EP0374441B1 - Verfahren zum Herstellen eines zweidimensional ausgedehnten Mikrostrukturkörpers aus Metall mit einer Vielzahl feiner Öffnungen und eines hierfür geeigneten Werkzeugs - Google Patents

Verfahren zum Herstellen eines zweidimensional ausgedehnten Mikrostrukturkörpers aus Metall mit einer Vielzahl feiner Öffnungen und eines hierfür geeigneten Werkzeugs Download PDF

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Publication number
EP0374441B1
EP0374441B1 EP89120246A EP89120246A EP0374441B1 EP 0374441 B1 EP0374441 B1 EP 0374441B1 EP 89120246 A EP89120246 A EP 89120246A EP 89120246 A EP89120246 A EP 89120246A EP 0374441 B1 EP0374441 B1 EP 0374441B1
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EP
European Patent Office
Prior art keywords
tool
electrically conductive
conductive layer
micro
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP89120246A
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German (de)
English (en)
French (fr)
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EP0374441A1 (de
Inventor
Wilhelm Dr. Bier
Asim Dr. Maner
Klaus Dr. Schubert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Forschungszentrum Karlsruhe GmbH
Original Assignee
Kernforschungszentrum Karlsruhe GmbH
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Publication of EP0374441A1 publication Critical patent/EP0374441A1/de
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Publication of EP0374441B1 publication Critical patent/EP0374441B1/de
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Expired - Lifetime legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms

Definitions

  • the two-dimensionally extended microstructure bodies can represent, for example, films or plates which are used for the filtration of liquids or as optical gratings.
  • Microstructure bodies according to the preamble of claim 1 can be produced by two different methods: by photolithography in combination with electroplating or by the method according to DE-PS 35 37 483. This method is referred to as the LIGA (X-ray depth lithography micro-electro-forming) method.
  • LIGA X-ray depth lithography micro-electro-forming
  • DE-OS 36 11 732 also shows that for the production of catalyst support bodies, individual plate-shaped microstructure bodies produced by the LIGA process are stacked on top of one another, aligned and assembled into a stable body.
  • predetermined opening sizes can be set depending on the electroplating layer thickness.
  • the transparency decreases sharply, especially as the size of the openings decreases. Therefore, high transparency, small opening size and large panel thickness cannot be achieved at the same time.
  • the invention has for its object to avoid the aforementioned disadvantages.
  • Two-dimensionally extended microstructure bodies such as e.g. B. have films or plates in series production that have a large number of fine openings or slots, the dimensions and distribution of which can be freely determined.
  • a method for producing a tool is to be specified by means of which these microstructure bodies can be produced.
  • the tool has such microstructures that closely adjacent in the impression material towards the electrically conductive layer Tapering microstructures are molded, and that the resulting shape is galvanically filled until the distance between two adjacent galvanic fillings on their surface corresponds to the predetermined dimension of the relevant opening of the microstructure body to be produced.
  • the tool for producing the plate-shaped microstructure body is produced according to the invention in that closely adjacent grooves are made in the surface of a machinable substrate by means of one or more form diamonds, which taper towards the groove base, whereupon the surface of the substrate structured in this way is molded with metal or ceramic and the molded surface is used as a tool.
  • a metal plate for example consisting of copper or an aluminum-magnesium alloy (AlMg3), can be used as the machinable substrate, which is galvanically coated with another metal, e.g. B. nickel is covered.
  • AlMg3 aluminum-magnesium alloy
  • a composite plate consisting of an electrically conductive and an electrically insulating layer, can also be used as the machinable substrate, into which the grooves are made until they reach into the electrically conductive layer, after which the metal impression is applied by electroplating the electrically conductive layer is carried out as a cathode with subsequent removal of the substrate.
  • the tool is inserted into the impression material and removed again when the microstructures are molded with ultrasound support. It is not necessary to heat the composite layer during the impression.
  • the impression is made by the tapered Form of the microstructures favored the impression of microstructures with vertical walls.
  • an opening size that is variable over the plate height and an expanding opening shape that is distributed for the filtration can be produced according to the invention.
  • FIGS. 1 to 9 The production of the tool, the molding and the galvanic filling of the molded structures are shown in FIGS. 1 to 9.
  • a plate made of AlMg3 with the dimensions 20 x 30 mm2 is used as the starting material for the production of the tool.
  • the surface of the plate is structured with a wedge-shaped micro-shaped diamond without chamfer on the tip by cross-cutting.
  • the grooves created here have a depth of 100 micrometers and an opening angle of 53 °.
  • the density of the grooves is 9.1 grooves per mm.
  • a nickel layer 3 is electrodeposited on the metal plate 2.
  • the nickel layer is machined flat on its free surface.
  • Fig. 2 shows the machined nickel layer 3 on the metal plate 2. Subsequently, the metal plate 2 in a suitable etching solution, for. B. dissolved in sodium hydroxide solution.
  • a composite layer is produced from an electrically insulating layer 6, which consists of the thermoplastic polymethyl methacrylate (PMMA) and an electrically conductive layer 7, which is formed from the thermoplastic PMMA with embedded graphite particles.
  • PMMA thermoplastic polymethyl methacrylate
  • polypropylene, polyethylene, polycarbonate, polystyrene, ABS, PVC, polyacetal and polyamide can also be used as thermoplastics.
  • the electrically conductive layer can also consist of a low-melting metal or a low-melting metal alloy.
  • the composite layer is expediently produced in such a way that the electrically conductive layer 7 is poured onto a metal plate or metal foil.
  • the solidified electrically conductive layer is made by pouring the electrical insulating layer 6 covers.
  • the composite layer is further processed in solidified form.
  • the tool 5 produced after step a) is pressed into the composite layer until the microstructures 4 of the tool 5 penetrate the electrically insulating layer 6 and protrude into the electrically conductive layer 7.
  • the impression of the microstructures 4 remains as a negative form in the composite layer.
  • the negative mold generated in step b) is galvanically filled with a metal by switching the electrically conductive layer 7 as a cathode.
  • the height h of the galvanically produced filling 8 determines the transparency and the opening size d of the plate-shaped microstructure body.
  • the metals nickel, gold and copper are particularly suitable as filling material.
  • the composite layer is removed.
  • This can be done, for example, by dissolving with dichloromethane, after which the galvanically produced metal filling of the negative form remains.
  • the result is a grid-shaped metal network with structures of triangular cross section and widening openings, the dimensions d of which can be adjusted via the height of the galvanic filling or the thickness of the metal network.
  • the transparency of the metal mesh or the opening ratio which is calculated as the ratio of the sum of the free openings to the total area of the metal mesh, is about 13% in this case.
  • the wedge angle of the form diamond other dimensions and transparencies can of course also be realized in the metal network depending on the height of the galvanic filling.
  • the grooves 11 have a depth of 240 ⁇ m and a maximum width of 200 ⁇ m, while the transverse grooves have a width of 400 ⁇ m at the same depth.
  • the density of the grooves 11 is 3.5 grooves per mm.
  • the hollow cylinder 9 provided with longitudinal grooves 11 and transverse grooves 10 is electroplated.
  • a thin rod is inserted along the cylinder axis, centered and switched as an anode.
  • the hollow cylinder itself serves as the cathode. With the aid of this arrangement, nickel is deposited on the inside of the hollow cylinder 9 until the free inner diameter has decreased to a desired value, for example to the diameter of a shaft. The inner, structured surface of the hollow cylinder is transferred to the electrodeposited metal as a negative form.
  • the anode is removed from the z. T. galvanically filled hollow cylinder pulled out and the remaining free inner surface of the hollow cylinder ground and polished rotationally symmetrically.
  • the originally used copper hollow cylinder 9 is selectively etched away with the aid of a CuCl2 solution, the electrodeposited nickel remaining in the interior of the copper hollow cylinder.
  • the tool has an outer diameter of 120 mm and an inner diameter of 60 mm and is 260 mm long.
  • the hollow cylinder made of copper with this inner microstructure cannot be completely molded with galvanically deposited metal. Cavities can arise in the narrow grooves.
  • B. consists of copper and on the inside with a thin layer of electrically insulating material, for. B. made of PMMA or another electrically insulating plastic. The layer thickness should be less than the height of the grooves 10, 11 to be produced, so that the grooves form the layer of electrically insulating plastic pierce and continue into the metal. In this way, the true-to-shape galvanization is made considerably easier.
  • the layer of electrically insulating plastic is removed after removal of the metal by a suitable solvent such. B. by dichloromethane in the case of PMMA.
  • a flexible composite layer is produced, in which case the electrically insulating layer 6 and the electrically conductive layer 7 are expediently prefabricated as films by rolling and then laminated to one another.
  • Polypropylene is used as the material for the electrically insulating layer 6 and a low-melting metal alloy, preferably a lead-tin alloy, is used for the electrically conductive layer 7.
  • the composite layer 15 is carried out between two adjacent rollers 12, 14.
  • the composite layer can be warmed up by an infrared radiator immediately before being introduced into the pair of rollers 12, 14.
  • the upper roller is identical to the tool 12 produced in step a).
  • the composite layer is passed between the two rollers 12, 14 in such a way that the microstructures of the roller 12 form the electrically insulating layer 16 of the composite layer penetrate and protrude into the electrically conductive layer 17 of the composite layer.
  • the negative mold 18 produced in this way on the composite layer is galvanically filled with nickel, as described in Example 1, step c).
  • the composite layer is galvanized as an endless sheet material in a continuous system, after which the galvanically produced filling is rolled up as an endless slit film made of metal by pulling it off the composite layer and onto a spool.
  • the result of this operation is shown in Fig. 9.
  • the result is an endless slot foil made of nickel with reinforcing ribs 20.
  • the slot width 19 can be adjusted as in Example 1, step c) via the height of the nickel electroplating layer.
  • a slot width of 125 ⁇ m is obtained and, without taking the reinforcing ribs into account, a transparency of approximately 44% is obtained.
  • the slit film produced in this way can be used as an optical grating or as an evaporation mask.
  • the plate-shaped tool is attached to the sonotrode of an ultrasonic welding machine.
  • the attachment can be done by gluing or soldering.
  • the composite layer with its electrically conductive layer is placed on the anvil of the ultrasonic welding machine.
  • the anvil is provided with suction openings that are evacuated by a vacuum pump Container or other suitable device in connection. Due to the negative pressure, the composite layer adheres to the anvil.
  • the mold is molded analogously to Example 1, step b), but the tool is pressed into the composite layer with ultrasound support and removed again.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Micromachines (AREA)
  • Mounting, Exchange, And Manufacturing Of Dies (AREA)
EP89120246A 1988-12-17 1989-11-02 Verfahren zum Herstellen eines zweidimensional ausgedehnten Mikrostrukturkörpers aus Metall mit einer Vielzahl feiner Öffnungen und eines hierfür geeigneten Werkzeugs Expired - Lifetime EP0374441B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3842610A DE3842610C1 (US08197722-20120612-C00042.png) 1988-12-17 1988-12-17
DE3842610 1988-12-17

Publications (2)

Publication Number Publication Date
EP0374441A1 EP0374441A1 (de) 1990-06-27
EP0374441B1 true EP0374441B1 (de) 1993-02-03

Family

ID=6369459

Family Applications (1)

Application Number Title Priority Date Filing Date
EP89120246A Expired - Lifetime EP0374441B1 (de) 1988-12-17 1989-11-02 Verfahren zum Herstellen eines zweidimensional ausgedehnten Mikrostrukturkörpers aus Metall mit einer Vielzahl feiner Öffnungen und eines hierfür geeigneten Werkzeugs

Country Status (5)

Country Link
US (1) US5055163A (US08197722-20120612-C00042.png)
EP (1) EP0374441B1 (US08197722-20120612-C00042.png)
JP (1) JP2907904B2 (US08197722-20120612-C00042.png)
DE (1) DE3842610C1 (US08197722-20120612-C00042.png)
ES (1) ES2037936T3 (US08197722-20120612-C00042.png)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4142001A1 (de) * 1991-12-19 1993-06-24 Microparts Gmbh Verfahren zum herstellen gestufter formeinsaetze, gestufte formeinsaetze und damit abgeformte mikrostrukturkoerper
DE4033233A1 (de) * 1990-10-19 1992-04-23 Kernforschungsz Karlsruhe Verfahren zur herstellung eines mikrostrukturkoerpers, insbesondere eines mikrostrukturierten abformwerkzeugs
DE4135676C1 (US08197722-20120612-C00042.png) * 1991-10-30 1993-03-18 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe, De
DE4307869C2 (de) * 1993-03-12 1996-04-04 Microparts Gmbh Mikrostrukturkörper und Verfahren zu deren Herstellung
DE4404021A1 (de) * 1994-02-09 1995-08-10 Bosch Gmbh Robert Düsenplatte, insbesondere für Einspritzventile und Verfahren zur Herstellung einer Düsenplatte
DE19608824A1 (de) 1996-03-07 1997-09-18 Inst Mikrotechnik Mainz Gmbh Verfahren zur Herstellung von Mikrowärmetauschern
AU4455601A (en) * 2000-03-22 2001-10-03 Citizen Watch Co. Ltd. Hole structure and production method for hole structure
US7090189B2 (en) * 2001-01-17 2006-08-15 Sandia National Laboratories Compliant cantilevered micromold
US6422528B1 (en) * 2001-01-17 2002-07-23 Sandia National Laboratories Sacrificial plastic mold with electroplatable base
US6881203B2 (en) 2001-09-05 2005-04-19 3M Innovative Properties Company Microneedle arrays and methods of manufacturing the same
KR20120087197A (ko) * 2002-07-19 2012-08-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 마이크로 니들 장치, 마이크로 니들 장치를 사용하는 방법 및 마이크로 니들 장치를 송출하는 방법
JP4556055B2 (ja) * 2003-05-02 2010-10-06 独立行政法人理化学研究所 ハニカム構造体を鋳型としたメゾ構造体の作製
JP5435824B2 (ja) 2009-02-17 2014-03-05 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ マイクロ構造を作製する方法
CN107394558B (zh) * 2016-05-17 2019-08-06 泰科电子(上海)有限公司 压印模板和在导电端子的镀层上形成微结构的方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2805986A (en) * 1952-01-11 1957-09-10 Harold B Law Method of making fine mesh screens
CH591570A5 (US08197722-20120612-C00042.png) * 1972-11-28 1977-09-30 Buser Ag Maschf Fritz
DE3537483C1 (de) * 1985-10-22 1986-12-04 Kernforschungszentrum Karlsruhe Gmbh, 7500 Karlsruhe Verfahren zum Herstellen einer Vielzahl plattenfoermiger Mikrostrukturkoerper aus Metall
DE3611732A1 (de) * 1986-04-08 1987-10-15 Kernforschungsz Karlsruhe Verfahren zur herstellung von katalysatortraeger-koerpern und danach hergestellte katalysatortraeger-koerper

Also Published As

Publication number Publication date
EP0374441A1 (de) 1990-06-27
DE3842610C1 (US08197722-20120612-C00042.png) 1990-06-21
JPH02194189A (ja) 1990-07-31
US5055163A (en) 1991-10-08
ES2037936T3 (es) 1993-07-01
JP2907904B2 (ja) 1999-06-21

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