EP0379948A3 - Aqueous acid solutions for the electrodeposition of tin and/or lead/tin alloys - Google Patents
Aqueous acid solutions for the electrodeposition of tin and/or lead/tin alloys Download PDFInfo
- Publication number
- EP0379948A3 EP0379948A3 EP19900100870 EP90100870A EP0379948A3 EP 0379948 A3 EP0379948 A3 EP 0379948A3 EP 19900100870 EP19900100870 EP 19900100870 EP 90100870 A EP90100870 A EP 90100870A EP 0379948 A3 EP0379948 A3 EP 0379948A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- tin
- alkanesulfonic acid
- lead
- solutions
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Abstract
Beschrieben werden wäßrige, saure Lösungen für die elektrolytische Abscheidung von Zinn und/oder Blei/ Zinnlegierungen zur verbesserten galvanischen Ab scheidung im hohen Stromdichtebereich und gleich mäßigen Glanzstreuung von im niedrigen Stromdichte bereich abgeschiedenen Metallen. Die erfindungsge mäßen Lösungen enthalten ein Gemisch aus Metallsal zen, freier Alkansulfonsäure, nicht ionogenen Netz mitteln und gegebenenfalls aromatische kurzkettige Aldehyde und/oder gegebenenfalls aromatische Ketone und/oder gegebenenfalls kurzkettige ungesättigte Car bonsäuren. Die erfindungsgemäßen Lösungen sind da durch gekennzeichnet, daß als Metallsalz Zinn- und/ oder Bleisalze der Alkansulfonsäure verwendet wer den, wobei die Alkylgruppe der Alkansulfonsäure aus 1 bis 5 C-Atomen besteht, freie Alkansulfonsäure Al kylgruppen mit 1 bis 5 C-Atomen aufweist und als wei terer Glanzbildner ein Gemisch aus einem Reaktions produkt aus Acetaldehyd und/oder seinen Aldolkonden sationsprodukten mit Ammoniak und/oder acyclischen Ketonen und/oder aliphatischen Aminen, Amiden, Ami nosäuren und/oder Hydrazinverbindungen enthalten ist. Aqueous, acidic solutions are described for the electrolytic deposition of tin and / or lead / Tin alloys for improved galvanic ab divide in the high current density range and the same moderate gloss scatter from low current density area of deposited metals. The fiction solutions contain a mixture of metal salts zen, free alkanesulfonic acid, non-ionogenic network medium and possibly aromatic short chain Aldehydes and / or optionally aromatic ketones and / or optionally short-chain unsaturated car Bon acids. The solutions according to the invention are there characterized in that tin and / or or lead salts of alkanesulfonic acid who used the, wherein the alkyl group of the alkanesulfonic acid 1 to 5 carbon atoms, free alkanesulfonic acid Al has alkyl groups with 1 to 5 carbon atoms and as white tere brightener a mixture of a reaction product from acetaldehyde and / or its aldol condens tion products with ammonia and / or acyclic Ketones and / or aliphatic amines, amides, ami no acids and / or hydrazine compounds is contained.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3902042A DE3902042A1 (en) | 1989-01-25 | 1989-01-25 | AQUEOUS, ACID SOLUTIONS FOR THE ELECTROLYTIC DEPOSITION OF TIN AND / OR LEAD / TIN ALLOYS |
DE3902042 | 1989-01-25 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0379948A2 EP0379948A2 (en) | 1990-08-01 |
EP0379948A3 true EP0379948A3 (en) | 1991-07-31 |
EP0379948B1 EP0379948B1 (en) | 1994-03-09 |
Family
ID=6372697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP90100870A Expired - Lifetime EP0379948B1 (en) | 1989-01-25 | 1990-01-17 | Aqueous acid solutions for the electrodeposition of tin and/or lead/tin alloys |
Country Status (5)
Country | Link |
---|---|
US (1) | US5021130A (en) |
EP (1) | EP0379948B1 (en) |
JP (1) | JP3096465B2 (en) |
DD (1) | DD291785A5 (en) |
DE (2) | DE3902042A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5651873A (en) * | 1994-06-30 | 1997-07-29 | Mitsubishi Materials Corporation | Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface |
WO1996017980A1 (en) * | 1994-12-09 | 1996-06-13 | Glyco-Metall-Werke Glyco B.V. & Co. Kg | Laminated material for sliding components and method and means for its production |
DE19728777C2 (en) * | 1997-07-05 | 2001-03-15 | Federal Mogul Wiesbaden Gmbh | Layered composite material for plain bearings and method for manufacturing bearing shells |
US6267863B1 (en) * | 1999-02-05 | 2001-07-31 | Lucent Technologies Inc. | Electroplating solution for electroplating lead and lead/tin alloys |
DE60226196T2 (en) * | 2001-05-24 | 2009-05-14 | Shipley Co., L.L.C., Marlborough | Tin-plating |
US6730209B2 (en) * | 2002-02-22 | 2004-05-04 | Lucent Technologies Inc. | Solder electroplating bath including brighteners having reduced volatility |
GB0216331D0 (en) | 2002-07-13 | 2002-08-21 | Dana Corp | Bearings |
WO2004034427A2 (en) * | 2002-10-08 | 2004-04-22 | Honeywell International Inc. | Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials |
JP4749746B2 (en) * | 2005-03-24 | 2011-08-17 | Dowaメタルテック株式会社 | Tin plating material and method for producing the same |
CN110428939B (en) * | 2019-08-09 | 2020-06-30 | 常州大学 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1260262B (en) * | 1963-05-06 | 1968-02-01 | Friedr Blasberg G M B H | Galvanic bath and process for the electrolytic deposition of high-gloss tin coatings |
US4132610A (en) * | 1976-05-18 | 1979-01-02 | Hyogo Prefectural Government | Method of bright electroplating of tin-lead alloy |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2525942A (en) * | 1945-06-29 | 1950-10-17 | Standard Oil Co | Electrodepositing bath and process |
-
1989
- 1989-01-25 DE DE3902042A patent/DE3902042A1/en active Granted
-
1990
- 1990-01-17 EP EP90100870A patent/EP0379948B1/en not_active Expired - Lifetime
- 1990-01-17 DE DE90100870T patent/DE59004841D1/en not_active Expired - Lifetime
- 1990-01-23 US US07/469,066 patent/US5021130A/en not_active Expired - Lifetime
- 1990-01-24 JP JP02014730A patent/JP3096465B2/en not_active Expired - Lifetime
- 1990-01-24 DD DD90337314A patent/DD291785A5/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1260262B (en) * | 1963-05-06 | 1968-02-01 | Friedr Blasberg G M B H | Galvanic bath and process for the electrolytic deposition of high-gloss tin coatings |
US4132610A (en) * | 1976-05-18 | 1979-01-02 | Hyogo Prefectural Government | Method of bright electroplating of tin-lead alloy |
US4582576A (en) * | 1985-03-26 | 1986-04-15 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
Also Published As
Publication number | Publication date |
---|---|
JP3096465B2 (en) | 2000-10-10 |
DD291785A5 (en) | 1991-07-11 |
EP0379948A2 (en) | 1990-08-01 |
DE3902042A1 (en) | 1990-07-26 |
DE59004841D1 (en) | 1994-04-14 |
DE3902042C2 (en) | 1991-05-02 |
EP0379948B1 (en) | 1994-03-09 |
US5021130A (en) | 1991-06-04 |
JPH02232389A (en) | 1990-09-14 |
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