Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0607—Solder feeding devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
  • H01L2224/78—Apparatus for connecting with wire connectors
  • H01L2224/7825—Means for applying energy, e.g. heating means
  • H01L2224/78264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
  • H01L2224/78266—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the upper part of the bonding apparatus, e.g. in the capillary or wedge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
  • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
  • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop

Definitions

• the invention relates to a soldering device with a hollow tip made of a metal alloy that can be heated by high-frequency eddy currents and whose Curie point is used to stabilize the soldering temperature.
• Soldering irons are known which, although they have an axial solder wire feed, are heated by resistance and therefore only insufficiently have the required heat capacity in the area of the soldering tip. Soldering tips of other buying standards of resistance-heated soldering irons are exposed to strong temperature fluctuations. These soldering irons have a delayed signaling of the heat requirement when heat is extracted due to the high thermal resistance of the tip and a delayed supply of heat to the tip end wetted by the solder when the heating is switched on again.
• Embodiments with thermal sensors which can be both electronic and thermomagnetic, suffer from the disadvantages of thermal hysteresis.
• soldering irons The sum of all thermal resistances to be included in conventional soldering irons results in a disproportionately long heating-up time and is the cause of sharp drops in temperature at the soldering contact point in spite of the regulation. These soldering irons can only be used to a limited extent regardless of their position.
• the invention is based on the object of restricting the heat capacity of the soldering hollow tip formed into a soldering injector to a minimum and shifting the thermal energy reserves from the soldering tip to the energy source while keeping the soldering tip temperature constant.
• the hollow core made of a suitable lethal alloy serves as a heating element and, with its thin-walled and cylindrical shape, acts as a high-speed condenser with a small amount of solder when the solder wire is fed in from the rear.
• Sufficient power reserves of the high-frequency generator to feed the induction coil surrounding the hollow core enable direct heat dissipation to the liquefaction zone inside the core as well as to the soldering point.
• the heat transfer from the liquefaction zone the exit zone of the melt and thus the soldering point can also be favorably influenced by the use of a particularly good heat-conducting material for the front part of the injector.
• the direct interaction of the heat source and the place of heat demand creates a constellation with negligible power loss which, compared to an earlier publication (DE 3612341 A1), represents a very significant improvement in the mode of operation and construction.
• the drawing shows a soldering device according to the invention that can be used as a solder injector for performing soft soldering when used in a longitudinal section.
• the drawing shows a solder injector 1 and 2 consisting of two parts, part 1 consisting of a ferromagnetic material with a Curie point freely selectable in the temperature range of soft soldering; Part 1 is referred to above as the hollow core of the coil. Part 2, referred to as the front part and firmly connected to the hollow core of the coil, is made of a material that conducts heat well.
• the hollow coil core 1 is electrically isolated from the induction coil 3 surrounding it.
• the connection ends 8 of the induction coil 3 are electrically permanently connected to a high-frequency generator, not shown. This feeds the induction coil with high-frequency current and, through a strong alternating magnetic field, causes induction heating of the hollow core of the coil, caused by eddy currents.
• a Kickel-iron connection for example, can be considered as an alloy for the hollow core of the coil.
• the heating time is essentially dependent on the output of the generator and can be reduced by up to one second if small solder injectors are used.
• the feed speed of the solder wire, whether pulsed or continuous, largely depends on the energy reserve of the generator.
• the high-frequency prenerator can be operated as a simple oscillator circuit using a mains-isolating matching transformer on the mains.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• General Induction Heating (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=6338199

Family Applications (1)

Country Status (3)

Families Citing this family (6)

Family Cites Families (6)

• 1987
  • 1987-10-13 DE DE19873734550 patent/DE3734550A1/de active Granted
• 1988
  • 1988-10-05 WO PCT/DE1988/000623 patent/WO1989003272A1/de not_active Application Discontinuation
  • 1988-10-05 EP EP88908672A patent/EP0351419A1/de not_active Withdrawn

Non-Patent Citations (1)

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