DE60045022D1 - Piezoelektrische dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf - Google Patents

Piezoelektrische dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf

Info

Publication number
DE60045022D1
DE60045022D1 DE60045022T DE60045022T DE60045022D1 DE 60045022 D1 DE60045022 D1 DE 60045022D1 DE 60045022 T DE60045022 T DE 60045022T DE 60045022 T DE60045022 T DE 60045022T DE 60045022 D1 DE60045022 D1 DE 60045022D1
Authority
DE
Germany
Prior art keywords
production
thin layer
piezoelectric thin
layer assembly
pressure head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60045022T
Other languages
English (en)
Inventor
Makoto Hanabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60045022D1 publication Critical patent/DE60045022D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1607Production of print heads with piezoelectric elements
    • B41J2/161Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1642Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1645Manufacturing processes thin film formation thin film formation by spincoating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/077Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/08Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
DE60045022T 1999-01-22 2000-01-21 Piezoelektrische dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf Expired - Lifetime DE60045022D1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1439699 1999-01-22
JP12943799 1999-05-11
JP32472199 1999-11-15
PCT/JP2000/000304 WO2000044054A1 (fr) 1999-01-22 2000-01-21 Dispositif a film mince piezoelectrique, procede de production associe et tete d'enregistrement a jet d'encre

Publications (1)

Publication Number Publication Date
DE60045022D1 true DE60045022D1 (de) 2010-11-11

Family

ID=27280620

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60045022T Expired - Lifetime DE60045022D1 (de) 1999-01-22 2000-01-21 Piezoelektrische dünnschichtanordnung, verfahren zu deren herstellung und tintenstrahldruckkopf

Country Status (4)

Country Link
US (1) US6478412B1 (de)
EP (1) EP1067609B1 (de)
DE (1) DE60045022D1 (de)
WO (1) WO2000044054A1 (de)

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DE20202297U1 (de) * 2001-09-07 2002-08-29 Drei S Werk Praez Swerkzeuge G Flacher Aktor oder Sensor mit interner Vorspannung
CN1245768C (zh) * 2001-09-07 2006-03-15 松下电器产业株式会社 薄膜压电体元件及其制造方法并致动器
US7067961B2 (en) * 2002-07-12 2006-06-27 Ngk Insulators, Ltd. Piezoelectric/electrostrictive film device, and manufacturing method of the device
JP3876986B2 (ja) * 2002-09-24 2007-02-07 ブラザー工業株式会社 インクジェットヘッド
KR100519764B1 (ko) * 2003-03-20 2005-10-07 삼성전자주식회사 잉크젯 프린트헤드의 압전 액츄에이터 및 그 형성 방법
WO2004097854A1 (ja) * 2003-04-30 2004-11-11 Asahi Glass Company, Limited 強誘電体薄膜形成用液状組成物および強誘電体薄膜の製造方法
KR100612852B1 (ko) 2003-07-18 2006-08-14 삼성전자주식회사 GoF/GoP의 질감 표현 방법과, 이를 이용한GoF/GoP 검색 방법 및 장치
EP1533816A3 (de) * 2003-11-18 2008-02-13 Konica Minolta Medical & Graphic, Inc. Strahlungsbildwandler und Verfahren zu seiner Herstellung
WO2008007551A1 (fr) * 2006-07-10 2008-01-17 Konica Minolta Medical & Graphic, Inc. Procédé de formation de films de résine synthétique piézoélectriques
JP2008028030A (ja) * 2006-07-19 2008-02-07 Seiko Epson Corp 圧電素子および液体噴射ヘッド
EP2154167A1 (de) * 2008-07-30 2010-02-17 Bayer MaterialScience AG Elektromechanischer Wandler mit einem Polymerelement auf Polyisocyanat-Basis
JP2011207071A (ja) * 2010-03-30 2011-10-20 Seiko Epson Corp 液体噴射ヘッドの製造方法及び圧電素子の形成方法
JP6182968B2 (ja) * 2012-08-14 2017-08-23 株式会社リコー 電気機械変換素子、液滴吐出ヘッド、画像形成装置及び電気機械変換素子の製造方法
JP2014072511A (ja) * 2012-10-02 2014-04-21 Ngk Insulators Ltd 積層体
JP6256101B2 (ja) 2014-02-28 2018-01-10 セイコーエプソン株式会社 液体噴射ヘッド、及び、液体噴射装置
US20160322560A1 (en) 2015-04-30 2016-11-03 The Regents Of The University Of California 3d piezoelectric polymer materials and devices
JP2019001114A (ja) * 2017-06-19 2019-01-10 コニカミノルタ株式会社 液体吐出ヘッド及び液体吐出装置
JP6868228B2 (ja) * 2019-08-01 2021-05-12 ブラザー工業株式会社 液体吐出装置及び液体吐出装置の製造方法

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DE2256667C3 (de) * 1972-11-18 1975-04-30 Olympia Werke Ag, 2940 Wilhelmshaven Vorrichtung zum Erzeugen von Druckimpulsen, die in einem Grundkörper angeordnet sind
US3824352A (en) * 1973-04-30 1974-07-16 Zenith Radio Corp Stacked piezoelectric transducer acting as quarter-wave resonator for recording video information
JPS63207185A (ja) * 1987-02-23 1988-08-26 Toyota Motor Corp 圧電アクチユエ−タ
EP0383972B1 (de) * 1989-02-22 1993-12-15 Siemens Aktiengesellschaft Ultraschall-Array mit trapezförmigen Schwingerelementen sowie Verfahren und Vorrichtung zu seiner Herstellung
US5075641A (en) * 1990-12-04 1991-12-24 Iowa State University Research Foundation, Inc. High frequency oscillator comprising cointegrated thin film resonator and active device
US5245244A (en) * 1991-03-19 1993-09-14 Brother Kogyo Kabushiki Kaisha Piezoelectric ink droplet ejecting device
US5185589A (en) * 1991-05-17 1993-02-09 Westinghouse Electric Corp. Microwave film bulk acoustic resonator and manifolded filter bank
US5459501A (en) * 1993-02-01 1995-10-17 At&T Global Information Solutions Company Solid-state ink-jet print head
US5410208A (en) * 1993-04-12 1995-04-25 Acuson Corporation Ultrasound transducers with reduced sidelobes and method for manufacture thereof
JP3114434B2 (ja) * 1993-06-30 2000-12-04 ブラザー工業株式会社 圧電アクチュエータの駆動方法
JP3250332B2 (ja) 1993-08-23 2002-01-28 セイコーエプソン株式会社 インクジェットヘッド
JP3007795B2 (ja) * 1994-06-16 2000-02-07 シャープ株式会社 複合金属酸化物誘電体薄膜の製造方法
DE69617288T2 (de) * 1995-02-20 2002-05-23 Seiko Epson Corp Verfahren zur Herstellung einer piezoelektrischen Dünnschicht
DE69624282T2 (de) * 1995-04-19 2003-07-03 Seiko Epson Corp Tintenstrahlaufzeichnungskopf und Verfahren zu dessen Herstellung
DE69612333T2 (de) * 1995-07-26 2001-10-11 Sony Corp Druckvorrichtung und Verfahren zu ihrer Herstellung
JP3460218B2 (ja) * 1995-11-24 2003-10-27 セイコーエプソン株式会社 インクジェットプリンタヘッドおよびその製造方法
JP3209082B2 (ja) 1996-03-06 2001-09-17 セイコーエプソン株式会社 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド
JPH09306865A (ja) * 1996-05-13 1997-11-28 Toshiba Corp 半導体装置の製造方法
JPH1020488A (ja) * 1996-07-04 1998-01-23 Mitsubishi Materials Corp Pb非含有金属酸化物薄膜パターンの形成方法
WO1998024296A2 (en) * 1996-11-20 1998-06-11 The Regents Of The University Of California Multilaminate piezoelectric high voltage stack
JPH10202874A (ja) * 1997-01-24 1998-08-04 Seiko Epson Corp インクジェットプリンタヘッド及びその製造方法
JP3682684B2 (ja) * 1997-10-20 2005-08-10 セイコーエプソン株式会社 圧電体薄膜素子の製造方法
US6260956B1 (en) * 1998-07-23 2001-07-17 Xerox Corporation Thermal ink jet printhead and process for the preparation thereof

Also Published As

Publication number Publication date
WO2000044054A1 (fr) 2000-07-27
EP1067609A1 (de) 2001-01-10
EP1067609A4 (de) 2007-06-13
EP1067609B1 (de) 2010-09-29
US6478412B1 (en) 2002-11-12

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