EP0383972B1 - Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication - Google Patents

Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication Download PDF

Info

Publication number
EP0383972B1
EP0383972B1 EP89103112A EP89103112A EP0383972B1 EP 0383972 B1 EP0383972 B1 EP 0383972B1 EP 89103112 A EP89103112 A EP 89103112A EP 89103112 A EP89103112 A EP 89103112A EP 0383972 B1 EP0383972 B1 EP 0383972B1
Authority
EP
European Patent Office
Prior art keywords
laser light
laser
electrode
ceramic
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP89103112A
Other languages
German (de)
English (en)
Other versions
EP0383972A1 (fr
Inventor
Hans Dr. Rer Nat. Kaarmann
Wolfram Dipl.-Phys. Wersing
Martina Dipl.-Phys. Vogt
Reinhard Dr.-Ing. Lerch
Karl Dr. Dipl.-Phys. Lubitz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to AT89103112T priority Critical patent/ATE98530T1/de
Priority to DE89103112T priority patent/DE58906448D1/de
Priority to EP89103112A priority patent/EP0383972B1/fr
Priority to JP2039535A priority patent/JP2960093B2/ja
Priority to US07/484,352 priority patent/US5045746A/en
Publication of EP0383972A1 publication Critical patent/EP0383972A1/fr
Priority to US08/116,800 priority patent/USRE35011E/en
Application granted granted Critical
Publication of EP0383972B1 publication Critical patent/EP0383972B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0648—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Definitions

  • the invention relates to an ultrasound array with a number of adjacent oscillator elements, which are coated with electrode material on a first and second electrode surface, which are opposite one another, all oscillator elements being arranged with their second electrode surface in a base surface, which oscillation elements are a first and have a second boundary surface, which lie opposite one another and are aligned non-parallel to one another, and which oscillator elements are aligned such that their cross section changes in the same way from the first electrode surface to the second electrode surface.
  • the invention also relates to a method for producing such an array.
  • An ultrasound array of the type mentioned at the outset is from PATENT ABSTRACTS OF JAPAN, Vol. 6, No. 132 (E-119) (1010), July 17, 1982 & JP-A-57-58 498.
  • the oscillating elements forming an array are trapezoidal and are lined up with alternating polarity directions so that they form an arc.
  • the reception sensitivity is increased by the same shape, but different polarization direction of the oscillating elements.
  • the arcuate arrangement of the vibrating elements allows sector scanning by means of continuous activation of the vibrating elements, the receiving surface being arranged on the outer side of the arc.
  • the converter elements cannot be arranged in such a way that they have a maximum possible opening angle or acceptance angle, which is a prerequisite for the construction of a phased array.
  • FIG 5 of DE-C-28 29 570 Another ultrasound array is known from FIG 5 of DE-C-28 29 570.
  • This is an ultrasound array which has a number of ultrasound transducer or oscillating elements of a trapezoidal cross section lying next to one another on a carrier or damping body.
  • the first and second electrode surfaces, which are covered with electrode material and lie opposite one another in parallel, are each rectangular. Two flat boundary surfaces run towards each other in a wedge shape.
  • two types of vibrating elements are used alternately side by side: those in which the first electrode area serving as the radiation area is larger than the second electrode area facing the damping body or arranged in a base area, and those in which, conversely, the first electrode area serving as the radiation area Electrode area is smaller than the second electrode area parallel to it.
  • an ultrasound array in particular one with fine division of the individual transducer elements, can be used in a sawing technique, e.g. B. by means of a laser cutting beam.
  • Such an ultrasound array is not suitable as a phased-array applicator, since the two types of oscillating element that are adjacent to each other have different radiation characteristics.
  • the width of the radiation area of each vibrating element must be less than or equal to ⁇ / 2, where ⁇ is the wavelength of the ultrasound emitted in the propagation medium. This condition cannot be met or can only be met incompletely in an ultrasound array with two different types of vibrating elements.
  • the invention is therefore based on the requirement that only identical oscillator elements should be used in an ultrasound array used as a phased array applicator.
  • the older German patent application P DE-A-37 39 226 states that acoustic cross-couplings between the individual ultrasonic transducers of an ultrasonic transducer array can be reduced if the second electrode base surfaces facing the carrier body are larger than their end faces or first electrode surfaces facing away from the carrier body.
  • ultrasound transducers are thus produced, the cross-sectional area of which runs parallel to the longitudinal direction of the array and has the shape of an isosceles trapezoid.
  • the opposite side surfaces of the parting lines located between the ultrasonic transducers are then no longer parallel and the cross-sectional area of the parting line then has a trapezoidal shape.
  • Such separating joints with a trapezoidal cross section can be produced, for example, by means of two saw cuts inclined at an acute angle to one another.
  • the angle of attack of the saw blade is limited relative to the end face of the array.
  • exact bevel cuts can only be achieved with great technical effort.
  • the invention has set itself the goal of specifying an ultrasound array constructed from individual oscillator elements, which enables the generation of short ultrasound pulses with a center frequency in the range from 1 to 50 MHz with a high bandwidth.
  • the vibrating elements which consist of a piezoelectric ceramic material covered on both sides with electrode material, are intended to work as thickness transducers.
  • the directional diagrams of the individual oscillator elements, namely all of the oscillator elements, should have the largest possible opening angle so that the ultrasound array can be used as a linear phased array antenna which is used to scan (scan) acoustically transparent media with the aid of ultrasound pulses , preferably for Ultrasound examination of patients.
  • the individual vibrating elements should have high transmission and reception transmission factors.
  • the invention is therefore based on the object of specifying an ultrasound array of the type mentioned at the outset, which can be used as a phased array antenna for scanning acoustically transparent media. Furthermore, a method for the production of such an ultrasound array and a device for the production are to be specified.
  • the first-mentioned object is achieved according to the invention with the characterizing features of claim 1 for AT, CH, GB, FR, LI and NL.
  • All similar vibrating elements with non-parallel boundary surfaces are used. All transducer elements thus have the same directional characteristic and - with a suitable dimensioning - all the same opening angle of a suitable size.
  • the arrangement is such that the first electrode area facing the radiation area of the oscillating elements is smaller than the second electrode area facing the damping body.
  • the method for producing such an ultrasound array is based on a method in which a piezoelectric material is irradiated with a laser cutting beam on lines spaced in parallel.
  • the second object is achieved on the basis of this method according to the invention (claim 1 for DE and claim 7 for AT, CH, GB, FR, LI and NL.) That a piezoelectric ceramic on only one side with converging laser light on the parallel spaced lines is irradiated such that in the Ceramic incisions next to each other with non-parallel walls are created.
  • a device for carrying out the method contains a laser, the laser beam of which can be directed onto a piezoelectric material.
  • a focusing device is arranged between the piezoelectric material and the laser and generates a converging laser light cutting beam on the piezoelectric material.
  • an ultrasound array 2 suitable as a phased array for medical purposes contains a number of juxtaposed vibrating elements 4.
  • the core of each vibrating element 4 is a piezoelectric material 6, in particular a piezoceramic such as, for. B. of the PZT-5 type, the opposite to each other in parallel first and second electrode surfaces are covered with an electrode material 8 and 10, respectively.
  • All (non-cuboid) vibrating elements 4 are the same and are aligned so that their cross-section changes continuously in the direction from the first to the second electrode surface 8 or 10 in the same way, here the first electrode surface 8 is smaller than the second electrode surface 10.
  • All Vibrator elements are arranged with their second electrode surface 10 in a base surface.
  • oscillator elements 4 with mutually opposite, non-parallel first and second boundary surfaces 12 and 14 in the transverse direction x are used.
  • the third and fourth boundary surfaces in the longitudinal direction y of each oscillating element 4, which are designated 16 and 18 in FIG. 1, are preferably non-parallel to one another.
  • the respective longitudinal section may also be trapezoidal.
  • the individual vibrating elements 4 are located on a common damping body 20, the surface of which represents the base area in which the second electrode surfaces 10 of the vibrating elements 4 are arranged. This can be known from a particle-filled plastic, the z. B. based on epoxy or polyurethane exist.
  • the individual vibrating elements 4 with essentially smooth boundary surfaces 12, 14 are separated from one another by V-shaped gaps or incisions 22. It is noteworthy that the V-shaped incisions 22 each extend into the damping body 20 in the present embodiment.
  • Each oscillating element 4 is provided with a coupling layer 24 on the radiation side. It should therefore be emphasized that in the present embodiment, a common coupling layer covering all oscillator elements 4 is not used.
  • the individual coupling layers 24 are also separated from one another by the V-shaped gap 22. This ensures good acoustic decoupling.
  • the incision 22 common to all layers 24, 8, 6, 10 and 20 is produced in one operation in each case during the production of the ultrasound array 2.
  • the ultrasonic radiation area on each coupling layer 24 is designated by 26.
  • the first electrode surface 8 facing the radiation surface of the oscillating elements 4 is smaller than the effective second electrode surface 10 facing the damping layer 20.
  • the wedge angle was 2.5 °
  • the thickness t of the individual vibrating element 4 t 0.4 mm
  • the length l 12 mm
  • the width w u 0.2 mm.
  • the thickness t to be used depends on the piezo material and the width w u on the medium in which the ultrasound propagates after coupling.
  • the width w u should be less than or equal to ⁇ / 2, where ⁇ is the wavelength.
  • the thickness t and the width w u should differ by a factor of 2 or larger. In the present case, a factor of almost exactly 2 was chosen for the dimensioning.
  • Fig. 2 In the reduced side view of Fig. 2 is shown schematically that the radiation-side first electrode 8 is bent sideways on both edges and electrically from the edges via a ground line 28 to a common point 30, z. B. to a grounded terminal 32, is performed.
  • the rear second electrode 10 has a center tap which is connected to a further connection 36 via a line 34.
  • Vibrating elements 4 with non-parallel boundary surfaces 12, 14 and / or 16, 18 can only be produced with great difficulty with the usual machining methods (mechanical sawing or cut-off grinding). Therefore, this problem is solved in the present case by using a device with laser sawing technology ("laser saw”).
  • laser saw a device with laser sawing technology
  • different types of lasers can be used for this, such as. B. Argon ion and Nd-YAG lasers.
  • the prepared layer package 40 consististing of layers 24, 8, 6, 10, 20 with piezoceramic 6
  • the ceramic 6 is principally transparent to the light from the abovementioned lasers, the absorption of the laser radiation takes place only on the basis of nonlinear effects. This means that the cut surfaces do not become very smooth and 22 beads are formed on the edges.
  • an excimer laser 42 is therefore used to avoid overheating and to achieve smooth surfaces, the light in the ultraviolet range of which is directly absorbed by the piezoceramic 6 in the layer package 40.
  • the radiation 44 emerging from the laser 42 is focused with a focusing device 46, which generates a point focus 48, that is, preferably with a converging lens, and is irradiated onto the location of the ceramic 6 in the package 40 that is to be removed.
  • the desired V-shape of the incisions 22 and thus the trapezoidal shape of the vibrating elements 4 can be selected by the focusing device 46.
  • the incisions 22 now result from a relative movement of the piezoelectric ceramic 6 and the laser light with the point focus 48 during the irradiation.
  • the layer package 40 is moved to produce the incisions 22.
  • the layer package 40 is mounted on a holder 50 which is moved in the direction of arrow 52.
  • the device according to FIG. 5 is constructed similarly to the device according to FIG. 4.
  • the focusing device 46 here consists of a cylindrical lens which converges the laser light 44 to a line focus 54 which has the length of the incision 22.
  • the relative movement which is indicated by the arrow 52 in FIG. 4, can be avoided.
  • the distance of the incisions (22, ie the width w of the oscillating elements 4) is set in FIGS. 4 and 5 by appropriate mechanical (stepwise) advancement of the package 40 transversely to the main beam direction s of the laser beam moved in the direction of arrow 56.
  • FIG. 6 A further device for producing V-shaped incisions is shown in FIG. 6.
  • the radiation 44 emerging from the laser 42 is broadened via the beam expansion device 58, so that the expanded laser beam 59 irradiates the entire array area.
  • the laser beam 59 then passes through a mask 60 which is provided with slots 62.
  • the arrangement of the slots 62 represents an image of the incisions 22 lying next to one another in the ceramic 6.
  • This mask 60 is imaged on the surface of the layer package 40 with the focusing device 46, which now represents an imaging system, so that the expanded laser beam 59 likewise Many line foci are generated at the same time as incisions 22 are to be made in the ceramic 6.
  • the device according to FIG. 6 thus allows all incisions 22 in the ultrasound array 2, which are spaced apart in parallel, to be produced in one operation.
  • the depth of cut of the incisions 22 is set by the number of laser pulses. This is possible with very high repeatability.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Claims (15)

  1. Procédé pour fabriquer un réseau à ultrasons comportant un certain nombre d'éléments oscillateurs (4) disposés côte-à-côte, selon lequel on expose un matériau piézoélectrique à un faisceau laser de coupe le long de traits parallèles, caractérisé par le fait qu'on expose une céramique piézoélectrique (6), uniquement sur une face, avec une lumière laser convergente (44), sur des lignes parallèles de manière à former, dans la céramique (6), des encoches (22) disposées côte-à-côte et à parois (12,14; 16,18) non parallèles, ainsi que les éléments oscillateurs.
  2. Procédé suivant la revendication 1, caractérisé que la lumière laser (44) converge en un foyer (48) et que l'encoche (22) est formée sous l'effet d'un déplacement relatif entre la céramique piézoélectrique (6) et la lumière laser, pendant l'exposition.
  3. Procédé suivant la revendication 1, caractérisé par le fait que la lumière laser (44) converge en un foyer en forme de trait (54), qui possède la longueur de l'encoche (22).
  4. Procédé suivant la revendication 2 ou 3, caractérisé par le fait qu'après chaque exposition, on déplace la céramique (6) d'un pas transversalement par rapport à la direction de rayonnement principale (s).
  5. Procédé suivant la revendication 3 ou 4, caractérisé par le fait que pour la production de la lumière laser, qui converge au foyer en forme de trait (47), il est prévu un laser (42), dont le faisceau (44) est dévié sur une lentille cylindrique.
  6. Procédé suivant la revendication 1, caractérisé par le fait que la lumière laser (44) est déviée au moyen d'un masque (60), qui comporte des fentes (62), la disposition des fentes (62) étant une reproduction des encoches (22) disposées côte-à-côte dans la céramique (6), et que pendant l'exposition, l'image de ce masque (60) est formée sur la céramique (6) de sorte que l'on obtient des encoches (22) disposées côte-à-côte.
  7. Procédé suivant l'une des revendications 1 à 6, caractérisé par le fait que plusieurs impulsions de lumière laser sont projetées dans la céramique (6) sur chacune des lignes parallèles.
  8. Procédé suivant l'une des revendications 1 à 7, caractérisé par le fait que pour la production de la lumière laser, il est prévu un laser (42), dont la lumière laser (44) est située dans le domaine ultraviolet.
  9. Procédé suivant la revendication, caractérisé par le fait que le laser (42) est un laser excimère, dont la lumière laser (44) est absorbée par la céramique piézoélectrique (6).
EP89103112A 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication Expired - Lifetime EP0383972B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT89103112T ATE98530T1 (de) 1989-02-22 1989-02-22 Ultraschall-array mit trapezfoermigen schwingerelementen sowie verfahren und vorrichtung zu seiner herstellung.
DE89103112T DE58906448D1 (de) 1989-02-22 1989-02-22 Ultraschall-Array mit trapezförmigen Schwingerelementen sowie Verfahren und Vorrichtung zu seiner Herstellung.
EP89103112A EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication
JP2039535A JP2960093B2 (ja) 1989-02-22 1990-02-19 超音波アレー及びその加工方法と装置
US07/484,352 US5045746A (en) 1989-02-22 1990-02-22 Ultrasound array having trapezoidal oscillator elements and a method and apparatus for the manufacture thereof
US08/116,800 USRE35011E (en) 1989-02-22 1993-09-03 Ultrasound array having trapezoidal oscillator elements and a method and apparatus for the manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP89103112A EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication

Publications (2)

Publication Number Publication Date
EP0383972A1 EP0383972A1 (fr) 1990-08-29
EP0383972B1 true EP0383972B1 (fr) 1993-12-15

Family

ID=8200994

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89103112A Expired - Lifetime EP0383972B1 (fr) 1989-02-22 1989-02-22 Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication

Country Status (5)

Country Link
US (2) US5045746A (fr)
EP (1) EP0383972B1 (fr)
JP (1) JP2960093B2 (fr)
AT (1) ATE98530T1 (fr)
DE (1) DE58906448D1 (fr)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0462311B1 (fr) * 1990-06-21 1995-04-05 Siemens Aktiengesellschaft Transducteur ultrason composite et procédé de fabrication d'un élément structurel d'une céramique piézoélectrique
US5329202A (en) * 1991-11-22 1994-07-12 Advanced Imaging Systems Large area ultrasonic transducer
US5329496A (en) * 1992-10-16 1994-07-12 Duke University Two-dimensional array ultrasonic transducers
US5311095A (en) * 1992-05-14 1994-05-10 Duke University Ultrasonic transducer array
US5744898A (en) * 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
US5281887A (en) * 1992-06-15 1994-01-25 Engle Craig D Two independent spatial variable degree of freedom wavefront modulator
US5282005A (en) * 1993-01-13 1994-01-25 Xerox Corporation Cross process vibrational mode suppression in high frequency vibratory energy producing devices for electrophotographic imaging
US5410208A (en) * 1993-04-12 1995-04-25 Acuson Corporation Ultrasound transducers with reduced sidelobes and method for manufacture thereof
US5460181A (en) * 1994-10-06 1995-10-24 Hewlett Packard Co. Ultrasonic transducer for three dimensional imaging
US5434827A (en) * 1993-06-15 1995-07-18 Hewlett-Packard Company Matching layer for front acoustic impedance matching of clinical ultrasonic tranducers
US5371717A (en) * 1993-06-15 1994-12-06 Hewlett-Packard Company Microgrooves for apodization and focussing of wideband clinical ultrasonic transducers
US5423319A (en) * 1994-06-15 1995-06-13 Hewlett-Packard Company Integrated impedance matching layer to acoustic boundary problems for clinical ultrasonic transducers
US5493541A (en) * 1994-12-30 1996-02-20 General Electric Company Ultrasonic transducer array having laser-drilled vias for electrical connection of electrodes
US5644085A (en) * 1995-04-03 1997-07-01 General Electric Company High density integrated ultrasonic phased array transducer and a method for making
EP0777913B1 (fr) * 1995-06-27 1999-08-25 Koninklijke Philips Electronics N.V. Procede de fabrication de composants electroniques multicouches
US5698928A (en) * 1995-08-17 1997-12-16 Motorola, Inc. Thin film piezoelectric arrays with enhanced coupling and fabrication methods
US5855049A (en) * 1996-10-28 1999-01-05 Microsound Systems, Inc. Method of producing an ultrasound transducer
JP2927286B1 (ja) * 1998-02-05 1999-07-28 日本電気株式会社 圧電アクチュエータ及びその製造方法
DE19833213C2 (de) * 1998-07-23 2002-11-07 Siemens Ag Ultraschall-Sendeanordnung
DE60045022D1 (de) * 1999-01-22 2010-11-11 Canon Kk Piezoelektrische dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf
US6894425B1 (en) * 1999-03-31 2005-05-17 Koninklijke Philips Electronics N.V. Two-dimensional ultrasound phased array transducer
US6390985B1 (en) * 1999-07-21 2002-05-21 Scimed Life Systems, Inc. Impedance matching transducers
US7105985B2 (en) * 2001-04-23 2006-09-12 Product Systems Incorporated Megasonic transducer with focused energy resonator
JP3485904B2 (ja) * 2001-04-24 2004-01-13 松下電器産業株式会社 音響変換器
JP3883823B2 (ja) * 2001-06-19 2007-02-21 日本電波工業株式会社 マトリクス型の超音波探触子及びその製造方法
US7309948B2 (en) * 2001-12-05 2007-12-18 Fujifilm Corporation Ultrasonic transducer and method of manufacturing the same
US20070222339A1 (en) * 2004-04-20 2007-09-27 Mark Lukacs Arrayed ultrasonic transducer
US7230368B2 (en) * 2004-04-20 2007-06-12 Visualsonics Inc. Arrayed ultrasonic transducer
US20060100522A1 (en) * 2004-11-08 2006-05-11 Scimed Life Systems, Inc. Piezocomposite transducers
JP4619845B2 (ja) * 2005-03-25 2011-01-26 株式会社東芝 超音波プローブ及び超音波診断装置
US20070046149A1 (en) * 2005-08-23 2007-03-01 Zipparo Michael J Ultrasound probe transducer assembly and production method
EP1952175B1 (fr) 2005-11-02 2013-01-09 Visualsonics, Inc. Formateur de faisceaux digital pour un système ultrasonore à réseau de transducteurs
US7622848B2 (en) * 2006-01-06 2009-11-24 General Electric Company Transducer assembly with z-axis interconnect
WO2008016599A2 (fr) * 2006-08-02 2008-02-07 Cts Corporation Élément piézoelectrique dont la capacité électrique a été ajustée par découpage laser et procédé de fabrication de celui-ci
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
WO2010031192A1 (fr) 2008-09-18 2010-03-25 Visualsonics Inc. Procédés de fabrication de transducteurs ultrasoniques et d’autres composants
JP5511202B2 (ja) * 2009-03-09 2014-06-04 キヤノン株式会社 圧電体素子、それを用いた液体吐出ヘッド及び記録装置
US8345511B1 (en) * 2010-03-15 2013-01-01 The United States Of America As Represented By The Secretary Of The Navy Blazed array for broadband transmission/reception
JP6052233B2 (ja) * 2014-05-26 2016-12-27 Tdk株式会社 積層型圧電素子
US11417309B2 (en) * 2018-11-29 2022-08-16 Ascent Venture, Llc. Ultrasonic transducer with via formed in piezoelectric element and method of fabricating an ultrasonic transducer including milling a piezoelectric substrate

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB595154A (en) * 1941-04-03 1947-11-27 Submarine Signal Co Improvements in or relating to piezoelectric vibrators
US2716708A (en) * 1950-11-17 1955-08-30 Nat Res Dev Apparatus for launching ultrasonic waves
US2833999A (en) * 1953-09-28 1958-05-06 Douglas H Howry Transducer
US3059130A (en) * 1957-10-03 1962-10-16 United Insulator Company Ltd Electromechanical transducers
DE2829570C2 (de) * 1978-07-05 1979-12-20 Siemens Ag, 1000 Berlin Und 8000 Muenchen Ultraschallkopf
US4211948A (en) * 1978-11-08 1980-07-08 General Electric Company Front surface matched piezoelectric ultrasonic transducer array with wide field of view
US4211949A (en) * 1978-11-08 1980-07-08 General Electric Company Wear plate for piezoelectric ultrasonic transducer arrays
JPS5927560B2 (ja) * 1980-09-26 1984-07-06 株式会社日立製作所 圧電セラミック振動子による超音波送受波器の製造方法
JPS57113700A (en) * 1980-12-30 1982-07-15 Nippon Dempa Kogyo Co Ltd Array type ultrasonic wave probe and its manufacture
JPS57148247A (en) * 1981-03-09 1982-09-13 Matsushita Electric Ind Co Ltd Manufacture of ultrasonic probing contact
US4604542A (en) * 1984-07-25 1986-08-05 Gould Inc. Broadband radial vibrator transducer with multiple resonant frequencies
US4825116A (en) * 1987-05-07 1989-04-25 Yokogawa Electric Corporation Transmitter-receiver of ultrasonic distance measuring device
DE3739226A1 (de) * 1987-11-19 1989-06-01 Siemens Ag Verfahren zur herstellung eines ultraschallwandler-arrays

Also Published As

Publication number Publication date
USRE35011E (en) 1995-08-08
EP0383972A1 (fr) 1990-08-29
JPH02246700A (ja) 1990-10-02
ATE98530T1 (de) 1994-01-15
US5045746A (en) 1991-09-03
DE58906448D1 (de) 1994-01-27
JP2960093B2 (ja) 1999-10-06

Similar Documents

Publication Publication Date Title
EP0383972B1 (fr) Transducteur ultrasonore à éléments de vibration trapézoidaux, et procédé et dispositif pour leur fabrication
DE4438672C2 (de) Ultraschallabbildungssystem mit phasengesteuertem Array und dynamischer Höhenfokussierung
DE68924057T2 (de) Anordnung von Ultraschallwandlern.
DE102004024643B4 (de) Werkstückteilungsverfahren unter Verwendung eines Laserstrahls
EP0041664B1 (fr) Procédé de fabrication d'un agencement d'un transducteur ultrasonique
DE102004029093B4 (de) Halbleiterwafer-Unterteilungsverfahren unter Verwendung eines Laserstrahls
DE3437862C2 (fr)
EP0025092B1 (fr) Transducteur ultrasonore et procédé pour sa fabrication
DE69710314T2 (de) Schallwandler mit mehreren elementen und gemeinsamer massenelektrode
DE3214789A1 (de) Dynamisch fokussierender ultraschallwandler
DE3733776A1 (de) Ultraschallsonde
DE2440718C2 (de) Anordnung für akustische Oberflächenwellen und Verfahren zur Herstellung einer derartigen Anordnung
DE3826414A1 (de) Ultraschall-therapiegeraet
DE68918372T2 (de) Piezoelektrischer Wandler zur Volumenwellenerregung.
DE10197068T5 (de) Multidimensionales Feld und dessen Herstellung
DE3116426A1 (de) "strahlablenkeinrichtung"
DE68925100T2 (de) Stosswellenerzeuger, der mit fokussierten Stosswellen in einem grossen Feld Konkremente zertrümmert
EP0308899A2 (fr) Transducteur à ultrasons avec une caractéristique d'émission et réception astigmatique
DE2742492C3 (de) Ultraschallwandler
DE4236255C2 (de) Akustische Linse
DE602004010097T2 (de) Piezoelektrische kompositmaterialien und herstellungsverfahren dafür
DE4321949C2 (de) Vibratoreinheit
DE68917149T2 (de) Ultraschallwandler, bestehend aus mindestens einer reihe von ultraschallelementen.
DE2451624C2 (de) Verfahren zum Verändern der Phasengeschwindigkeit von elastischen Oberflächenwellen in einem kristallinen Substrat durch Ionenimplantation
DE2719119A1 (de) Fokussierter schallkopf mit schwinger und schallinse fuer untersuchungen mit ultraschall

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT CH DE FR GB LI NL

17P Request for examination filed

Effective date: 19900919

17Q First examination report despatched

Effective date: 19921120

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT CH DE FR GB LI NL

REF Corresponds to:

Ref document number: 98530

Country of ref document: AT

Date of ref document: 19940115

Kind code of ref document: T

REF Corresponds to:

Ref document number: 58906448

Country of ref document: DE

Date of ref document: 19940127

ET Fr: translation filed
GBT Gb: translation of ep patent filed (gb section 77(6)(a)/1977)

Effective date: 19940310

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed
PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 19960122

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: AT

Payment date: 19960124

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 19960215

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 19960221

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 19960520

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Effective date: 19970222

Ref country code: AT

Effective date: 19970222

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Effective date: 19970228

Ref country code: CH

Effective date: 19970228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Effective date: 19970901

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 19970222

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Effective date: 19971030

NLV4 Nl: lapsed or anulled due to non-payment of the annual fee

Effective date: 19970901

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20040419

Year of fee payment: 16

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20050901