EP0533760B1 - Verfahren zur herstellung einer elektrischen vorrichtung - Google Patents

Verfahren zur herstellung einer elektrischen vorrichtung Download PDF

Info

Publication number
EP0533760B1
EP0533760B1 EP91910990A EP91910990A EP0533760B1 EP 0533760 B1 EP0533760 B1 EP 0533760B1 EP 91910990 A EP91910990 A EP 91910990A EP 91910990 A EP91910990 A EP 91910990A EP 0533760 B1 EP0533760 B1 EP 0533760B1
Authority
EP
European Patent Office
Prior art keywords
mixture
polymer material
electrodes
electrically conductive
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP91910990A
Other languages
English (en)
French (fr)
Other versions
EP0533760A1 (de
Inventor
Tomas Hansson
Ulf Henriksson
Hakan Johansson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB AB
Original Assignee
Asea Brown Boveri AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Brown Boveri AB filed Critical Asea Brown Boveri AB
Publication of EP0533760A1 publication Critical patent/EP0533760A1/de
Application granted granted Critical
Publication of EP0533760B1 publication Critical patent/EP0533760B1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon

Definitions

  • the present invention relates to a method of manufacturing an electrical device, particularly an overcurrent protective device, comprising a body, provided with two parallel surfaces, of an electrically conductive polymer composition with a resistivity of at most 100 m ⁇ cm and two electrodes arranged in contact with the parallel surfaces, the polymer composition comprising a polymer material and an electrically conductive powdered material distributed in the polymer material.
  • PTC element Physical Temperature Coefficient
  • the resistance of a PTC element of the above kind is low, for example a few hundredths ⁇ , in the normal working range of the element which may extend to, for example, 80°C and increases slightly with the temperature. If the temperature of the element exceeds this value, for example because of overcurrent, the resistance increases more rapidly, and upon exceeding a certain critical temperature, the element suddenly changes from a low-resistance to a high-resistance state in which the resistance may amount to 10 k ⁇ and more.
  • thermal overload relay Another type of such an electrical device in the form of an overcurrent protective device is a thermal overload relay.
  • the used polymer material if it is a thermoplastic resin, for example polyethylene, is melted and mixed (compounded) with the conductive powdered material which normally consists of carbon in some form or of a metallic material or of a mixture of carbon and a metallic material.
  • the conductive powdered material which normally consists of carbon in some form or of a metallic material or of a mixture of carbon and a metallic material.
  • This technique involves a number of limitations.
  • the polymer material must have a relatively low viscosity and even if this is the case, it may be impossible to intermix the desired, sufficiently high contents of carbon.
  • the powerful processing during the compounding operation also entails a risk that the conductive material is crushed or otherwise influenced so as to undergo undesirable changes.
  • the produced mixture is subjected to a processing in connection with it being formed by extrusion, compression moulding, or in some other way, which entails a risk of an undesired anisotropy arising in the material in the formed product.
  • the processes described may lead to problems in achieving reproducible properties in the manufactured, finished body.
  • the body After the forming of the body of polymer composition, the body is provided with electrodes according to applied technique.
  • the electrodes usually consist of metal foils and are applied by being pressed onto the body while being heated.
  • the invention makes possible the use of polymer material with a considerably higher viscosity than what has previously been possible. It provides a considerably greater freedom of choice as regards types and contents of conductive materials.
  • the conductive material is not subjected to any processing with undesired consequences. No forming, entailing a risk of anisotropy, occurs.
  • the electrodes may be applied without having to carry out a separate operating step.
  • a particularly important advantage is that the method makes it possible to obtain devices with very low transition resistance between electrode and polymer composition.
  • the favourable results are obtained by mixing the polymer material in thermoplastic state and in powdered form with a grain size of below 100 ⁇ m, and of below 40 ⁇ m in at least 50% of the material, in solid, dry state with the electrically conductive powdered material in a grain size of below 100 ⁇ m into a mixture in which the polymer material constitutes at least 30 per cent and the electrically conductive powdered material at least 20 per cent of the total volume of these materials and by subjecting the mixture together with the electrodes to a pressing and a heating to a temperature at which the polymer material melts at least on the surface of the grains while forming a permanently coherent body of the mixture and while fixing the electrodes to the coherent body.
  • the grains of the polymer material then entirely lose their identity.
  • the mixture of polymer material and electrically conductive powdered material is subjected to a pressing operation at room temperature or other temperature which is considerably lower than the temperature at which the polymer material melts while forming a preformed body, before the mixture in the form of the preformed body together with the electrodes is subjected to the pressing and the heating for forming the permanently coherent body and for fixing the electrodes.
  • Electrodes there are preferably used prefabricated plates of a powdered metallic material, which have a porous structure on the side facing the mixture and are impermeable to the polymer material so that they prevent penetration of the polymer material to the side facing away from the mixture.
  • the electrodes are effectively secured to the conductive polymer composition without the polymer material providing any insulating or any possibly slightly conductive coating on the outside of the electrodes.
  • the polymer material penetrates, in its thermoplastic state, into the pores of the electrodes without penetrating the electrodes. Plates which are completely porous from the beginning may be made impermeable to the penetration of polymer material by being provided on the outside with a metallic coating, for example electrolytically.
  • the electrode material in powdered state may be applied in the form of layers on the surfaces of the conductive polymer composition, before it is subjected to pressing and heating for forming the permanently coherent body and for fixing the electrodes. Also in such a case, measures are preferably taken for ensuring that the electrodes are tight against the penetration of polymer material, for example by providing them with a tight coating of metallic material on that side facing away from the mixture.
  • the metallic material in the electrodes may advantageously consist of nickel or copper but also other metallic materials in the form of pure metal or metal alloy with sufficient electric conductivity may be used.
  • a suitable grain size of the metallic material is 0.5 ⁇ m - 20 ⁇ m and a suitable thickness of an electrode 100-1000 ⁇ m.
  • the coating may advantageously consist of copper which provides a well scattered electrical conduction in the lateral direction within the electrode in question, irrespective of the material on which the electrode is otherwise based.
  • the tight surface layer on an otherwise porous electrode may advantageously have a thickness which amounts to 3-30% of the thickness of the entire electrode.
  • a crosslinkable linear polymer is used as polymer material in the manufacture of the device. If the crosslinking ability of the polymer material is utilized, the crosslinking is carried out after the mixture of the polymer material and the conductive material together with the electrodes has been subjected to the pressing and the heating for forming the permanently coherent body and for fixing the electrodes.
  • crosslinking polymer material By crosslinking polymer material, a greater mechanical and thermal stability of the manufactured device may be achieved.
  • the polymer material preferably consists of a polyolefin, such as polyethylene, polypropylene, polybutene, or a copolymer of ethylene and propylene.
  • a polyolefin such as polyethylene, polypropylene, polybutene, or a copolymer of ethylene and propylene.
  • Specially preferred is HD polyethylene.
  • liner polymers which may be made sufficiently fine-grained and be mixed in dry state with the conductive material and be transferred into thermoplastic state when the mixture is subjected to pressing and heating for forming a permanently coherent body of the polymer composition and for fixing the electrodes.
  • Examples of such other linear polymers are polyamide, polethylene terephthalate, polybutene terephthalate and polyoxymethylene.
  • the polymer material preferably has a crystallinity of at least 5%.
  • the grain size of the polymer material is preferably 5-100 ⁇ m, of which at least 50% of the material has a grain size smaller than 40 ⁇ m.
  • suitable electrically conductive materials in the polymer composition may be mentioned carbon in the form of conductive carbon powders such as carbon black, metallic materials such as, for example, nickel, tungsten, molybdenum, cobalt, copper, silver, aluminium and brass, borides such as, for example, ZrB 2 and TiB 2 , nitrides such as, for example, ZrN and TiN, oxides such as, for example, V 2 O 3 and TiO, carbides such as, for example, TaC, WC and ZrC, as well as mixtures of two or more of the exemplified materials such as, for example, a mixture of soot and nickel.
  • metallic materials such as, for example, nickel, tungsten, molybdenum, cobalt, copper, silver, aluminium and brass
  • borides such as, for example, ZrB 2 and TiB 2
  • nitrides such as, for example, ZrN and TiN
  • oxides such as, for example, V 2 O 3 and Ti
  • the grain size of the conductive carbon powders such as carbon black is usually 0.01-0.10 ⁇ m, the grain size of metallic material preferably 0.5-100 ⁇ m and the grain size of borides, nitrides, oxides, and carbides preferably 0.01-100 ⁇ m.
  • at least part of the electrically conductive powdered material has a grain size which is smaller than the cross section of the pores of the electrode, so that at least that part of the powdered material can accompany the polymer material when it penetrates into the pores of the electrode.
  • the polymer material suitably constitutes 30-80 per cent and the electrically conductive powdered material 20-70 per cent of the total volume of these materials in the polymer composition built up of the mixture.
  • the electrically conductive material consists of a mixture of carbon and metallic material, there are preferred a content of polymer material of 65-80 per cent and a content of electrically conductive powdered material of 20-35 per cent of the total volume of these materials in devices with a pronounced PTC effect.
  • the carbon preferably constitutes 5-75 per cent by volume and the metallic material 25-95 per cent by volume.
  • HD polyethylene 75 parts by volume HD polyethylene (NB 6081 from PLAST-LABOR S.A., Bulle, Switzerland) with a melting index (MI 190/2) of 40 g/10 min, a density of 0.960 g/cm 3 and a grain size of 5-90 ⁇ m, thereof a grain size of 24-36 ⁇ m in more than 50% of the material, is mixed with 13 parts by volume nickel powder with a grain size of less than 7 ⁇ m and with 12 parts by volume carbon black of type N550 (ASTM) with a grain size of 0.040-0.048 ⁇ m into a mixture in the form of a polymer composition.
  • the mixture is pressed at room temperature and a pressure of 70 MPa in a forming tool with a cylindrical cavity and one or two movable cylindrical dies into a preformed round plate with a diameter of 25 mm and a height of 1.5 mm.
  • each plate is electrolytically provided on one side with a 20 ⁇ m thick layer of copper which, for one thing, eliminates the presence of through-going pores by the layer being tight, and, for another, provides a radially scattered surface layer of high conductivity.
  • the plate of the polymer composition with one of the nickel electrode plates on each flat side is again placed in the forming tool with the copper layers facing outwards, whereupon the stack of the three plates is first pressed at room temperature and a pressure of 70 MPa and then at 150°C without changing the pressure.
  • the polymer composition then forms a permanently coherent body, to which the electrodes are mechanically secured in an effective manner with a low transition resistance between electrode and polymer composition by the polymer composition having penetrated into the pores of the electrodes or at least the polymer material and the part of the electrically conductive powdered material having a grain size which is smaller than the pores of the electrode.
  • the polymer composition has a resistivity of less than 50 m ⁇ cm. The manufactured device is excellently suited for use as PTC element.
  • a device is manufactured in the manner stated in Example 1 with the difference that the copper layers on the outside of the electrodes are not applied until the stack of the plates of the polymer composition and of the nickel electrodes has been pressed at room temperature into a coherent body. After application of the copper layers on the outside of the electrodes, the coherent body is subjected to a pressing at a pressure of 70 MPa and a temperature of 150°C.
  • a device is manufactured in the manner described in Example 1 with the difference that the electrode plates pressed at room temperature, instead of being provided with tight copper layers on the outside, are subjected to a sintering in hydrogen gas atmosphere at about 400°C for four hours followed by a grinding of the side facing away from the polymer composition using 320 mesh wet grinding paper.
  • the grinding entails a deformation of the surface layer so that this becomes tight.
  • This resuls in electrode plates with a porous surface structure on the side facing the polymer composition but without through-going pores. They will therefore become impermeable to polymer material during the hot pressing.
  • a device is manufactured in the manner described in Example 1 with the difference that the porous electrodes, instead of being provided on the outside with a copper layer, are made tight there by melting down the surface layer to a depth of about 50 ⁇ m and causing it to solidify by the use of laser.
  • the device is excellently suited for use as PTC element.
  • a device is manufactured in any of the ways described in Examples 1-4. After the last pressing with heat treatment, the polymer composition is subjected to a crosslinking by electron-irradiating the device in its entirety until the crosslinking degree of the polymer material amounts to 80%.
  • the polymer composition has a resistivity of less than 50 m ⁇ cm. The device is excellently suited for use as PTC element.
  • Electrodes are manufacturd in a manner described in Example 1, Example 3 or Example 4.
  • the electrodes are placed together with the polymer composition described in Example 1 in the form of a powder, that is, without preforming, in the cavity of a forming tool of the kind described in Example 1 with the electrodes on either side of the polymer composition and with the tight layers (Examples 1 and 4) facing outwards.
  • the polymer composition and the electrodes are subjected to a pressing with a pressure of 70 MPa at a temperature of 150°C.
  • the polymer composition has a resistivity of less than 50 m ⁇ cm.
  • the device is excellently suited for use as PTC element.
  • a device is manufactured in any of the ways described in Examples 1-6 but with the difference that, instead of polyethylene mentioned there, there is used an LD polyethylene (HX 1681 from PLAST-LABOR S.A.) with a melting index of 70 g/10 min, a density of 0.916 g/cm 3 and a grain size of 5-35 ⁇ m, thereof a grain size of 10-14 ⁇ m in more than 50% of the material.
  • the polymer composition has a resistivity of less than 50 m ⁇ cm.
  • the produced device is excellently suited for use as a PTC element.
  • a device is manufactured in any of the ways described in Example 1, 2, 3, 4 or 6, with the difference that instead of polyethylene mentioned there, there is used polypropylene (PB 0580 from PLAST-LABOR S.A.) with a melting index (MI 230/5) of 100 g/10 min, a density of 0.905 g/cm 3 , and a grain size of 5-90 ⁇ m, thereof a grain size of 24-36 ⁇ m in more than 50% of the material and the difference that the hot pressing is carried out at 170°C.
  • PB 0580 from PLAST-LABOR S.A.
  • a device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black mentioned there, there are used 50 parts by volume ZrN with a grain size of less than 45 ⁇ m.
  • the polymer composition has a resistivity of less than 50 m ⁇ cm.
  • a device is manufactured in the manner described in Example 9, with the difference that instead of ZrN there is used TiN with a grain size of less than 6-10 ⁇ m.
  • the polymer composition has a resistivity of less than 35 m ⁇ cm.
  • a device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black mentioned there, there are used 13 parts by volume of the same carbon black and 52 parts by volume TiN with a grain size of 6-10 ⁇ m.
  • the polymer composition has a resistivity of less than 35m ⁇ cm.
  • a device is manufactured in the manner described in Example 10, with the difference that instead of TiN there is used ZrB 2 with a grain size of less than 45 ⁇ m.
  • the polymer composition has a resistivity of less than 30 m ⁇ cm.
  • a device is manufactured in the manner described in Example 9, with the difference that instead of ZrN there is used TiB 2 with a grain size of less than 45 ⁇ m.
  • a device is manufactured in any of the ways described in Examples 1-8, but with the difference that instead of the electrically conductive powdered materials mentioned there in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black, there is used 120 parts by volume soot of the same kind as in Example 1.
  • a device is manufactured in any of the ways described in Examples 1-8, with the difference that instead of the electrically conductive powdered materials mentioned there in the form of 13 parts by volume nickel powder and 12 parts by volume carbon black, there is used 60 parts by volume nickel powder of the same kind as in Example 1.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Noodles (AREA)
  • Dc-Dc Converters (AREA)
  • Fuses (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Claims (16)

  1. Verfahren zur Herstellung einer elektrischen Vorrichtung, insbesondere einer Überstromschutzvorrichtung, mit einem zwei parallele Oberflächen aufweisenden Körper aus einer elektrisch leitenden Polymerverbindung mit einem spezifischen Widerstand von höchstens 100 mOhm·cm und zwei Elektroden, die in Kontakt mit den parallelen Oberflächen angeordnet sind, wobei die Polymerverbindung ein Polymermaterial und ein in diesem verteiltes elektrisch leitendes Pulvermaterial enthält,
    dadurch gekennzeichnet, daß
    das Polymermaterial im thermoplastischen Zustand und in Pulverform mit einer Korngröße von weniger als 100 µm, und weniger als 40 µm in mindestens 50 Prozent des Materials,
    im festen und trockenen Zustand mit dem elektrisch leitenden Pulvermaterial, welches eine Korngröße von weniger als 100 µm hat, zu einem Gemisch vermischt wird,
    in welcher das Polymermaterial mindestens 30 Prozent und das elektrisch leitende Pulvermaterial mindestens 20 Prozent des Gesamtvolumens dieser Materialien ausmacht,
    und daß das Gemisch zusammen mit den Elektroden einer Pressung und einer Erhitzung auf eine Temperatur ausgedetzt wird, bei der das Polymermaterial zumindest an der Oberfläche der Körner derart schmilzt, daß aus dem Gemisch, in der die Körner des Polymermaterials ihre Identität vollständig verloren haben, ein permanent zusammenhängender Körper gebildet wird und die Elektroden an den zusammenhängenden Körper fixiert werden.
  2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß das Gemisch einer Pressung bei Raumtemperatur oder einer anderen Temperatur, die bedeutend unter der Temperatur liegt, bei welcher das Polymermaterial schmilzt, unterworfen wird, wobei ein vorgeformter Körper gebildet wird, bevor das Gemisch in Gestalt des vorgeformten Körpers zusammen mit den Elektroden der Pressung und Erhitzung zur Bildung des permanent zusammenhängenden Körpers und zur Fixierung der Elektroden unterworfen wird.
  3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß als Elektroden vorgefertigte Platten aus einem pulverförmigen metallischen Material verwendet werden, welche Platten eine poröse Struktur an derjenigen Seite haben, die dem Gemisch zugewandt ist, und die dicht gegenüber dem Durchdringen von Polymermaterial zu der Seite sind, welche von dem Gemisch wegweist.
  4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Platten an der von dem Gemisch wegweisenden Seite dadurch dicht sind, daß sie auf der genannten Seite mit einem dichten Überzug aus einem metallischen Material versehen sind.
  5. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Platten an der von dem Gemisch wegweisenden Seite dadurch dicht sind, daß die genannte Seite mit einer geschmolzenen und fest gewordenen Oberflächenschicht aus dem pulverförmigen metallischen Material der Platten versehen ist.
  6. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß die Platten gegen ein Durchdringen von Polymermaterial undurchlässig sind infolge der Beseitigung von durchgehenden Poren durch Sintern der Platten und anschließender mechanischer Bearbeitung derjenigen Seite, die von dem Gemisch wegweist.
  7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß als Polymermaterial ein vernetzbares lineares Polymer verwendet wird und daß das Polymermaterial vernetzt wird, nachdem das Gemisch zusammen mit den Elektroden der Pressung und Erhitzung zur Bildung eines permanent zusammenhängenden Körpers und zur Fixierung der Elektroden ausgesetzt worden ist.
  8. Verfahren nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, daß als Polymermaterial ein Polyolefin verwendet wird.
  9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, daß als Polymermaterial ein Polyethylen verwendet wird.
  10. Verfahren nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß das Polymermaterial 30 bis 80 Prozent und das elektrisch leitende Pulvermaterial 20 bis 70 Prozent des Gesamtvolumens dieser Materialien des Gemisches ausmacht.
  11. Verfahren nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, daß das Polymermaterial 65 bis 80 Prozent und das elektrisch leitende Pulvermaterial 20 bis 35 Prozent des Gesamtvolumens dieser Materialien des Gemisches ausmacht.
  12. Verfahren nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß als elektrisch leitendes Pulvermaterial Kohlenstoff in Form von Ruß verwendet wird.
  13. Verfahren nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß als elektrisch leitendes Pulvermaterial in dem Gemisch ein metallisches Material verwendet wird.
  14. Verfahren nach einem der Ansprüche 1 bis 11, dadurch gekennzeichnet, daß als elektrisch leitendes Pulvermaterial in dem Gemisch eine Mischung aus Kohlenstoff in Form von Ruß und einem metallischen Material verwendet wird.
  15. Verfahren nach einem der Ansprüche 13 oder 14, dadurch gekennzeichnet, daß das metallische Material aus Nickel besteht.
  16. Verfahren nach Anspruch 14, dadurch gekennzeichnet, daß der Kohlenstoff 5 bis 75 Prozent und das metallische Material 25 bis 95 Prozent des Gesamtvolumens dieser Materialien in der Mischung beträgt.
EP91910990A 1990-06-05 1991-05-28 Verfahren zur herstellung einer elektrischen vorrichtung Expired - Lifetime EP0533760B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9001990A SE468026B (sv) 1990-06-05 1990-06-05 Saett att framstaella en elektrisk anordning
SE9001990 1990-06-05
PCT/SE1991/000375 WO1991019297A1 (en) 1990-06-05 1991-05-28 Method of manufacturing an electrical device

Publications (2)

Publication Number Publication Date
EP0533760A1 EP0533760A1 (de) 1993-03-31
EP0533760B1 true EP0533760B1 (de) 1999-11-17

Family

ID=20379667

Family Applications (1)

Application Number Title Priority Date Filing Date
EP91910990A Expired - Lifetime EP0533760B1 (de) 1990-06-05 1991-05-28 Verfahren zur herstellung einer elektrischen vorrichtung

Country Status (6)

Country Link
EP (1) EP0533760B1 (de)
JP (1) JP2836959B2 (de)
AT (1) ATE186793T1 (de)
DE (1) DE69131787T2 (de)
SE (1) SE468026B (de)
WO (1) WO1991019297A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4221309A1 (de) * 1992-06-29 1994-01-05 Abb Research Ltd Strombegrenzendes Element
JP2965815B2 (ja) * 1993-04-05 1999-10-18 アルプス電気株式会社 半田付け可能な塗膜形成用導電性ペースト
EP0640995B1 (de) * 1993-08-25 1997-06-25 Abb Research Ltd. Elektrisches Widerstandselement und Verwendung dieses Widerstandselementes in einem Strombegrenzer
IT1267672B1 (it) * 1994-01-17 1997-02-07 Hydor Srl Composto resistivo termosensibile, suo metodo di realizzazione ed uso
DE4427161A1 (de) 1994-08-01 1996-02-08 Abb Research Ltd Verfahren zur Herstellung eines PTC-Widerstandes und danach hergestellter Widerstand
DE19520869A1 (de) * 1995-06-08 1996-12-12 Abb Research Ltd PTC-Widerstand
US5793276A (en) * 1995-07-25 1998-08-11 Tdk Corporation Organic PTC thermistor
US5614881A (en) * 1995-08-11 1997-03-25 General Electric Company Current limiting device
DE19534442A1 (de) * 1995-09-16 1997-03-27 Abb Research Ltd Überstromschutzvorrichtung
DE19548741A1 (de) * 1995-12-23 1997-06-26 Abb Research Ltd Verfahren zur Herstellung eines Materials für PTC-Widerstände
US5929744A (en) * 1997-02-18 1999-07-27 General Electric Company Current limiting device with at least one flexible electrode
US6535103B1 (en) 1997-03-04 2003-03-18 General Electric Company Current limiting arrangement and method
US5977861A (en) * 1997-03-05 1999-11-02 General Electric Company Current limiting device with grooved electrode structure
US6191681B1 (en) 1997-07-21 2001-02-20 General Electric Company Current limiting device with electrically conductive composite and method of manufacturing the electrically conductive composite
US6373372B1 (en) 1997-11-24 2002-04-16 General Electric Company Current limiting device with conductive composite material and method of manufacturing the conductive composite material and the current limiting device
DE19800470A1 (de) * 1998-01-09 1999-07-15 Abb Research Ltd Widerstandselement
US6290879B1 (en) 1998-05-20 2001-09-18 General Electric Company Current limiting device and materials for a current limiting device
US6124780A (en) * 1998-05-20 2000-09-26 General Electric Company Current limiting device and materials for a current limiting device
US6133820A (en) * 1998-08-12 2000-10-17 General Electric Company Current limiting device having a web structure
DE19915525A1 (de) * 1999-04-07 2000-11-02 Bosch Gmbh Robert Temperaturfühler mit wenigstens einer Leiterbahn und Verfahren zur Herstellung eines Temperaturfühlers
US6323751B1 (en) 1999-11-19 2001-11-27 General Electric Company Current limiter device with an electrically conductive composite material and method of manufacturing
WO2002079302A1 (en) * 2001-03-28 2002-10-10 Perplas Ltd Composite obtainable by sintering an inorganic material with one or more polymers
FR3038710B1 (fr) * 2015-07-10 2021-05-28 Cpc Tech Capteur d'une caracteristique physique, comportant de preference une structure multicouches
CN107230511B (zh) * 2016-03-24 2019-09-03 上海利韬电子有限公司 导电聚合物组合物、电气器件及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2309834A1 (de) * 1973-02-28 1974-08-29 Bosch Gmbh Robert Verfahren zur herstellung von kohlebuersten fuer elektrische maschinen
US4533685A (en) * 1983-07-26 1985-08-06 Hudgin Donald E Polymer-metal blend
EP0185783A1 (de) * 1984-12-20 1986-07-02 General Electric Company Abschirmung höherer Wirksamkeit durch thermoplastische Werkstoffe
EP0371059A1 (de) * 1986-01-14 1990-06-06 Raychem Corporation Elektrisch leitende kunstharzmasse

Also Published As

Publication number Publication date
SE9001990D0 (sv) 1990-06-05
EP0533760A1 (de) 1993-03-31
DE69131787T2 (de) 2000-06-21
SE9001990L (sv) 1991-12-06
WO1991019297A1 (en) 1991-12-12
JP2836959B2 (ja) 1998-12-14
ATE186793T1 (de) 1999-12-15
JPH05508055A (ja) 1993-11-11
DE69131787D1 (de) 1999-12-23
SE468026B (sv) 1992-10-19

Similar Documents

Publication Publication Date Title
EP0533760B1 (de) Verfahren zur herstellung einer elektrischen vorrichtung
Chan et al. Electrical properties of polymer composites prepared by sintering a mixture of carbon black and ultra‐high molecular weight polyethylene powder
EP0908902B1 (de) PTC-Element, Schutzvorrichtung und elektrische Leiterplatte
CN105321639B (zh) 过电流保护元件
EP2592628B1 (de) Leitender verbundstoff mit positivem temperaturkoeffizient des widerstands und überspannungsschutzelement
US5928547A (en) High power current limiting polymer devices for circuit breaker applications
US4769901A (en) Method of making PTC devices
JPH11329076A (ja) 高温度ｐｔｃデバイス及び導電性ポリマ―組成物
WO1996036057A1 (en) Ptc circuit protection device and manufacturing process for same
EP1001436A2 (de) Leitfähige Polymermaterialen für Hochspannungskaltleiter
KR20180022817A (ko) 전도성 폴리머 조성물, 전도성 폴리머 시트, 전기 부품 및 이들의 제조 방법
US5817423A (en) PTC element and process for producing the same
CN102522173A (zh) 电阻正温度效应导电复合材料及过电流保护元件
CN112210176B (zh) 聚偏氟乙烯基导电复合材料及ptc元件
JPH08191003A (ja) Ｐｔｃ抵抗体の製造方法およびそれで製造された抵抗体
ITMI20002695A1 (it) Composizioni di polimero conduttivo contenenti fibre fibrillate e dispositivi
WO1997039461A1 (en) Manufacturing methods for positive temperature coefficient materials
KR20070070092A (ko) Ｐｔｃ 소자
JP3168262B2 (ja) 回路保護装置
US7304562B2 (en) Organic PTC thermistor and production
US9613736B1 (en) Positive temperature coefficient circuit protection chip device
KR100767058B1 (ko) 피티씨 고분자시트-전극 복합체의 제조방법
CN103854815A (zh) 电极组件、高分子ptc热敏电阻器件及其制备方法
JP7657331B2 (ja) 非線形抵抗樹脂材料、非線形抵抗体、過電圧保護装置および非線形抵抗樹脂材料の製造方法
DE19510100A1 (de) Elastisch verformbarer Widerstand und Vorrichtung zum Begrenzen und/oder Schalten von Strom mit einem solchen Widerstand

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 19921127

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE

17Q First examination report despatched

Effective date: 19950425

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LI LU NL SE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 19991117

Ref country code: GR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 19991117

Ref country code: SE

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 19991117

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 19991117

Ref country code: ES

Free format text: THE PATENT HAS BEEN ANNULLED BY A DECISION OF A NATIONAL AUTHORITY

Effective date: 19991117

REF Corresponds to:

Ref document number: 186793

Country of ref document: AT

Date of ref document: 19991215

Kind code of ref document: T

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REF Corresponds to:

Ref document number: 69131787

Country of ref document: DE

Date of ref document: 19991223

ITF It: translation for a ep patent filed
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20000217

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: PATENTANWAELTE SCHAAD, BALASS, MENZL & PARTNER AG

ET Fr: translation filed
NLV1 Nl: lapsed or annulled due to failure to fulfill the requirements of art. 29p and 29m of the patents act
PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20000528

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
REG Reference to a national code

Ref country code: GB

Ref legal event code: IF02

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20060515

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20060524

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20060525

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20060530

Year of fee payment: 16

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: BE

Payment date: 20060711

Year of fee payment: 16

BERE Be: lapsed

Owner name: *ASEA BROWN BOVERI A.B.

Effective date: 20070531

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20070528

Year of fee payment: 17

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20070528

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070531

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070531

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20080131

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20071201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070528

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20070531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20080528