EP0534108A1 - Procédé pour le traitement de surface unilatéral de pièces - Google Patents

Procédé pour le traitement de surface unilatéral de pièces Download PDF

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Publication number
EP0534108A1
EP0534108A1 EP92113514A EP92113514A EP0534108A1 EP 0534108 A1 EP0534108 A1 EP 0534108A1 EP 92113514 A EP92113514 A EP 92113514A EP 92113514 A EP92113514 A EP 92113514A EP 0534108 A1 EP0534108 A1 EP 0534108A1
Authority
EP
European Patent Office
Prior art keywords
arrangement according
carrier
intermediate layer
disks
carrier disks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP92113514A
Other languages
German (de)
English (en)
Other versions
EP0534108B1 (fr
Inventor
Gerhard Wittstock
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Peter Wolters AG
Original Assignee
Peter Wolters AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Peter Wolters AG filed Critical Peter Wolters AG
Publication of EP0534108A1 publication Critical patent/EP0534108A1/fr
Application granted granted Critical
Publication of EP0534108B1 publication Critical patent/EP0534108B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Definitions

  • the invention relates to a method for one-sided surface machining of workpieces with lapping, grinding, honing or polishing machines according to the preamble of claim 1.
  • the invention has for its object to provide a method for one-sided surface machining of workpieces with lapping, grinding, honing or polishing machines, which results in a reduction in manufacturing costs.
  • the use of a Two-disc machine is provided, and between the working discs are placed pairs of carrier discs, one above the other, between which an elastic intermediate layer is arranged.
  • a two-disc machine is naturally more complex than a single-disc machine.
  • the method according to the invention enables twice the production quantity per unit of time as a single-disc machine.
  • two single-disc machines require considerably more effort than a two-disc machine, the manufacturing costs can be significantly reduced.
  • the space requirement is reduced for a given production quantity per unit of time.
  • the carrier discs are arranged centrally one above the other.
  • an embodiment of the invention provides that the pairs of carrier disks are rotatably supported on the circumference in the two-disk machine.
  • the rotation for the carrier disks can be generated via friction.
  • the support means can contribute to the rotation, for example by a toothing engagement between the carrier disks and a ring gear or pin ring, which is outside the working disks, for example is arranged.
  • Another possibility is to provide support rollers against which the carrier disks are brought into contact.
  • a central drive or idler roller can also be provided, while support rollers are arranged on the circumference in order to set the carrier disks in a controlled rotation.
  • the carrier or workpiece holding disks are dimensionally stable from a thermal point of view. Therefore, an embodiment of the invention provides that the carrier disks consist of ceramic or Invar metal, which materials are known to have a small coefficient of thermal expansion.
  • the elastic intermediate layer is connected to at least one carrier disk.
  • the intermediate layer can also consist of foam rubber according to an embodiment of the invention.
  • Another embodiment of the invention provides that the elastic intermediate layer is filled with a fluid Pressure pad is.
  • at least one carrier disk can be shaped in such a way that it fixes the intermediate layer radially.
  • the workpieces can also be arranged in recesses or breakthroughs, the workpiece resting against the elastic intermediate layer in the event of a breakthrough.
  • This embodiment is chosen if the back side of the workpiece that is not to be machined is not very accurate.
  • a molded part is seated in the recess, which is adapted to the rear of the workpiece.
  • the molded part can in turn consist of an elastically yielding material corresponding to the material for the intermediate layer.
  • the carrier disk arrangement it can be advantageous if means are provided which prevent the workpiece from falling out. If the workpiece lies against the elastic intermediate layer, it can be designed in this way, for example by a recess or the like that the workpieces are held by a suction effect.
  • both carrier discs are rotatably supported or actively driven, they rotate synchronously during processing. If this is not the case, it is advantageous according to a further embodiment of the invention if the carrier disks are coupled in a torsionally rigid manner. For example, then only one carrier disc has circumferential teeth, e.g. roll around on a pen ring. Alternatively, only one carrier disk can have a cylindrical drive friction surface, which engages with support rollers of the machine.
  • a drive disk is arranged in a rotationally fixed manner between two carrier disks.
  • the drive disk which extends circumferentially beyond the carrier disks, brings about the rotary drive of the carrier disks, which in turn then only have to be designed as cylindrical structures.
  • the cylindrical shape is particularly advantageous if a complex or difficult-to-machine material is used for the carrier disks.
  • a thrust collar can be coupled to the drive pulley, which provides a large contact surface with the support rollers.
  • an elastic intermediate layer toward the carrier disk is preferably provided on each side of the drive disk. If, according to a further embodiment of the invention, the drive pulley has at least one opening for receiving an elastic intermediate layer, only a single elastic intermediate layer consisting of several sections is necessary.
  • FIG. 1 shows a two-disc machine 10 which can be used for lapping, grinding, honing or polishing. It has an upper working disc 12 which is rotatably mounted on a shaft in an upper pivotable frame part 14 and is driven by a drive motor 16. A lower working disk 18 is supported by a hollow shaft which is driven by a drive motor 20. An inner shaft arranged in the hollow shaft drives an inner pin ring 24 with the aid of a drive motor 22. An outer pin ring 26 is stationary.
  • the contact pressure between the working discs 12, 18 is adjustable, for example with the aid of an adjusting cylinder 26a.
  • a paired arrangement 30 of carrier disks for workpieces to be machined is provided between the working disks 12, 18.
  • the workpieces are machined on one side with the assigned working disc.
  • individual possible embodiments of such carrier disk arrangements are shown, specifically in a section that is indicated by the dot-dash circle 32 in FIG. 1.
  • the working disks 12a, 18a of the embodiment according to FIG. 2 are provided with a polishing cloth 34, for example.
  • the carrier disk arrangement 30a consists of two carrier disks 36, 38, between which a cushion 40 is arranged, which is filled with a fluid.
  • the carrier disks 36, 38 have a toothing on the circumference which can be brought into engagement with the toothed rings 24, 26, so that the carrier disk arrangement 30a also rotates about its own axis when the working disks 12a, 18a are rotated relative.
  • Workpieces 42 to be machined are, for example, attached to the facing surface of the carrier disks 36, 38, for example by means of wax or the like.
  • the carrier disks 36, 38 consist of a material with a very low coefficient of thermal expansion, so that they retain their shape even at different temperatures.
  • the carrier disk 44 of the carrier disk arrangement 30b has openings 48 in which workpieces 50 are received.
  • the workpieces therefore lie with the surface not to be machined against an elastic intermediate layer 52, for example made of foam rubber.
  • the carrier disks 44, 46 are excluded on the side facing each other, so that the intermediate layer 52 is fixed to the side.
  • a so-called templet with recesses for receiving workpieces 54 is arranged on the side of the carrier disk 46 facing the working disk 18b.
  • the workpieces are secured to the side with the aid of the templet 56.
  • the carrier disks 58, 60 of a carrier disk arrangement 30c are arranged against one another via an elastic intermediate layer 62 and are coupled in a torsionally rigid manner by means of pins, one of which is shown at 64.
  • pins one of which is shown at 64.
  • only the lower carrier disk 60 has a circumferential toothing for the purpose of engagement with the pin ring 26 or 24.
  • the carrier disks 58, 60 have openings for receiving workpieces 66 and 68, respectively.
  • the back of the workpiece 66 which is not flat, is seated in a form-fitting manner in a molded part 70, which can be made of an elastically yielding material.
  • the workpiece 68 lies directly against the intermediate layer 62, which has a bulge 72 in the area of the opening, so that the workpiece 68 is secured against falling out by means of a suction effect.
  • the carrier disk arrangement 30d has the two Carrier disks 74, 76, between which a drive disk 78 is arranged with a circumferential toothing, which engages with the pin rings 24, 26.
  • An elastic intermediate layer 80 or 82 is arranged between the drive disk 78 and the associated carrier disk 74 or 76.
  • the entire arrangement 30d of the disks or layers can be coupled in a torsionally rigid manner with the aid of pins or the like, as indicated by dashed lines at 84.
  • support rollers are used here, on which the carrier disks are supported and only rotate about their own axis, but not in the circumferential direction of the machine move.
  • support rollers can be provided on both sides of the annular work surface.
  • support rollers can be arranged on the outer circumference, while a idler roller or a driven roller centrally supports the carrier disk arrangement. 6 and 7, a support roller 86 is indicated.
  • the carrier disk arrangement 30e has two cylindrical carrier disks 88, 90 which can be coupled to one another in a torsionally rigid manner, as indicated by the pin 92 shown in broken lines.
  • An elastically yielding layer 94 lies between the carrier disks 88, 90.
  • the carrier disk arrangement 30f according to FIG. 7 has two cylindrical carrier disks 96, 98 which have an annular recess 100 on the outer edge.
  • a drive disk or hub disk 102 is arranged between the carrier disks 96, 98 and has an annular collar 104 on the circumference, the height of which approximately corresponds to the height of the support rollers 86.
  • the outer circumference of the federal government 104 interacts with the support roller 86.
  • the drive pulley 102 has cutouts 106 which accommodate elastic elements 108, so that the carrier pulleys 96, 98 are in turn elastically supported on one another.
  • Flat rings 110, 112 sit in the recesses 100 and corresponding recesses on the end faces of the collar 104, which rings are connected to one another and to the collar 104 by a screw connection, as indicated at 114, in order to hold the carrier disks 96, 98 together.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
EP92113514A 1991-09-24 1992-08-07 Procédé pour le traitement de surface unilatéral de pièces Expired - Lifetime EP0534108B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4131752A DE4131752A1 (de) 1991-09-24 1991-09-24 Verfahren zum einseitigen flaechenbearbeiten von werkstuecken
DE4131752 1991-09-24

Publications (2)

Publication Number Publication Date
EP0534108A1 true EP0534108A1 (fr) 1993-03-31
EP0534108B1 EP0534108B1 (fr) 1995-09-06

Family

ID=6441359

Family Applications (1)

Application Number Title Priority Date Filing Date
EP92113514A Expired - Lifetime EP0534108B1 (fr) 1991-09-24 1992-08-07 Procédé pour le traitement de surface unilatéral de pièces

Country Status (2)

Country Link
EP (1) EP0534108B1 (fr)
DE (2) DE4131752A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0577537A1 (fr) * 1992-05-27 1994-01-05 International Business Machines Corporation Dispositif à coussin d'eau pour supporter des pastilles soumises à un polissage mécano-chimique
WO1999016580A1 (fr) * 1997-09-26 1999-04-08 Memc Electronic Materials, Inc. Appareil de traitement de plaquettes
US6114245A (en) * 1997-08-21 2000-09-05 Memc Electronic Materials, Inc. Method of processing semiconductor wafers
CN101269478B (zh) * 2007-03-23 2010-06-23 中国科学院半导体研究所 减薄抛光用的精密磨抛头机械装置
WO2010112225A1 (fr) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Prodédé d'usinage par enlèvement de matière de pièces très minces dans une machine de meulage double face

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4314152C2 (de) * 1992-05-07 1995-05-11 Wacker Chemitronic Vorrichtung zur Beseitigung der Schwingungsneigung eines Werkstückscheiben- oder Werkzeugträgers in Maschinen zur einseitigen Bearbeitung der Oberflächen von Halbleiterscheiben
CN100448615C (zh) * 2007-05-09 2009-01-07 浙江工业大学 精密双面抛光机
CN100462202C (zh) * 2007-05-09 2009-02-18 浙江工业大学 精密双面抛光机的主轴传动机构

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 12, no. 142 (M-692)(2989) 30. April 1988 & JP-A-62 264 864 ( SONY CORP. ) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 71 (M-799)(3419) 17. Februar 1989 & JP-A-63 272 462 ( HITACHI CABLE LTD ) *
PATENT ABSTRACTS OF JAPAN vol. 7, no. 197 (M-239)(1342) 27. August 1983 & JP-A-58 94 964 ( TOKYO SHIBAURA DENKI K.K. ) *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0577537A1 (fr) * 1992-05-27 1994-01-05 International Business Machines Corporation Dispositif à coussin d'eau pour supporter des pastilles soumises à un polissage mécano-chimique
US6114245A (en) * 1997-08-21 2000-09-05 Memc Electronic Materials, Inc. Method of processing semiconductor wafers
WO1999016580A1 (fr) * 1997-09-26 1999-04-08 Memc Electronic Materials, Inc. Appareil de traitement de plaquettes
CN101269478B (zh) * 2007-03-23 2010-06-23 中国科学院半导体研究所 减薄抛光用的精密磨抛头机械装置
WO2010112225A1 (fr) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Prodédé d'usinage par enlèvement de matière de pièces très minces dans une machine de meulage double face
CN102378668A (zh) * 2009-04-01 2012-03-14 彼特沃尔特斯有限公司 用于在双面磨床中去除材料地加工非常薄的工件的方法

Also Published As

Publication number Publication date
DE4131752A1 (de) 1993-03-25
EP0534108B1 (fr) 1995-09-06
DE59203556D1 (de) 1995-10-12

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