Reference to a national code

Ref country code: GR

Ref legal event code: FG4A

Free format text: 3016220

ET Fr: translation filed
SC4A Pt: translation is available

Free format text: 950608 AVAILABILITY OF NATIONAL TRANSLATION

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GR

Payment date: 19951121

Year of fee payment: 4

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19961025

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 19961112

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 19961119

Year of fee payment: 5

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19970218

Year of fee payment: 5

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 19970531

REG Reference to a national code

Ref country code: GR

Ref legal event code: MM2A

Free format text: 3016220

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PT

Payment date: 19971118

Year of fee payment: 6

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19971124

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19971201

Ref country code: ES

Free format text: LAPSE BECAUSE OF THE APPLICANT RENOUNCES

Effective date: 19971201

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 19980121

Year of fee payment: 6

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19971130

EUG Se: european patent has lapsed

Ref document number: 92923688.3

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990730

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19990901

REG Reference to a national code

Ref country code: PT

Ref legal event code: MM4A

Free format text: LAPSE DUE TO NON-PAYMENT OF FEES

Effective date: 19990531

REG Reference to a national code

Ref country code: ES

Ref legal event code: FD2A

Effective date: 20010402

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20051130