CN110428939B - Preparation method of high-conductivity graphene copper/aluminum composite wire - Google Patents
Preparation method of high-conductivity graphene copper/aluminum composite wire Download PDFInfo
- Publication number
- CN110428939B CN110428939B CN201910732824.0A CN201910732824A CN110428939B CN 110428939 B CN110428939 B CN 110428939B CN 201910732824 A CN201910732824 A CN 201910732824A CN 110428939 B CN110428939 B CN 110428939B
- Authority
- CN
- China
- Prior art keywords
- graphene
- copper
- electrodeposition
- aluminum composite
- composite wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/042—Manufacture of coated wire or bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C9/00—Cooling, heating or lubricating drawing material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0006—Apparatus or processes specially adapted for manufacturing conductors or cables for reducing the size of conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention relates to the technical field of wires and cables, and particularly discloses a preparation method of a high-conductivity graphene copper/aluminum composite wire. The lead comprises the following components in percentage by mass: 20wt% of CuSO40.005-0.020 wt% of benzalacetone, 2-5 wt% of NaCl, 0.08-0.5 wt% of graphene, 0.003-0.016 wt% of N, N-dimethylformamide and the balance of deionized water; the preparation method of the lead comprises the following steps: electrodeposition, drawing and annealing; the obtained lead has excellent conductivity and tensile strength, can effectively improve the power transmission efficiency and reduce the power loss. The formula and the preparation method of the electrodeposition liquid provided by the invention ensure the comprehensive performance and the microstructure of the composite material by controlling the technological parameters, and obtain a novel practical lead with simple preparation method and high transmission efficiency.
Description
Technical Field
The invention belongs to the technical field of wires and cables, and particularly relates to a preparation method of a high-conductivity graphene copper/aluminum composite wire.
Background
For a long time, metals have found widespread use in the wire and cable technology industry, undertaking the tasks of power transport and signal transmission. In recent years, the emergence of some new materials is expected to break the existing pattern, and graphene becomes a new material which is urgently developed at present due to the excellent comprehensive performance of graphene.
Graphene is a material having a hexagonal honeycomb-like two-dimensional planar structure composed of a single layer of atoms, and is sp2The graphene has a plurality of excellent physical properties and ultrahigh electron mobility, and reaches 2.5 × 105cm2V-1s-1(ii) a The Young modulus of the single-layer graphene reaches 130GPa, and the thermal conductivity reaches 5000W/m.K. The existence of these excellent properties means that graphene can be a material with great development prospects. However, since graphene is a two-dimensional material and is difficult to mold alone, graphene and metal are processed by a certain methodThe composite material is prepared by a method which can effectively improve the material performance.
The single wire is only suitable for the transmission of power with common frequency, but for the transmission and conduction of high-frequency power and electric signals, the traditional copper/aluminum, copper/steel and aluminum alloy wires and cables are not suitable, and the problems are solved mainly by gold/silver plating or adding a semiconductor material layer at present, but the gold/silver plating is high in cost and pollution and has great limitation.
On the other hand, at present, there are various methods for preparing metal-based graphene materials, mainly including various methods such as a powder metallurgy method, a hydrothermal method, a vapor deposition method, an electrodeposition method, and the like. The controllability of the powder metallurgy method is poor, and the limitation is more; the hydrothermal method has strong controllability, high material purity and great technical difficulty; although the vapor deposition method has strong controllability and compact and uniform plating layer, the general plating layer is too thin and is not beneficial to practical application; the electrodeposition method is to prepare a material which grows rapidly by taking a plating solution with specific components as a medium in an electrochemical redox mode, has the advantages of simple process, uniform plating layer, controllable size and the like, and has the defect that the components of the electrodeposition solution, the selection of the substrate material and the selection of process parameters directly influence the tissue and the performance of the prepared composite material. For example, the composite material prepared by the conventional electrodeposition solution of graphene copper has poor density and relatively coarse grains, and the performance of the composite material is not obviously improved compared with that of pure copper.
Disclosure of Invention
In order to solve the technical problems, the invention provides a preparation method of a composite wire with high conductivity and high-frequency transmission performance. The invention aims to provide the electroplating solution of the copper-based graphene composite material with reasonable proportion, environmental protection, cost saving and controllable coating thickness, and the required process parameters and process method, so as to obtain the composite wire with excellent performance.
The technical solution of the invention is as follows:
the preparation method of the graphene copper/aluminum (alloy) composite wire by electrodeposition comprises the following steps:
(1) preparing copper baseThe electrodeposition liquid of the graphene composite material comprises the following components in percentage by mass: 20wt% of CuSO40.005-0.020 wt% of benzalacetone, 2-5 wt% of NaCl, 0.08-0.5 wt% of graphene, 0.003-0.016 wt% of DMF (N, N-dimethylformamide) and the balance of deionized water.
Wherein, the benzylidene acetone is used as a grain refiner, the overpotential and the nucleation rate of a cathode are influenced in the electrodeposition process, and the proper addition amount of the benzylidene acetone can lead the material to obtain a fine-grained structure accompanied with high-density twin crystals; the DMF has a dispersing effect, can improve the dispersibility of the graphene, reduce agglomeration, simultaneously does not introduce other functional groups, reduces microscopic and macroscopic defects in the composite material, and improves the density of the material.
(2) The prepared deposition solution is used for deposition, aluminum (alloy) is used as a base material, a pulse electrodeposition method is adopted, and the process parameters are as follows: the pulse width ratio is 2: 1-5: 1 (positive/negative), the pulse voltage is 2-3 v/0.5-1 v, the pulse current frequency is 400-800 Hz, the temperature is 30 ℃, and the electroplating time is 1-4 h. Variations in parameters such as pulse width, pulse voltage, frequency, temperature, etc., can affect the deposition rate of the material and the quality of the deposited layer.
(3) Carrying out drawing process treatment on the deposited graphene copper/aluminum (alloy) composite wire: and (2) carrying out high-temperature stretching on the graphene copper/aluminum composite wire at the stretching temperature of 130-330 ℃ and the stretching speed of 10-30 mm/min to obtain the wire with the diameter of 0.8-1.4 mm.
(4) Annealing the wire treated by the drawing process, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 30-130 ℃, and the treatment time is 2-4 hours. Through annealing treatment, the performance of the composite material is improved, and the quality of a composite interface is improved.
The copper sulfate-graphene plating solution used in the invention is nontoxic, has reasonable proportion, can be recycled, saves the cost, and is green and environment-friendly; the graphene copper plating layer prepared by the method has bright surface and uniform and compact texture. The graphene copper/aluminum composite wire prepared by the invention is applied to the technical field of wires and cables, and the volume percentage of a coating is 10-30%.
The additive can improve nucleation rate and inhibit crystal growth, nano-scale crystal grains can be obtained by proper additive dosage, and a large number of nano-scale crystal grains and nano twin crystals are contained in the material structure, so that the conductivity and mechanical property of the material can be effectively improved.
The action mechanism is as follows: the nanocrystalline and the twin crystal can effectively reduce the scattering effect of crystal boundary on energy, reduce the loss of energy in the transmission process, and simultaneously, the reduction of crystal grains is accompanied with the improvement of strength according to the Hall-Peltier formula; the existence of the graphene in the material effectively improves the electron mobility of the material and promotes the transmission and conduction efficiency of high-frequency signals.
The invention has the beneficial effects that:
(1) the electrodeposition method adopts a pulse electrodeposition method, has low cost, relatively simple method, uniform and compact plating layer and bright surface without rough raised particles. The microstructure has a large number of nanocrystals therein.
(2) The deposited layer has excellent conductivity and mechanical property, compared with an aluminum alloy conductor matrix, the strength is improved by more than 30%, and the conductivity is close to that of standard annealed pure copper.
(3) The highest electric conductivity of the material can reach more than 90% IACS, and the highest tensile strength can reach 490 +/-10 MPa. The deposited layer can greatly improve the practicability and applicability of the material.
Detailed Description
The invention is described in more detail below with reference to the following examples: these examples are intended to illustrate the invention only and are not intended to limit the scope of the invention: the results of the electrodeposition process parameters of this example were shown using a pulse voltage of 2.5v/0.8v and an electrodeposition frequency of 500 Hz.
Example 1
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.005wt% of benzalacetone, 2wt% of NaCl, 0.08wt% of few-layer graphene and 0.003wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width ratio was 2:1 (positive/negative), and the pulse voltage was 2.5v/0.8v, the frequency of the pulse current is 500Hz, and the electrodeposition time is 1 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 130 ℃ and the drawing speed of 10mm/min to obtain a wire with the diameter of 1.4 mm.
Then carrying out annealing process treatment, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 30 ℃, and the treatment time is 2 hours.
Under the condition and the process condition, the volume of the deposited layer accounts for 10%, the deposited layer and the aluminum core wire have good bonding performance, the electric conductivity of the prepared material can reach 75.4% IACS, and the tensile strength reaches 410 +/-10 MPa.
Example 2
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.010 wt% of benzalacetone, 3wt% of NaCl, 0.2 wt% of few-layer graphene and 0.008 wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width ratio was 3:1 (positive/negative), the pulse voltage was 2.5v/0.8v, the pulse current frequency was 500Hz, and the electrodeposition time was 2 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 230 ℃ and the drawing speed of 20mm/min to obtain a wire with the diameter of 1.0 mm.
Then carrying out annealing process treatment, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 80 ℃, and the treatment time is 3 hours.
Under the condition and the process condition, the volume of the deposited layer accounts for 15%, the deposited layer and the aluminum core wire have good bonding performance, the electric conductivity of the prepared material can reach 83.3% IACS, and the tensile strength reaches 445 +/-10 MPa.
Example 3
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.015 wt% of benzalacetone, 3wt% of NaCl, 0.4 wt% of few-layer graphene and 0.012 wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: pulse widthThe ratio of the degree to the degree is 5:1 (positive/negative), the pulse voltage is 2.5v/0.8v, the pulse current frequency is 500Hz, and the electrodeposition time is 4 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 330 ℃ and the drawing speed of 30mm/min to obtain the wire with the diameter of 0.8 mm.
Then carrying out annealing process treatment, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 130 ℃, and the treatment time is 3.5 hours.
Under the condition and the process condition, the volume of the deposited layer accounts for 30%, the deposited layer and the aluminum core wire have good bonding performance, the electric conductivity of the prepared material can reach 90.2% IACS, and the tensile strength reaches 490 +/-10 MPa.
Example 4
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.020wt% of benzalacetone, 4 wt% of NaCl, 0.5wt% of few-layer graphene and 0.016wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width is 5:1 (positive/negative), the pulse voltage is 2.5v/0.8v, the pulse current frequency is 500Hz, and the electrodeposition time is 4 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 330 ℃ and the drawing speed of 30mm/min to obtain the wire with the diameter of 0.9 mm.
Then carrying out annealing process treatment, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 130 ℃, and the treatment time is 4 hours.
Under the condition and the process condition, the volume of the deposited layer accounts for 25%, the deposited layer and the aluminum core wire have good bonding performance, the conductivity of the prepared material can reach 86.7% IACS, and the tensile strength reaches 465 +/-10 MPa.
Comparative example 1
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.015 wt% of benzalacetone, 3wt% of NaCl, 0.4 wt% of few-layer graphene and 0.012 wt% of DMF; worker's toolThe process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width ratio was 5:1 (positive/negative), the pulse voltage was 2.5v/0.8v, the pulse current frequency was 500Hz, and the electrodeposition time was 4 h. After the electrodeposition is finished, the deposition layer is loose and not compact, and the bonding force with the matrix is poor.
Comparative example 2
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO40.015 wt% of benzalacetone, 3wt% of NaCl, 0.4 wt% of few-layer graphene and 0.012 wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width ratio was 5:1 (positive/negative), the pulse voltage was 2.5v/0.8v, the pulse current frequency was 500Hz, and the electrodeposition time was 4 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 330 ℃ and the drawing speed of 30mm/min to obtain the wire with the diameter of 0.8 mm.
Under the condition and the process condition, the volume of the deposited layer accounts for 30%, the deposited layer and the aluminum core wire have good bonding performance, the electric conductivity of the prepared material can reach 86.2% IACS, and the tensile strength reaches 450 +/-10 MPa.
Comparative example 3
The graphene copper electrodeposition liquid comprises the following components in percentage by mass; 20wt% of CuSO43wt% of NaCl, 0.4 wt% of few-layer graphene and 0.012 wt% of DMF; the process environment is as follows: the temperature is 30 ℃; the technological parameters are as follows: the pulse width ratio was 5:1 (positive/negative), the pulse voltage was 2.5v/0.8v, the pulse current frequency was 500Hz, and the electrodeposition time was 4 h.
And (3) carrying out drawing process treatment after electrodeposition, and carrying out high-temperature drawing on the graphene copper/aluminum composite wire at the drawing temperature of 330 ℃ and the drawing speed of 30mm/min to obtain the wire with the diameter of 0.8 mm.
Then carrying out annealing process treatment, wherein the process parameters are as follows: and adding nitrogen into an annealing furnace for annealing, wherein the annealing temperature is 130 ℃, and the treatment time is 3.5 hours.
In this case and under the process conditions, the volume of the deposited layer accounts for 28%, the bonding property of the deposited layer and the aluminum core wire is general, the surface quality of the deposited layer is poor, the electric conductivity of the prepared material can reach 84.6% IACS, and the tensile strength reaches 440 +/-10 MPa.
The examples are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any obvious improvements, substitutions or modifications can be made by those skilled in the art without departing from the spirit of the present invention.
Claims (7)
1. A preparation method of a high-conductivity graphene copper/aluminum composite wire is characterized by comprising the following steps: the preparation method comprises the following steps:
(1) preparing electrodeposition liquid of the copper-based graphene composite material;
the copper-based graphene composite material electrodeposition liquid comprises the following components in percentage by mass: 20wt% of CuSO40.005-0.020 wt% of benzalacetone, 2-5 wt% of NaCl, 0.08-0.5 wt% of graphene, 0.003-0.016 wt% of N, N-dimethylformamide and the balance of deionized water;
(2) carrying out electrodeposition on the aluminum or aluminum alloy wire by adopting the electrodeposition solution obtained in the step (1), wherein the adopted electrodeposition method is pulse electrodeposition;
(3) carrying out high-temperature stretching on the graphene copper/aluminum composite wire obtained in the step (2), wherein the diameter of the obtained wire is 0.8-1.4 mm;
(4) and (4) annealing the graphene copper/aluminum composite wire obtained in the step (3) in a nitrogen atmosphere.
2. The preparation method of the high-conductivity graphene copper/aluminum composite wire according to claim 1, characterized in that: the sine pulse parameters in the electrodeposition process in the step (2) are as follows: the positive/negative direction duration ratio of the pulse voltage is 2: 1-5: 1, the pulse voltage is 2-3 v/0.5-1 v, and the pulse current frequency is 400-800 Hz.
3. The preparation method of the high-conductivity graphene copper/aluminum composite wire according to claim 1, characterized in that: the graphene copper/aluminum composite material wire prepared in the step (2) has a graphene copper volume ratio of 10-30%.
4. The preparation method of the high-conductivity graphene copper/aluminum composite wire according to claim 1, characterized in that: and (4) high-temperature stretching in the step (3), wherein the stretching temperature is 130-330 ℃, and the stretching speed is 10-30 mm/min.
5. The preparation method of the high-conductivity graphene copper/aluminum composite wire according to claim 1, characterized in that: and (4) annealing at the temperature of 30-130 ℃, and keeping the temperature for 2-4 hours.
6. The high-conductivity graphene copper/aluminum composite wire prepared by the method of claim 1, wherein: the conductivity of the composite wire is not less than 75% IACS, and the tensile strength reaches 500 MPa.
7. The application of the high-conductivity graphene copper/aluminum composite wire prepared by the method of claim 1 is characterized in that: the graphene copper/aluminum composite wire is applied to the technical field of wires and cables.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732824.0A CN110428939B (en) | 2019-08-09 | 2019-08-09 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
| PCT/CN2020/106520 WO2021027607A1 (en) | 2019-08-09 | 2020-08-03 | Preparation method for highly conductive graphene copper/aluminium composite wire |
| US17/433,247 US20220042195A1 (en) | 2019-08-09 | 2020-08-03 | Method for preparing copper-based graphene/aluminum composite wire with high electrical conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732824.0A CN110428939B (en) | 2019-08-09 | 2019-08-09 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110428939A CN110428939A (en) | 2019-11-08 |
| CN110428939B true CN110428939B (en) | 2020-06-30 |
Family
ID=68413475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910732824.0A Active CN110428939B (en) | 2019-08-09 | 2019-08-09 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20220042195A1 (en) |
| CN (1) | CN110428939B (en) |
| WO (1) | WO2021027607A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110428939B (en) * | 2019-08-09 | 2020-06-30 | 常州大学 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
| TR202016383A1 (en) * | 2020-10-14 | 2022-04-21 | Atatuerk Ueniversitesi Rektoerluegue Bilimsel Arastirma Projeleri Bap Koordinasyon Birimi | METHOD AND SYSTEM FOR MANUFACTURING LAYERED Cu-GRAPHEN ULTRA CONDUCTOR WIRE |
| CN115519840A (en) * | 2022-09-22 | 2022-12-27 | 北京石墨烯技术研究院有限公司 | Metal graphene composite material, preparation method and application thereof, and electronic component |
| CN116994792B (en) * | 2023-08-02 | 2024-05-14 | 彭丽楠 | Graphene copper-clad aluminum alloy wire, preparation method thereof and electric wire and cable |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE735856A (en) * | 1967-04-03 | 1970-01-09 | ||
| DE3902042A1 (en) * | 1989-01-25 | 1990-07-26 | Blasberg Oberflaechentech | AQUEOUS, ACID SOLUTIONS FOR THE ELECTROLYTIC DEPOSITION OF TIN AND / OR LEAD / TIN ALLOYS |
| US5415749A (en) * | 1994-03-04 | 1995-05-16 | E. I. Du Pont De Nemours And Company | Process for electrodeposition of resist formulations which contain metal salts of β-diketones |
| US9892813B1 (en) * | 2012-04-19 | 2018-02-13 | Thomas A. Barkow | Graphene/metal molecular level lamination (GMMLL) |
| TWI486970B (en) * | 2013-01-29 | 2015-06-01 | Tung Han Chuang | Copper alloy wire and methods for manufacturing the same |
| CN103887013A (en) * | 2013-12-31 | 2014-06-25 | 美特科技(苏州)有限公司 | Production method for copper-coated graphene conductive wire |
| CN103943170B (en) * | 2014-05-09 | 2016-03-02 | 浙江大学 | Core-sheath structural conductive core of a kind of electric wire and preparation method thereof |
| CN103943281B (en) * | 2014-05-09 | 2016-05-04 | 浙江大学 | A kind of preparation method of the electric wire with copper-graphite alkene complex phase conductor wire core |
| CN108396346B (en) * | 2018-02-06 | 2020-02-14 | 常州大学 | Preparation method and application of graphene copper/steel composite material |
| CN110428939B (en) * | 2019-08-09 | 2020-06-30 | 常州大学 | Preparation method of high-conductivity graphene copper/aluminum composite wire |
-
2019
- 2019-08-09 CN CN201910732824.0A patent/CN110428939B/en active Active
-
2020
- 2020-08-03 WO PCT/CN2020/106520 patent/WO2021027607A1/en active Application Filing
- 2020-08-03 US US17/433,247 patent/US20220042195A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20220042195A1 (en) | 2022-02-10 |
| WO2021027607A1 (en) | 2021-02-18 |
| CN110428939A (en) | 2019-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110428939B (en) | Preparation method of high-conductivity graphene copper/aluminum composite wire | |
| CN103898425B (en) | A kind of compound deformation heat treatment method suitable in Cu-Cr-Zr system alloy wire | |
| CN108573763B (en) | Preparation method of wire and cable conductor, graphene-coated metal powder and conductor | |
| CN103966475B (en) | A kind of copper chromium titanium alloy osculatory and preparation method thereof | |
| CN110055479B (en) | 800 MPa-grade high-conductivity copper-chromium-zirconium alloy and preparation method thereof | |
| CN110592621B (en) | Method for preparing nano twin copper layer by adopting high-frequency pulse | |
| CN111549253B (en) | Rare earth copper-iron alloy, preparation method and application | |
| CN109136987B (en) | Gradient nano twin crystal copper block material and temperature control preparation method thereof | |
| CN112030030B (en) | High-strength high-conductivity copper alloy wire and preparation method thereof | |
| CN104746068A (en) | Copper-based coating for iron-based alloy surface laser cladding and preparation method thereof | |
| CN110699676A (en) | High-strength high-conductivity metal glass composite material and preparation method thereof | |
| CN114086013A (en) | High-strength high-conductivity ultrafine-grained tungsten-copper composite material and preparation method thereof | |
| WO2022267488A1 (en) | Preparation method for high-toughness corrosion-resistant az80 magnesium alloy | |
| CN113481405B (en) | Preparation method of copper-iron alloy | |
| CN117604318A (en) | In-situ authigenic graphene/copper composite material with orientation double-peak structure and preparation method thereof | |
| CN108543945A (en) | A kind of external oxidation preparation method of aluminum oxide dispersion copper alloy powder | |
| CN111378867A (en) | High-conductivity and high-strength copper-chromium-magnesium alloy and preparation method thereof | |
| CN114250489B (en) | Method for preparing copper-iron alloy based on electrodeposition method | |
| CN116623244A (en) | Preparation method of copper-based-graphene composite material | |
| CN113445077B (en) | Grain size multimodal distribution heterogeneous nano structure Cu and preparation method thereof | |
| CN114561566B (en) | Preparation method of copper-silver alloy wire | |
| CN115780798A (en) | Nano boron carbide/copper composite material and preparation method thereof | |
| CN108359834A (en) | A kind of preparation method of electrospark electrode nanostructure copper alloy | |
| CN112222552B (en) | Gamma electrode wire and preparation method thereof | |
| CN110408976B (en) | Graphene/nano twin crystal composite material with controllable tissue and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |