EP0498799A1 - Circuit integrable de sonde de temperature - Google Patents

Circuit integrable de sonde de temperature

Info

Publication number
EP0498799A1
EP0498799A1 EP19900911729 EP90911729A EP0498799A1 EP 0498799 A1 EP0498799 A1 EP 0498799A1 EP 19900911729 EP19900911729 EP 19900911729 EP 90911729 A EP90911729 A EP 90911729A EP 0498799 A1 EP0498799 A1 EP 0498799A1
Authority
EP
European Patent Office
Prior art keywords
node
circuit
fet
temperature sensor
sensor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19900911729
Other languages
German (de)
English (en)
Inventor
Karl-Günther DALSASS
Bedrich Hosticka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19893936773 external-priority patent/DE3936773A1/de
Priority claimed from DE19904001509 external-priority patent/DE4001509C1/de
Application filed by Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Publication of EP0498799A1 publication Critical patent/EP0498799A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
    • G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
    • G05F3/02—Regulating voltage or current
    • G05F3/08—Regulating voltage or current wherein the variable is dc
    • G05F3/10—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics
    • G05F3/16—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices
    • G05F3/20—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices using diode- transistor combinations
    • G05F3/26—Current mirrors
    • G05F3/262—Current mirrors using field-effect transistors only

Definitions

  • the present invention relates to an integrable temperature sensor circuit with a first current mirror circuit and with a second circuit which is complementary to the first current mirror circuit and which is connected to the first current mirror circuit at a first and second node, according to the preamble of patent claim 1.
  • the present invention relates to an integrable temperature sensor circuit with a first, a first and a second FET current mirror circuit and with a second, complementary to the first current mirror circuit, a third and a fourth FET circuit, which with the first current mirror circuit on a first and second Node is connected, with a first resistor, which is connected to a third node of the second circuit and a reference potential node, and with an output terminal, according to the preamble of claim 11.
  • a generic integrable temperature sensor circuit is known from the specialist publication BJ Hosticka, J. Fichtel, G. Zimmer, "Integrated monolithic temperature sensors for acquisition and regulation", Sensors and Actuators, Issue 6 (1984), pages 191 to 200.
  • This known temperature sensor circuit implemented in CMOS technology is connected to the fourth node of the second circuit directly to the reference potential node.
  • One of the two output connections of the known integrable temperature sensor circuit is formed by the fourth node, while the other output connection is the reference potential node.
  • the output voltage of the known integrable temperature sensor circuit is present across its single resistor.
  • the known integrable temperature sensor circuit is operated in such a way that the four field effect transistors are in the weak inversion range.
  • the currents which are used in the known temperature sensor circuit are so low that the field effect transistors are operated in the linear region far below the saturation state.
  • the temperature sensitivity of the known temperature sensor circuit is limited to a value which corresponds to the product of the temperature voltage and the natural logarithm of the channel width-channel length quotients of the field effect transistors used.
  • the sensitivities that can be achieved in the known temperature sensor circuit in the order of magnitude of only about 0.2 mV / ° C. are too low for many applications.
  • a further, integrable temperature sensor circuit is known from this technical publication, which consists of a current mirror circuit and two diodes connected in the current paths of this current mirror circuit. The difference between the voltages falling across the diodes forms the output voltage, the value of which is the temperature voltage multiplied by the natural logarithm of the current mirror ratio and the diode area quotient.
  • This known temperature sensor circuit also has a low sensitivity.
  • the temperature sensor circuits described above have a voltage output signal.
  • Temperature sensor circuits with a current output signal are also known from the prior art. Such a temperature sensor circuit is disclosed in the specialist publication M.P. Timko, "A two-terminal IC temperature transducer", IEEE Journal of Solid-State Circuits SC-11, number 6, Dec. 1976, pages 784 to 788. This known temperature sensor has an output current with a low temperature sensitivity of only about 1 microampere / ° C. Since it is usually necessary to convert a current output signal into a voltage signal, this known temperature sensor circuit requires extremely temperature-stable resistors to be connected externally to the integrated structure of the temperature sensor circuit.
  • the object of the present invention is to develop an integrable temperature sensor circuit of the type mentioned at the outset in such a way that its sensitivity is increased further and that it can be integrated in an even smaller area.
  • an integrable temperature sensor circuit with a first current mirror circuit and with a second circuit which is complementary to the first current mirror circuit and which is connected to the first current mirror circuit at a first and second node, in that the second circuit is connected at a third node to a first series circuit, which has a first resistor and a first diode, and at a fourth node to a second series circuit, which has a second resistor and a second diode.
  • this object is achieved according to a second aspect of the invention in an integrable temperature sensor circuit with a first, a first and a second FET current mirror circuit, with a second, complementary to the first current mirror circuit, a third and a fourth FET circuit, which with the first Current mirror circuit is connected at a first and second node, and has a third and fourth node, with a first resistor connected to a fourth node of the second circuit and a reference potential node, and with an output terminal, solved by providing a second resistor that is connected to a third node and the reference potential node, that the FETs operate in their saturation region and that the output terminal is connected to the first node or to the second node.
  • the first current mirror circuit works as a current source pair, which delivers impressed currents with a specific current ratio, which operates via the second circuit, which is complementary to the first current mirror circuit and, to a first approximation, works as a second current mirror circuit, insofar as the potentials are at third and fourth nodes match, and the first and second resistors are conducted to the first and second diodes, respectively.
  • a temperature-dependent voltage drop arises at these diodes, which not only depends on the temperature, but also on the size of the impressed current and the diode area.
  • the temperature sensor circuit can be implemented with paired components, so that manufacturing differences relating to both paired elements in the same way do not lead to errors in the measuring voltage.
  • the integrable temperature sensor circuit according to the invention works with a sensitivity that is many times higher than the sensitivity of the known temperature sensor circuits.
  • the temperature sensor circuit according to the second aspect of the invention operates in the saturation range of the FETs, the voltage drop caused by the impressed temperature-dependent currents across the resistances becoming one of the magnitude of the impressed currents and the magnitude of the Resistance-dependent voltage difference value between the third and fourth nodes leads, which causes the second feedback circuit to shift the voltage operating points at the first and second nodes.
  • a temperature sensitivity of -7.0 mV / ° C. was measured within the temperature range from 0 ° C. to 100 ° C.
  • the temperature sensitivity of this circuit is thus approximately a factor of 17 above the temperature sensitivity of the temperature sensor circuits according to the prior art.
  • the temperature sensor circuit according to the invention can be implemented as an integrated circuit, the temperature sensitivity of the circuit can be changed directly by external parallel connection of resistors without having to change anything on the integrated circuit.
  • a further advantage of the temperature sensor circuit according to the invention lies in its low area requirement, since in a preferred embodiment it can be implemented on an area of only 0.3 square millimeters, and in its low power consumption, this value being a maximum of 2 mW in a preferred embodiment.
  • the temperature sensor circuit according to the invention can comprise a voltage amplifier circuit comprising a third resistor and a fifth transistor. This is preferably connected to a transistor of the first current mirror circuit as a third current mirror circuit, so that the sensitivity of the temperature sensor circuit according to the invention can be determined by suitable choice of the quotient of the first and third resistor or the quotient of the channel width-channel length ratios of the fifth and the second FET.
  • the transistors of the first current mirror circuit and the fifth transistor are field effect transistors of a first conductivity type, the gates of these transistors being connected to a first node, and the transistors of the second current mirror circuit are field effect transistors of a second conductivity type, the gates of which are connected to the second Nodes are connected.
  • This configuration of the current mirror circuits makes it possible to manufacture the transistors of the first, second and third circuits that belong together with matching pairing properties.
  • the specified structure can be implemented with a small footprint and low power consumption.
  • the temperature sensor circuit according to the invention preferably comprises the operating point setting circuit defined in claim 6.
  • the operating point of these circuits may run out if the operating point is not defined in an area in which it stabilizes itself.
  • the operating point setting circuit which forces the temperature sensor circuit to take the desired operating point, serves this purpose.
  • the circuit dimensioning defined in claim 7 ensures the temperature dependency of the output-side voltage signal of the circuit according to the invention.
  • the dimensioning specified in claim 8 ensures good temperature sensitivity in the preferred case in practice, in which use is made of diodes of the same area.
  • the output voltage of the temperature sensor according to the invention is proportional to the measured temperature, so that the output voltage has no temperature-independent additive terms.
  • the second circuit preferably comprises a third and fourth transistor, the control electrodes of which are both both operatively connected to the first or both to the second node.
  • the transistors are arranged such that the input voltage of these transistors is applied between the first or second node and the third node on the one hand and the fourth node on the other.
  • the first and second FETs are preferably designed as transistors of a first conductivity type, the gates of which are connected to the first node, the third and fourth FETs having a second conductivity type and their gates being connected to the second node.
  • an operating point setting circuit is provided which is connected to the second node and which has a voltage divider and a diode or a transistor connected between the divider node of the same and the second node such that it is only in leads in one direction. Since the circuit structure comprising the first current mirror circuit and the second, complementary circuit is a coupled circuit, the operating points of this circuit may run out, provided the operating point of these circuits does not define an area in which it stabilizes itself . The aforementioned operating point setting circuit is used for this.
  • the dimensioning defined in claim 14 ensures that a temperature-dependent term in the voltage output signal is guaranteed.
  • the third and the fourth FET are both operatively coupled to the first or both to the second node with their gates, the gates Source voltage of these FETs is present between the first or second node and the third node on the one hand and the fourth node on the other hand, so that the desired high temperature sensitivity is achieved with a simple circuit structure.
  • Fig. 1 shows a first embodiment of the invention
  • Fig. 2 shows a second embodiment of the invention
  • the first embodiment of the integrable temperature sensor circuit according to the invention which is designated in its entirety by the reference number 1, comprises a first and a second PMOS-FET M1, M2, each of which has a positive supply on the source side. potential V DD are connected.
  • these FETs M1, M2 are connected to a first node 1, to which the second FET is also connected on the drain side.
  • the first FET is connected to a second node 2 on the drain side.
  • the first and second FET M1, M2 together form a PMOSS current mirror with a current divider ratio, which is defined by the ratio of the channel width-channel length quotients W 1 L 2 / W 2 L 1 of the first and second transistors M1, M2.
  • This current ratio n which indicates the ratio of the first current I to the second current I 2 , is 1.05 in the exemplary embodiment shown.
  • a third and fourth NMOS-FET M3, M4 are connected as a complementary NMOS circuit, the gates of these FETs being connected to the second node, while these FETs M3, M4 are connected on the source side to the third and fourth nodes, so that the input control voltage for these FETs are formed by the gate-source voltage between the second and third or second and fourth nodes of the circuit.
  • the potential at the third node 3 corresponds to that at the fourth node 4, so that the second circuit can also be regarded as a current mirror circuit.
  • the gates of these transistors M3, M4, like the drain of the third FET M3, are connected to the second node, while the drain of the fourth FET M4 is connected to the first node.
  • the third and fourth FET M3, M4 are connected to a third and fourth node 3, 4.
  • a series circuit comprising a first resistor R1 and a first diode D1 arranged in the forward direction, the connection point of which is designated as the fifth node 5.
  • the series circuit consisting of a fifth PMOS-FET M5 and a third resistor R3 lies between a supply potential terminal 10 and the ground potential terminal 0, the connection point of these components forming an output terminal 7, at which an output voltage V ou ⁇ is generated.
  • the fifth FET M5 forms a current mirror with the second FET M2, the current ratio a of which corresponds to the quotient from the fifth current I 5 to the second current I 2 .
  • This current ratio is also defined by the ratio of the channel width to the channel length of the fifth FET in relation to the channel width to the channel length of the second FET.
  • the temperature sensor circuit 1 comprises an operating point setting circuit which is formed from the sixth to ninth transistors M6-M9.
  • the operating point setting circuit comprises a voltage divider M6 - M8, which by the sixth and seventh PMOS-FET M6, M7 and the eighth NMOS-FET are formed, which are connected in series and each as resistors.
  • the eighth node 8 between the seventh FET M7 and the eighth FET M8 is connected to the drain of a ninth NMOS FET connected as a diode, the source of which is connected to the second node.
  • the ninth FET M9 works as a diode which conducts when the potential at the eighth node 8 is higher than that at the second node 2.
  • the operating point setting circuit M6-M9 is only active if the potential at the second node is below an allowable operating point range, in which case the operating point is forced into a range by switching the diode formed by the ninth FET M9 into a range in which the actual temperature sensor circuit M1 - M4 automatically stabilizes at its working point.
  • the resistance values of the resistors R1-R3 are each in kiloohms:
  • the diode areas A1, A2 of the two diodes D1, D2 have the same size and are each 128 ⁇ m 2 .
  • the channel width / channel length ratios Wi / Li of the transistors M1 - M9 are each in ⁇ m:
  • M1 21/20; M2: 20/20; M3: 20/20; M4: 20/20;
  • M5 100/20
  • M6 5/20
  • M7 5/40
  • M8 5/40
  • I 1 (V 1 - V DD - V p ) 2 ;
  • I 1 (V 2 - V 3 - V N ) 2 ;
  • I 2 (V 1 - V DD - V p ) 2 ;
  • I 2 _ (V 2 - V s 2- V N ) 2 ;
  • ⁇ 5 (V 1 - V s2 - V p ) 2 ;
  • V 3 V 2 - V N +
  • V 4 V 2 - V N +
  • V 5 - V 6 U T ⁇ In (n ⁇ m);
  • equation 21 which assumes equal channel lengths L1-L4 of the first to fourth transistors M1-M4, it can be seen that the additive interference term on the right-hand side of the equation drops out if the quotient of the channel widths of the second and fourth transistor is that of the channel widths of the first and third transistors. This requirement is largely met with the dimensions specified above.
  • a sensitivity of 9.5 mV / ° C was measured in a temperature range from -25 ° C to 100 ° C.
  • This circuit sensitivity corresponds to a sensitivity improvement by a factor of 23 compared to the prior art recognized at the outset. It is obvious that the sensitivity increases further can, if this is desired, by selecting a higher value of the third resistor R3, if this should be necessary in the event that the temperature sensor circuit according to the invention is to be used for measurements only within small temperature ranges.
  • the circuit is implemented on an area of 0.7 mm 2 and shows a maximum power consumption of 8 mW.
  • the temperature sensitivity in the circuit according to the invention can be set by connecting resistors in parallel at the terminals 0.7, without this requiring any intervention in the integrated circuit.
  • the operating point setting circuit can have two resistors connected in series between the positive supply voltage potential V DD and the negative supply voltage potential V SS instead of the sixth to eighth field effect transistor, to the common eighth node of which the anode of a diode can be connected, which ninth field effect transistor M9 replaced.
  • the current mirror circuits which are formed by the first and second, the third and fourth or the first and fifth transistor, can be implemented in bipolar technology.
  • the second embodiment of the integrable temperature sensor circuit according to the invention which is designated in its entirety by the reference symbol 1 ', comprises a first and a second PMOS-FET M1', M2 ', which are each connected on the source side to a positive supply potential V DD '.
  • these FETs M1 ', M2' are connected to a first node 1 ', to which the second FET is also connected on the drain side.
  • the first FET is connected on the drain side to a second node 2 '.
  • the first and second FET M1 ', M2' together form a PMOSS current mirror with a current divider ratio, which is defined by the ratio of the channel width-channel length quotients W1L2 / W2L1 of the first and second transistor M1 ', M2'.
  • This current ratio n ' which indicates the ratio of the first current I 1 ' to the second current I 2 ', is 1.05 in the exemplary embodiment shown.
  • a third and fourth NMOS-FET M3 ', M4' are connected as a complementary NMOS circuit, the gates of these FETs being connected to the second node 2 ', while these FETs M3', M4 'are connected on the source side to the third and fourth nodes 3 ', 4' are connected, so that the input control voltage for these FETs are formed by the gate-source voltage between the second and third or second and fourth nodes of the circuit.
  • the gates of these transistors M3 ', M4' are connected to the second node, while the drain of the fourth FET M4' is connected to the first node.
  • the third and fourth FET M3 ', M4' are located at a third and fourth node 3 ', 4', respectively.
  • a ground terminal 7' to which a negative supply potential V SS 'is present, there is a first resistor R1'.
  • a second resistor R2 ' lies between the fourth node 4' and the ground terminal 7 '.
  • An output terminal 5 ' is connected to the first node 1', at which an output potential V OUT 'is generated which defines an output voltage in relation to the negative supply potential V SS '.
  • the temperature sensor circuit 1 ' comprises a work point setting circuit, which is formed from the fifth to eighth transistor M5 '- M8'.
  • the operating point setting circuit comprises a voltage divider M5 '- M7', which is formed by the fifth and sixth PMOS-FET M5 ', M6' and the seventh NMOS-FET M7 ', which are connected in series and in each case as resistors.
  • the sixth node 6 'between the sixth FET M6' and the seventh FET M7 ' is connected to the drain of an eighth NMOS FET, the source of which is connected to the second node.
  • the eighth FET M8 ' functions as a semiconducting element that conducts when the potential at the sixth node 6' is higher than that at the second node 2 '.
  • the operating point setting circuit M5 '- M8' is only active when the potential at the second node is below a permissible operating point range, in which case the operating point is forced into a range in which the actual temperature sensor circuit M1 'is forced by switching the eighth FET M8'. - M4 'automatically stabilizes at its working point.
  • the resistance values of the resistors R1 ', R2' are each in kiloohms:
  • the channel width / channel length ratios Wi / Li of the transistors M1 '- M8' are each in micrometers:
  • the channel width-channel length ratios of the first and second FET M1 ', M2', which form the first current mirror circuit, are selected so that the currents flowing to the first and second nodes 1 ', 2' essentially coincide with each other.
  • the slight deviation provided in the preferred exemplary embodiment results from the requirement of the unequal quotients of the ratios of the channel width to the channel length of the second to the fourth or the first to the third FET.
  • the operating point setting circuit can have two resistors connected in series between the positive supply potential V DD 'and the seventh terminal instead of the fifth to seventh field effect transistor, to whose common sixth node the anode of a diode can be connected, which is the eighth field effect transistor M8 'replaced.
  • resistors can be connected to the fifth and seventh terminals 5 ', T in order to adapt the temperature sensitivity of the temperature sensor circuit formed by the integrated circuit to a desired application.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Electromagnetism (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

Un circuit intégrable de sonde de température (1; 1') comporte un premier circuit à niveau de courant (M1, M2; M1', M2') et un deuxième circuit (M3, M4; M3', M4') complémentaire du premier. Pour accroître la sensibilité thermique du circuit de la sonde de température, dans une première forme d'exécution de ce circuit on monte en série par rapport au deuxième circuit (M3, M4) un premier et deuxième circuit en série comportant chacun une résistance (R1, R2) et une diode (D1, D2). Un circuit intégrable de sonde de température contient un premier circuit à niveau de courant qui comporte un premier et un deuxième transistor à effet de champ, un deuxième circuit, complémentaire du circuit à niveau de courant, qui comporte un troisième et un quatrième transistor à effet de champ et qui est relié au premier circuit à mémoire de courant au niveau d'un premier et d'un deuxième noeud. Pour accroître la sensibilité thermique du circuit intégrable de sonde de température en conservant au circuit une structure simple, une deuxième forme d'exécution de ce circuit prévoit une première résistance (R2') entre un noeud du deuxième circuit (M3', M4') et un noeud du potentiel de référence (Vss') ainsi qu'une connexion de sortie et une deuxième résistance (R1') reliée à un autre noeud du deuxième circuit complémentaire (M3', M4') et au noeud du potentiel de référence (VSS'), les transistors à effet de champ (M1', M2') du premier circuit à niveau de courant et ceux (M3', M4') du second circuit complémentaire étant mis en oeuvre dans leur domaine de saturation et la connexion de sortie (VOUT') du circuit de la sonde de température étant reliée activement au premier ou au deuxième noeud (1', 2').
EP19900911729 1989-11-04 1990-08-06 Circuit integrable de sonde de temperature Withdrawn EP0498799A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE19893936773 DE3936773A1 (de) 1989-11-04 1989-11-04 Integrierbare temperatursensorschaltung
DE3936773 1989-11-04
DE4001509 1990-01-19
DE19904001509 DE4001509C1 (en) 1990-01-19 1990-01-19 Integratable temp. sensor circuit - has circuit complementary to current mirror circuit contg. two FETs with reference potential node

Publications (1)

Publication Number Publication Date
EP0498799A1 true EP0498799A1 (fr) 1992-08-19

Family

ID=25886756

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19900911729 Withdrawn EP0498799A1 (fr) 1989-11-04 1990-08-06 Circuit integrable de sonde de temperature

Country Status (2)

Country Link
EP (1) EP0498799A1 (fr)
WO (1) WO1991006839A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847319B1 (en) 2003-07-22 2005-01-25 Standard Microsystems Corporation Temperature-to-digital converter
US7030793B2 (en) 2004-02-18 2006-04-18 Standard Microsystems Corporation Accurate testing of temperature measurement unit
US7193543B1 (en) 2005-09-02 2007-03-20 Standard Microsystems Corporation Conversion clock randomization for EMI immunity in temperature sensors
US7281846B2 (en) 2004-08-23 2007-10-16 Standard Microsystems Corporation Integrated resistance cancellation in temperature measurement systems
US7429129B2 (en) 2005-02-28 2008-09-30 Standard Microsystems Corporation Proportional settling time adjustment for diode voltage and temperature measurements dependent on forced level current
US7622903B2 (en) 2005-09-02 2009-11-24 Standard Microsystems Corporation EMI rejection for temperature sensing diodes

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Publication number Priority date Publication date Assignee Title
GB9206058D0 (en) * 1992-03-20 1992-05-06 Philips Electronics Uk Ltd A semiconductor switch and a temperature sensing circuit for such a switch
US5422832A (en) * 1993-12-22 1995-06-06 Advanced Micro Devices Variable thermal sensor
EP0735351B1 (fr) * 1995-03-29 2002-06-05 Infineon Technologies AG Montage de circuit pour détecter la température d'un élément semi-conducteur de puissance
US7084695B2 (en) 2004-08-31 2006-08-01 Micron Technology, Inc. Method and apparatus for low voltage temperature sensing

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DE2644597C2 (de) * 1976-10-02 1984-08-30 Philips Patentverwaltung Gmbh, 2000 Hamburg Temperaturfühler in einer integrierten Halbleiterschaltung
JPS57148221A (en) * 1981-03-10 1982-09-13 Citizen Watch Co Ltd Temperature detecting device
FR2627027A1 (fr) * 1988-02-04 1989-08-11 Sgs Thomson Microelectronics Detecteur de surcharge thermique dans un circuit integre

Non-Patent Citations (1)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847319B1 (en) 2003-07-22 2005-01-25 Standard Microsystems Corporation Temperature-to-digital converter
US7030793B2 (en) 2004-02-18 2006-04-18 Standard Microsystems Corporation Accurate testing of temperature measurement unit
US7281846B2 (en) 2004-08-23 2007-10-16 Standard Microsystems Corporation Integrated resistance cancellation in temperature measurement systems
US7429129B2 (en) 2005-02-28 2008-09-30 Standard Microsystems Corporation Proportional settling time adjustment for diode voltage and temperature measurements dependent on forced level current
US8696199B2 (en) 2005-02-28 2014-04-15 Standard Microsystems Corporation Proportional settling time adjustment for diode voltage and temperature measurements dependent on forced level current
US7193543B1 (en) 2005-09-02 2007-03-20 Standard Microsystems Corporation Conversion clock randomization for EMI immunity in temperature sensors
US7622903B2 (en) 2005-09-02 2009-11-24 Standard Microsystems Corporation EMI rejection for temperature sensing diodes

Also Published As

Publication number Publication date
WO1991006839A1 (fr) 1991-05-16

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